H01G   2/00  \	0	0	5E074	H01G   2/00	0	롼ףȣǣȣǣΤΣĤΥ롼פˤޤʤǥ󥵤κΣ	Details of capacitors?not covered by a single one of groups H01G4/00-H01G11/00 [6]
H01G   2/00 101 \	1	1	5E074	H01G   2/00	357	ǥ󥵤ŵŪޤ뤿βϩʥԡ󥹲ϩ֣ȣȡ	Circuits for modifying, or compensating for, electric characteristics of capacitors (impedance networks H03H)
H01G   2/02  \	1	1	5E073	H01G   2/02	70	դΣ	Mountings [6]
H01G   2/02 101 \	2	2	5E073	H01G   2/02	925	յͭ	with mounting mechanism
H01G   2/02 101 A	2	0	5E073	H01G   2/02	207	դХɤѤ	Using mounting bands
H01G   2/02 101 B	2	0	5E073	H01G   2/02	250	դƴѤ	Using mounting containers
H01G   2/02 101 C	2	0	5E073	H01G   2/02	398	դѤΡʣȣǣͥ	Using mounting tools (H01G 2/02 101A, B take precedence)
H01G   2/02 101 D	2	0	5E073	H01G   2/02	219	ǥǻҼǼΤ˼դ	forming mounts on cases for accommodating capacitor elements per se
H01G   2/02 101 E	2	0	5E073	H01G   2/02	1630	ʣΥǥ󥵤μդ㡥쥤ޤϥ⥸塼	Mounting multiple capacitors, e.g. arrays or modules
H01G   2/02 101 Z	2	0	5E073	H01G   2/02	2204	¾Τ	Others
H01G   2/04  \	2	2	5E073	H01G   2/04	97	ä˥㡼ؤμդŬ礹ΡΣ	specially adapted for mounting on a chassis [6]
H01G   2/06  \	2	2	5E073	H01G   2/06	2268	ä˰ϩĤؤμդŬ礹ΡΣ	specially adapted for mounting on a printed-circuit support [6]
H01G   2/06  A	2	0	5E073	H01G   2/06	407	꡼ɷǻҤդ	Mounting lead type elements
H01G   2/06  B	2	1	5E073	H01G   2/06	242	꡼ɤ˲ùܤ	processed leads
H01G   2/06  C	2	0	5E073	H01G   2/06	285	ϩļΤħͭ	Characterized by printed circuit boards per se
H01G   2/06  Z	2	0	5E073	H01G   2/06	186	¾Τ	Others
H01G   2/06 500 \	3	3	5E073	H01G   2/06	1302	ɽ̼㡥åץǥ	for surface mounting, e.g. chip capacitors
H01G   2/06 501 \	4	4	5E073	H01G   2/06	263	ǻҼΤϩĤι˼դ	Mounting elements per se in holes provided in printed circuit boards
H01G   2/08  \	1	1	5E074	H01G   2/08	800	֡Ǯ̵֡֡Σ	Cooling arrangements; Heating arrangements; Ventilating arrangements [6]
H01G   2/08  A	1	0	5E074	H01G   2/08	836	ǮޤѤ˴ؤ	Related to dissipating heat or cooling
H01G   2/08  B	1	0	5E074	H01G   2/08	138	Ĵ˴ؤ	Related to adjusting oil levels
H01G   2/08  Z	1	0	5E074	H01G   2/08	21	¾Τ	Others
H01G   2/10  \	1	1	5E072	H01G   2/10	8540	ƴΣ	Housing; Encapsulation [2006.01]
H01G   2/10  A	1	0	5E072	H01G   2/10	380	ѥǥ	Power capacitors
H01G   2/10  B	1	0	5E072	H01G   2/10	145		Tightening
H01G   2/10  C	1	0	5E072	H01G   2/10	545	ƴ	Containers
H01G   2/10  D	1	1	5E072	H01G   2/10	90	ƴ	Cylindrical containers
H01G   2/10  E	1	1	5E072	H01G   2/10	101	ƴ	Containers filled with oil
H01G   2/10  J	1	0	5E072	H01G   2/10	641	ʤ	sheathing
H01G   2/10  K	1	1	5E072	H01G   2/10	1017	⡼	Moulds
H01G   2/10  Q	1	2	5E072	H01G   2/10	32	ҤˤΡ㡥ǥåԥ	by immersion, e.g. dipping
H01G   2/10  R	1	2	5E072	H01G   2/10	98	ǥ⡼ɤ	Moulding with moulds
H01G   2/10  L	1	1	5E072	H01G   2/10	99	ʤΤ	sealing the openings of covering cylinders
H01G   2/10  M	1	0	5E072	H01G   2/10	393	Сݸ	Covers, protecting cases
H01G   2/10  P	1	0	5E072	H01G   2/10	263	Υǥ󥵰ʳηΥǥ󥵤ˤŬѤ	Applicable to other capacitors other than fixed capacitors
H01G   2/10  Z	1	0	5E072	H01G   2/10	349	¾ΤΡʥåȣȣǣ	Others (chip frames H01G 2/06)
H01G   2/10 300 \	2	2	5E072	H01G   2/10	360	ߡ㡥꡼	sealings, e.g. for lead-in wires; Covers
H01G   2/10 301 \	3	3	5E072	H01G   2/10	639		Mouth sealing
H01G   2/10 600 \	2	2	5E072	H01G   2/10	794	ƴǤΥǥ󥵤θ	fixing the capacitor in a housing
H01G   2/12  \	1	1	5E074	H01G   2/12	32	忩ФݸʣȣǣͥˡΣ	Protection against corrosion (H01G2/10 takes precedence) [6]
H01G   2/14  \	1	1	5E075	H01G   2/14	1659	ŵŪޤǮŪ٤ФݸѤˤΣȣǣˡΣ	Protection against electric or thermal overload (by cooling H01G2/08) [6]
H01G   2/14 101 \	2	2	5E075	H01G   2/14	1644	ŵŪ٤Фݸ	Protections against electric overloading
H01G   2/14 101 A	2	0	5E075	H01G   2/14	96	Ԥ	Releasing pressures
H01G   2/14 101 Z	2	0	5E075	H01G   2/14	94	¾Τ	Others
H01G   2/14 103 \	3	3	5E075	H01G   2/14	119	ǥ󥵤Ŵַ䤬Ȥ߹ޤ줿	Discharge gaps assembled in parallel to capacitors
H01G   2/14 104 \	3	3	5E075	H01G   2/14	44	ʪŪޤϲŪ˰۾Τʤޤ줿	Built-in means for physically or chemically detecting defects
H01G   2/14 105 \	4	4	5E075	H01G   2/14	444	۾ήΤʤȤ߹ޤ줿	Built-in means for detecting faulty currents
H01G   2/14 105 D	4	0	5E075	H01G   2/14	40	ãʤħͭ	Characterized by means for transmitting
H01G   2/14 105 Z	4	0	5E075	H01G   2/14	83	¾Τ	Others
H01G   2/14 106 \	4	4	5E075	H01G   2/14	193	۾ﲹ٤ΤʤȤ߹ޤ줿	Built-in means for detecting faulty temperatures
H01G   2/14 107 \	4	4	5E075	H01G   2/14	105	ȯ륬ΤʤȤ߹ޤ줿	Built-in means for detecting generated gases
H01G   2/14 108 \	3	3	5E075	H01G   2/14	323	ǥ󥵤ƴľܼ齼Ŷ줿	Capacitors with directly filled with resin in containers
H01G   2/14 108 B	3	0	5E075	H01G   2/14	71	۾ήΤ	Detecting faulty currents
H01G   2/14 108 C	3	0	5E075	H01G   2/14	83	۾ﲹ٤Τ	Detecting faulty temperatures
H01G   2/14 108 D	3	0	5E075	H01G   2/14	48	¤ͭ	With pressure relief structures
H01G   2/14 108 Z	3	0	5E075	H01G   2/14	47	¾Τ	Others
H01G   2/16  \	2	2	5E075	H01G   2/16	264	ҥ塼ǻҤͭΡΣ	with fusing elements [6]
H01G   2/16 101 \	3	3	5E075	H01G   2/16	48	ûԤ	forced shorting
H01G   2/16 201 \	3	3	5E075	H01G   2/16	19	Ƿͭ	with shutoff alarms
H01G   2/16 301 \	3	3	5E075	H01G   2/16	113	٥ҥ塼ͭ	with thermal fuses
H01G   2/18  \	2	2	5E075	H01G   2/18	479	ǲǽͭΡΣ	with breakable contacts [6]
H01G   2/18 101 \	3	3	5E075	H01G   2/18	55	åѤ	using switches
H01G   2/20  \	1	1	5E075	H01G   2/20	229	ŶˤüŤɤ֡Σ	Arrangements for preventing discharge from edges of electrodes [6]
H01G   2/22  \	1	1	5E074	H01G   2/22	187	żäޤϼáΣ	Electrostatic or magnetic shielding [6]
H01G   2/24  \	1	1	5E074	H01G   2/24	1049	ɽޡ㡥顼ɡΣ	Distinguishing marks, e.g. colour coding [6]
H01G   4/00  \	0	0	5E082	H01G   4/00	38	ꥳǥ󥵡¤ˡŲ򥳥ǥ󥵣ȣǣˡΣ	Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00) [2]
H01G   4/00  A	0	0	5E082	H01G   4/00	344	¤ˡ	Manufacturing method
H01G   4/00  B	0	0	5E082	H01G   4/00	130	¤	Structures
H01G   4/00  Z	0	0	5E082	H01G   4/00	266	¾Τ	Others
H01G   4/002  \	1	1	5E082	H01G   4/002	788	Σ	Details [6]
H01G   4/005  \	2	2	5E082	H01G   4/005	798	ŶˡΣ	Electrodes [6]
H01G   4/008  \	3	3	5E082	H01G   4/008	744	Σ	Selection of materials [6]
H01G   4/008 500 \	4	4	5E082	H01G   4/008	2	Ŷ	fried electrodes
H01G   4/01  \	3	3	5E082	H01G   4/01	55	ʻٻŶ˷Σ	Form of self-supporting electrodes [6]
H01G   4/012  \	3	3	5E082	H01G   4/012	422	󼫸ʻٻŶ˷Σ	Form of non-self-supporting electrodes [6]
H01G   4/015  \	3	3	5E082	H01G   4/015	93	ʲΣ	Special provisions for self-healing [6]
H01G   4/018  \	2	2	5E082	H01G   4/018	5	ͶΡΣ	Dielectrics [6]
H01G   4/02  \	3	3	5E082	H01G   4/02	73	ΤޤϾͶΡΣ	Gas or vapour dielectrics [2, 6]
H01G   4/04  \	3	3	5E082	H01G   4/04	36	ͶΡΣ	Liquid dielectrics [2, 6]
H01G   4/06  \	3	3	5E082	H01G   4/06	464	ͶΡΣ	Solid dielectrics [2, 6]
H01G   4/08  \	4	4	5E082	H01G   4/08	34	̵ͶΡΣ	Inorganic dielectrics [2, 6]
H01G   4/08  A	4	0	5E082	H01G   4/08	148	ޥѤ	Using mica
H01G   4/08  C	4	0	5E082	H01G   4/08	6	ˤ	Vapour deposited
H01G   4/08  Z	4	0	5E082	H01G   4/08	97	¾Τ	Others
H01G   4/10  \	5	5	5E082	H01G   4/10	861	°ʪͶΡΣ	Metal-oxide dielectrics [2, 6]
H01G   4/10 500 \	6	6	5E082	H01G   4/10	140	饹Ѥ	Using glass
H01G   4/12  \	5	5	5E001	H01G   4/12	3690	ߥåͶΡΣ	Ceramic dielectrics [2, 6]
H01G   4/12 090 \	6	6	5E001	H01G   4/12	49	ߥåͶκħդΡʣȣǣȣǣͥ	
H01G   4/12 180 \	7	7	5E001	H01G   4/12	35	ޤϥȤΡʣȣǣͥ	based on titanium oxides or titanates (H01G 4/12 450 takes precedence)
H01G   4/12 270 \	8	8	5E001	H01G   4/12	91	륫ΥȤ	based on alkaline earth titanates
H01G   4/12 360 \	7	7	5E001	H01G   4/12	14	륳˥ޤϥ륳˥ȤΡʣȣǣͥ	based on zirconium oxides or zirconates (H01G 4/12 630 takes precedence)
H01G   4/12 450 \	8	8	5E001	H01G   4/12	31	ޤ	containing also titanates
H01G   4/12 540 \	7	7	5E001	H01G   4/12	33	˥֤ޤϥ󥰥ƥ󡤻󥿥ޤϥ˥ֻ󥿥Ȥ	based on niobium or tungsteen, tantalum oxides or niobates, tantalates
H01G   4/12 630 \	8	8	5E001	H01G   4/12	12	륳˥ޤϥ륳ޤ	containing also zirconium oxides or zirconates
H01G   4/12 720 \	6	6	5E001	H01G   4/12	222	ȾƳߥåǥ	semiconductive ceramic capacitors
H01G   4/12 810 \	7	7	5E001	H01G   4/12	541	γؤͭ	with grain boundary layer
H01G   4/12 900 \	6	6	5E001	H01G   4/12	10	饹ޤΡ㡥饹ߥå	containing a glassy phase, e.g. glass ceramic
H01G   4/14  \	4	4	5E082	H01G   4/14	195	ͭͶΡΣ	Organic dielectrics [2, 6]
H01G   4/14 500 \	5	5	5E082	H01G   4/14	1411	ˤ	vapour deposited
H01G   4/16  \	5	5	5E082	H01G   4/16	244	ˤΡ㡥Σ	of fibrous material, e.g. paper [2, 6]
H01G   4/18  \	5	5	5E082	H01G   4/18	83	ʪˤΡ㡥ǤʪʣȣǣͥˡΣ	of synthetic material, e.g. derivatives of cellulose (H01G4/16 takes precedence) [2, 6]
H01G   4/18 300 \	6	6	5E082	H01G   4/18	2	Ǥʪʣȣǣͥ	Derivatives of cellulose (H01G 4/14 500 takes precedence)
H01G   4/18 600 \	6	6	5E082	H01G   4/18	7	ϥʪʣȣǣͥ	halogenated (H01G 4/14 500 takes precedence)
H01G   4/20  \	3	3	5E082	H01G   4/20	469	롼ףȣǣȣǣޤǤİʾ夫ͶΤȤ߹碌ѤΡʣȣǣͥˡΣ	using combinations of dielectrics from more than one of groups H01G4/02-H01G4/06 (H01G4/12 takes precedence) [2, 6]
H01G   4/20 300 \	4	4	5E082	H01G   4/20	2	ޤϹʪ	fibrous material or synthetic material
H01G   4/20 600 \	4	4	5E082	H01G   4/20	19	̵ӹ	inorganic and synthetic material
H01G   4/22  \	4	4	5E082	H01G   4/22	1151	޿ΡΣ	impregnated [2, 6]
H01G   4/22 100 \	5	5	5E082	H01G   4/22	0	޿ʪħͭ	characterised by the composition of the impregnant
H01G   4/22 200 \	6	6	5E082	H01G   4/22	2	ϥʪ	halogenated
H01G   4/224  \	2	2	5E001	H01G   4/224	311	ƴΣ	Housing; Encapsulation [2006.01]
H01G   4/224 100 \	3	3	5E082	H01G   4/224	327	ߥåǥ󥵤γ	Encapsulation for ceramic capacitors
H01G   4/224 200 \	3	3	5E082	H01G   4/224	904	եॳǥ󥵤ƴ	Housing for film capacitors
H01G   4/228  \	2	2	5E076	H01G   4/228	114	üΣ	Terminals [6]
H01G   4/228  A	2	0	5E076	H01G   4/228	955	Ĥؤμι¤ħͭ	Characterised by structure of mounting part to substrates
H01G   4/228  B	2	0	5E076	H01G   4/228	819	Ŷˤؤ³ι¤ħͭ	Characterised by structure of connection part to electrodes
H01G   4/228  E	2	0	5E076	H01G   4/228	278	꡼ɥե졼ޤϥ꡼ɹ	Lead frame or chain lead structures
H01G   4/228  F	2	0	5E076	H01G   4/228	585	꡼ɤκޤ̹¤ħͭ	Characterised by materials or cross sectional structures of lead
H01G   4/228  G	2	0	5E076	H01G   4/228	99	㡼¾֤ؤμդħͭ	Characterized by mounting on chassis or other arrangements
H01G   4/228  H	2	0	5E076	H01G   4/228	291	⡼ɡ¾֤ؤμդħͭ	Characterized by mounting on moulds or other arrangements
H01G   4/228  J	2	0	5E076	H01G   4/228	671	ʣʤ³˴ؤ	Related to connections to multiple parts
H01G   4/228  K	2	0	5E076	H01G   4/228	239	üʥǥ󥵤üҡ㡥̷졤쥳ǥü	Terminals of special capacitors, e.g. penetrating type, thick-film, thin-film capacitors terminals
H01G   4/228  L	2	0	5E076	H01G   4/228	103	ͭͶΤѤ륳ǥ󥵤ü	Terminals of capacitors using organic dielectrics
H01G   4/228  M	2	1	5E076	H01G   4/228	33	ĤޤϴĤĺ	cores or core closings
H01G   4/228  Q	2	1	5E076	H01G   4/228	287	߷ޤϥ⡼ɷΥǥ󥵤ü	terminals of resin injection seal type or mould type capacitors
H01G   4/228  R	2	1	5E076	H01G   4/228	42	ݸ֤˴Ϣ	related to protecting devices
H01G   4/228  S	2	1	5E076	H01G   4/228	313	ʣǻҤ³˴ؤ	related to connections of multiple elements
H01G   4/228  T	2	1	5E076	H01G   4/228	115	åײ	Chipped
H01G   4/228  W	2	0	5E076	H01G   4/228	367	꡼ɤͭå׷	Chip type with lead
H01G   4/228  Z	2	0	5E076	H01G   4/228	344	¾Τ	Others
H01G   4/232  \	3	3	5E076	H01G   4/232	40	طޤϴ󷿥ǥ󥵡İʾؤŵŪ³ΡΣ	electrically connecting two or more layers of a stacked or rolled capacitor [6]
H01G   4/232  A	3	0	5E076	H01G   4/232	357	̵ͶΤͭ	having an inorganic dielectric [2]
H01G   4/232  B	3	0	5E076	H01G   4/232	72	üҤκħͭ	Characterised by the material of the terminals
H01G   4/232  E	3	0	5E076	H01G   4/232	128	ŶˤüҤ򵡳Ū³ޤܡȾĤˤ³	Connecting electrodes and terminals mechanically or by welding or soldering
H01G   4/232  Z	3	0	5E076	H01G   4/232	133	¾Τ	Others
H01G   4/236  \	3	3	5E076	H01G   4/236	897	ƴ̤꡼ɤФΡʤ꡼ɥ롼Σ	leading through the housing, i.e. lead-through [6]
H01G   4/242  \	3	3	5E076	H01G   4/242	71	üϤॳǥǻҡΣ	the capacitive element surrounding the terminal [6]
H01G   4/245  \	4	4	5E076	H01G   4/245	400	Ŷˤش֤Υ֡Σ	Tabs between the layers of a rolled electrode [6]
H01G   4/248  \	3	3	5E076	H01G   4/248	312	ǥǻҤޤޤϼϤü㡥åסʣȣǣͥˡΣ	the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) [6]
H01G   4/252  \	3	3	5E076	H01G   4/252	2441	ǥǻҤʤüʣȣǣͥˡΣ	the terminals being coated on the capacitive element (H01G4/232 takes precedence) [6]
H01G   4/252  B	3	0	5E076	H01G   4/252	151	᥿ꥳƳȾĤޤϾ˴ؤ	Related to metallikon, conductive paints, soldering or depositing
H01G   4/252  C	3	1	5E076	H01G   4/252	178	᥿ꥳƳȾĤޤϾι¤ޤϺħͭ	characterized by metallikon materials or structures of conductive paints, soldering or depositing
H01G   4/252  D	3	1	5E076	H01G   4/252	151	᥿ꥳƳȾĤޤϾˤüҤ³ħͭ	characterized by terminal connection by metallikon, conductive paints, soldring or depositing
H01G   4/252  V	3	0	5E076	H01G   4/252	679	꡼ɥ쥹å׷	Leadless chip type
H01G   4/252  Z	3	0	5E076	H01G   4/252	424	¾Τ	Others
H01G   4/255  \	2	2	5E082	H01G   4/255	543	ʡΣ	Means for correcting the capacitance value [6]
H01G   4/258  \	2	2	5E082	H01G   4/258	87	ʡΣ	Temperature compensation means [6]
H01G   4/26  \	1	1	5E082	H01G   4/26	60	ޤŤͷǥ󥵡Σ	Folded capacitors [2]
H01G   4/28  \	1	1	5E082	H01G   4/28	112	塼֥饳ǥ󥵡Σ	Tubular capacitors [2]
H01G   4/30  \	1	1	5E082	H01G   4/30	105	طǥ󥵡ʣȣǣͥˡΣ	Stacked capacitors (H01G4/33 takes precedence) [2, 6]
H01G   4/30 120 \	2	2	5E082	H01G   4/30	0	ߥå˷ƶ˶°줿	obtained by injection of metal in cavities formed in a ceramic body
H01G   4/30 140 \	2	2	5E082	H01G   4/30	1	¾Υǥ󥵤줿	obtained from a another capacitor
H01G   4/30 160 \	2	2	5E082	H01G   4/30	35	쵻Ѥˤ줿	made by thin film techniques
H01G   4/30 180 \	2	2	5E082	H01G   4/30	1	ž̵Ѥˤ줿	made by transfer techniques
H01G   4/30 201 \	2	2	5E082	H01G   4/30	32	¤ޤϺ	structures or materials
H01G   4/30 201 A	2	0	5E082	H01G   4/30	809	ع¤	Laminated structures
H01G   4/30 201 B	2	0	5E082	H01G   4/30	2831	Ŷ	Internal electrodes
H01G   4/30 201 C	2	1	5E082	H01G   4/30	1998	Ŷˤι¤	structures of internal electrodes
H01G   4/30 201 D	2	1	5E082	H01G   4/30	1440	Ŷˤκ	Materials of internal electrodes
H01G   4/30 201 E	2	0	5E082	H01G   4/30	1901	Ŷ	External electrodes
H01G   4/30 201 F	2	1	5E082	H01G   4/30	2381	Ŷˤι¤	structures of external electrodes
H01G   4/30 201 G	2	1	5E082	H01G   4/30	1358	Ŷˤκ	Materials of external electrodes
H01G   4/30 201 H	2	1	5E082	H01G   4/30	292	Ŷˤ³꡼	Leads connecting external electrodes
H01G   4/30 201 J	2	0	5E082	H01G   4/30	1974	Ͷ	Dielectrics
H01G   4/30 201 K	2	1	5E082	H01G   4/30	1250	ͶΤι¤	structures of dielectrics
H01G   4/30 201 L	2	1	5E082	H01G   4/30	2263	ͶΤκ	Materials of dielectrics
H01G   4/30 201 M	2	1	5E082	H01G   4/30	391	ǻҼ̤ͶΤħͭ	characterised by dielectric body of cover layer
H01G   4/30 201 N	2	1	5E082	H01G   4/30	665	ǻ¦̤ͶΤħͭ	characterised by dielectric body of side margin
H01G   4/30 201 P	2	0	5E082	H01G   4/30	906	å׷	Chip type
H01G   4/30 201 Q	2	0	5E082	H01G   4/30	18	Ʊ	Coaxial type
H01G   4/30 201 R	2	0	5E082	H01G   4/30	36	ľ³	Connected in series
H01G   4/30 201 S	2	0	5E082	H01G   4/30	78	դΤ	With safety arrangements
H01G   4/30 201 Z	2	0	5E082	H01G   4/30	237	¾Τ	Others
H01G   4/30 311 \	2	2	5E082	H01G   4/30	93	¤ˡ	Manufacturing methods
H01G   4/30 311 A	2	0	5E082	H01G   4/30	452	Ǥλ	Trimming methods
H01G   4/30 311 B	2	1	5E082	H01G   4/30	65	ɥ˴Ǥˡ	Trimming method after winding around drum
H01G   4/30 311 C	2	1	5E082	H01G   4/30	27	塤Ĥ֤Ǥˡ	Trimming by crushing after winding
H01G   4/30 311 D	2	0	5E082	H01G   4/30	1557	Ŷˤ¤ˡ	Manufacturing method of internal electrodes
H01G   4/30 311 E	2	0	5E082	H01G   4/30	1171	Ŷˤ¤ˡ	Manufacturing method of external electrodes
H01G   4/30 311 F	2	0	5E082	H01G   4/30	1257	ؤλ	Laminating methods
H01G   4/30 311 Z	2	0	5E082	H01G   4/30	1700	¾Τ	Others
H01G   4/30 500 \	2	2	5E001	H01G   4/30	9	ߥåǥ	Ceramic capacitors
H01G   4/30 501 \	3	3	5E001	H01G   4/30	225	ȾƳμ拾ǥ	semiconductor magnetic capacitors
H01G   4/30 504 \	4	4	5E001	H01G   4/30	129	γ﷿ĴԸƻ	Grain boundary insulated or reduced and re-oxdised type
H01G   4/30 506 \	4	4	5E001	H01G   4/30	533	γ﷿	Grain boundary insulated type
H01G   4/30 508 \	4	4	5E001	H01G   4/30	178	Ըƻ	Reduced and re-oxdised type
H01G   4/30 510 \	3	3	5E001	H01G   4/30	544	إߥåǥ󥵡ʣȣǣͥ	Laminated ceramic capacitors (H01G 4/30 501 takes precedence)
H01G   4/30 511 \	4	4	5E001	H01G   4/30	988	¤	structures
H01G   4/30 512 \	5	5	5E001	H01G   4/30	1719	Ͷ	Dielectrics
H01G   4/30 513 \	5	5	5E001	H01G   4/30	4739	ŶˤޤϳŶ	Internal electrodes or external electrodes
H01G   4/30 514 \	4	4	5E001	H01G   4/30	179		Materials
H01G   4/30 515 \	5	5	5E001	H01G   4/30	3984	Ͷ	Dielectrics
H01G   4/30 516 \	5	5	5E001	H01G   4/30	3663	ŶˤޤϳŶ	Internal electrodes or external electrodes
H01G   4/30 517 \	4	4	5E001	H01G   4/30	5491	ˡ	Manufacturing methods
H01G   4/30 520 \	3	3	5E001	H01G   4/30	436	۷ޤ	Cylindrical, urn-shaped, pillar-shaped
H01G   4/30 530 \	3	3	5E001	H01G   4/30	68		Wound types
H01G   4/30 540 \	3	3	5E001	H01G   4/30	108	İ㡥ޤ쥳ǥ	Printed board type, e.g. capacitors having thick or thin films
H01G   4/30 541 \	4	4	5E001	H01G   4/30	788	¤	structures
H01G   4/30 544 \	4	4	5E001	H01G   4/30	590		Materials
H01G   4/30 547 \	4	4	5E001	H01G   4/30	585	ˡ	Manufacturing methods
H01G   4/30 550 \	3	3	5E001	H01G   4/30	249	̷	Penetrating type
H01G   4/30 560 \	3	3	5E001	H01G   4/30	3249	̼拾ǥ󥵡㡥ľޤϣջǥ	ceramic capacitors in general, e.g. plate-shaped or U-shaped capacitors
H01G   4/32  \	1	1	5E082	H01G   4/32	74	󤷤ǥ󥵡Σ	Wound capacitors [2]
H01G   4/32 301 \	2	2	5E082	H01G   4/32	17	¤	Structures
H01G   4/32 301 A	2	0	5E082	H01G   4/32	238	եȹ礻ޤ	Combination or laying out films
H01G   4/32 301 B	2	0	5E082	H01G   4/32	134	ե༫Τι¤	Structures of film per se
H01G   4/32 301 C	2	0	5E082	H01G   4/32	76	դΤ	With safety arrangements
H01G   4/32 301 D	2	0	5E082	H01G   4/32	38	ѥѥդΤ	Cooling pipe type
H01G   4/32 301 E	2	0	5E082	H01G   4/32	59	å׷	Chip type
H01G   4/32 301 F	2	0	5E082	H01G   4/224	364	ޤƴ	Sheathes or containers
H01G   4/32 301 Z	2	0	5E082	H01G   4/32	310	¾Τ	Others
H01G   4/32 305 \	3	3	5E082	H01G   4/32	15	꡼ɤӥ꡼ɰФ	Leads or lead outlets
H01G   4/32 305 A	3	0	5E082	H01G   4/32	327	꡼	Leads
H01G   4/32 305 B	3	0	5E082	H01G   4/32	171	üŶˡ㡥᥿ꥳŶ	End surface electrodes, e.g. metallikon electrodes, etc.
H01G   4/32 305 Z	3	0	5E082	H01G   4/32	53	¾Τ	Others
H01G   4/32 311 \	2	2	5E082	H01G   4/32	14	¤ˡ	Manufacturing methods
H01G   4/32 311 A	2	0	5E082	H01G   4/32	153		Winding methods
H01G   4/32 311 Z	2	0	5E082	H01G   4/32	232	¾Τ	Others
H01G   4/32 500 \	2	2	5E082	H01G   4/32	3424	եॳǥ	film capacitors
H01G   4/32 510 \	3	3	5E082	H01G   4/32	423	եॳǥ󥵤ι¤ޤϺ	structures or materials of film capacitors
H01G   4/32 511 \	4	4	5E082	H01G   4/32	246	°եι¤ޤϺ	structures or materials of metalic film capacitors
H01G   4/32 511 A	4	0	5E082	H01G   4/32	597	̷Ŷˤι¤	structures of
H01G   4/32 511 D	4	0	5E082	H01G   4/32	221	̷Ŷˤκ	Materials of
H01G   4/32 511 G	4	0	5E082	H01G   4/32	507	ͶΥեι¤	structures of dielectric films
H01G   4/32 511 H	4	1	5E082	H01G   4/32	184	ʴޤγҤ	Mixed with powders or granules
H01G   4/32 511 J	4	1	5E082	H01G   4/32	10	ǤĤ	With mesh elements
H01G   4/32 511 K	4	1	5E082	H01G   4/32	128	̲	Rough surfaces
H01G   4/32 511 L	4	0	5E082	H01G   4/32	1022	ͶΥեκ	Materials of dielectric films
H01G   4/32 511 P	4	0	5E082	H01G   4/32	157	°ե֤ͭ	With insulating materials located between metallised films
H01G   4/32 511 Z	4	0	5E082	H01G   4/32	142	¾Τ	Others
H01G   4/32 521 \	4	4	5E082	H01G   4/32	0	°եι¤ޤϺ	structures or materials of nonmetallized films
H01G   4/32 521 A	4	0	5E082	H01G   4/32	104	Ŷ	Electrode foil
H01G   4/32 521 G	4	0	5E082	H01G   4/32	164	ͶΥե	Dielectric films
H01G   4/32 521 H	4	1	5E082	H01G   4/32	18	ŲٰưΤͭ	With charge-transfer type complexes
H01G   4/32 521 J	4	1	5E082	H01G   4/32	8	ʣ	Complex salts
H01G   4/32 521 K	4	1	5E082	H01G   4/32	12	ñ	simple salts
H01G   4/32 521 L	4	1	5E082	H01G   4/32	4	ԿۤΤ	Unwoven fabrics
H01G   4/32 521 P	4	0	5E082	H01G   4/32	104	ŶͶΥեȹ礻ޤ	Combinations or arrangements of electrode foils and dielectric films
H01G   4/32 521 Q	4	0	5E082	H01G   4/32	25	ŶͶΥե	Gluing electrode foils and dielectric films
H01G   4/32 521 Z	4	0	5E082	H01G   4/32	402	¾Τ	Others
H01G   4/32 530 \	4	4	5E082	H01G   4/32	323	üŶˤι¤㡥᥿ꥳŶˤι¤	structure of external electrodes, e.g. structure of metallikon electrodes
H01G   4/32 531 \	4	4	5E082	H01G   4/32	693	üŶˤ³꡼	leads connecting to electrodes end surfaces
H01G   4/32 540 \	4	4	5E082	H01G   4/32	971	⡼ɡƴޤϥ	housing, moulds, containers or injection of gas
H01G   4/32 541 \	4	4	5E082	H01G   4/32	171	޿	immersed
H01G   4/32 542 \	4	4	5E082	H01G   4/32	143	å׷	chip type
H01G   4/32 543 \	4	4	5E082	H01G   4/32	59	ľ³	connected in series
H01G   4/32 544 \	4	4	5E082	H01G   4/32	280	դΤΡ㡥ҥ塼Ŷ	with safety arrangements, e.g. fuse electrodes
H01G   4/32 550 \	3	3	5E082	H01G   4/32	419	եॳǥ󥵤¤ˡ	manufacturing methods of film capacitors
H01G   4/32 551 \	4	4	5E082	H01G   4/32	19	°ե¤ˡ	manufacturing methods of metallised films
H01G   4/32 551 A	4	0	5E082	H01G   4/32	161	̷Ŷˤ¤ˡ㡥ˡ	Manufacturing methods of capacitor forming electrodes, e.g. deposition method
H01G   4/32 551 B	4	0	5E082	H01G   4/32	282	ͶΥե¤ˡ	Manufacturing methods of dielectric films
H01G   4/32 551 Z	4	0	5E082	H01G   4/32	99	¾Τ	Others
H01G   4/32 561 \	4	4	5E082	H01G   4/32	109	°ե¤ˡ	manufacturing methods of nonmetallized films
H01G   4/32 561 A	4	0	5E082	H01G   4/32	52	Ŷ¤ˡ	Manufacturing methods of electrode foils
H01G   4/32 561 B	4	0	5E082	H01G   4/32	78	ͶΥե¤ˡ	Manufacturing methods of dielectric films
H01G   4/32 561 C	4	1	5E082	H01G   4/32	54	ȼͽˤΡ㡥ȼ͡Żȼ	By radiation processing, e.g. light or electron beams
H01G   4/32 561 D	4	1	5E082	H01G   4/32	28	Žˤ	By electric discharge processing
H01G   4/32 561 Z	4	0	5E082	H01G   4/32	137	¾Τ	Others
H01G   4/32 571 \	4	4	5E082	H01G   4/32	36	Ǯ	Heat treatments
H01G   4/32 572 \	4	4	5E082	H01G   4/32	35	̤ޤϲù	Compressing or machining
H01G   4/32 573 \	4	4	5E082	H01G   4/32	18		Trimming
H01G   4/32 574 \	4	4	5E082	H01G   4/32	77	ʣν	Treatments by multiple processes
H01G   4/33  \	1	1	5E082	H01G   4/33	32	ޤϸ쥳ǥ󥵡Σ	Thin- or thick-film capacitors [6]
H01G   4/33 101 \	2	2	5E082	H01G   4/33	572	쥳ǥ󥵡㡥ͶΤۤޤϰˤ줿ǥ	Thick film capacitors, e.g. dielectrics formed by coating or printing
H01G   4/33 102 \	2	2	5E082	H01G   4/33	2557	쥳ǥ󥵡㡥ͶΤޤ۶˻ˤ줿ǥ	Thin film capacitors, e.g. dielectrics formed by depositing or anodising
H01G   4/35  \	1	1	5E082	H01G   4/35	1773	̷ǥ󥵤ޤϻɻߥǥ󥵡Σ	Feed-through capacitors or anti-noise capacitors [6]
H01G   4/35 301 \	2	2	5E082	H01G   4/35	355		Cylindrical types
H01G   4/35 311 \	2	2	5E082	H01G   4/35	60		Wound types
H01G   4/35 321 \	2	2	5E082	H01G   4/35	121	Ʊ	Coaxial types
H01G   4/35 331 \	2	2	5E082	H01G   4/35	286	¿ط	Multi-layer types
H01G   4/35 341 \	2	2	5E082	H01G   4/35	253	ʣ緿	Combined types
H01G   4/38  \	1	1	5E082	H01G   4/38	1105	ʣ祳ǥ󥵡ʤʣĤθꥳǥ󥵤ι¤Ūȹ碌Σ	Multiple capacitors, i.e. structural combinations of fixed capacitors [2]
H01G   4/38  A	1	0	5E082	H01G   4/38	2478	ꥳǥƱΤΤߤǹ	Consisting of fixed capacitors only
H01G   4/38  B	1	0	5E082	H01G   4/38	2156	ñ칽¤Τʣ祳ǥ	single unit multiple capacitors
H01G   4/38  Z	1	0	5E082	H01G  15/00	43	¾Τ	Others
H01G   4/40  \	1	1	5E082	H01G   4/40	1028	Υ֥饹ޤʤ¾ŵǻҤͭꥳǥ󥵤ι¤Ūȹ礻Ǥäơι¤Ȥƥǥ󥵤ʤΡ㡥ǥ󥵤ʣʡΣ	Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations [2]
H01G   4/40  A	1	0	5E082	H01G   4/40	367	ꥳǥ󥵰ʳηΥǥ󥵤ޤޤʤ	Not containing other capacitors than fixed type
H01G   4/40  Z	1	0	5E082	H01G  17/00	59	¾Τ	Others
H01G   4/40 301 \	2	2	5E082	H01G   4/40	274	ǻҤȷ礷	Combinations with resistance elements
H01G   4/40 301 A	2	0	5E082	H01G   4/40	175	ꥳǥ󥵰ʳηΥǥ󥵤ޤޤʤ	Not containing other capacitors than fixed type
H01G   4/40 301 Z	2	0	5E082	H01G  17/00	18	¾Τ	Others
H01G   4/40 304 \	3	3	5E082	H01G   4/40	125	ŰľǻҤȷ礷	Combinations with resistance elements having nonlinearity with voltage
H01G   4/40 304 A	3	0	5E082	H01G   4/40	67	ꥳǥ󥵰ʳηΥǥ󥵤ޤޤʤ	Not containing other capacitors than fixed type
H01G   4/40 304 Z	3	0	5E082	H01G  17/00	2	¾Τ	Others
H01G   4/40 307 \	3	3	5E082	H01G   4/40	294	񹳤ȷ礷	Combinations with deposited resistance
H01G   4/40 307 A	3	0	5E082	H01G   4/40	139	ꥳǥ󥵰ʳηΥǥ󥵤ޤޤʤ	Not containing other capacitors than fixed type
H01G   4/40 307 Z	3	0	5E082	H01G  17/00	4	¾Τ	Others
H01G   4/40 310 \	3	3	5E082	H01G   4/40	17	Űݸʤ	For protecting from over-voltages
H01G   4/40 310 A	3	0	5E082	H01G   4/40	25	ꥳǥ󥵰ʳηΥǥ󥵤ޤޤʤ	Not containing other capacitors than fixed type
H01G   4/40 310 Z	3	0	5E082	H01G  17/00	0	¾Τ	Others
H01G   4/40 313 \	4	4	5E082	H01G   4/40	97	ťåפޤ񹳤ͭ	With discharge gaps or discharge resistances
H01G   4/40 313 A	4	0	5E082	H01G   4/40	19	ꥳǥ󥵰ʳηΥǥ󥵤ޤޤʤ	Not containing other capacitors than fixed type
H01G   4/40 313 Z	4	0	5E082	H01G  17/00	0	¾Τ	Others
H01G   4/40 321 \	2	2	5E082	H01G   4/40	1563	ǻҤȷ礷	Combinations with inductance elements
H01G   4/40 321 A	2	0	5E082	H01G   4/40	1287	ꥳǥ󥵰ʳηΥǥ󥵤ޤޤʤ	Not containing other capacitors than fixed type
H01G   4/40 321 Z	2	0	5E082	H01G  17/00	41	¾Τ	Others
H01G   5/00  \	0	0	5E083	H01G   5/00	79	Ūʤˤä̤Ѥ륳ǥ󥵡㡥βžˤΡ¤ˡΣ	Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture [2]
H01G   5/01  \	1	1	5E083	H01G   5/01	25		Details
H01G   5/01  B	1	0	5E083	H01G   5/01	325	Ƴħͭ	Characterised by transmitting mechanisms
H01G   5/01  C	1	0	5E083	H01G   5/01	237	žħͭ	Characterised by turning shafts
H01G   5/01  D	1	0	5E083	H01G   5/01	194	դħͭ	Characterised by mounting
H01G   5/01  E	1	0	5E083	H01G   5/01	100	ħͭ	Characterised by grounding
H01G   5/01  F	1	0	5E083	H01G   5/01	29	ɤħͭ	Characterised by shields
H01G   5/01  G	1	0	5E083	H01G   5/01	71	üҤħͭ	Characterised by terminals
H01G   5/01  H	1	0	5E083	H01G   5/01	19	ưɻߤħͭ	Characterised by preventing vibrations
H01G   5/01  J	1	0	5E083	H01G   5/01	26	Ĥħͭ	Characterised by boards
H01G   5/01  Z	1	0	5E083	H01G   5/01	142	¾	Others
H01G   5/011  \	2	2	5E083	H01G   5/011	383	ŶˡΣ	Electrodes [6]
H01G   5/012  \	3	3	5E083	H01G   5/012	12	ŶˤξʤȤĤִΤޤʴΤǤΡΣ	at least one of the electrodes being a displaceable liquid or powder [6]
H01G   5/013  \	2	2	5E083	H01G   5/013	5	ͶΡΣ	Dielectrics [6]
H01G   5/013 100 \	3	3	5E083	H01G   5/013	142	ͶΤȤƶޤϿѤΡʱΤޤϸͶΤִѤΡȣǣȣǣ	having air, gas, or vacuum as the dielectric (using displacement of liquid or solid dielectric H01G 5/013, 200- H01G 5/013, 390)
H01G   5/013 200 \	3	3	5E083	H01G   5/013	30	ͶΤѤ	having a liquid dielectric
H01G   5/013 300 \	3	3	5E083	H01G   5/013	78	ͶΤѤ	having a solid dielectric
H01G   5/013 310 \	4	4	5E083	H01G   5/013	296	ưŶ˷	with movable electrodes
H01G   5/013 315 \	5	5	5E083	H01G   5/013	144	ͶΤκץ饹åǤ	Dielectric made of a plastic material
H01G   5/013 316 \	6	6	5E083	H01G   5/013	39	ץ饹åħͭ	Characterised by plastic materials
H01G   5/013 320 \	5	5	5E083	H01G   5/013	93	ͶΤκʪǤ	Dielectric made of an oxide material
H01G   5/013 321 \	6	6	5E083	H01G   5/013	31	ͶΤκ饹Ǥ	Dielectric made of a glass material
H01G   5/013 325 \	5	5	5E083	H01G   5/013	140	ž̵	Rotary type without shaft
H01G   5/013 330 \	5	5	5E083	H01G   5/013	43		Cylindrical type
H01G   5/013 335 \	5	5	5E083	H01G   5/013	17	饤ɷ	Slide type
H01G   5/013 340 \	5	5	5E083	H01G   5/013	205	¿ϢΤ	Multiple type
H01G   5/013 345 \	5	5	5E083	H01G   5/013	94	¤ˡħͭ	Characterised by manufacturing methods
H01G   5/013 350 \	5	5	5E083	H01G   5/013	112	Ĥħͭ	Characterised by plates
H01G   5/013 351 \	6	6	5E083	H01G   5/013	133	Ŷˤħͭ	Characterised by fixed plates
H01G   5/013 352 \	6	6	5E083	H01G   5/013	214	ưŶˤħͭ	Characterised by movable plates
H01G   5/013 355 \	5	5	5E083	H01G   5/013	78	ħͭ	Characterised by pressing members
H01G   5/013 360 \	5	5	5E083	H01G   5/013	32	դħͭ	Characterised by mounting
H01G   5/013 365 \	5	5	5E083	H01G   5/013	77	üҤħͭ	Characterised by terminals
H01G   5/013 370 \	5	5	5E083	H01G   5/013	110	žħͭ	Characterised by rotating shafts
H01G   5/013 375 \	5	5	5E083	H01G   5/013	44	Ĥħͭ	Characterised by boards
H01G   5/013 380 \	5	5	5E083	H01G   5/013	37	ŶˤͭѤѲˤ	By changes in effective electrode areas
H01G   5/013 381 \	6	6	5E083	H01G   5/013	90	ʿʤޤϼ¼ŪʿŶˤž	Due to rotation of flat or essentially flat electrodes
H01G   5/013 385 \	5	5	5E083	H01G   5/013	57	ŶˤδַѲˤ	Due to changes in gaps between electrodes
H01G   5/013 390 \	4	4	5E083	H01G   5/013	23	ưͶη	with movable dielectric
H01G   5/014  \	2	2	5E083	H01G   5/014	80	ƴΣ	Housing; Encapsulation [2006.01]
H01G   5/015  \	2	2	5E083	H01G   5/015	7	Ż	Current collectors
H01G   5/017  \	2	2	5E083	H01G   5/017	57	Σ	Temperature compensation [6]
H01G   5/019  \	2	2	5E083	H01G   5/019	120	ʡΣ	Means for correcting the capacitance characteristics [6]
H01G   5/04  \	1	1	5E083	H01G   5/04	41	ŶˤͭѤѲѤΡΣ	using variation of effective area of electrode  [6]
H01G   5/06  \	2	2	5E083	H01G   5/06	18	ʿʤޤϼ¼ŪʿŶˤβžˤΡΣ	by rotation of flat or substantially flat electrodes [6]
H01G   5/06  B	2	0	5E083	H01G   5/06	68	Ƴħͭ	Characterised by transmitting mechanisms
H01G   5/06  C	2	0	5E083	H01G   5/06	94	žħͭ	Characterised by turning shafts
H01G   5/06  K	2	0	5E083	H01G   5/06	39	ƴħͭ	Characterised by containers
H01G   5/06  L	2	0	5E083	H01G   5/06	61	Ĥħͭ	Characterised by plates
H01G   5/06  M	2	1	5E083	H01G   5/06	87	Ŷˤħͭ	Characterised by fixed plates
H01G   5/06  N	2	1	5E083	H01G   5/06	98	ưŶˤħͭ	Characterised by movable plates
H01G   5/06  P	2	0	5E083	H01G   5/06	32	ħͭ	Characterised by pressing members
H01G   5/06  Q	2	0	5E083	H01G   5/06	32	ǥ󥵤ħͭ	Characterised by auxiliary capacitors
H01G   5/06  Z	2	0	5E083	H01G   5/06	111	¾	Others
H01G   5/08  \	3	3	5E083	H01G   5/08	3	Ϣ³ƲѤȤΡΣ	becoming active in succession [6]
H01G   5/10  \	2	2	5E083	H01G   5/10	2	ŶˤβưˤΡΣ	due to rotation of helical electrodes [6]
H01G   5/12  \	2	2	5E083	H01G   5/12	253	ߤޤϵŶˤβžˤΡΣ	due to rotation of part-cylindrical, conical, or spherical electrodes [6]
H01G   5/14  \	2	2	5E083	H01G   5/14	166	ŶˤĹؤΰưˤΡΣ	due to longitudinal movement of electrodes [6]
H01G   5/16  \	1	1	5E083	H01G   5/16	439	ŶˤδַѲѤΡΣ	using variation of distance between electrodes [6]
H01G   5/18  \	2	2	5E083	H01G   5/18	60	ѲˤΡ㡥ޤŤͤˤΡΣ	due to change in inclination, e.g. by flexing or by spiral wrapping [6]
H01G   5/38  \	1	1	5E083	H01G   5/38	203	ʣ祳ǥ󥵡㡥	Multiple capacitors, e.g. ganged
H01G   5/40  \	1	1	5E083	H01G   5/40	21	Υ֥饹ޤʤ¾ŵǻҤͭѥǥ󥵤ι¤Ūȹ礻Ǥäơι¤Ȥƥǥ󥵤ʤΡ㡥ңȹ礻Σ	Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations [6]
H01G   7/00  \	0	0	5E083	H01G   7/00	38	ŪǤʤʤˤä̤Ѥ륳ǥ󥵡¤ˡΣ	Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture [2]
H01G   7/00  A	0	0	5E083	H01G   7/00	59	٥󥵡	Humidity sensors
H01G   7/00  Z	0	0	5E083	H01G   7/00	155	¾Τ	Others
H01G   7/02  \	1	1	5E083	H01G   7/02	55	쥯ȥåȡʤʵж˻Ҥͭ	Electrets, i.e. having a permanently-polarised dielectric
H01G   7/02  A	1	0	5E083	H01G   7/02	209	ħͭ	Characterised by compositions
H01G   7/02  B	1	0	5E083	H01G   7/02	77	ʣؤΤ	Multiple layers
H01G   7/02  C	1	1	5E083	H01G   7/02	46	°ؤͭ	With metal layers
H01G   7/02  D	1	0	5E083	H01G   7/02	114	ħͭ	Characterised by profiles
H01G   7/02  E	1	0	5E083	H01G   7/02	195	¤ˡħͭ	Characterised by manufacturing methods
H01G   7/02  F	1	1	5E083	H01G   7/02	73	եǤޤ	Containing fluorine
H01G   7/02  G	1	2	5E083	H01G   7/02	47	եĲӥ˥ǥ	Vinylidene fluoride
H01G   7/02  H	1	1	5E083	H01G   7/02	54	ݾΤ	Fibrous
H01G   7/02  Z	1	0	5E083	H01G   7/02	30	¾Τ	Others
H01G   7/04  \	1	1	5E083	H01G   7/04	115	Ϳ벹٤ˤäͶΨѲ褦򤵤줿ͶΤĤ	having a dielectric selected for the variation of its permitivity with applied temperature
H01G   7/06  \	1	1	5E083	H01G   7/06	467	ͿŰˤäͶΨѲ褦򤵤줿ͶΤĤΡʤͶǥ󥵡ʥ쥯ȥåȣȣǣ	having a dielectric selected for the variation of its permitivity with applied voltage, i.e. ferroelectric capacitors (electrets H01G 7/02)
H01G   9/00  \	0	0	5E084	H01G   9/00	380	Ų򷿥ǥ󥵡ήȴ֤֡ޤϴ֡¤ˡΣ	Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture [2]
H01G   9/00 030 \	1	1	5E084	H01G   9/00	364	ŵŪޤǮŪ٤ФݸѤˤΡη򤱤	
H01G   9/00 290 \	1	1	5E084	H01G   9/00	93	¤ˡħͭ	Characterised by manufacturing methods
H01G   9/00 290 A	1	0	5E084	H01G   9/00	1144	Ͷؤη	formation of the dielectric layer
H01G   9/00 290 B	1	1	5E084	H01G   9/00	446	Ʋ󥰤ħͭ	Characterised by re-forming or aging
H01G   9/00 290 C	1	0	5E084	H01G   9/00	897	졤ΥΡŲդޤϵۼΤ¤ˡ	Manufacturing methods of Diaphragms, separators, Electrolytes or Absorbents
H01G   9/00 290 D	1	0	5E084	H01G   9/00	1258	Ŷˤ¤ˡ	Manufacturing methods of electrodes
H01G   9/00 290 E	1	0	5E084	H01G   9/00	2378	Ų򥳥ǥ󥵤¤ˡ	Manufacturing methods of solid electrolytic capacitors
H01G   9/00 290 F	1	1	5E084	H01G   9/00	814	Ųؤη	formation of the solid electrolyte layer
H01G   9/00 290 G	1	2	5E084	H01G   9/00	162	ԣãΣѤѤΤ¤ˡ	Manufacturing methods of TCNQ electrolyte
H01G   9/00 290 H	1	2	5E084	H01G   9/00	1896	ƳʬҤѤΤ¤ˡ	Manufacturing methods of conductive polymer electrolyte
H01G   9/00 290 J	1	0	5E084	H01G   9/00	74	ƴؤμդ¤ˡ	Manufacturing methods of mountings to containers
H01G   9/00 290 K	1	0	5E084	H01G   9/00	232	ƴ¤ˡ	Manufacturing methods of containers
H01G   9/00 290 L	1	0	5E084	H01G   9/00	301	ߤ¤ˡ	Manufacturing methods of seal
H01G   9/00 290 M	1	0	5E084	H01G   9/00	47	ĥФۤ¾μʤ¤ˡ	Vents or other means allowing expansion
H01G   9/00 290 N	1	0	5E084	H01G   9/00	24	Ų򥳥ǥ󥵤ŵνޤѲϩ¤ˡ	Modifying electrical characteristics of electrolytic capacitors or manufacturing method of compensating circuits (alternate)
H01G   9/00 290 Z	1	0	5E084	H01G   9/00	701	¾Τ	Others
H01G   9/004  \	1	1	5E080	H01G   9/004	0	Σ	Details [6]
H01G   9/008  \	2	2	5E080	H01G   9/008	876	üҡΣ	Terminals [6]
H01G   9/008 301 \	3	3	5E080	H01G   9/008	629	Ĥ˼դ줿³ü	Connecting terminals mounted at sealing plate
H01G   9/008 303 \	3	3	5E080	H01G   9/008	558	꡼ɤŶȤ³ħͭ	Characterised by connections between lead and electrode foil
H01G   9/008 305 \	3	3	5E080	H01G   9/008	196	ü	Cathode terminals
H01G   9/012  \	3	3	5E080	H01G   9/012	471	ä˸Υǥ󥵤Ŭ礹ΡΣ	specially adapted for solid capacitors [6]
H01G   9/012 301 \	4	4	5E080	H01G   9/012	1225	üҤޤϥ꡼ɤħͭ	Characterised by cathode terminals or leads
H01G   9/012 303 \	4	4	5E080	H01G   9/012	1911	۶üҤޤϥ꡼ɤħͭ	Characterised by anode terminals or leads
H01G   9/012 305 \	4	4	5E080	H01G   9/012	1461	å׷ǻҤѤ	Used for chip type elements
H01G   9/012 307 \	4	4	5E080	H01G   9/012	489	꡼ɥե졼ޤϥ꡼ɹ	Lead frames or chain lead body structures
H01G   9/012 309 \	4	4	5E080	H01G   9/012	252	¾Τ	Others
H01G   9/02  \	2	2	5E079	H01G   9/02	1552	졨ѥ졼Σ	Diaphragms; Separators [6]
H01G   9/022  \	2	2	5E079	H01G   9/022	7670	ŲۼΡΣ	Electrolytes; Absorbents [6]
H01G   9/025  \	3	3	5E079	H01G   9/025	37	ŲʣȣǣͥˡΣ	Solid electrolytes (H01G11/54 takes precedence) [6]
H01G   9/028  \	4	4	5E079	H01G   9/028	291	ͭȾƳŲ㡥ԣãΣѡΣ	Organic semiconducting electrolytes, e.g. TCNQ [6]
H01G   9/028  A	4	0	5E079	H01G   9/028	43	ԣãΣѤѤ	TCNQ type
H01G   9/028  B	4	1	5E079	H01G   9/028	128	¤	structures
H01G   9/028  C	4	1	5E079	H01G   9/028	215		Materials
H01G   9/028  E	4	0	5E079	H01G   9/028	334	ƳʬҤѤ	Conductive polymer type
H01G   9/028  F	4	1	5E079	H01G   9/028	937	¤	structures
H01G   9/028  G	4	1	5E079	H01G   9/028	1780		Materials
H01G   9/028  Z	4	0	5E079	H01G   9/028	97	¾Τ	Others
H01G   9/032  \	4	4	5E079	H01G   9/032	819	̵ȾƳŲ㡥ޥ󥬥Σ	Inorganic semiconducting electrolytes, e.g. MnO2 [6]
H01G   9/035  \	3	3	5E079	H01G   9/035	3258	Ų㡥޿ʪʣȣǣͥˡΣ	Liquid electrolytes, e.g. impregnating materials (H01G11/54 takes precedence) [6]
H01G   9/04  \	2	2	5E080	H01G   9/04	116	ŶˡΣ	Electrodes [6]
H01G   9/042  \	3	3	5E080	H01G   9/042	174	ħͭΡʣȣǣͥˡΣ	characterised by the material (H01G11/22 takes precedence) [6]
H01G   9/042 500 \	4	4	5E080	H01G   9/042	514	ˤѤ	used for cathodes
H01G   9/045  \	4	4	5E080	H01G   9/045	431	ߥ˥äȤΡΣ	based on aluminium [6]
H01G   9/048  \	3	3	5E080	H01G   9/048	23	¤ħͭΡʣȣǣͥˡΣ	characterised by their structure (H01G11/22 takes precedence) [6]
H01G   9/048  A	3	0	5E080	H01G   9/048	211	ǻҤι¤ħͭ	Characterised by whole element structures
H01G   9/048  B	3	1	5E080	H01G   9/048	254		Winding type
H01G   9/048  C	3	2	5E080	H01G   9/048	326	ĤޤǻҼϡ㡥ߤơ	Roll core or element circumference, e.g. a winding-stop tape
H01G   9/048  D	3	2	5E080	H01G   9/048	273	üҤμհ֤ޤŶΰִط	Positional relationships of terminal mounting positions or electrode foils
H01G   9/048  E	3	2	5E080	H01G   9/048	73	ʣǻҤȹ礻	Combinations of multiple elements
H01G   9/048  F	3	1	5E080	H01G   9/048	402	ط	Laminated type
H01G   9/048  G	3	0	5E080	H01G   9/048	927	Ŷ	Electrode foils in general
H01G   9/048  H	3	0	5E080	H01G   9/048	752	åײ	Chipped
H01G   9/048  Z	3	0	5E080	H01G   9/048	30	¾Τ	Others
H01G   9/052  \	4	4	5E080	H01G   9/052	947	ƷŶˡΣ	Sintered electrodes [6]
H01G   9/052 500 \	5	5	5E080	H01G   9/052	1288	ʴˤ	Powder therefor
H01G   9/052 503 \	4	4	5E080	H01G   9/052	1148	ƷŶ	non-sintered electrodes
H01G   9/052 505 \	5	5	5E080	H01G   9/052	1149	ä˸Υǥ󥵤Ŭ礹	specially adapted for solid capacitors
H01G   9/052 507 \	5	5	5E080	H01G   9/052	50	ä˱Υǥ󥵤Ŭ礹	specially adapted for liquid capacitors
H01G   9/052 509 \	6	6	5E080	H01G   9/052	625	۶	Anode foils
H01G   9/055  \	4	4	5E080	H01G   9/055	900	å󥰤ŶˡΣ	Etched foil electrodes [6]
H01G   9/055 100 \	5	5	5E080	H01G   9/055	36		Cathodes
H01G   9/055 103 \	6	6	5E080	H01G   9/055	1299	Υǥ󥵤Ŭ礹뱢ˡ㡥ܥ󥰥եءڡؤޤȾ	Cathodes adapted for solid capacitors, e.g. carbon graphite layer, silver paste layer or soldered layer
H01G   9/055 105 \	6	6	5E080	H01G   9/055	415	Υǥ󥵤Ŭ礹뱢	Cathodes adapted for liquid capacitors
H01G   9/055 107 \	7	7	5E080	H01G   9/055	55	˥	Cathode cases
H01G   9/06  \	3	3	5E080	H01G   9/06	32	ƴؤμչ¤Σ	Mounting in containers [6]
H01G   9/06  A	3	0	5E080	H01G   9/06	115	Ŷ޺ħͭ	Characterised by filling materials
H01G   9/06  Z	3	0	5E080	H01G   9/06	449	¾Τ	Others
H01G   9/07  \	2	2	5E084	H01G   9/07	222	ͶءΣ	Dielectric layers [6]
H01G   9/08  \	2	2	5E084	H01G   9/08	23	ƴΣ	Housing; Encapsulation [2006.01]
H01G   9/08  A	2	0	5E084	H01G   9/08	117	ʤ	Coating
H01G   9/08  B	2	1	5E084	H01G   9/08	545	եࡤȡ塼֤ޤϥ꡼֤˴ؤ	Related to films, sheets, tubes or sleeves
H01G   9/08  C	2	1	5E084	H01G   9/08	1241	⡼ɡǥåפ˴ؤ	Related to moulds or dips
H01G   9/08  D	2	0	5E084	H01G   9/08	551	㡥ƴ	Cases e.g. double containers
H01G   9/08  E	2	1	5E084	H01G   9/08	538	ʤ륱˴ؤ	Related to containers consisting of insulating materials
H01G   9/08  F	2	1	5E084	H01G   9/08	715	°˴ؤ	Related to metal cases
H01G   9/08  Z	2	0	5E084	H01G   9/08	198	¾Τ	Others
H01G   9/10  \	3	3	5E084	H01G   9/10	31	ߡ㡥꡼ΡΣ	Sealing, e.g. of lead-in wires [6]
H01G   9/10  A	3	0	5E084	H01G   9/10	91	ϡå	Hermetic seals
H01G   9/10  C	3	0	5E084	H01G   9/10	697	ΤüҤޤϥ꡼ɤȤߤħͭ	Characterised by sealing between sealing body and terminals or leads
H01G   9/10  D	3	0	5E084	H01G   9/10	569	ΤȥüȤߤħͭ	Characterised by sealing between body and case ends
H01G   9/10  E	3	0	5E084	H01G   9/10	449	κħͭ	Characterised by materials of body
H01G   9/10  F	3	1	5E084	H01G   9/10	347	¿ع¤	Multi-layer structures
H01G   9/10  G	3	0	5E084	H01G   9/10	401	å׷ǻҤѤ	Used for chip type elements
H01G   9/10  Z	3	0	5E084	H01G   9/10	418	¾Τ	Others
H01G   9/12  \	3	3	5E084	H01G   9/12	22	ĥФۤ¾μʡΣ	Vents or other means allowing expansion [6]
H01G   9/12  A	3	0	5E084	H01G   9/12	520	Τ˹¡ʬޤͭ	With grooves, portion with thin materials or explosion-proof holes in sealing body
H01G   9/12  B	3	0	5E084	H01G   9/12	515	ƴ˹¡ʬޤͭ	With grooves, portion with thin materials or explosion-proof holes on containers
H01G   9/12  C	3	0	5E084	H01G   9/12	619	ݸ֡㡥ҥ塼	Protecting devices, e.g. fuses
H01G   9/12  Z	3	0	5E084	H01G   9/12	414	¾Τ	Others
H01G   9/14  \	2	2	5E084	H01G   9/14	3	Ų򥳥ǥ󥵤ŵŪνޤѹ¤Ūȹ碌	Structural combinations for modifying, or compensating for, electric characteristics of electrolytic capacitors
H01G   9/14  A	2	0	5E084	H01G   9/14	715	㥤ԡ󥹲ħͭ	Characterised by lowered impedance
H01G   9/14  B	2	0	5E084	H01G   9/14	146	̵˲ħͭ	Characterised by non-polarising
H01G   9/14  Z	2	0	5E084	H01G   9/14	177	¾Τ	Others
H01G   9/145  \	1	1	5E084	H01G   9/145	3314	Ų򥳥ǥ󥵡ʣȣǣͥˡΣ	Liquid electrolytic capacitors (H01G11/00 takes precedence) [6]
H01G   9/15  \	1	1	5E084	H01G   9/15	10208	Ų򥳥ǥ󥵡ʣȣǣͥˡΣ	Solid electrolytic capacitors (H01G11/00 takes precedence) [6]
H01G   9/15 100 \	2	2	5E084	H01G   9/15	148	ŶˤѤ	with wound foil electrodes
H01G   9/16  \	1	1	5E084	H01G   9/16	103	ήޤϸȴȤѤ뤿äŬ礹Ρʣȣǣͥ	specially adapted for use as rectifiers or detectors (H01G9/22 takes precedence)
H01G   9/18  \	1	1	5E084	H01G   9/18	7	ʼ	Self-interrupters
H01G   9/20  \	1	1	5H033	H01G   9/20	57		Light-sensitive devices
H01G   9/20 101 \	2	2	5H033	H01G   9/20	256		cell
H01G   9/20 103 \	3	3	5H033	H01G   9/20	190	Ų	electrolyte
H01G   9/20 105 \	4	4	5H033	H01G   9/20	458	Ρ㡥ݥޡޤϥ	solid, e.g. polymer or gell
H01G   9/20 107 \	4	4	5H033	H01G   9/20	9		liquid
H01G   9/20 107 A	4	0	5H033	H01G   9/20	528	ϼ	solute
H01G   9/20 107 B	4	0	5H033	H01G   9/20	269		solvent
H01G   9/20 107 C	4	0	5H033	H01G   9/20	344	źú	additive
H01G   9/20 107 Z	4	0	5H033	H01G   9/20	83	¾	Others
H01G   9/20 109 \	3	3	5H033	H01G   9/20	222	ѥ졼ޤϥڡ	separator or spacer
H01G   9/20 111 \	3	3	5H033	H01G   9/20	1	Ŷ	photoelectrode
H01G   9/20 111 A	3	0	5H033	H01G   9/20	826	ȾƳؤκ	semiconductor layer
H01G   9/20 111 B	3	0	5H033	H01G   9/20	1188	ȾƳؤι¤	structure of semiconductor
H01G   9/20 111 C	3	0	5H033	H01G   9/20	1019	ȾƳؤ¤	structure of semiconductor
H01G   9/20 111 D	3	0	5H033	H01G   9/20	855	Ƴء㡥ƩƳءޤϽ	electrically conducting layer, e.g. transparent electrically conducting layer or electrical current collector
H01G   9/20 111 E	3	0	5H033	H01G   9/20	558		substrate
H01G   9/20 111 Z	3	0	5H033	H01G   9/20	577	¾	Others
H01G   9/20 113 \	4	4	5H033	H01G   9/20	2		sensitizer
H01G   9/20 113 A	4	0	5H033	H01G   9/20	1311	ͭ	organic dye
H01G   9/20 113 B	4	0	5H033	H01G   9/20	2168	°	metal complex
H01G   9/20 113 C	4	0	5H033	H01G   9/20	446	ʣޤȹ礻ޤޤ¾εʪȤȹ礻	combination of multiple sinsitizers, or of sensitizer and other adsorbate
H01G   9/20 113 D	4	0	5H033	H01G   9/20	366	ˡޤϵ	adsorption method or adsorption device
H01G   9/20 113 Z	4	0	5H033	H01G   9/20	237	¾	Others
H01G   9/20 115 \	3	3	5H033	H01G   9/20	5	ж	antipode
H01G   9/20 115 A	3	0	5H033	H01G   9/20	764	Ƴء㡥ƩƳؤޤϿء	electrically conducting layer, e.g. transparent electrically conducting layer or catalyst layyer; electrical current collector
H01G   9/20 115 B	3	0	5H033	H01G   9/20	364		substrate
H01G   9/20 115 Z	3	0	5H033	H01G   9/20	123	¾	Others
H01G   9/20 117 \	3	3	5H033	H01G   9/20	212	üҤޤϥ꡼	terminal or lead of cell
H01G   9/20 119 \	3	3	5H033	H01G   9/20	649	ΤޤϥϤι¤	structure of whole cell or cell surrundings
H01G   9/20 121 \	3	3	5H033	H01G   9/20	348	¤	manufacture of cell
H01G   9/20 201 \	2	2	5H033	H01G   9/20	31	⥸塼	module
H01G   9/20 203 \	3	3	5H033	H01G   9/20	8	⥸塼ι¤	structure of module
H01G   9/20 203 A	3	0	5H033	H01G   9/20	149	֤Ƴ³	conductive conecton between cells
H01G   9/20 203 B	3	1	5H033	H01G   9/20	649	ڷ⥸塼	Z-type module
H01G   9/20 203 C	3	1	5H033	H01G   9/20	95	׷⥸塼	W-type module
H01G   9/20 203 Z	3	0	5H033	H01G   9/20	170	¾	Others
H01G   9/20 205 \	3	3	5H033	H01G   9/20	182	⥸塼¤	manufacture of module
H01G   9/20 301 \	2	2	5H033	H01G   9/20	231	ǥ෿	tandem type
H01G   9/20 303 \	2	2	5H033	H01G   9/20	2		sealing
H01G   9/20 303 A	2	0	5H033	H01G   9/20	401		materials
H01G   9/20 303 B	2	0	5H033	H01G   9/20	465	¤	structure
H01G   9/20 303 C	2	0	5H033	H01G   9/20	296	¤ˡ	manufacturing method
H01G   9/20 303 Z	2	0	5H033	H01G   9/20	12	¾	Others
H01G   9/20 305 \	2	2	5H033	H01G   9/20	137	Ųդ	injection of electrolyte
H01G   9/20 307 \	2	2	5H033	H01G   9/20	1104	ࡤ㡥ȿءؤޤϽ	optical members, e.g. reflecting layer, scattering layer or light condensing member
H01G   9/20 309 \	2	2	5H033	H01G   9/20	244	ǧޤϰվ	visibility or design
H01G   9/20 311 \	2	2	5H033	H01G   9/20	500	ݸޤûɻ	protection or prevention of short circuit
H01G   9/20 313 \	2	2	5H033	H01G   9/20	53	ɾޤϻ	evaluation or examination
H01G   9/20 315 \	2	2	5H033	H01G   9/20	331	¾Ӥޤ¾֤Ȥȹ礻	combined with other battery or device
H01G   9/20 317 \	2	2	5H033	H01G   9/20	171	ޤѤʤ	not using sensitize
H01G   9/21  \	1	1	5E084	H01G   9/21	21	֡Σ	Temperature-sensitive devices [6]
H01G   9/22  \	1	1	5E084	H01G   9/22	97	ԸȻȤ߹碌Ѥ֡㡥ң֡ޤϥꥪΣ	Devices using combined reduction and oxidation, e.g. redox arrangement or solion [1, 2013.01]
H01G   9/26  \	1	1	5E084	H01G   9/26	511	Ų򥳥ǥ󥵡ήδ֤֡ޤϴߤι¤ŪȤ߹碌Σ	Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other [6]
H01G   9/28  \	1	1	5E084	H01G   9/28	314	Ų򥳥ǥ󥵡ήδ֤ȡΥ֥饹ޤʤ¾ŵʤȤι¤ŪȤ߹碌Σ	Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass [6]
H01G  11/00  \	0	0	5E078	H01G  11/00	1022	ϥ֥åɥǥ󥵡ʤۤʤŶˤĥǥ󥵡ŵءΣţģ̡ϥǥ󥵡¤ΥץޤϤ¤ΥץΣ	Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof [2013.01]
H01G  11/02  \	1	1	5E078	H01G  11/02	624	ԸȿѤΡ㡥ң֤ޤϥꥪΣ	using combined reduction-oxidation reactions, e.g. redox arrangement or solion [2013.01]
H01G  11/04  \	1	1	5E078	H01G  11/04	70	ϥ֥åɥǥ󥵡Σ	Hybrid capacitors [2013.01]
H01G  11/06  \	2	2	5E078	H01G  11/06	3708	Ŷˤ˥󤬲ĵŪ˥ɡפƤΡ㡥।󥳥ǥ󥵡Σ̣ɣáϡΣ	with one of the electrodes allowing ions to be reversibly doped thereinto, e.g. lithium ion capacitors [LIC] [2013.01]
H01G  11/08  \	1	1	5E078	H01G  11/08	544	¤Ūȹ礻㡥ϥ֥åɤޤϣţģ̥ǥ󥵤¾ŵʤȤΩƤޤϢ롤ʤȤ⣱ĤΥϥ֥åɤޤϣţģ̥ǥ󥵤礿빽ʤǤ뤳ȡΣ	Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component [2013.01]
H01G  11/10  \	1	1	5E078	H01G  11/10	2689	ʣΥϥ֥åɤޤϣţģ̥ǥ󥵡㡥쥤ޤϥ⥸塼ʥϥ󥰡ץ벽ޤϤμդȣǣˡΣ	Multiple hybrid or EDL capacitors, e.g. arrays or modules (housings, cases, encapsulations&nbsp;or mountings thereof H01G 11/78) [2013.01]
H01G  11/12  \	2	2	5E078	H01G  11/12	1904	ؤ줿ϥ֥åɤޤϣţģ̥ǥ󥵡Σ	Stacked hybrid or EDL capacitors [2013.01]
H01G  11/14  \	1	1	5E078	H01G  11/14	1555	ϥ֥åɤޤϣţģ̥ǥ󥵤Ĵޤݸ뤿֤ޤˡʥǥ󥵤äŬ礹۵ݸϩ֡̾ư狼˾ޤʤѲ򵯤ˡưå¹Ԥȣȣϩ˲ήޤϲŰ¤뤿ݸϩ֣ȣȣˡΣ	Arrangements or processes for adjusting or protecting hybrid or EDL capacitors (emergency protective circuit arrangements specially adapted for capacitors, and effecting automatic switching in the event of an undesired change from normal working conditions H02H 7/16; emergency protective circuit arrangements for limiting excess current or voltages without disconnection H02H 9/00) [2013.01]
H01G  11/16  \	2	2	5E078	H01G  11/16	167	ŵŪ٤ФΡ㡥ҥ塼ޤΣ	against electric overloads, e.g. including fuses [2013.01]
H01G  11/18  \	2	2	5E078	H01G  11/18	457	ǮŪ٤ФΡ㡥ǮѤޤΣ	against thermal overloads, e.g. heating, cooling or ventilating [2013.01]
H01G  11/20  \	2	2	5E078	H01G  11/20	361	ޤԽʪνˡ㡥Σ	Reformation or processes for removal of impurities, e.g. scavenging [2013.01]
H01G  11/22  \	1	1	5E078	H01G  11/22	4480	ŶˡΣ	Electrodes [2013.01]
H01G  11/24  \	2	2	5E078	H01G  11/24	3464	Ŷˤޤι¤ŪÿħͭΡ㡥֡ɽѤޤ϶ΨѤʴޤγҤι¤ŪÿħͭΡΣ	characterised by structural features of the materials making up or comprised in the electrodes, e.g. form,&nbsp;surface area or porosity; characterised by the structural features of powders or particles used therefor [2013.01]
H01G  11/26  \	2	2	5E078	H01G  11/26	1739	¤ħͭΡ㡥¿ΨޤɽΣ	characterised by their structure, e.g. multi-layered,&nbsp;porosity or surface features [2013.01]
H01G  11/28  \	3	3	5E078	H01G  11/28	1188	Τξ¤٤ޤ֤줿ΡŶˤȽΤδ֤ؤޤ̡㡥ޡΣ	arranged or disposed on a current collector; Layers or phases between electrodes and current collectors, e.g. adhesives [2013.01]
H01G  11/30  \	2	2	5E078	H01G  11/30	3060	ħͭΡΣ	characterised by their material [2013.01]
H01G  11/32  \	3	3	5E078	H01G  11/32	1593	úǤ١ȤΡΣ	Carbon-based [2013.01]
H01G  11/34  \	4	4	5E078	H01G  11/34	1444	úޤħͭΡΣ	characterised by carbonisation or activation of carbon [2013.01]
H01G  11/36  \	4	4	5E078	H01G  11/36	873	ʥι¤㡥ʥΥեСʥΥ塼֤ޤϥե顼Σ	Nanostructures, e.g. nanofibres, nanotubes or fullerenes [2013.01]
H01G  11/38  \	4	4	5E078	H01G  11/38	3916	ܥڡȤޤϥ֥ɡηޤޤޡΣ	Carbon pastes or blends; Binders or additives therein [2013.01]
H01G  11/40  \	4	4	5E078	H01G  11/40	887	ݡΣ	Fibres [2013.01]
H01G  11/42  \	4	4	5E078	H01G  11/42	4225	ʴޤγҡ㡥Σ	Powders or particles, e.g. composition thereof [2013.01]
H01G  11/44  \	4	4	5E078	H01G  11/44	1744	θ㡥ޤúΣ	Raw materials therefor, e.g. resins or coal [2013.01]
H01G  11/46  \	3	3	5E078	H01G  11/46	1105	°ʪΣ	Metal oxides [2013.01]
H01G  11/48  \	3	3	5E078	H01G  11/48	464	ƳݥޡΣ	Conductive polymers [2013.01]
H01G  11/50  \	3	3	5E078	H01G  11/50	758	।󥳥ǥ󥵤äŬ礷Ρ㡥Υɡԥ󥰤ޤϥ󥿡졼ΤΤΡΣ	specially adapted for lithium-ion capacitors, e.g. for lithium-doping or for intercalation [2013.01]
H01G  11/52  \	1	1	5E078	H01G  11/52	2969	ѥ졼Σ	Separators [2013.01]
H01G  11/54  \	1	1	5E078	H01G  11/54	1395	ŲΣ	Electrolytes [2013.01]
H01G  11/56  \	2	2	5E078	H01G  11/56	1212	Ų㡥롨źʪΣ	Solid electrolytes, e.g. gels; Additives therein [2013.01]
H01G  11/58  \	2	2	5E078	H01G  11/58	1089	ŲΣ	Liquid electrolytes [2013.01]
H01G  11/60  \	3	3	5E078	H01G  11/60	1709	ޤħͭΡΣ	characterised by the solvent [2013.01]
H01G  11/62  \	3	3	5E078	H01G  11/62	2409	ϼħͭΡ㡥αޤۥΣ	characterised by the solute, e.g. salts, anions or cations therein [2013.01]
H01G  11/64  \	3	3	5E078	H01G  11/64	1241	źúޤħͭΡΣ	characterised by additives [2013.01]
H01G  11/66  \	1	1	5E078	H01G  11/66	1244	ΡΣ	Current collectors [2013.01]
H01G  11/68  \	2	2	5E078	H01G  11/68	2061	ħͭΡΣ	characterised by their material [2013.01]
H01G  11/70  \	2	2	5E078	H01G  11/70	2346	¤ħͭΡΣ	characterised by their structure [2013.01]
H01G  11/72  \	2	2	5E078	H01G  11/72	440	ʣΤޤؤ줿ϥ֥åɤޤϣţģ̥ǥ󥵤ΰβäŬ礷ΡΣ	specially adapted for integration in multiple or stacked hybrid or EDL capacitors [2013.01]
H01G  11/74  \	1	1	5E078	H01G  11/74	2250	üҡ㡥ΤγĥΣ	Terminals, e.g. extensions of current collectors [2013.01]
H01G  11/76  \	2	2	5E078	H01G  11/76	688	ʣޤؤ줿ϥ֥åɤޤϣţģ̥ǥ󥵤ΰβäŬ礷ΡΣ	specially adapted for integration in multiple or stacked hybrid or EDL capacitors [2013.01]
H01G  11/78  \	1	1	5E078	H01G  11/78	5141	ϥ󥰡ץ벽դΣ	Cases; Housings; Encapsulations; Mountings [2013.01]
H01G  11/80  \	2	2	5E078	H01G  11/80	1889	åȡ󥰡Σ	Gaskets; Sealings [2013.01]
H01G  11/82  \	2	2	5E078	H01G  11/82	1689	ǥǤΥϥؤμդޤΩơ㡥ŶˤμդΤޤüҤΥƥؤμդޤϥץ벽Σ	Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations [2013.01]
H01G  11/84  \	1	1	5E078	H01G  11/84	4207	ϥ֥åɤޤϣţģ̥ǥ󥵡ޤϤʤ¤ˡΣ	Processes for the manufacture of hybrid or EDL capacitors, or components thereof [2013.01]
H01G  11/86  \	2	2	5E078	H01G  11/86	5398	ŶˤäŬ礷ΡŶˤ¤ΤúޤȣǣˡΣ	specially adapted for electrodes (carbonisation or activation of carbon for the manufacture of electrodes H01G 11/34) [2013.01]
H01G  13/00  \	0	0	5E082	H01G  13/00	207	ǥ󥵤¤Ŭ礷֡롼ףȣǣȣǣʬवʤǥ󥵤¤äŬ礷ˡΣ	Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G 4/00-H01G 11/00 [2,2013.01]
H01G  13/00 301 \	1	1	5E082	H01G  13/00	1	꡼	Leads
H01G  13/00 301 A	1	0	5E082	H01G  13/00	29		Inserting
H01G  13/00 301 B	1	0	5E082	H01G  13/00	65	ޤ϶	Transferring or feeding
H01G  13/00 301 C	1	0	5E082	H01G  13/00	65	ޤϰַ	Aligning or positioning
H01G  13/00 301 D	1	0	5E082	H01G  13/00	26	Ƚ̤ޤϸ	Determining or inspecting
H01G  13/00 301 E	1	0	5E082	H01G  13/00	104	꡼üҤνΡ꡼ɥե졼	Lead terminal aggregates; lead frames
H01G  13/00 301 Z	1	0	5E082	H01G  13/00	50	¾Τ	Others
H01G  13/00 303 \	2	2	5E082	H01G  13/00	3	꡼ɤβù	Machining leads
H01G  13/00 303 A	2	0	5E082	H01G  13/00	4		Inhibiting cracking in resins
H01G  13/00 303 B	2	0	5E082	H01G  13/00	64	꡼Ƭù	Machining top part of leads
H01G  13/00 303 C	2	0	5E082	H01G  13/00	76	꡼ɽ̽	Treating lead surfaces
H01G  13/00 303 D	2	0	5E082	H01G  13/00	91		Trimming
H01G  13/00 303 Z	2	0	5E082	H01G  13/00	70	¾Τ	Others
H01G  13/00 305 \	3	3	5E082	H01G  13/00	0	եߥ	Forming
H01G  13/00 305 A	3	0	5E082	H01G  13/00	149	޶ʤǤ޶ʤȼ	Folding; accompany trimming + folding
H01G  13/00 305 B	3	0	5E082	H01G  13/00	57	꡼ɤ׾	Bending at an intermediary position of leads
H01G  13/00 305 C	3	0	5E082	H01G  13/00	54		Reforming
H01G  13/00 305 Z	3	0	5E082	H01G  13/00	60	¾Τ	Others
H01G  13/00 307 \	2	2	5E082	H01G  13/00	2	꡼ɤμդ	Mounting leads
H01G  13/00 307 A	2	0	5E082	H01G  13/00	39	ƥåˤΡˤǻߤ	By stitching; fixing with needles
H01G  13/00 307 B	2	0	5E082	H01G  13/00	11	꡼ɴ	Reed flag
H01G  13/00 307 C	2	0	5E082	H01G  13/00	26	ʴץ쥹ˤ	By powder forming press
H01G  13/00 307 D	2	0	5E082	H01G  13/00	19		Brazing
H01G  13/00 307 E	2	0	5E082	H01G  13/00	164	Ⱦġ㡥ȾĤޤͽȾ	Soldering, e.g. pre-soldering or preparatory soldering
H01G  13/00 307 F	2	0	5E082	H01G  13/00	209		Welding
H01G  13/00 307 Z	2	0	5E082	H01G  13/00	162	¾Τ	Others
H01G  13/00 311 \	1	1	5E082	H01G  13/00	7	ơԥ󥰡ŵʤΩΤ¤ޤĴȣˣơԥŵʤ켫Σ£ġơԥŵʤ¤̣£¡	taping (manufacturing or coordinating assembling bodies of electric components H05K13/00; taped electric components per se B 65 D: manufacturing of taped electric components in general B 65 B)
H01G  13/00 311 A	1	0	5E082	H01G  13/00	172	ơԥ	Taping for adhesion
H01G  13/00 311 B	1	0	5E082	H01G  13/00	28	Υơԥ	Taping for peeling off
H01G  13/00 311 Z	1	0	5E082	H01G  13/00	114	¾Τ	Others
H01G  13/00 321 \	1	1	5E082	H01G  13/00	1	ޤƴ	Sheathes or containers
H01G  13/00 321 A	1	0	5E082	H01G  13/00	120		Paints
H01G  13/00 321 B	1	0	5E082	H01G  13/00	27	ơ״	Taping
H01G  13/00 321 C	1	0	5E082	H01G  13/00	104		Sealing mouth
H01G  13/00 321 D	1	0	5E082	H01G  13/00	31		Packing
H01G  13/00 321 E	1	0	5E082	H01G  13/00	218	鳰	Resin sheathes
H01G  13/00 321 F	1	0	5E082	H01G  13/00	57	ʤ	Coatings
H01G  13/00 321 G	1	0	5E082	H01G  13/00	39	塼	Mounting tubes
H01G  13/00 321 H	1	0	5E082	H01G  13/00	20	Ǯ̥塼	Thermal shrinking tubes
H01G  13/00 321 J	1	0	5E082	H01G  13/00	61	顼ƥ󥰡ޡ󥰡ɽ	Colour coating (marking or indicating)
H01G  13/00 321 K	1	0	5E082	H01G  13/00	60	⡼	Moulding
H01G  13/00 321 L	1	0	5E082	H01G  13/00	50	Ѷⷿ	Moulding die sets
H01G  13/00 321 Z	1	0	5E082	H01G  13/00	88	¾Τ	Others
H01G  13/00 331 \	1	1	5E082	H01G  13/00	4	ޤϰַ	Feeding or positioning
H01G  13/00 331 A	1	0	5E082	H01G  13/00	169		Feeding
H01G  13/00 331 B	1	0	5E082	H01G  13/00	39		Inserting
H01G  13/00 331 C	1	0	5E082	H01G  13/00	244		Transferring
H01G  13/00 331 D	1	0	5E082	H01G  13/00	284	ޤϰַ	Aligning or positioning
H01G  13/00 331 E	1	0	5E082	H01G  13/00	55	Ф	Unloading
H01G  13/00 331 F	1	0	5E082	H01G  13/00	34	ȿž	Turning
H01G  13/00 331 Z	1	0	5E082	H01G  13/00	57	¾Τ	Others
H01G  13/00 341 \	1	1	5E082	H01G  13/00	44	Ω	Assembling
H01G  13/00 351 \	1	1	5E082	H01G  13/00	13	ݻޤϼ	Retaining or jigs
H01G  13/00 351 A	1	0	5E082	H01G  13/00	495		Jigs
H01G  13/00 351 B	1	0	5E082	H01G  13/00	155	߻ޤ϶	Suspending or crimping support
H01G  13/00 351 Z	1	0	5E082	H01G  13/00	238	¾Τ	Others
H01G  13/00 361 \	1	1	5E082	H01G  13/00	5	ޤϸɽޡȣǣ	Testing or inspecting (indicating mark H01G1/04)
H01G  13/00 361 A	1	0	5E082	H01G  13/00	217	̤ޤϼư	Sorting or automatic sorting
H01G  13/00 361 B	1	0	5E082	H01G  13/00	50	Ƚ	Determining polarities
H01G  13/00 361 C	1	0	5E082	H01G  13/00	92	̸	Detecting capacities
H01G  13/00 361 D	1	0	5E082	H01G  13/00	138	ϳή㡥ΤΤ	Inspecting leakage currents, e.g. for testing degradation of characteristics
H01G  13/00 361 E	1	0	5E082	H01G  13/00	5	ư	Vibration tests
H01G  13/00 361 F	1	0	5E082	H01G  13/00	70	Ż	Charging and discharging tests
H01G  13/00 361 G	1	0	5E082	H01G  13/00	45	Ѱ	Pressure resistance tests
H01G  13/00 361 Z	1	0	5E082	H01G  13/00	488	¾Τ	Others
H01G  13/00 371 \	1	1	5E082	H01G  13/00	11	Ų򥳥ǥ¤֡Ų򥳥ǥ󥵤¤ˡȣǣ	Manufacturing device for electrolytic capacitors (manufacturing method H01G9/24)
H01G  13/00 371 A	1	0	5E082	H01G  13/00	58	ޤ϶Ƚ	Determining alignment or polarity
H01G  13/00 371 B	1	0	5E082	H01G  13/00	65	߻ޤݻ	Suspending support of retention support
H01G  13/00 371 C	1	0	5E082	H01G  13/00	95		Inspections
H01G  13/00 371 D	1	0	5E082	H01G  13/00	84		Aging
H01G  13/00 371 E	1	0	5E082	H01G  13/00	58	ʣ	Multiple processes
H01G  13/00 371 F	1	0	5E082	H01G  13/00	152	㡥Ͷ	Forming, e.g. forming dielectric films
H01G  13/00 371 G	1	0	5E082	H01G  13/00	80	Ŷ㡥å󥰤ˤŶη	Electrode foils, e.g. by etching
H01G  13/00 371 H	1	0	5E082	H01G  13/00	97	޿	Impregnating
H01G  13/00 371 J	1	0	5E082	H01G  13/00	75	å󥰡ʣȣǣͥ	Etching (H01G13/00, 371J takes precedence)
H01G  13/00 371 Z	1	0	5E082	H01G  13/00	471	¾Τ	Others
H01G  13/00 381 \	1	1	5E082	H01G  13/00	979	ŵإǥ¤֡ŵإǥ󥵤¤ˡȣǣ	Manufacturing device for electric double layer capacitors (manufacturing method H01G11/84, 11/86)
H01G  13/00 391 \	1	1	5E082	H01G  13/00	11	ǥ󥵤¤ˡ	Manufacturing methods for capacitors
H01G  13/00 391 A	1	0	5E082	H01G  13/00	76	󥰡Ʋ	Aging; re-forming
H01G  13/00 391 B	1	0	5E082	H01G  13/00	783	Ŷ	Painting electrodes
H01G  13/00 391 C	1	0	5E082	H01G  13/00	141		Depositing
H01G  13/00 391 D	1	0	5E082	H01G  13/00	49	᥿ꥳ	Metallikon
H01G  13/00 391 E	1	0	5E082	H01G  13/00	309		Baking
H01G  13/00 391 F	1	0	5E082	H01G  13/00	22	å¤	Manufacturing of caps
H01G  13/00 391 G	1	0	5E082	H01G  13/00	22	åƥ󥰡㡥Υåƥ	Slitting, e.g. of aluminium foils
H01G  13/00 391 H	1	0	5E082	H01G  13/00	330	ǡ㡥ߥå	Trimming, e.g. of ceramics
H01G  13/00 391 J	1	0	5E082	H01G  13/00	169	ʣ	Multiple processes
H01G  13/00 391 Z	1	0	5E082	H01G  13/00	390	¾Τ	Others
H01G  13/02  \	1	1	5E082	H01G  13/02	7	ǥ󥵴󵡡Σ	Machines for winding capacitors [2]
H01G  13/02  A	1	0	5E082	H01G  13/02	12	Ĵ	Adjusting capacities
H01G  13/02  B	1	0	5E082	H01G  13/02	25	եޤβù	Machining films or foils
H01G  13/02  C	1	0	5E082	H01G  13/02	99		Cores for winding
H01G  13/02  D	1	0	5E082	H01G  13/02	20	鹽¤	Roller structures
H01G  13/02  E	1	0	5E082	H01G  13/02	38		Feeding
H01G  13/02  F	1	0	5E082	H01G  13/02	43	ĥĴ	Adjusting tensions
H01G  13/02  G	1	0	5E082	H01G  13/02	5	֥졼	Brakes
H01G  13/02  H	1	0	5E082	H01G  13/02	44		Trimming
H01G  13/02  J	1	0	5E082	H01G  13/02	7	Τդ	Gluing
H01G  13/02  K	1	0	5E082	H01G  13/02	23	ʣΤ	Of multiple processes
H01G  13/02  L	1	0	5E082	H01G  13/02	20	¬ޤϸ	Measuring or inspecting
H01G  13/02  M	1	0	5E082	H01G  13/02	135	֤ι¤	Structures of winding devices
H01G  13/02  Z	1	0	5E082	H01G  13/02	66	¾Τ	Others
H01G  13/02 301 \	2	2	5E082	H01G  13/02	6	ˡ	Winding methods
H01G  13/02 301 A	2	0	5E082	H01G  13/02	53	Ϥ	Treatments before starting winding
H01G  13/02 301 B	2	0	5E082	H01G  13/02	40		Treatments after ending winding
H01G  13/02 301 C	2	0	5E082	H01G  13/02	11	곰	Treatment for unloading
H01G  13/02 301 D	2	0	5E082	H01G  13/02	9	Ʊ¿	Having multiple coaxial windings
H01G  13/02 301 Z	2	0	5E082	H01G  13/02	93	¾Τ	Others
H01G  13/04  \	1	1	5E082	H01G  13/04	222	硨޿Σ	Drying; Impregnating [2]
H01G  13/06  \	1	1	5E082	H01G  13/06	188	°ɽ̤뤿ĤΡΣ	with provision for removing metal surfaces [2]
H01G  15/00  \	0	0	5E088	H01G  15/00	906	Υ֥饹ΰۤʤᥤ󥰥롼פΤʤȤ⣲Ĥޤ륳ǥ󥵤ޤ¾֤ߤι¤Ūȹ碌ʾʤȤ⣱ĤΥϥ֥åɥǥ󥵤ޤŵءΣţģ̡ϥǥ󥵤ʥݡͥȤȤƴޤȣǣˡΣ	Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with each other (involving at least one hybrid or electric double-layer [EDL] capacitor as the main component H01G11/08)[6, 2013.01]
H01G  17/00  \	0	0	5E089	H01G  17/00	319	ʣĤΥǥ󥵡ޤϤΥ֥饹ΰۤʤᥤ󥰥롼פΤʤȤ⣲Ĥޤ¾֤Ȥι¤Ūȹ碌ǤäơΥ֥饹ޤʤ¾ŵǻҤͭΡ㡥ңȤ߹碌Σ	Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with other electric elements, not covered by this subclass, e.g. RC combinations [6]
