H05K   1/00  \	0	0	5E338	H05K   1/00	321	ϩΣ	Printed circuits[2006.01]
H05K   1/02  \	1	1	5E338	H05K   1/02	1156	Σ	Details[2006.01]
H05K   1/02  A	1	0	5E338	H05K   1/02	2080	Ĥη¤ħͭ	characterized by the shape or structure of the board
H05K   1/02  B	1	1	5E338	H05K   1/02	3797	ľΤȤѷ	deformed as a plate member
H05K   1/02  C	1	1	5E338	H05K   1/02	3895	η֤˴ؤ	related to the shape or layout of the hole
H05K   1/02  D	1	1	5E338	H05K   1/02	2074	Ĥ䶯˴ؤΡñʤ䶯ƳؤĤƱΤϣ	related to board reinforcement (simple reinforcement; each having a conductive layer 1/14)
H05K   1/02  E	1	2	5E338	H05K   1/02	767	°ˤ䶯̴ĤȿɻߤΤΥߡݥѥݥʤɡ	Reinforcement by a metal foil (dummy pattern for preventing board camber)
H05K   1/02  F	1	1	5E338	H05K   1/02	2880	ѼΡǮĤϤͿ͡ʳˤѤϤء	Area-deteriorated (this category is assigned to the heat radiation plate) (this category is assigned to cooling by other than wiring.)
H05K   1/02  G	1	1	5E338	H05K   1/02	2717	Ǥμʤͭġ̳Ȥ䶯ʬΤϣǡ	Board having a cutting means (reinforcement provided on the cut-off position G)
H05K   1/02  H	1	2	5E338	H05K   1/02	248	ǤĤѡĤ	Board to be cut that has a jumper wire
H05K   1/02  J	1	0	5E338	H05K   1/02	5445	ѥݥħͭΡŵʤȤƵǽʤΡ	characterized by the wiring pattern (not functioning as an electrical part)
H05K   1/02  K	1	1	5E338	H05K   1/02	622	ݸ˴ؤΡδŪݸϣĤء	related to protective wiring (relative protection of wiring D)
H05K   1/02  L	1	1	5E338	H05K   1/02	981	ƳΤΩŪѷΡ̴ĤȶѷΤޤ	Wiring conductor deformed in three-dimensional manner (including deformation along with the board)
H05K   1/02  M	1	1	5E338	H05K   1/02	331	˥СݥĤ˴ؤ	related to the universal wiring board
H05K   1/02  N	1	1	5E338	H05K   1/02	3042	Ÿݥ˴ؤΡ̣Фͥ	related to the power supply or earth wiring (takes precedence over P.)
H05K   1/02  P	1	1	5E338	H05K   1/02	3143	ݥ˴ؤΡ̥ԡݥޤ	related to the shield wiring (including impedance matching)
H05K   1/02  Q	1	1	5E338	H05K   1/02	1219	Ǯ˴ؤΡʳˤǮΤϣơ	related to the heat radiation wiring (heat radiation by other than wiring F)
H05K   1/02  R	1	0	5E338	H05K   1/02	2589	ɽܤġ̣ȣˣФ⻲ȡ	Board having ID indication (Also refer to H 05 K 1/18.)
H05K   1/02  S	1	1	5E338	H05K   1/02	252	ˤ뼱	Identification by colour
H05K   1/02  T	1	0	5E338	H05K   1/02	758	ƳʤĴ	Board having an optical conduction means
H05K   1/02  Z	1	0	5E338	H05K   1/02	279	¾	Others
H05K   1/03  \	2	2	5E341	H05K   1/03	797	ѺλѡΣ	Use of materials for the substrate [3]
H05K   1/03 610 \	3	3	5E341	H05K   1/03	24	ʬ¼Ū˰ؤΤ	Substantially one layer as the board member
H05K   1/03 610 A	3	0	5E341	H05K   1/03	156	ؤʤΡ¿ع¤ǤäƤƱؤΤϰؤȤư	Board member consisting of one layer (lamination of the same material is treated as one layer even though the structure consists of multi-layer lamination.)
H05K   1/03 610 B	3	0	5E341	H05K   1/03	438	̵ʬʬȤΡ㡨ߥʡ饹ޥߥåڡݥѡ	Inorganic component as the main component, e.g. alumina, glass, mica, ceramic paper
H05K   1/03 610 C	3	1	5E341	H05K   1/03	329	ʬħͭ	characterized by composition of components
H05K   1/03 610 D	3	2	5E341	H05K   1/03	1807	ߥåʤ	consisting of ceramics
H05K   1/03 610 E	3	3	5E341	H05K   1/03	495	ⲽߥ˥ࡤɣΤʤ	consisting of aluminium nitride or AIN
H05K   1/03 610 G	3	0	5E341	H05K   1/03	697	ͭʬʬȤ	Organic component as the main component
H05K   1/03 610 H	3	1	5E341	H05K   1/03	3138	ʬħͭ	characterized by the resin component
H05K   1/03 610 J	3	2	5E341	H05K   1/03	359	ݥꥪեϡ	Polyolefin, acryl
H05K   1/03 610 K	3	2	5E341	H05K   1/03	452	եΡݥ	Phenol
H05K   1/03 610 L	3	2	5E341	H05K   1/03	3150	ݥ	Epoxy
H05K   1/03 610 M	3	2	5E341	H05K   1/03	618	ݥꥨƥϡ˰¡˰¡	Polyester (saturated or unsaturated)
H05K   1/03 610 N	3	2	5E341	H05K   1/03	2608	ݥꥤߥɷϡݥꥢߥɷ	Polyimide, polyamide
H05K   1/03 610 P	3	3	5E341	H05K   1/03	618	ݥꥤߥΡݥꥢߥɻ	Polyimide precursor, polyamic acid, polyamide acid
H05K   1/03 610 Q	3	1	5E341	H05K   1/03	313	źúޤħͭΡδȤʤͭʬźäΡ	characterized by the additive (added to the organic component as the base
H05K   1/03 610 R	3	2	5E341	H05K   1/03	1907	̵ʪźú	Additive for an inorganic compound
H05K   1/03 610 S	3	2	5E341	H05K   1/03	659	ͭʪźú	Additive for an organic compound
H05K   1/03 610 T	3	1	5E341	H05K   1/03	1900	ץץ쥰δħͭΡ֥饹ʪԿۡڡݥѡ	characterized by the pre-preg base (glass cloth, fabric, non-woven fabric, paper)
H05K   1/03 610 U	3	2	5E341	H05K   1/03	506	ߥɡ˧²ߥ	Aramid, all aromatic amides
H05K   1/03 610 Z	3	0	5E341	H05K   1/03	136	¾	Others
H05K   1/03 630 \	3	3	5E341	H05K   1/03	6		Lamination
H05K   1/03 630 A	3	0	5E341	H05K   1/03	267	Τع¤ʤ	Base consisting of a lamination structure
H05K   1/03 630 B	3	1	5E341	H05K   1/03	192	ͭʬʤ	Lamination consisting of an organic component
H05K   1/03 630 C	3	2	5E341	H05K   1/03	319	ؤΤߤꤵƤΡؤʬ	One layer only specified (resin component configuring the layer)
H05K   1/03 630 D	3	2	5E341	H05K   1/03	965	ؤꤵƤ	Two layers specified
H05K   1/03 630 E	3	2	5E341	H05K   1/03	299	ذʾ夫鹽	consisting of at least three layers
H05K   1/03 630 F	3	2	5E341	H05K   1/03	579	ʣΥץץ쥰ΤߤʤΡδޤॳݥåȥס	consisting of multiple types of pre-pregs only (including the composite type)
H05K   1/03 630 G	3	1	5E341	H05K   1/03	376	̵ؤޤ	Lamination including an inorganic later
H05K   1/03 630 H	3	2	5E341	H05K   1/03	1757	ƼĥΡ°Ƽޤ	Copper-plated lamination including the metal foil or copper foil
H05K   1/03 630 J	3	2	5E341	H05K   1/03	528	ߥåޤ	including ceramics
H05K   1/03 630 Z	3	0	5E341	H05K   1/03	22	¾	Others
H05K   1/03 650 \	3	3	5E341	H05K   1/03	1412	ؤ𤷤ܹ礹	Bonding via an adhesive layer
H05K   1/03 670 \	3	3	5E341	H05K   1/03	514	ե쥭֥	Flexible base
H05K   1/03 670 A	3	0	5E341	H05K   1/03	904	ؤΤʤ	having no adhesive layer
H05K   1/03 670 Z	3	0	5E341	H05K   1/03	1251	¾	Others
H05K   1/05  \	3	3	5E315	H05K   1/05	226	°ΡΣ	Insulated metal substrate [3]
H05K   1/05  A	3	0	5E315	H05K   1/05	1220	ħͭΡ̹¤Ⱥ	characterized by the insulation material (structure and material)
H05K   1/05  B	3	0	5E315	H05K   1/05	756	°ħͭΡ̹¤Ⱥ	characterized by the metal material (structure and material)
H05K   1/05  C	3	0	5E315	H05K   1/05	213	ۤĤ˴ؤΡ̣¤ͥ	related to the porcelain enamel board (takes precedence over A and B.)
H05K   1/05  Z	3	0	5E315	H05K   1/05	1429	¾̶°ĤȲϩƳΤȤΥݥ³ʤɡ	Others (earth connection of the metal core and circuit conductor)
H05K   1/09  \	2	2	4E351	H05K   1/09	203	°ѥΤκλѡΣ	Use of materials for the metallic pattern [3]
H05K   1/09  A	2	0	4E351	H05K   1/09	4162	Ƴźħͭ	characterized by the conductive material
H05K   1/09  B	2	1	4E351	H05K   1/09	417	֥ǥ󡤥󥰥ƥޤ	including molybdenum and tungsten
H05K   1/09  C	2	1	4E351	H05K   1/09	2752	Ƴź¿ؤȤƤλѡ̣ȣˣ򻲾ȡ	using the conductive material for multiple layers (Refer to H 05 K 3/24, 3/22.)
H05K   1/09  D	2	0	4E351	H05K   1/09	1260	ͭħͭΡ̵ʣ¢Ϣ좭ϢˤϣڤءͭӥҥʤɤϤء	characterized by the organic material (inorganic material (B2O3, Al2O3) Z. This category is applied to organic vehicles.)
H05K   1/09  Z	2	0	4E351	H05K   1/09	618	¾̥饹եåȤʤɡ	Others (glass frit, etc.)
H05K   1/11  \	2	2	5E317	H05K   1/11	290	ϩؤΡޤϰϩ֤ŵŪ³ΤΰǡΣ	Printed elements for providing electric connections to or between printed circuits [3]
H05K   1/11  A	2	0	5E317	H05K   1/11	1069	Ʊľˤ֤³˴ؤ	related to the connection between wires on a board
H05K   1/11  B	2	1	5E317	H05K   1/11	232	ˤ³	Connection by printing
H05K   1/11  C	2	0	5E317	H05K   1/11	1430	Ĥ˴ؤ	related to the board connection
H05K   1/11  D	2	1	5E317	H05K   1/11	1141	ѥݥ˴ؤΡΥѥݥħΤΡ	related to the wiring pattern (characterized by the connection pattern)
H05K   1/11  E	2	1	5E317	H05K   1/11	298	ݸʤܤƤ	Protection means applied
H05K   1/11  F	2	0	5E317	H05K   1/11	544	ɽ΢ƳΤ¦³˴ؤ	related to the side connection of the front and rear conductor
H05K   1/11  G	2	1	5E317	H05K   1/11	102	³ˤ	using a connection device
H05K   1/11  H	2	0	5E317	H05K   1/11	2108	ɽ΢ƳΤΥݥۡݥ³̴̹ɤƳؤˤ³	Through-hole connection of the front and rear conductor (connection by the conductive layer on the inner surface of the through-hole)
H05K   1/11  J	2	1	5E317	H05K   1/11	194	ݥˤΡ̥ݥۡݥ˥ݥɽ΢̤³	using a lead wire (connection between the front and rear sides by inserting a lead wire into the through-hole)
H05K   1/11  K	2	1	5E317	H05K   1/11	158	ƳΤѷˤΡؤϢ³ƳΤѷ	Using deformation of the conductor (deformation of the conductor that continues from the wiring layer)
H05K   1/11  L	2	1	5E317	H05K   1/11	524	ƳΤˤΡ̥ԥʤɡ	using a solid conductor (pin, etc.)
H05K   1/11  M	2	1	5E317	H05K   1/11	193	ƳΤˤΡ̤ϤȤʤɡ	using a hollow conductor (eyelet, etc.)
H05K   1/11  N	2	1	5E317	H05K   1/11	2521	ƳźνŶˤ	filling a conductive material
H05K   1/11  Z	2	0	5E317	H05K   1/11	961	¾̸ü˴ؤΡ	Others (blind hole, inspection terminal)
H05K   1/14  \	2	2	5E344	H05K   1/14	420	İʾΰϩι¤ŪʰϩФޤϰϩ֤ŵŪ³򤹤뤿ΤΣȣˣȣңˡΣ	Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K 1/11, H01R 12/00)
H05K   1/14  A	2	0	5E344	H05K   1/14	1498	ϩĤľ³	Direct connection of printed circuit boards
H05K   1/14  B	2	1	5E344	H05K   1/14	276	ϩĤȤ	Fitting one printed circuit board into another
H05K   1/14  C	2	1	5E344	H05K   1/14	3238	ϩĤȥե쥭֥ĤȤ³	Connection between the printed circuit board and flexible board
H05K   1/14  D	2	1	5E344	H05K   1/14	1170	ϩĤοľ³	Vertical connection of printed circuit boards
H05K   1/14  E	2	0	5E344	H05K   1/14	1408	ϩĤ³𤷤³	Connection of printed circuit boards via a connection member
H05K   1/14  F	2	1	5E344	H05K   1/14	480	³ȤŻʤͿƤ	Electronic part used as the connection member
H05K   1/14  G	2	1	5E344	H05K   1/14	1667	ϩĤνŤ͹礻ˤ³	Connection by overlapping printed circuit boards together
H05K   1/14  H	2	1	5E344	H05K   1/14	2254	³ħΤ	characterized by the connection member
H05K   1/14  J	2	2	5E344	H05K   1/14	985	³बͭƳǤΡ̣ȣˣȡ	Organic conductive material as the connection member (Refer to H 05 K 3/32.)
H05K   1/14  Z	2	0	5E344	H05K   1/14	337	¾	Others
H05K   1/16  \	1	1	4E351	H05K   1/16	418	ŵʡ㡥񹳴ǥϰΡΣ	incorporating printed electric components, e.g. printed resistors, capacitors or inductors[2006.01]
H05K   1/16  A	1	0	4E351	H05K   1/16	451	ŵʤΤߤʤ	consisting of printed electrical parts only
H05K   1/16  B	1	1	4E351	H05K   1/16	1539	ñʡ̼˰롤ϡȣƣϡ	Single printed part (mainly printed coil. Main category is H 01 F 17 or 15.)
H05K   1/16  C	1	2	4E351	H05K   1/16	2412		Printed resistor
H05K   1/16  D	1	2	4E351	H05K   1/16	1113	ǥ	Printed capacitor
H05K   1/16  E	1	0	4E351	H05K   1/16	752	ŵʤȰˤʤŵʤȤȤ߹礻	Combination of the printed electrical part and non-printed electrical part
H05K   1/16  Z	1	0	4E351	H05K   1/16	364	¾	Others
H05K   1/18  \	1	1	5E336	H05K   1/18	192	ˤʤŵʤȹ¤Ū˷礷ΡʣȣˣͥˡΣ	structurally associated with non-printed electric components  (H05K0001160000 takes precedence)[2026.01]
H05K   1/18  S	1	0	5E336	H05K   1/18	3276	ʣʤΰϩؤľܼ	Direct installation of multiple parts on the printed board
H05K   1/18  T	1	1	5E336	H05K   1/18	660	°ѤΡ̢ͥ𤹤Ρա	using an accessory ( , via a connector U)
H05K   1/18  U	1	0	5E336	H05K   1/18	1899	ŵʤΰϩؤδŪʼա̥ͥΤΡȣҡ	Indirect installation of the electrical part on the printed board (connector itself H 01 R)
H05K   1/18  Z	1	0	5E336	H05K   1/18	474	¾	Others
H05K   1/181  \	2	2	5E336	H05K   1/181	0	ɽ̼ʤȷ礷ΡΣ	associated with surface mounted components[2026.01]
H05K   1/181  A	2	0	5E336	H05K   1/181	1079	ݥʤǤ	Leaded components
H05K   1/181  B	2	1	5E336	H05K   1/181	1888	ݥʤηħĤ	Characterised by the shapes of leaded components
H05K   1/181  C	2	0	5E336	H05K   1/181	2275	ݥɥ쥹ʤǤ	Leadless components
H05K   1/181  D	2	1	5E336	H05K   1/181	1469	ݥɥ쥹ʤηħĤ	Characterised by the shapes of leadless components
H05K   1/181  E	2	2	5E336	H05K   1/181	1217	եåץå	Flip chips
H05K   1/181  Z	2	0	5E336	H05K   1/181	833	¾	Others
H05K   1/182  \	2	2	5E336	H05K   1/182	0	ץȴġΣУã¡˼줿ʡ㡥ʡΣɣͣáϡȷ礷ΡΣ	associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC][2026.01]
H05K   1/182  A	2	0	5E336	H05K   1/182	1619	ݥüҤηϺħĤ	Characterised by shapes or materials of lead terminals
H05K   1/182  B	2	0	5E336	H05K   1/182	750	ݥüҤüʤηħĤ	Characterised by the shapes of mounting terminals other than lead terminals or by the shapes of components
H05K   1/182  C	2	0	5E336	H05K   1/182	1682	°㡥ڡѤ	Mounting using accessories, e.g., spacers
H05K   1/182  D	2	1	5E336	H05K   1/182	448	°㡥ϤȤᡤŵŪ³ѤΤΤǤΡʥͥ𤷤Ƥμաա	Accessories, e.g., eyelets used for electrical connections (installation via connectors: 1/18U)
H05K   1/182  Z	2	0	5E336	H05K   1/182	1899	¾	Others
H05K   1/183  \	3	3	5E336	H05K   1/183	0	Уã¤α˼ڤӻٻ줿ʤȷ礷ΡΣ	associated with components mounted in and supported by recessed areas of the PCBs[2026.01]
H05K   1/183  A	3	0	5E336	H05K   1/183	0	ݥɥ쥹ʤǤ	Leadless components
H05K   1/183  Z	3	0	5E336	H05K   1/183	0	¾	Others
H05K   1/184  \	3	3	5E336	H05K   1/184	0	Уã¤δ̹줿ʤȷ礷ΤǤäơʤüҤϡδ̹̾㤷Ϥüΰ³Ƥ뤫ϡδ̹ĶƼ㤷Ϥδ̹ͽФƤΣ	associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes[2026.01]
H05K   1/184  A	3	0	5E336	H05K   1/184	0	ݥʤǤ	Leaded components
H05K   1/184  B	3	0	5E336	H05K   1/184	0	ݥɥ쥹ʤǤ	Leadless components
H05K   1/184  Z	3	0	5E336	H05K   1/184	0	¾	Others
H05K   1/185  \	3	3	5E336	H05K   1/185	3087	Уã¤줿ʤȷ礷Ρ¿إץȴĤȤ߹ޤ줿ʤȷ礷ΡΣ	associated with components encapsulated in the insulating substrate of the PCBs; associated with components  incorporated in internal layers of multilayer circuit boards[2026.01]
H05K   1/189  \	2	2	5E336	H05K   1/189	0	ե쥭֥ޤꤿ߰ϩλѤħȤΡΣ	characterised by the use of flexible or folded printed circuits[2026.01]
H05K   3/00  \	0	0	5E342	H05K   3/00	229	ϩ¤뤿֤ޤˡΣ	Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) [3]
H05K   3/00  A	0	0	5E342	H05K   3/00	323	üˡˤ¤΢󥿥ˡ	Manufacture of the printed wiring by a special method (&larr; cookie-cutter method)
H05K   3/00  W	0	1	5E342	H05K   3/00	903	ѤΡ΢󥵡	using the resin moulding technology (&larr; insertion moulding)
H05K   3/00  B	0	0	5E342	H05K   3/00	268	ʣ繩ʤ¤Υ֥ȥ饯ȹȥǥƥֹȤȹ礻ߥǥƥˡʴޡգԣˡˤϥǥƥˡء	Manufacture of the printed wiring in composite processes (combination of the subtractive process and additive process, semi-additive method (including the UTC method) included in the additive method)
H05K   3/00  X	0	0	5E342	H05K   3/00	2493	¿ˤ¤΢ΤΡ	Manufacture of the printed wiring by taking multiple pieces ( &larr; 2-piece taking)
H05K   3/00  C	0	0	5E342	H05K   3/00	257	¿ʹʤ¤Σ¡ؤͥ	Manufacture of the printed wiring in multiple processes (B and X take precedence.)
H05K   3/00  D	0	0	5E342	H05K   3/00	1583	ãĤˤ߷סμʬࢪǣƣ	Design of the printed wiring by CAD (main category R  G 06 F 15)
H05K   3/00  Y	0	0	5E342	H05K   3/00	179	ãĤˤʤ߷ס΢߷Ѷʡ	Design of the printed wiring not using CAD (&larr; design tool, utilities)
H05K   3/00  E	0	0	5E342	H05K   3/00	388	Ϫѥޥμʬࢪǣơ	Exposure mask (main category R G 03 F)
H05K   3/00  F	0	0	5E342	H05K   3/00	1195	ѥ쥸ȺμʬࢪǣơŪå󥰥쥸Ⱥȡ	Multi-purpose resist material (main category R G 03 F, etching resist material in general R 3/06 H)
H05K   3/00  G	0	0	5E342	H05K   3/00	637	Ϫˡμʬࢪǣơ	Exposure method (main category R G 03 F)
H05K   3/00  H	0	0	5E342	H05K   3/00	926	Ϫ֡μʬࢪǣơ	Exposure device (main category R G 03 F)
H05K   3/00  J	0	0	5E342	H05K   3/00	1357	ĤεŪùˡ΢ùΰַˡǤȴˡˡùθˡ	Mechanical machining method for the board (&larr; alignment method in machining, punching method, indexing method, method of inspection after machining)
H05K   3/00  K	0	1	5E342	H05K   3/00	1410	ˡ΢å󥰤ˤ빦ˡ¤ˡθˡ	Boring method (&larr; boring method by etching, spot facing method, method of inspection after boring)
H05K   3/00  L	0	0	5E342	H05K   3/00	1320	ĤεŪù֡βùѼ°֡	Mechanical machining device for the board (machining jig, accessory device)
H05K   3/00  M	0	1	5E342	H05K   3/00	681		Boring device
H05K   3/00  N	0	0	5E342	H05K   3/00	2890	ĤΥ졼ùΣʡ̤ͥ褹롤졼ˤѥηġ졼ù̢£ˡ	Laser machining for the board (takes precedence over J and L. Forming the wiring pattern by laser R 3/08 D, laser machining in general R B 23 K)
H05K   3/00  P	0	0	5E342	H05K   3/00	1088	ϩĤؤΥޡ󥰡Υޡ󥰤줿΢ҡӡ	Marking on the printed wiring/circuit board (marked R 1/02 R, S)
H05K   3/00  V	0	0	5E342	H05K   3/00	549	λμʬࢪǣҡǣΡå󥰤λġ	Testing or inspection of the printed wiring (main category R G 01 R, G 01 N, testing or inspection of etching R 3/06 D)
H05K   3/00  Q	0	1	5E342	H05K   3/00	1659	Ѥ΢ʹ֤λФˤΡ	Testing or inspection utilising light (&larr; by human's visual sense)
H05K   3/00  S	0	2	5E342	H05K   3/00	298	롼ۡʬλ	Testing or inspection of the through-hole
H05K   3/00  T	0	1	5E342	H05K   3/00	2259	ŵѤΣѤͥ	Testing or inspection utilising electricity (Q takes precedence.)
H05K   3/00  U	0	2	5E342	H05K   3/00	111	롼ۡʬλ	Testing or inspection of the through-hole
H05K   3/00  R	0	0	5E342	H05K   3/00	1644	Ƴʪٻ̤˻ܤΡذ̢£¡ѥå󥰰̢ãá	Conductive substance applied to the entire surface of the insulation supporting member (lamination in general R B 32 B, spattering in general R C 23 C)
H05K   3/00  Z	0	0	5E342	H05K   3/00	768	¾	Others
H05K   3/02  \	1	1	5E339	H05K   3/02	40	Ƴʪٻɽ̤˻ܤ줽θήƳפؤΤ˻Ȥʤʬɽ̤ΡΣ	in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K   3/02  A	1	0	5E339	H05K   3/02	248	եȥˡΡ̲ؤ뤳ȤˤꡤξˤؤƱ˽	using the lift-off method (by removing the lower layer, the upper layer is removed at the same time.)
H05K   3/02  B	1	0	5E339	H05K   3/02	189	ƳʪʪΤ	Conductive substance having the light-sensitive composition
H05K   3/02  Z	1	0	5E339	H05K   3/02	83	¾ƳؤŪƳβ	Others (making the conductor layer non-conductive selectively)
H05K   3/04  \	2	2	5E339	H05K   3/04	12	ƳʪŪ˼Ρ㡥ѥˤΡΣ	the conductive material being removed mechanically, e.g. by punching
H05K   3/04  A	2	0	5E339	H05K   3/04	101	ںˤ	by cutting
H05K   3/04  B	2	0	5E339	H05K   3/04	156	ȴˤΡ̢ˡ͡ȴƱ˼ΡѥȴƤŽΤϡڡ	by punching (&larr; die stamp method) (punched and embedded into the resin at the same time; pattern punching then bonding 3/20 Z)
H05K   3/04  C	2	1	5E339	H05K   3/04	36	ⷿ˴ؤ	related to the metal mold
H05K   3/04  D	2	0	5E339	H05K   3/04	56	ɥ֥饹Ȥˤ	using sand blasting
H05K   3/04  Z	2	0	5E339	H05K   3/04	71	¾̥ɥ֥饹ȤˤΡ	Others (by polishing other than sand blasting)
H05K   3/06  \	2	2	5E339	H05K   3/06	164	ƳʪŪˤޤŵʬˤΡ㡥ۥȥåˡΣ	the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K   3/06  A	2	0	5E339	H05K   3/06	1640	åˡ̡̥å󥰹ޤ¤ˡ	Etching method in general (manufacturing method including the etching process)
H05K   3/06  B	2	1	5E339	H05K   3/06	279	̢ݸν̥͡쥸ȷ̤ʤɥ쥸ȷν	Pre-treatment (&larr; protective layer removal) (process such as cleaning of the resist forming surface before resist forming)
H05K   3/06  C	2	1	5E339	H05K   3/06	331	̢쥸Ȥν̥͡å󥰸ν	Post-treatment (&larr; resist removal) (process after etching)
H05K   3/06  D	2	1	5E339	H05K   3/06	275	å󥰤桤̢쥸Ȥθ̥͡å󥰱դδ	Etching control or inspection (&larr; resist inspection) (etching liquid management or control)
H05K   3/06  E	2	0	5E339	H05K   3/06	1070	쥸ȤηϪǡȡ	Resist forming (exposure R 3/00 G, H)
H05K   3/06  F	2	1	5E339	H05K   3/06	490	쥸Ȥ̢ۡѥľܷ	Resist coating (&larr; direct pattern forming)
H05K   3/06  G	2	1	5E339	H05K   3/06	209	쥸ȤθΥʡ	Resist developing (peeling development R 3/06 J)
H05K   3/06  H	2	0	5E339	H05K   3/06	1274	쥸ȺħΤΡ̴եࢪǣá	characterized by the resist material (light-sensitive film R G 03 C)
H05K   3/06  J	2	1	5E339	H05K   3/06	1170	ե쥸ȤΡ̥ߥ͡ơפŽ塤Υ֡ե쥸ؤĲϩĺ	using a film resist (laminator; tape bonding/peeling device; circuit board material having a film resist layer)
H05K   3/06  K	2	1	5E339	H05K   3/06	327	᥿쥸ȤΡ̶°ʪ쥸Ȥޤ	using a metal resist (including the metal oxide resist)
H05K   3/06  L	2	1	5E339	H05K   3/06	179	ؤΥ쥸Ȥ	using a 2-layer resist
H05K   3/06  M	2	0	5E339	H05K   3/06	417	å󥰺ħΤ	characterized by the etching material
H05K   3/06  N	2	1	5E339	H05K   3/06	351	ƼФ륨å󥰺	Etching material for copper
H05K   3/06  P	2	1	5E339	H05K   3/06	106	°Ф륨å󥰺	Etching material for non-metal
H05K   3/06  Q	2	0	5E339	H05K   3/06	544	å֤֡ħΤˡ	Etching apparatus (method characterized by the device)
H05K   3/06  Z	2	0	5E339	H05K   3/06	98	¾̢ꥨå󥰡ץ饺ޡѥå󡤥졼γƥå󥰤ϣġ	Others (&larr; gas phase etching; plasma, spatter, ion, or laser etching 3/08 A to D)
H05K   3/07  \	3	3	5E339	H05K   3/07	62	ŵʬˤΡΣ	being removed electrolytically [3]
H05K   3/08  \	2	2	5E339	H05K   3/08	2	ƳʪŤˤäƼΡ㡥вŤοΣ	the conductive material being removed by electric discharge, e.g. by spark erosion
H05K   3/08  A	2	0	5E339	H05K   3/08	80	ץ饺ޥå󥰤ˤΡ̥ץ饺ʷϵΥå󥰡	using plasma etching (etching in the plasma atmosphere)
H05K   3/08  B	2	0	5E339	H05K   3/08	33	ѥåå󥰤ˤΡʿԤŶĤȤäƹԤå󥰡	using spatter etching (etching by applying high frequency to parallel electrode plates)
H05K   3/08  C	2	0	5E339	H05K   3/08	42	󥨥å󥰤ˤΡ̥ȯȯĤˤ֤ĤƹԤå󥰡	using ion etching (etching by hitting the ion generated from the ion generation source against the board)
H05K   3/08  D	2	0	5E339	H05K   3/08	364	졼å󥰤ˤΡ̥졼ùΡ	using laser etching (laser machining R 3/00 N)
H05K   3/08  Z	2	0	5E339	H05K   3/08	26	¾̢ťå󥰤ˤΡ̤͡¾εꥨå󥰢ڡ	Others (&larr;  using discharge etching) (other gas phase etching R 3/06 Z)
H05K   3/10  \	1	1	5E343	H05K   3/10	35	Ƴʪ˾Ƴͤ褦ٻ˻ܤΡΣ	in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K   3/10  A	1	0	5E343	H05K   3/10	345	磻ˡ̢ޥ磻ˡ	Wire installation method (&larr; multi-wire R method)
H05K   3/10  B	1	0	5E343	H05K   3/10	164	ʴˡ	Powder adhesion method
H05K   3/10  C	1	0	5E343	H05K   3/10	637	ͥ륮ȼͤˤѥ	Pattern forming by energy irradiation
H05K   3/10  D	1	0	5E343	H05K   3/10	1795	ǽˡˡ	Delivery method (drawing method)
H05K   3/10  E	1	0	5E343	H05K   3/10	948	ؤƳźνŶ	Filling concavity with the conductive material
H05K   3/10  Z	1	0	5E343	H05K   3/10	231	¾	Others
H05K   3/12  \	2	2	5E343	H05K   3/12	145	Ƴʪ夹Τ˰ѤѤΡΣ	using printing techniques to apply the conductive material
H05K   3/12 610 \	3	3	5E343	H05K   3/12	18	꡼ˤ	using screen printing
H05K   3/12 610 A	3	0	5E343	H05K   3/12	398	ͭĤؤΰʴĺΤʤΤϣš	Printing on an organic board (board material not specified A to E)
H05K   3/12 610 B	3	1	5E343	H05K   3/12	972	ƳťڡȤħΤΡƳťڡȤν	characterized by the conductive paste, conductive paste treatment
H05K   3/12 610 C	3	1	5E343	H05K   3/12	206		Pre-treatment
H05K   3/12 610 D	3	1	5E343	H05K   3/12	451	ʹŲޤ	Post-treatment (including the hardening process)
H05K   3/12 610 E	3	1	5E343	H05K   3/12	101	ֹ碌	Alignment
H05K   3/12 610 F	3	0	5E343	H05K   3/12	136	̵Ĥؤΰʣͥ	Printing on an inorganic board (M takes precedence.)
H05K   3/12 610 G	3	1	5E343	H05K   3/12	548	ƳťڡȤħΤΡƳťڡȤν	characterized by the conductive paste, conductive paste treatment
H05K   3/12 610 H	3	1	5E343	H05K   3/12	121		Pre-treatment
H05K   3/12 610 J	3	1	5E343	H05K   3/12	324	ʾޤ	Post-treatment (including the baking process)
H05K   3/12 610 K	3	1	5E343	H05K   3/12	95	֡ʾϧѼ	Baking apparatus (baking furnace, baking jig)
H05K   3/12 610 L	3	1	5E343	H05K   3/12	54	ֹ碌	Alignment
H05K   3/12 610 M	3	1	5E343	H05K   3/12	264	꡼󥷡ȤؤΰʴĤƳͤƱΡ	Printing on the green sheet (board and conductor pattern baked at the same time)
H05K   3/12 610 N	3	0	5E343	H05K   3/12	950	꡼֡ʼ£ơ	Screen printing apparatus (mainly B 41 F)
H05K   3/12 610 P	3	1	5E343	H05K   3/12	808	꡼󡢥ޥ	Screen, mask
H05K   3/12 610 Q	3	1	5E343	H05K   3/12	320	֡	Device for ink tack, squeezee
H05K   3/12 610 R	3	1	5E343	H05K   3/12	287	ֹ碌	Alignment apparatus
H05K   3/12 610 Z	3	0	5E343	H05K   3/12	37	¾	Others
H05K   3/12 630 \	3	3	5E343	H05K   3/12	18	꡼ʳΰˡˤ	using a printing method other than screen printing
H05K   3/12 630 A	3	0	5E343	H05K   3/12	236	š	Electrostatic or magnetic printing
H05K   3/12 630 Z	3	0	5E343	H05K   3/12	722	¾ʿǡǰʤɡ	Others (lithography, letterpress, etc.)
H05K   3/14  \	2	2	5E343	H05K   3/14	21	Ƴʪ夹Τ˥ץ쵻ѤѤΡΣ	using spraying techniques to apply the conductive material
H05K   3/14  A	2	0	5E343	H05K   3/14	451	塦ץ졼ƥ󥰡ˡ	Evaporation or ion plating (method)
H05K   3/14  B	2	1	5E343	H05K   3/14	133	̥֡ޥޤ	Apparatus (including masking)
H05K   3/14  Z	2	0	5E343	H05K   3/14	99	¾ϼ͡	Others (flame spraying)
H05K   3/16  \	3	3	5E343	H05K   3/16	267	ɥѥå󥰤ˤΡΣ	by cathodic sputtering
H05K   3/18  \	2	2	5E343	H05K   3/18	120	Ƴʪ夹ΤǤ󵻽ѤѤΡΣ	using precipitation techniques to apply the conductive material
H05K   3/18  A	2	0	5E343	H05K   3/18	1340	̢ط㡥	Pre-treatment (&larr; adhesive layer forming, etc.)
H05K   3/18  K	2	1	5E343	H05K   3/18	332	̲	Coarse surface making
H05K   3/18  B	2	1	5E343	H05K   3/18	1378	åˤη̢	Plating core forming (&larr; activation, sensitisation)
H05K   3/18  C	2	2	5E343	H05K   3/18	303	ˤ	using light
H05K   3/18  D	2	1	5E343	H05K   3/18	1931	å쥸ȡ̢åޥ	Plating resist (&larr; plating mask)
H05K   3/18  E	2	0	5E343	H05K   3/18	985	Ĥؤκǽ̵Ųå̵Ųåι硤ħΤΡ	Primary non-electrolytic plating to the board (characterized by the process combination or operation of non-electrolytic plating)
H05K   3/18  F	2	1	5E343	H05K   3/18	334	åաħ̼͡ϡãã	Plating liquid (characterized by the composition (mainly C 23 C 18/)
H05K   3/18  G	2	0	5E343	H05K   3/18	1224	ĤؤŪŲåŲäա	Secondary electrolytic plating to the board (electrolytic plating liquid, electrolytic plating device) (copper foil as the base in most cases) (paste, etc. as the base 3/24 A)
H05K   3/18  H	2	1	5E343	H05K   3/18	553	ǽƳؤ̵Ųåˤ	First conductive layer made by non-electrolytic plating
H05K   3/18  J	2	0	5E343	H05K   3/18	382	ĤؤŪ̵Ųå̲Ƽ󡤾줬¿	Secondary non-electrolytic plating to the board (copper foil or evaporated film as the base in most cases)
H05K   3/18  L	2	0	5E343	H05K   3/18	109	å֡ʰŪʥå֡ˡʼϣãáãġ	Plating apparatus (plating apparatus in general) (mainly C 23 C, C 25 D)
H05K   3/18  M	2	1	5E343	H05K   3/18	75	̵Ųå֡ʼϣãá	Non-electrolytic plating apparatus (mainly C 23 C)
H05K   3/18  N	2	1	5E343	H05K   3/18	285	Ųå֡ʼϣãġ	Electrolytic plating apparatus (mainly C 25 D)
H05K   3/18  Z	2	0	5E343	H05K   3/18	279	¾	Others
H05K   3/20  \	2	2	5E343	H05K   3/20	13	餫ȤΩƤƳͤŽ夹ΡΣ	by affixing prefabricated conductor pattern
H05K   3/20  A	2	0	5E343	H05K   3/20	965	ž̤ˤΡƳͤ򥨥å󥰡ʤɤǺž̴̢͡Τμͽ	using copy (copy base that created the conductor pattern by etching or evaporation) (&larr; injection moulding of the base)
H05K   3/20  B	2	1	5E343	H05K   3/20	652	åˤƳͤʤž	Copy member consisting of the conductor pattern made by plating
H05K   3/20  C	2	1	5E343	H05K   3/20	568	ˤƳͤʤž	Copy member consisting of the conductor pattern made by printing
H05K   3/20  Z	2	0	5E343	H05K   3/20	891	¾ѥƳĤʤɤĤŽĤ	Others (conductor plate having the wiring pattern bonded to the board)
H05K   3/22  \	1	1	5E343	H05K   3/22	41	ϩΣŪΣ	Secondary treatment of printed circuits
H05K   3/22  A	1	0	5E343	H05K   3/22	851	Ƴͤνѹ	Modification or change of the conductor pattern
H05K   3/22  D	1	1	5E343	H05K   3/22	127	ƳΤϽФˤΡŲå̵ŲåУ֣ġã֣ĤʤɤˤΡ	using conductor deposition (electrolytic plating, non-electrolytic plating, PVD, CVD, etc.)
H05K   3/22  E	1	1	5E343	H05K   3/22	473	ƳͤνˤΡǡƳΤƳβޤ	Removal of the conductor pattern (including cut-off and making the conductor non-conductive)
H05K   3/22  B	1	0	5E343	H05K   3/22	576	Ƴͤʿ경ʿġ֤͡ؤ	Smoothing of the conductor patterns (smooth board) (wiring embedded, insulation layer embedded between wires)
H05K   3/22  C	1	0	5E343	H05K   3/22	268	ϩĤΥζ	Correction for camber of the printed circuit board
H05K   3/22  Z	1	0	5E343	H05K   3/22	324	¾̥󥰡Ǯ	Others (aging, heat treatment)
H05K   3/24  \	2	2	5E343	H05K   3/24	22	Ƴͤ䶯Σ	Reinforcing of the conductive pattern
H05K   3/24  A	2	0	5E343	H05K   3/24	2642	åˤΡ̣ذʾΰۼƳΤŲϲؤäؤ򾯤ȤǳؤˤĤΡ	using plating (conductor consisting of at least two different type layers with the electrolytic plating layer or chemical plating layer provided on the outer-most layer, e.g. paste for the base layer and copper plating for the upper layer)
H05K   3/24  C	2	1	5E343	H05K   3/24	297	ؤƳťڡȤǷ줿	Base layer formed with conductive paste
H05K   3/24  D	2	1	5E343	H05K   3/24	381	ʬŪ䶯	Partial reinforcement
H05K   3/24  E	2	2	5E343	H05K   3/24	9	ʬå	Partial plating apparatus
H05K   3/24  B	2	0	5E343	H05K   3/24	937	ϥˤΡͻϤŲϤäʤΡ	using soldering (wiring covered by fused solder or electrolytic solder plating)
H05K   3/24  F	2	1	5E343	H05K   3/24	87	ϥʤθʥե塼󥰡٥󥰤ʤɡ	Post-treatment after covering with solder (fusing, levelling, etc.)
H05K   3/24  Z	2	0	5E343	H05K   3/24	668	¾̥ڡȡ塤Ƴĥ碌ʤɤˤ䶯	Others (reinforcement by paste, evaporation, or bonding a conductive foil)
H05K   3/26  \	2	2	5E343	H05K   3/26	1457	ƳͤޤϸΣ	Cleaning or polishing of the conductive pattern
H05K   3/26  A	2	0	5E343	H05K   3/26	955	ˡ֡	Washing (washing method or apparatus)
H05K   3/26  B	2	1	5E343	H05K   3/26	300		Washing in the hole
H05K   3/26  C	2	1	5E343	H05K   3/26	123	ιʤꡢʤɡ	Post-treatment (squeezing, drying, etc.)
H05K   3/26  D	2	1	5E343	H05K   3/26	56	դκդθޤ	Recycling of the washing liquid (including inspection of the washing liquid)
H05K   3/26  E	2	1	5E343	H05K   3/26	524	ադ	Washing liquid (composition of the washing liquid)
H05K   3/26  F	2	0	5E343	H05K   3/26	411	εŪࡢŪޤ	Polishing (including mechanical polishing and chemical polishing)
H05K   3/26  Z	2	0	5E343	H05K   3/26	56	¾	Others
H05K   3/28  \	2	2	5E314	H05K   3/28	132	°ݸʤܤȡΣ	Applying non-metallic protective coatings
H05K   3/28  A	2	0	5E314	H05K   3/28	653	ݸʤ̵ΤߤʤΡ̢饹ڡȡ	Protection covering consisting of the inorganic material only (&larr; glass paste)
H05K   3/28  B	2	0	5E314	H05K   3/28	4041	ݸʤͭޤΡ̥쥸ȤħʤˡۥѥħΡ	Protection covering containing the organic material (not characterized by the solder resist composition but characterized by the coating method or coating pattern)
H05K   3/28  C	2	1	5E314	H05K   3/28	2408	ħĤ	characterized by the material
H05K   3/28  D	2	2	5E314	H05K   3/28	3503	Ų̢եȥ쥸ȡ	Light-hardened resin (&larr; photo solder resist)
H05K   3/28  E	2	1	5E314	H05K   3/28	502		Coating device
H05K   3/28  F	2	1	5E314	H05K   3/28	2753	եߥ͡ȤˤΡ̥ɥ饤ե	using the film laminate (dry film)
H05K   3/28  G	2	0	5E314	H05K   3/28	2404	ĤʤξԤݸʤܤΡʾΥƥ󥰡	Protection covering applied to both printed wiring board and parts (coating over parts)
H05K   3/28  Z	2	0	5E314	H05K   3/28	263	¾	Others
H05K   3/30  \	1	1	5E353	H05K   3/30	172	ŵʡ㡥񹳴ϩ˼դ뤳ȡΣ	Assembling printed circuits with electric components, e.g. with resistors[2026.01]
H05K   3/303  \	2	2	5E353	H05K   3/303	47	ɽ̼ʤդ뤳ȡʣȣˣͥˡΣ	with surface mounted components (H05K0003320000 takes precedence)[2026.01]
H05K   3/306  \	2	2	5E353	H05K   3/306	68	꡼ʤդ뤳ȡʣȣˣͥˡΣ	with lead-in-hole components (H05K0003320000 takes precedence)[2026.01]
H05K   3/32  \	2	2	5E319	H05K   3/32	64	ϩФŵŵŪ³Σ	electrically connecting electric components or wires to printed circuits[2026.01]
H05K   3/32  A	2	0	5E319	H05K   3/32	212	ͭƳźˤ³̥֥饳ͥ	Connection using an organic conductive material (zebra connector, etc.)
H05K   3/32  Z	2	0	5E319	H05K   3/32	944	¾̤äܿˤΡ	Others (using plating, fusing, etc.)
H05K   3/321  \	3	3	5E319	H05K   3/321	3975	ƳޤˤΡΣ	by conductive adhesives[2026.01]
H05K   3/325  \	3	3	5E319	H05K   3/325	779	͹礻϶ˤΡΤεŪʡΣ	by abutting or pinching;  Mechanical auxiliary parts therefor[2026.01]
H05K   3/328  \	3	3	5E319	H05K   3/328	2624	ܤˤΡΣ	by welding[2026.01]
H05K   3/34  \	3	3	5E319	H05K   3/34	5665	ϤդˤΡΣ	by soldering[2026.01]
H05K   3/34 501 \	4	4	5E319	H05K   3/34	10		Pre-treatment
H05K   3/34 501 A	4	0	5E319	H05K   3/34	414	ƳťѥΥɷ	Shape of the land on the conductive pattern
H05K   3/34 501 B	4	1	5E319	H05K   3/34	810	ѥ	Land for insertion
H05K   3/34 501 C	4	1	5E319	H05K   3/34	289	¿üѥ	Land for multiple terminals to be inserted
H05K   3/34 501 D	4	1	5E319	H05K   3/34	2314	̼ѥ	Land for plane mounting
H05K   3/34 501 E	4	1	5E319	H05K   3/34	2062	̼¿üѥ	Land for multiple terminals to be mounted planely
H05K   3/34 501 F	4	0	5E319	H05K   3/34	783	¿إ	Multi-layer land
H05K   3/34 501 Z	4	0	5E319	H05K   3/34	838	¾̥ץȴĤΤɻߡʤΰֹ碌ʤɡ	Others (printed circuit board camber prevention, parts alignment, etc.)
H05K   3/34 504 \	4	4	5E319	H05K   3/34	5	ʤβ	Temporary fastening of parts
H05K   3/34 504 A	4	0	5E319	H05K   3/34	373	ˤʤβ	Temporary fastening of parts by adhesion
H05K   3/34 504 B	4	1	5E319	H05K   3/34	761	ɽ̼ʤ	Bonding of front side mounted parts
H05K   3/34 504 C	4	0	5E319	H05K   3/34	265	̥֡ǥڥ󥵡	Adhesive coating device (excluding the dispenser)
H05K   3/34 504 D	4	1	5E319	H05K   3/34	447	ǥڥ󥵡	Dispenser
H05K   3/34 504 E	4	0	5E319	H05K   3/34	144	ޤιŲ	Hardening of the adhesive
H05K   3/34 504 Z	4	0	5E319	H05K   3/34	476	¾̼ˤΡФѤΤʤɡ	Others (using a jig, using a magnet, etc.)
H05K   3/34 508 \	4	4	5E319	H05K   3/34	9	¾ΤϤդۼϤդʻ	Co-use of another soldering or different-type soldering
H05K   3/34 508 A	4	0	5E319	H05K   3/34	356	ۼϤդʻ	Co-use of different-type soldering
H05K   3/34 508 Z	4	0	5E319	H05K   3/34	48	¾	Others
H05K   3/34 509 \	4	4	5E319	H05K   3/34	940	ϤդѼ̽ޥѡѡ	Soldering jig (excluding those for masking or temporary fastening)
H05K   3/34 510 \	4	4	5E319	H05K   3/34	1079	Ϥդ줿ʤμ賰	Removal or replacement of the soldered part
H05K   3/34 511 \	4	4	5E319	H05K   3/34	457	̤ζᣳáᣳ	Post-treatment (camber correction 3/22 C, washing 3/26)
H05K   3/34 512 \	4	4	5E319	H05K   3/34	32	¾Ϣ	Others such as the related technology
H05K   3/34 512 A	4	0	5E319	H05K   3/34	1065	¬̤ϤդǣΡǣҤ򻲾ȡ	Inspection or measurement (soldering inspection. Refer to G 01 N, G 01 R.)
H05K   3/34 512 B	4	1	5E319	H05K   3/34	1336	ˤ븡¬	Inspection or measurement by light
H05K   3/34 512 C	4	0	5E319	H05K   3/34	2115	Ϥ	Solder composition
H05K   3/34 512 Z	4	0	5E319	H05K   3/34	176	¾	Others
H05K   3/341  \	4	4	5E319	H05K   3/341	21198	ɽ̼ʡΣ	Surface mounted components[2026.01]
H05K   3/3447  \	4	4	5E319	H05K   3/3447	5494	꡼ʡΣ	Lead-in-hole components[2026.01]
H05K   3/3452  \	4	4	5E319	H05K   3/3452	0	ϤޥΣ	Solder masks[2026.01]
H05K   3/3452  A	4	0	5E319	H05K   3/3452	177	쥸ȥѥʥ쥸ˡ	Solder resist patterns (solder resist coating methods: 3/28)
H05K   3/3452  B	4	1	5E319	H05K   3/3452	359	¿üҥ쥸ȥѥ	Insertable multi-terminal resist patterns
H05K   3/3452  C	4	1	5E319	H05K   3/3452	138	ѥ쥸ȥѥ	Resist patterns for insertion
H05K   3/3452  D	4	1	5E319	H05K   3/3452	928	̼쥸ȥѥ	Resist patterns for surface mounting
H05K   3/3452  E	4	1	5E319	H05K   3/3452	652	̼¿üҥ쥸ȥѥ	Resist Patterns for Multi-terminal Surface Mounting
H05K   3/3452  Z	4	0	5E319	H05K   3/3452	747	¾	Others
H05K   3/346  \	4	4	5E319	H05K   3/346	3363	ϤκϤκΤäŬ礷Σ	Solder materials or compositions specially adapted therefor[2026.01]
H05K   3/3465  \	4	4	5E319	H05K   3/3465	158	ϤΣ	Application of solder[2026.01]
H05K   3/3468  \	5	5	5E319	H05K   3/3468	0	ͻϤۡ㡥ǥåפϤդΣ	Application of molten solder, e.g. dip soldering[2026.01]
H05K   3/3468  A	5	0	5E319	H05K   3/3468	355	ʤ̼ʤξʤΥǥåפϤդ	Dip soldering of both inserted components and surface-mounted components
H05K   3/3468  B	5	1	5E319	H05K   3/3468	587	ʤΥǥåפϤդ	Dip soldering of inserted components
H05K   3/3468  C	5	1	5E319	H05K   3/3468	254	³ʤΥǥåפϤդ	Dip soldering of surface-mounted components
H05K   3/3468  D	5	0	5E319	H05K   3/3468	634	ǥåפϤդ	Dip soldering devices
H05K   3/3468  E	5	1	5E319	H05K   3/3468	75	ǥå׼	Dip methods
H05K   3/3468  F	5	1	5E319	H05K   3/3468	188	ʷϵ	Atmosphere
H05K   3/3468  G	5	1	5E319	H05K   3/3468	346		Conveyance
H05K   3/3468  H	5	2	5E319	H05K   3/3468	372	䡤쥹	Carriers; carrierless
H05K   3/3468  J	5	1	5E319	H05K   3/3468	307	Ϥ	Solder baths
H05K   3/3468  K	5	2	5E319	H05K   3/3468	1196	ʮήϤ	Jet solder baths
H05K   3/3468  Z	5	0	5E319	H05K   3/3468	73	¾	Others
H05K   3/3473  \	5	5	5E319	H05K   3/3473	0	ϤΤäΣ	Plating of solder[2026.01]
H05K   3/3478  \	5	5	5E319	H05K   3/3478	4632	Ϥͽʪ塨äƷ줿Ϥͤž̡Σ	Application of solder preforms; Transferring prefabricated solder patterns[2026.01]
H05K   3/3485  \	5	5	5E319	H05K   3/3485	0	Ϥڡȡ꡼ʴΤƳ夵뤳Ȥǰϩν˾Ƴѥ뤿˰ѤѤΡȣˣˡΣ	Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K0003120000)[2026.01]
H05K   3/3485  A	5	0	5E319	H05K   3/3485	1131	ڡȤϤζ	Paste solder supply
H05K   3/3485  B	5	1	5E319	H05K   3/3485	1052	꡼ˤ	Produced by screen printing
H05K   3/3485  C	5	2	5E319	H05K   3/3485	2663	꡼	Screen printing machines
H05K   3/3485  D	5	1	5E319	H05K   3/3485	322	ʤؤΤϤζ	Solder supply to components
H05K   3/3485  E	5	1	5E319	H05K   3/3485	183	ʤȴĤؤΤϤζ	Solder supply to components and boards
H05K   3/3485  Z	5	0	5E319	H05K   3/3485	0	¾	Others
H05K   3/3489  \	4	4	5E319	H05K   3/3489	0	եå塨̤ܿ뤿¾ˡΣ	Composition of fluxes; Application thereof; Other processes of activating the contact surfaces[2026.01]
H05K   3/3489  A	4	0	5E319	H05K   3/3489	626	եå	Flux application
H05K   3/3489  B	4	1	5E319	H05K   3/3489	683	եå	Flux application devices
H05K   3/3489  Z	4	0	5E319	H05K   3/3489	529	¾	Others
H05K   3/3494  \	4	4	5E319	H05K   3/3494	0	եϤդβǮˡΣ	Heating processes for reflow soldering[2026.01]
H05K   3/3494  A	4	0	5E319	H05K   3/3494	339	ʤ̼ʤξʤΥեϤդ	Reflow soldering of both inserted components and surface-mounted components
H05K   3/3494  B	4	1	5E319	H05K   3/3494	287	ʤΥեϤդ	Reflow soldering of inserted components
H05K   3/3494  C	4	1	5E319	H05K   3/3494	2216	̼ʤΥեϤդ	Reflow soldering of surface-mounted components
H05K   3/3494  D	4	0	5E319	H05K   3/3494	255	ϤդʬܿǮ	Contactless heating of soldered parts
H05K   3/3494  E	4	1	5E319	H05K   3/3494	839	졼ֳ	Lasers; Infrared rays
H05K   3/3494  F	4	1	5E319	H05K   3/3494	238		Steam
H05K   3/3494  G	4	1	5E319	H05K   3/3494	309	Ǯ	Hot air
H05K   3/3494  H	4	1	5E319	H05K   3/3494	425	եϧ	Reflow furnaces
H05K   3/3494  J	4	2	5E319	H05K   3/3494	448	ʷϵ	Atmosphere
H05K   3/3494  K	4	2	5E319	H05K   3/3494	723	١Ǯ	Temperature; Heating
H05K   3/3494  L	4	2	5E319	H05K   3/3494	425	ʣʡˤͥ	Conveyance (3/3494J and 3/3494K take precedence)
H05K   3/3494  M	4	0	5E319	H05K   3/3494	700	ܿǮˤեϤդ	Reflow soldering by contact heating
H05K   3/3494  N	4	1	5E319	H05K   3/3494	685	եåפϤ	Reflow chip soldering equipment
H05K   3/3494  Z	4	0	5E319	H05K   3/3494	199	¾	Others
H05K   3/36  \	1	1	5E344	H05K   3/36	34	ϩ¾ΰϩȤ߹碌Σ	Assembling printed circuits with other printed circuits
H05K   3/36  A	1	0	5E344	H05K   3/36	1740	ϩƱΤľ³̳ƴĴ֤ƳʤɤϤʳ³	Direct connection of printed boards (connection of boards via a conductive adhesive other than solder)
H05K   3/36  B	1	1	5E344	H05K   3/36	1209	ϥդˤ	using soldering
H05K   3/36  Z	1	0	5E344	H05K   3/36	874	¾̥꡼ͥʤɤˤΡ	Others (using the lead wire, connector, etc.)
H05K   3/38  \	1	1	5E343	H05K   3/38	235	Τȶ°֤βɡΣ	Improvement of the adhesion between the insulating substrate and the metal [3]
H05K   3/38  A	1	0	5E343	H05K   3/38	1826	Τ˴ؤΡ̥ܥСɡʥޥå󥰡ˤˤɽƲ	related to the insulation base (making the surface coarse by ion bombardment (micro-etching), etc. D)
H05K   3/38  B	1	0	5E343	H05K   3/38	1978	°˴ؤΡ夷Ƥ椯°ħΡ̲ءå	related to the metal material (characterized by the deposited metal; making the surface coarse, conversion treatment layer, plated layer, etc.)
H05K   3/38  C	1	1	5E343	H05K   3/38	346	ʾζ°ʻ	Co-use of at least two types of metals
H05K   3/38  D	1	0	5E343	H05K   3/38	882	ˡ̺ħΤʤΡ̥͡ߥåȶ°ʪʤȤβǮܹ硤ã£ŵŪܹʰϡưˣ£ˣ	Bonding method (not characterized by the material) (bonding ceramic and metal together by heating C 04 B 37/02; non-electrical bonding (pressure, vibration, shock, etc.) B 23 K 20/00)
H05K   3/38  E	1	0	5E343	H05K   3/38	1304	ޤħΤΡ̥ܥǥ󥰥Ȥʬ	characterized by the adhesive (bonding sheet components)
H05K   3/38  J	1	0	5E343	H05K   3/38	70	գԣạ́գᡡžˡ	UTC (Ultra Thin Copper copy method)
H05K   3/38  Z	1	0	5E343	H05K   3/38	176	¾	Others
H05K   3/40  \	1	1	5E317	H05K   3/40	175	ϩؤΡޤϰϩ֤ŵŪ³ΤΰǤηΣ	Forming printed elements for providing electric connections to or between printed circuits [3]
H05K   3/40  A	1	0	5E317	H05K   3/40	244	Ʊľˤ֤³ˡ	Method of connection between wires on a board
H05K   3/40  B	1	1	5E317	H05K   3/40	88	ˤ³	Connection by printing
H05K   3/40  C	1	0	5E317	H05K   3/40	364	Ĥ¤ä	Manufacture of the board connector (connector plating 3/24 A)
H05K   3/40  D	1	0	5E317	H05K   3/40	302	ɽ΢ƳΤ¦³ˡ̰ä³ѤΡ	Method of side connection for the front and rear conductors (using printing, plating, or connection clamp)
H05K   3/40  E	1	0	5E317	H05K   3/40	989	ɽ΢ƳΤΥۡ³ˡŵäؤäϡѥåˤΡ	Method of through-hole connection for the front and rear conductors (electric plating, chemical plating 3/42 by spattering or printing)
H05K   3/40  F	1	1	5E317	H05K   3/40	82	꡼ˤΡ̺٤ƳѷȼΡ	using the leader wire (accompanied by deformation of the thin conductive wire)
H05K   3/40  G	1	1	5E317	H05K   3/40	184	ƳΤѷˤΡɽ΢ƳΤץ쥹ѷΡ	using conductor deformation (front and rear wiring conductors deformed by the press, etc.)
H05K   3/40  H	1	1	5E317	H05K   3/40	360	ƳΤˤΡ̥ԥʤɤˤΡ	using a solid conductor (pin, etc.)
H05K   3/40  J	1	1	5E317	H05K   3/40	104	ƳΤˤΡ̥ϥȥʤɡ	using a hollow conductor (eyelet, etc.)
H05K   3/40  K	1	1	5E317	H05K   3/40	3398	ƳźνŶˤΡƳťڡȤä°°Ρʥܡˤ򹦤᤿Ρ	filling with the conductive material (conductive paste, plated metal, or moulded metal (ball, etc.) embedded in the hole)
H05K   3/40  Z	1	0	5E317	H05K   3/40	453	¾̸ü˴ؤΡ	Others (connection in the blind hole, related to the inspection terminal)
H05K   3/42  \	2	2	5E317	H05K   3/42	188	å줿̹Σ	Plated through-holes [3]
H05K   3/42 610 \	3	3	5E317	H05K   3/42	7	ƳΥѥƤʤ	Conductor pattern forming process not described
H05K   3/42 610 A	3	0	5E317	H05K   3/42	720	ιߥʤɡ	Pre-treatment (boring, washing, smear removal, etc.)
H05K   3/42 610 B	3	0	5E317	H05K   3/42	527	åˡ	Plating method or device
H05K   3/42 610 C	3	0	5E317	H05K   3/42	196	Υ롼ۡؤνåȷʤɡ	Post-treatment (treatment in the through-hole, slit forming, etc.)
H05K   3/42 610 Z	3	0	5E317	H05K   3/42	146	¾	Others
H05K   3/42 620 \	3	3	5E317	H05K   3/42	20	ƳΥѥ˥롼ۡå򤹤	Through-hole plating performed before the conductor patter is formed
H05K   3/42 620 A	3	0	5E317	H05K   3/42	677	ƳΥѥη֥ȥ饯ƥˡˤ	using the subtractive method for forming the conductor pattern
H05K   3/42 620 B	3	0	5E317	H05K   3/42	251	ƳΥѥηߥǥƥˡˤ	using the semi-additive method for forming the conductor pattern
H05K   3/42 620 Z	3	0	5E317	H05K   3/42	46	¾	Others
H05K   3/42 630 \	3	3	5E317	H05K   3/42	23	ƳΥѥηƱ˥롼ۡå򤹤	Conductor pattern formed and through-hole plating performed at the same time
H05K   3/42 630 A	3	0	5E317	H05K   3/42	262	ƳΥѥηե륢ǥƥˡˤ	using the full additive method for forming the conductor pattern
H05K   3/42 630 Z	3	0	5E317	H05K   3/42	81	¾	Others
H05K   3/42 640 \	3	3	5E317	H05K   3/42	7	ƳΥѥ˥롼ۡå򤹤	Through-hole plating performed after the conductor patter is formed
H05K   3/42 640 A	3	0	5E317	H05K   3/42	88	ƳΥѥ˥롼ۡ˿ޤͿƤ	Catalyst given in the through-hole before the conductor pattern is formed
H05K   3/42 640 B	3	0	5E317	H05K   3/42	285	ƳΥѥ˹򤹤	Boring performed after the conductor pattern is formed
H05K   3/42 640 Z	3	0	5E317	H05K   3/42	70	¾	Others
H05K   3/42 650 \	3	3	5E317	H05K   3/42	5	롼ۡ䶯ؤ	Reinforcing layer formed in the through-hole
H05K   3/42 650 A	3	0	5E317	H05K   3/42	57	ƳΥѥƤʤ	Conductor pattern forming process not described
H05K   3/42 650 B	3	0	5E317	H05K   3/42	263	䶯طƳΥѥ	Conductor pattern formed after the reinforcing layer is formed
H05K   3/42 650 C	3	0	5E317	H05K   3/42	175	ƳΥѥ䶯ؤ	Reinforcing layer formed after the conductor pattern is formed
H05K   3/42 650 Z	3	0	5E317	H05K   3/42	8	¾	Others
H05K   3/44  \	1	1	5E315	H05K   3/44	88	蘆줿°ϩ¤Σ	Manufacturing insulated metal core circuits [3]
H05K   3/44  A	1	0	5E315	H05K   3/44	608	ˡ	Insulation method
H05K   3/44  B	1	1	5E315	H05K   3/44	203	롼ۡɤˡ̴Τȥ롼ۡξϤء	Through-hole inner wall insulation method (This category is applied to insulation of both entire board and through-hole.)
H05K   3/44  C	1	1	5E315	H05K   3/44	108	ۤĤ¤	Manufacture of the porcelain enamel board
H05K   3/44  Z	1	0	5E315	H05K   3/44	687	¾	Others
H05K   3/46  \	1	1	5E316	H05K   3/46	1532	¿زϩ¤Σ	Manufacturing multi-layer circuits [3]
H05K   3/46  B	1	0	5E316	H05K   3/46	7183	¿زϩ¤	Multi-layer circuit manufacture in general
H05K   3/46  C	1	0	5E316	H05K   3/46	1189	¿زϩ	Thick-film multi-layer circuit
H05K   3/46  E	1	0	5E316	H05K   3/46	1936	¿زϩ	Thin-film multi-layer circuit
H05K   3/46  G	1	0	5E316	H05K   3/46	6334	ط¿زϩ	Laminated multi-layer circuit
H05K   3/46  H	1	1	5E316	H05K   3/46	5020	̵̥ߥå¿زϩ	Inorganic (ceramic) multi-layer circuit
H05K   3/46  J	1	0	5E316	H05K   3/46	250	磻ϩ	Wired circuit
H05K   3/46  K	1	0	5E316	H05K   3/46	332	ξ¿زϩ	Double-side multi-layer circuit
H05K   3/46  L	1	0	5E316	H05K   3/46	2066	ʣ緿¿زϩ	Composite multi-layer circuit
H05K   3/46  M	1	0	5E316	H05K   3/46	351	С	Crossover wiring
H05K   3/46  N	1	0	5E316	H05K   3/46	13247	Ƴش֤ŵŪ³	Electrical connection between conductive layers
H05K   3/46  Q	1	0	5E316	H05K   3/46	9711	ʤμͤ줿¿زϩ	Parts mounted (containing) multi-layer circuit
H05K   3/46  S	1	0	5E316	H05K   3/46	2325	¿زϩѤκ	Material for multi-layer circuits
H05K   3/46  T	1	1	5E316	H05K   3/46	7588		Insulation material
H05K   3/46  U	1	0	5E316	H05K   3/46	1187	¿زϩǮ̼硤°ġ	Heat radiation from the multi-layer circuit (mainly for metal boards)
H05K   3/46  V	1	0	5E316	H05K   3/46	369	¿زϩ󼡽̸	Secondary processing of the multi-layer circuit (post-treatment)
H05K   3/46  W	1	0	5E316	H05K   3/46	771	¿زϩλ	Testing of the multi-layer circuit
H05K   3/46  X	1	0	5E316	H05K   3/46	2646	¿زϩεŪù	Mechanical machining of the multi-layer circuit
H05K   3/46  Y	1	0	5E316	H05K   3/46	1182	¿زϩ¤֡	Manufacturing device or jig for the multi-layer circuit
H05K   3/46  Z	1	0	5E316	H05K   3/46	4141	¾	Others
H05K   5/00  \	0	0	4E360	H05K   5/00	96	ŵ֤ΤȢΡӥͥåȤޤϰФΣ	Casings, cabinets or drawers for electric apparatus
H05K   5/00  A	0	0	4E360	H05K   5/00	1772	ץȴġѲϩĤƴ	Container for the printed board or hybrid integrated circuit board
H05K   5/00  B	0	1	4E360	H05K   5/00	977	ݥɤ줿	moulded
H05K   5/00  C	0	0	4E360	H05K   5/00	782	Żʤƴʬ	Container for electronic parts (sub-category)
H05K   5/00  D	0	1	4E360	H05K   5/00	799	ݥɤ줿Ρʬ	moulded (sub-category)
H05K   5/00  Z	0	0	4E360	H05K   5/00	281	¾	Others
H05K   5/02  \	1	1	4E360	H05K   5/02	205	Σ	Details
H05K   5/02  A	1	0	4E360	H05K   5/02	4214	ġѥͥμա̲žѥͥ롤饤ɥѥͥ롤Фѥͥ롤ĥʾȡա	Front plate or panel installation (rotary panel, slide panel, pull-out panel, escutcheon (ornamental frame), elastic installation)
H05K   5/02  B	1	0	4E360	H05K   5/02	2563	ӡܤ̥ɰ̡ƣ̥͡͡䥹ݡӡ­ݥơݥ֥롤֥ĥӤθꡤ	Leg or mounting stand (stands in general F 16 M) (casters, adsorbing leg, foot, turntable, mounting rack, leg fastening, fastening on the floor)
H05K   5/02  C	1	0	4E360	H05K   5/02	933	ѥݥ	Portable case
H05K   5/02  D	1	0	4E360	H05K   5/02	1956	ļꡦѥ٥ȡļ̣£ġ	Handle or carry belt (handles in general B 65 D)
H05K   5/02  E	1	0	4E360	H05K   5/02	2714	Τμդ̥ĥסؤμդ	Cabinet installation (clip, installation on the wall, etc.)
H05K   5/02  F	1	1	4E360	H05K   5/02	975	̿ξʪؤμա̿	Installation of the communication device on the vehicle R components)
H05K   5/02  G	1	0	4E360	H05K   5/02	854	°ʤμǼ̥ݥɤδݻ	Storage of accessories (cord take-up, holding, etc.)
H05K   5/02  H	1	0	4E360	H05K   5/02	2154	ǽ̥ݥ̰Ф͡ƴʵǽΡ	Case for each function (drawer, etc.) (particular function provided for the container)
H05K   5/02  V	1	0	4E360	H05K   5/02	2452	δ֤ηħͭ	Coupling between cabinets
H05K   5/02  J	1	0	4E360	H05K   5/02	1456	ݥκħͭ	characterized by the case material
H05K   5/02  K	1	1	4E360	H05K   5/02	239	ħͭ	characterized by the acoustic characteristics
H05K   5/02  L	1	0	4E360	H05K   5/02	3601	ɲɿɲСɿ塦ɿФ˴ؤ	related to sound-proofing, vibration-proofing, fire-proofing, water-proofing, and dust-proofing
H05K   5/02  M	1	0	4E360	H05K   5/02	486	ޤʤˤΤη	Cabinet formed by bending
H05K   5/02  N	1	0	4E360	H05K   5/02	560	ͭ	Cabinet having supports
H05K   5/02  R	1	0	4E360	H05K   5/02	401	ʿΡ̷ǣơ	Flat cabinet (pocket calculator G 06 F)
H05K   5/02  S	1	0	4E360	H05K   5/02	234	ͭ	having an operation console
H05K   5/02  T	1	0	4E360	H05K   5/02	228	Ρ̱ȹͤ	Cylindrical cabinet (cylindrical R considered as the column type)
H05K   5/02  Z	1	0	4E360	H05K   5/02	2559	¾	Others
H05K   5/03  \	2	2	4E360	H05K   5/03	85	СΣ	Covers
H05K   5/03  A	2	0	4E360	H05K   5/03	2786	С	Cover
H05K   5/03  B	2	0	4E360	H05K   5/03	2264	⡦	Door or lid
H05K   5/03  C	2	1	4E360	H05K   5/03	2242	žħͭ	characterized by the rotary shaft
H05K   5/03  D	2	1	4E360	H05K   5/03	2283	ĥħͭ	characterized by the lock mechanism
H05K   5/03  G	2	1	4E360	H05K   5/03	950	ˤ본μդ	Lid installed by elasticity
H05K   5/03  H	2	1	4E360	H05K   5/03	614	ͥˤ본μդ	Lid installed by screws
H05K   5/03  Z	2	0	4E360	H05K   5/03	115	¾	Others
H05K   5/04  \	1	1	4E360	H05K   5/04	1100	°Σ	Metal casings
H05K   5/06  \	1	1	4E360	H05K   5/06	47	̩Ĥ줿Σ	Hermetically-sealed casings
H05K   5/06  A	1	0	4E360	H05K   5/06	2519	̩Ĥ줿ݥ	Fully closed case
H05K   5/06  B	1	1	4E360	H05K   5/06	276	ƴ	Explosion-proof container
H05K   5/06  D	1	1	4E360	H05K   5/06	1761	ѥĥ󥰡ĥȤͭ	having a backing gasket
H05K   5/06  E	1	1	4E360	H05K   5/06	1301	ݥδ̩	Full enclosing of the penetrated part on the case
H05K   5/06  Z	1	0	4E360	H05K   5/06	80	¾	Others
H05K   5/10  \	1	1	4E360	H05K   5/10	9332	ĤȢΤʣʬޤΡΣ	comprising several parts forming a closed casing
H05K   5/13  \	2	2	4E360	H05K   5/13	788	ͤˤȤΩƤΡΣ	assembled by screws
H05K   5/15  \	2	2	4E360	H05K   5/15	919	ˤȤΩƤΡΣ	assembled by resilient members
H05K   5/30  \	1	1	4E360	H05K   5/30	4413	֤ޤ֡Σ	Side-by-side or stacked arrangements
H05K   7/00  \	0	0	4E352	H05K   7/00	405	ۤʤ뷿ŵ֤˶̤ι¤ŪʥӥͥåȡФȣˣˡΣ	Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K 5/00)
H05K   7/00  A	0	0	4E352	H05K   7/00	673	ݥɤ;ĹǼ	Storage of the excessive length of the wire or cord
H05K   7/00  B	0	0	4E352	H05K   7/00	685	ư뵡ưΤ̣ͥ	Wiring for the moving component or part (takes precedence over A.)
H05K   7/00  C	0	0	4E352	H05K   7/00	92	ݥɤĹĴ	Wire or cord length adjustment
H05K   7/00  D	0	0	4E352	H05K   7/00	694	ݥɤ«	Wire or cords bundled
H05K   7/00  E	0	0	4E352	H05K   7/00	282	ݥ֥ˤŵ	Wiring of electrical components using the optical cable
H05K   7/00  F	0	0	4E352	H05K   7/00	1874	ŵؤݥɤοդ	Installation and fastening of the wire or cord to the electrical components
H05K   7/00  G	0	1	4E352	H05K   7/00	961	Ĥؤݥ֥θ	Fastening of the wire or cable to the board
H05K   7/00  H	0	1	4E352	H05K   7/00	1578	ݥɤ«	Fastening the bundled wires or cords
H05K   7/00  J	0	1	4E352	H05K   7/00	191	ŵؤݥɤ	Hanging the wire or cord on the electrical component
H05K   7/00  K	0	0	4E352	H05K   7/00	536	ŵˤƳ	Wire guide on the electrical component
H05K   7/00  L	0	1	4E352	H05K   7/00	638	ŵˤƳ	Wire guide port on the electrical component
H05K   7/00  M	0	1	4E352	H05K   7/00	1568	Ƴ	Sealing of the wire guide
H05K   7/00  N	0	1	4E352	H05K   7/00	479	ʤФƳݸ	Protecting the wire on the guide from bending
H05K   7/00  P	0	1	4E352	H05K   7/00	942	Ƴˤη	Engaging the wire on the guide
H05K   7/00  Q	0	2	4E352	H05K   7/00	560	ʡդˤ	using bending or winding
H05K   7/00  R	0	2	4E352	H05K   7/00	60	ηܤˤ	using the knot of the wire
H05K   7/00  S	0	2	4E352	H05K   7/00	106	ͤˤ	using screwing
H05K   7/00  T	0	2	4E352	H05K   7/00	246	ݥˤ붴̣Ѥͥ	holding by a case (takes precedence over Q.)
H05K   7/00  U	0	2	4E352	H05K   7/00	111	ޤˤ	using pawls
H05K   7/00  V	0	0	4E352	H05K   7/00	244	Ƴˤݥɤĥϻ	Tension-resistance fastening of the wire or cord on the guide
H05K   7/00  Z	0	0	4E352	H05K   7/00	496	¾	Others
H05K   7/02  \	1	1	5E333	H05K   7/02	696	ٻ־βϩǻҤޤ֡Σ	Arrangements of circuit components or wiring on supporting structure
H05K   7/02  L	1	0	5E333	H05K   7/02	77		Frame wiring
H05K   7/02  M	1	1	5E333	H05K   7/02	202	ͤι¤˴ؤ	related to the frame structure
H05K   7/02  N	1	1	5E333	H05K   7/02	124	ݥ֥ȡˤ˴ؤΡʣѡҤͥ	related to the cable duct (or winding in the cable duct) (takes precedence over Q and R.)
H05K   7/02  Q	1	1	5E333	H05K   7/02	252	ݥ֥ݻդ˴ؤ	related to cable holding or installation
H05K   7/02  R	1	1	5E333	H05K   7/02	215	ݥ֥ˤ¤˴ؤ	related to the wiring structure using cables
H05K   7/02  Z	1	0	5E333	H05K   7/02	1217	¾㡢ϩˡ	Others, e.g. circuit, method, etc.
H05K   7/04  \	2	2	5E333	H05K   7/04	122	Ƴ㥷ˤΡΣ	on conductive chassis
H05K   7/04  A	2	0	5E333	H05K   7/04	240	ݥι¤	Chassis structure
H05K   7/04  B	2	0	5E333	H05K   7/04	46	ݥκ	Chassis material
H05K   7/04  C	2	0	5E333	H05K   7/04	51	ݥ¤	Manufacture of the chassis
H05K   7/04  D	2	0	5E333	H05K   7/04	79	ץȥѥݥΤ륷ݥ	Chassis having a printed pattern
H05K   7/04  E	2	0	5E333	H05K   7/04	89	ݥǤü	Wiring and relay terminal on the chassis
H05K   7/04  F	2	0	5E333	H05K   7/04	81		Cooling
H05K   7/04  G	2	0	5E333	H05K   7/04	171	ᥫ˥륷ݥ	Mechanical chassis
H05K   7/04  H	2	0	5E333	H05K   7/04	309	ݥФʤμդ	Installation of parts on the chassis
H05K   7/04  J	2	0	5E333	H05K   7/04	428	Ĥμդ	Installation of the printed wiring board
H05K   7/04  K	2	1	5E333	H05K   7/04	191	ݥڵؤΰμդ	Installation of the printed wiring on the cut and bent up parts of the chassis
H05K   7/04  L	2	1	5E333	H05K   7/04	84	ȾդˤĤμդ	Installation of the printed wiring board by soldering
H05K   7/04  M	2	1	5E333	H05K   7/04	151	ڡݥ𤷤Ĥμդ	Installation of the printed wiring board via a spacer
H05K   7/04  Z	2	0	5E333	H05K   7/04	125	¾	Others
H05K   7/06  \	2	2	5E333	H05K   7/06	72	ľˤΡΣ	on insulating boards
H05K   7/06  A	2	0	5E333	H05K   7/06	112	ݥɤˤ	moulded
H05K   7/06  B	2	0	5E333	H05K   7/06	86	ħΤ	characterized by the printed wiring
H05K   7/06  C	2	0	5E333	H05K   7/06	1560	ХС	Bus/bar wiring
H05K   7/06  D	2	0	5E333	H05K   7/06	39	ǥݥʬΥ	Discrete wiring (separate wiring)
H05K   7/06  E	2	0	5E333	H05K   7/06	40	üҤˤʤ	Mounting components using terminals
H05K   7/06  F	2	0	5E333	H05K   7/06	30	路°ĤˤΡʥݥɤ	using an insulated metal plate (excluding the mould)
H05K   7/06  Z	2	0	5E333	H05K   7/06	186	¾	Others
H05K   7/08  \	3	3	5E333	H05K   7/08	276	ꤢľˤΡΣ	on perforated boards
H05K   7/08  A	3	0	5E333	H05K   7/08	571	ʤμ	Installation of parts
H05K   7/08  B	3	0	5E333	H05K   7/08	104	ݥݥĤμ	Installation of the case or shield plate
H05K   7/08  C	3	0	5E333	H05K   7/08	241	Ĥμ	Installation of the board
H05K   7/08  D	3	1	5E333	H05K   7/08	119	ڡݥˤΡʥڡݥΤޤ	using a spacer (including the spacer per se)
H05K   7/08  E	3	0	5E333	H05K   7/08	98	ļΤι¤˴ؤ	related to the structure of the board per se
H05K   7/08  Z	3	0	5E333	H05K   7/08	17	¾	Others
H05K   7/10  \	2	2	5E333	H05K   7/10	67	ϩǻҤΥץ饰ˤȤΩơΣ	Plug-in assemblages of components
H05K   7/10  C	2	0	5E333	H05K   7/10	166	ĤؤʤΥͥˤ	Installation of a part on the board by using a connector
H05K   7/10  D	2	0	5E333	H05K   7/10	221	ݥϥݥؤΥͥˤ	Installation between cases or to the case by using a connector
H05K   7/10  E	2	0	5E333	H05K   7/10	67	ͥΤι¤˴ؤ	related to the structure of the connector per se
H05K   7/10  Z	2	0	5E333	H05K   7/10	15	¾	Others
H05K   7/12  \	2	2	4E353	H05K   7/12	82	¤ʪФʤޤϥפˤռʡΣ	Resilient or clamping means for holding component to structure (holding two-part couplings together H01R 13/00)
H05K   7/12  A	2	0	4E353	H05K   7/12	552	ˤʤμ	Installation of parts by elasticity
H05K   7/12  B	2	1	4E353	H05K   7/12	574	ʤ켫ȤĤ	Part per se having elasticity
H05K   7/12  C	2	1	4E353	H05K   7/12	669	ʤդ¦Ĥ	Mate having elasticity for the part
H05K   7/12  D	2	0	4E353	H05K   7/12	1085	ͤˤʤμ	Installation of parts by screws
H05K   7/12  E	2	1	4E353	H05K   7/12	310	ͤˤȥ󥸥ǻҤμ	Installation of devices such as the transistor by screws
H05K   7/12  F	2	1	4E353	H05K   7/12	209	üͤǸꤷ¾ü¾μθʻѤʤμ	Installation of a part, an end of which is fastened by a screw and the others end uses another type fastening
H05K   7/12  G	2	0	4E353	H05K   7/12	103	ǲžǽʥˤʤμա㡥	Installation of a part by a clamp member that can rotate around the main axis, e.g. swing arm having catching jaws
H05K   7/12  H	2	0	4E353	H05K   7/12	144	Хͥĥȷˤʤμ	Installation of a part by bayonet coupling
H05K   7/12  J	2	0	4E353	H05K   7/12	510	⤷ʿ԰ưˤʤμ	Installation of a part by insertion or parallel moving
H05K   7/12  K	2	0	4E353	H05K   7/12	245	ᡤǱꡤ޶αʵѷˤʤμ	Installation of a part by permanent deformation such as caulking, twisting, bending, etc.
H05K   7/12  L	2	0	4E353	H05K   7/12	491	⤷ӾθѤʤμաμբȣˣ	Installation of a part using a line type or belt type fixing clamp (wire installation R H 05 K 7/00)
H05K   7/12  M	2	0	4E353	H05K   7/12	410	ܡȾաǮ̡塤æơݥפˤʤμ	Installation of a part using welding, soldering, heat shrinkage, bonding, or removable tape
H05K   7/12  N	2	0	4E353	H05K   7/12	426	ַᤵ줿ʤμա̣ԡա֤ͥ褹	Installation of an aligned part (T, U, and V take precedence.)
H05K   7/12  P	2	0	4E353	H05K   7/12	382	ɿǽʤμ	Installation of a part having the vibration-proof function
H05K   7/12  Q	2	0	4E353	H05K   7/12	313	ʼդȼʤݥ⤷üҤμ	Installation of the lead wire or terminal for installation of a part
H05K   7/12  R	2	0	4E353	H05K   7/12	645	̥ѥͥδ̹ؤʤμ	Installation of a part into the through-hole on the front panel, etc.
H05K   7/12  S	2	0	4E353	H05K   7/12	646	ݥؤʤμ	Installation of a part on a rail
H05K   7/12  T	2	0	4E353	H05K   7/12	470	ʤμ	Installation of operating parts
H05K   7/12  U	2	1	4E353	H05K   7/12	592	žʤμ	Installation of an operating part having a rotary shaft
H05K   7/12  V	2	0	4E353	H05K   7/12	934	ɽǻҡǻҤμ	Installation of the indication device or optical device
H05K   7/12  Z	2	0	4E353	H05K   7/12	513	¾	Others
H05K   7/14  \	1	1	5E348	H05K   7/14	125	ޤϥե졼⤷ϲ;ؤλٻ֤μդΣ	Mounting supporting structure in casing or on frame or rack
H05K   7/14  A	1	0	5E348	H05K   7/14	2078	ϩĤΥݥؤμդ̣°ʲʬवʤΡ	Installation of a printed circuit board in a case, etc. (not categorized into B or below)
H05K   7/14  B	1	1	5E348	H05K   7/14	2357	ƳħΤ㡥ݥؤȾդˤ	characterized by the conductor unit, e.g. fastening on the case by soldering
H05K   7/14  C	1	1	5E348	H05K   7/14	1974	Ʊ˼դ¾ʤȴϢ	related to another part that is installed at the same time
H05K   7/14  D	1	1	5E348	H05K   7/14	599	ɿǽĤΡɿ̢ƣơ	having a vibration-proof function (vibration-proofing in general R F 16 F)
H05K   7/14  E	1	1	5E348	H05K   7/14	1730	ޡ¡ݥˤΡ̣Ƥ̥ͥ͡ĥ¦̤˥ݥ뤬ꡤ˥ͥϡӡ	using an elastic pawl, groove, or rail (takes precedence over F.) (rail provided on a side of the rack and connector provided on the far end S)
H05K   7/14  F	1	1	5E348	H05K   7/14	711	ܥܥˤΡ̥ݥ˥ݥɤ䲡ФˤĤƼѤΥܥܥĤΡ	using boss or emboss (boss or emboss for installation provided on the case, etc. by moulding or extrusion moulding
H05K   7/14  G	1	1	5E348	H05K   7/14	1166	ʥڡݥˤˤϩĤΥݥؤοʿդ	Horizontal installation of a printed circuit board in the case by using a coupling clamp (spacer)
H05K   7/14  H	1	1	5E348	H05K   7/14	687	ϩĤΥݥؤοľդ̰ϩĤǼΩΤϡĤȤ	Vertical installation of a printed circuit board in the case (stand-alone printed circuit board 1/14 D)
H05K   7/14  J	1	1	5E348	H05K   7/14	488	ѲϩĤΥݥեݥࡤͤؤμդ̺ѲϩޥѴ̩δĤμĤ	Installation of an integrated circuit board on the case or frame (installation of a small precision board such as the hybrid integrated circuit, microwave board, etc.)
H05K   7/14  K	1	1	5E348	H05K   7/14	1145	ϩĤΥݥؤμդ䶯Ǽդ˻ĤƤʤȤϡġ	Installation of a flexible printed circuit board on the case (reinforcement made but installation not performed 1/02 D)
H05K   7/14  L	1	0	5E348	H05K   7/14	254	ϩݴɤ⤷͢Ѥƴ¤ݴɤΤƴϡ	Container for storage or transportation of a printed circuit (container for storage during manufacture 13/02)
H05K   7/14  M	1	0	5E348	H05K   7/14	598	ݥΥݥեݥࡤͤؤμ	Installation of a chassis on the case or frame
H05K   7/14  N	1	0	5E348	H05K   7/14	470	ץ饰˥ĥȡ̣ˤͥ͡ʤΥץ饰ϡС֤ŸǤʤΤʬह	Plug-in unit (takes precedence over A to K.) (This category is applied to part plug-in that cannot be categorised into 7/10 P to V.)
H05K   7/14  P	1	1	5E348	H05K   7/14	1796	ץ饰˥ĥȤˤ񡤰ȴ񤪤ӥḥ̂Ҥ̥ͥ͡ݥĥ˼Ĥ뤿ΤΤޤ롣̢££	Inserting clamp, removing clamp, and lock mechanism in the plug-in unit (takes precedence over R.) (tools for installing a case on the rack included; tools in general R B 25 B 27/14)
H05K   7/14  Q	1	1	5E348	H05K   7/14	641	ץ饰˥ĥȤˤæɻߤԴɻߡ̣ҡӤͥ	Prevention of faulty insertion/removal and prevention of incomplete insertion on the plug-in unit (takes precedence over R and S.)
H05K   7/14  R	1	1	5E348	H05K   7/14	333	ץ饰˥ĥȤβͤؤμդ̣ӡ֤ŸǤʤΤʬह	Installation of a plug-in unit on the frame (those not categorised into S to V)
H05K   7/14  S	1	1	5E348	H05K   7/14	1919	ץ饰ϩݥȥ˥ĥȤΥ֥ĥؤμդȹ礻ĥȢΥ֥ĥꤷΥ֥ĥ˰ϩĤץ饰³Ρ	Installation of a plug-in printed circuit sheet unit on the subrack (A box type subrack is fastened onto the rack made by combining rod type members. The printed circuit board is inserted into the subrack and plug-in connection is made.)
H05K   7/14  T	1	2	5E348	H05K   7/14	1986	ץ饰ϩݥȥ˥ĥȤˤŵ³	Wiring or electrical connection on the plug-in printed circuit sheet unit
H05K   7/14  U	1	3	5E348	H05K   7/14	294	ץ饰ϩݥȥ˥ĥȤλѤ⤷ĴѤδıĹ̥ƥ󥷥󥫡ݥɡ	Board extension for testing or adjusting the plug-in printed circuit sheet unit (extension card)
H05K   7/14  V	1	2	5E348	H05K   7/14	329	ץ饰ϩݥȥ˥ĥȤ	Front plate of the plug-in printed circuit sheet unit
H05K   7/14  W	1	0	5E348	H05K   7/14	156	ʻҾΰϩΩ̣֡ȹ礻ǤꡤŤ͹礻ǡľˤϡȡ	Cubic layout of printed circuits in the cylindrical or grid mode (three-dimensional combination; overlapping G, vertical layout only H)
H05K   7/14  Z	1	0	5E348	H05K   7/14	604	¾ؤɻѤʤ	Other (almost unused)
H05K   7/16  \	2	2	5E334	H05K   7/16	72	ҥ󥸤ޤϥԥܥåȾؤμդΣ	on hinges or pivots
H05K   7/16  A	2	0	5E334	H05K   7/16	220	ԥܥĥȤˤ	using a pivot
H05K   7/16  B	2	0	5E334	H05K   7/16	117	Ĺޤڹ¤ˤդ	Installation using an oblong hole or cut groove
H05K   7/16  C	2	0	5E334	H05K   7/16	226	ҥ󥸤ˤդ	Installation using a hinge
H05K   7/16  D	2	1	5E334	H05K   7/16	104	ץ饹ĥҥ󥸤ˤդ	Installation using a plastic hinge
H05K   7/16  E	2	0	5E334	H05K   7/16	117	žѤƤդ	Installation for which the rotation angle is regulated
H05K   7/16  F	2	0	5E334	H05K   7/16	84	æǤդ	Installation that allows removal
H05K   7/16  Z	2	0	5E334	H05K   7/16	151	¾	Others
H05K   7/18  \	1	1	5E335	H05K   7/18	124	ͤޤϥե졼ι¤Σ	Construction of rack or frame
H05K   7/18  A	1	0	5E335	H05K   7/18	337	Сݡ¦	Cover or side plate
H05K   7/18  B	1	0	5E335	H05K   7/18	360	ê	Shelf or installation frame
H05K   7/18  C	1	0	5E335	H05K   7/18	145	Ѽι¤	Joint structure
H05K   7/18  D	1	0	5E335	H05K   7/18	535	졦եݥι¤	Structure of the support, frame, etc.
H05K   7/18  E	1	0	5E335	H05K   7/18	749	ŵ³	Wiring, electrical connection, routing
H05K   7/18  F	1	0	5E335	H05K   7/18	330	Ҥ	Drawer
H05K   7/18  G	1	0	5E335	H05K   7/18	214	žޤϼؤĤ	having a rotary part or wheels
H05K   7/18  H	1	0	5E335	H05K   7/18	153	ͤοդӾ	Frame installation and floor
H05K   7/18  J	1	0	5E335	H05K   7/18	183	˥ĥȷĥĥߤη	Unit coupled rack or coupling of racks together
H05K   7/18  K	1	0	5E335	H05K   7/18	680		Cooling
H05K   7/18  L	1	0	5E335	H05K   7/18	571	ĥФ֤μ	Installation of a device on the rack
H05K   7/18  M	1	0	5E335	H05K   7/18	236	ѥѤΥĥ	Rack for audio, video, or PC
H05K   7/18  N	1	0	5E335	H05K   7/18	42	ĥ	Slim rack
H05K   7/18  P	1	0	5E335	H05K   7/18	117	ץݴɡ¤ѥĥ	Rack for storage or manufacture of printed circuit boards, etc.
H05K   7/18  Q	1	0	5E335	H05K   7/18	487	桤	Mounting stand, frame stand
H05K   7/18  Z	1	0	5E335	H05K   7/18	126	¾	Others
H05K   7/20  \	1	1	5E322	H05K   7/20	236	ѡޤϲǮưפˤ뤿ѷΣ	Modifications to facilitate cooling, ventilating, or heating
H05K   7/20  A	1	0	5E322	H05K   7/20	1011	䤪Ƴˤ	Air-cooling or cooling by conduction
H05K   7/20  B	1	1	5E322	H05K   7/20	5773	䤪ӸƳѤѴ⤷ϼ¼ŪѴĤΡ̥ݥ䥱ݥѴˤʤĤƤΡ	having a self-cooling or solid conductive cooler or a substantial cooler (e.g. chassis or case as a cooler)
H05K   7/20  C	1	2	5E322	H05K   7/20	1302	Ѵ郎ĤǤΡǮѥݥǮؤĤѵǽĤΡ	Wiring board as a cooler (heat radiation pattern or heat radiation layer provided and the wiring board provided with the cooling function)
H05K   7/20  D	1	2	5E322	H05K   7/20	2757	ȾƳΤӽѲϩѤѴ̥ݥȾƳθ꤬Сȣ̣	Cooler for the semiconductor or integrated circuit (limitation of the semiconductor, etc. described in the claim H 01 L 23/36)
H05K   7/20  E	1	3	5E322	H05K   7/20	3256	դ˴ؤ	related to installation
H05K   7/20  F	1	1	5E322	H05K   7/20	4485	ʤѴȤδ֤˲ߤǮΡ̽Ŷʪ	Heat conductor provided between the cooled part and cooler (filler R 7/20 A)
H05K   7/20  G	1	1	5E322	H05K   7/20	4068	ζήϩ	Airflow channel such as vent, duct, etc.
H05K   7/20  H	1	1	5E322	H05K   7/20	6553	̣¡Ǥͥ褹	Forced air-cooling (takes precedence over B to G.)
H05K   7/20  J	1	2	5E322	H05K   7/20	1368	ư梪ȣС梪ǣģ	Blower control (motor control R H 02 P, temperature control R G 05 D 23/00)
H05K   7/20  K	1	1	5E322	H05K   7/20	822	ΤζɿСС̣Ȥͥ褹̰͡ʬࡤ£ġ	Air cleaning, dust-proofing, or dust removal for air-cooling (takes precedence over H.) (in general B 01 D)
H05K   7/20  L	1	0	5E322	H05K   7/20	78	ʳεΤˤ	Cooling by gas other than air
H05K   7/20  M	1	0	5E322	H05K   7/20	1565	Τˤ	Cooling by liquid
H05K   7/20  N	1	1	5E322	H05K   7/20	2835	ѤѴ浪ƴȾƳΤѢȣ̣	Liquid-cooling cooler and cooling container (semiconductor cooling R H 01 L 23/00)
H05K   7/20  P	1	1	5E322	H05K   7/20	947		Water-cooling
H05K   7/20  Q	1	0	5E322	H05K   7/20	1890	Ѳޤˤѡ㡥ʨƭѡ̱ꢫ͡ȾƳΤϡȣ̣Ѱϡȣƣʬह	Cooling by a refrigerant that changes its phase, e.g. cooling by boiling (liquid phase &larr; R gas phase) (semiconductor H 01 L 23/42, transformer H 01 F 27/18)
H05K   7/20  R	1	1	5E322	H05K   7/20	2506	ҡݥȥѥפˤѡ̥ҡݥȥѥװ̢ƣģ	Cooling by a heat pipe (heat pipes in general R F 28 D 15/02)
H05K   7/20  S	1	0	5E322	H05K   7/20	474	ŵŪѡ̰ʬࡤȣ̣	Electrical cooling (in general H 01 L 35/00)
H05K   7/20  T	1	0	5E322	H05K   7/20	986	ʣȾƳΤѡ̣Ӥͥ褹̥֥͡ĥ³줿ݥɡꥹĥ	Cooling of multiple semiconductors (takes precedence over A to S.) (bridge-connected diode, thyristor, etc.)
H05K   7/20  U	1	0	5E322	H05K   7/20	2268	ĥӥĥʤѡ̣Ԥͥ褹̣͡ӡʬव뷿ΤΤѡ	Cooling of the rack and rack-mounted parts (takes precedence over A to T.) (cooling of types categorised into 7/14 S, 7/18, etc.)
H05K   7/20  V	1	1	5E322	H05K   7/20	668	ե󤪤Ӥ	Blower fan and its control
H05K   7/20  W	1	1	5E322	H05K   7/20	655	ҡݥȥѥסѴͭΡ̣ΡҤͥ	having the heat pipe, liquid cooler, etc. (takes precedence over N and R.)
H05K   7/20  X	1	0	5E322	H05K   7/20	487	ϪɻߡɼŵѤ䴹ȼΤ˸¤	Dew condensation prevention, humidity removal, or humidity-proofing (limited to cooling or ventilation of electrical components)
H05K   7/20  Y	1	0	5E322	H05K   7/20	960	ǮƴǮ̵̲֤Ѵ۸μǮʬषβǮˤ뤬βǮϼ谷ʤ	Insulation, isothermal container, heating (Insulation of the sunlight from outdoor radio repeaters is included, but temperatuer risings as isothermal heating is not.)
H05K   7/20  Z	1	0	5E322	H05K   7/20	283	¾	Others
H05K   9/00  \	0	0	5E321	H05K   9/00	326	žޤϼФ֤ޤʤμפؤʥƥʤռͤۼ뤿֣ȣѣ	Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00)
H05K   9/00  A	0	0	5E321	H05K   9/00	817	ťݥ	Electrostatic shield
H05K   9/00  B	0	1	5E321	H05K   9/00	97	ʥݥ	Corona shield
H05K   9/00  C	0	1	5E321	H05K   9/00	3332	ťݥƴ	Electrostatic shield container
H05K   9/00  D	0	2	5E321	H05K   9/00	764	°ťݥƴ	Non-metal electrostatic shield container
H05K   9/00  E	0	2	5E321	H05K   9/00	1581	ťݥƴγ⡤ĥ	Lid, door, or gasket of the electrostatic shield container
H05K   9/00  F	0	1	5E321	H05K   9/00	1173	ťݥ	Electrostatic shield plate
H05K   9/00  G	0	1	5E321	H05K   9/00	2338	ťݥѼա̣áƤͥ	Installation for electrostatic shield (takes precedence over C to F.)
H05K   9/00  H	0	0	5E321	H05K   9/00	1725	ݥ	Magnetic shield
H05K   9/00  J	0	1	5E321	H05K   9/00	604	ݥƴ	Magnetic shield container
H05K   9/00  K	0	0	5E321	H05K   9/00	1679	ϩλ˻	Prevention of noise from the channel
H05K   9/00  L	0	1	5E321	H05K   9/00	2462	ŵ³Υݥɡ̣ѡҤͥ	Shield of the wire or electrically connected part (takes precedence over Q and R.)
H05K   9/00  M	0	0	5E321	H05K   9/00	4863	ȵۼ̣ȡʡסؤͥ	Electrowave absorption (takes precedence over H, J, W, and X.)
H05K   9/00  N	0	1	5E321	H05K   9/00	967	Ȱż	Electrowave dark room
H05K   9/00  P	0	1	5E321	H05K   9/00	757	Ȥɻ	Prevention of electrowave leak
H05K   9/00  Q	0	0	5E321	H05K   9/00	1504	ݥƳΤͭ	Part having a shield conductor
H05K   9/00  R	0	1	5E321	H05K   9/00	2737	ݥƳΤͭϩ	Printed circuit having a shield conductor
H05K   9/00  S	0	0	5E321	H05K   9/00	108	ɤΥݥɡ̣ʤͥ	Shield of a vacuum tube (takes precedence over A to J.)
H05K   9/00  T	0	0	5E321	H05K   9/00	610	¾Ūͤݥ	Shield also used for another purpose
H05K   9/00  U	0	1	5E321	H05K   9/00	1106	ѷѤΥݥ	Shield also used for cooling
H05K   9/00  V	0	0	5E321	H05K   9/00	3001	ƩΥݥɡ¾Τ٤Ƥͥ	Light-transmitting shield (takes precedence over all of the others.)
H05K   9/00  W	0	0	5E321	H05K   9/00	3784	ݥɺ	Shield material
H05K   9/00  X	0	1	5E321	H05K   9/00	922	ݥѼʪ	Resin composition for shield
H05K   9/00  Z	0	0	5E321	H05K   9/00	444	¾	Others
H05K  10/00  \	0	0	5E311	H05K  10/00	275	Ż֤ư뤿֡㡥Ʊͤͽ֤ߤΡΣ	Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar stand-by unit
H05K  11/00  \	0	0	5E312	H05K  11/00	31	饸ޤϥƥӥȤϰۤʤäפʵǽ֤ȥ饸ޤϥƥӥȤȤ߹碌	Combinations of a radio or television receiver with apparatus having a different main function
H05K  11/00  A	0	0	5E312	H05K  11/00	70	ơݥץ쥳ݥޤϥ쥳ݥɥץݥȤȤ߹碌	Combination with a tape recorder or record player
H05K  11/00  B	0	0	5E312	H05K  11/00	12	ȤȤ߹碌	Combination with eyeglasses
H05K  11/00  C	0	0	5E312	H05K  11/00	8	ʱȤȤ߹碌	Combination with the smoker's requisites
H05K  11/00  D	0	0	5E312	H05K  11/00	10	˾дȤȤ߹碌	Combination with a telescope or binocular
H05K  11/00  E	0	0	5E312	H05K  11/00	7	르ݥȤȤ߹碌	Combination with a music box
H05K  11/00  F	0	0	5E312	H05K  11/00	53	⤷ϴͤ	also used for decoration or as a toy
H05K  11/00  G	0	0	5E312	H05K  11/00	31	ȤȤ߹碌	Combination with a lighting apparatus
H05K  11/00  H	0	0	5E312	H05K  11/00	37	פȤȤ߹碌	Combination with a clock
H05K  11/00  J	0	0	5E312	H05K  11/00	103	¾˽д𤵤줿	Others filed and disclosed
H05K  11/00  Z	0	0	5E312	H05K  11/00	863	¾Τ	Others
H05K  11/02  \	1	1	5E312	H05K  11/02	27	֤Ĥ	with vehicles
H05K  13/00  \	0	0	5E353	H05K  13/00	114	ŵʤΩΤ¤ޤĴäŬ֤ޤˡΣ	Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K  13/00  A	0	0	5E353	H05K  13/00	237	Ȥˤʤμդʡ㡥桤֡	Means as an aid for manual installation of a part, e.g. workbench, its layout)
H05K  13/00  B	0	1	5E353	H05K  13/00	113	ľɽ	Indication on the printed wiring board
H05K  13/00  C	0	2	5E353	H05K  13/00	106	㡥ݥĥȡͤˤɽ	Indication by light, e.g. spot
H05K  13/00  D	0	3	5E353	H05K  13/00	40	ץ	Projector
H05K  13/00  E	0	4	5E353	H05K  13/00	54	ƴϢư	linked with the part container
H05K  13/00  F	0	0	5E353	H05K  13/00	198	깩ʤæΤΤ΢ҡʤΥݥνԤ΢ӡ	Manual tools (part setting/removal R 13/04 R, part lead wire processing R 13/04 S)
H05K  13/00  G	0	0	5E353	H05K  13/00	277	ΩΤĴݥ	Adjustment, repair, or aging of an assembly
H05K  13/00  Y	0	0	5E353	H05K  13/00	933	ʶʼդȤĤ	having the part supply unit and part installation unit
H05K  13/00  Z	0	0	5E353	H05K  13/00	1927	¾Τ	Others
H05K  13/02  \	1	1	5E353	H05K  13/02	120	ʤζΣ	Feeding of components (in general B65G)
H05K  13/02  A	1	0	5E353	H05K  13/02	910	ޥѹߡڴѹߤ	Magazine loading, transfer, change-over, and unloading
H05K  13/02  B	1	0	5E353	H05K  13/02	4015	Ϣơݥפˤ붡	Supply by series of parts or tapes
H05K  13/02  C	1	1	5E353	H05K  13/02	913	ϢơݥפʬΥФʬΥФإĥɤǹԤʤ΢ġʬΥФȤȤ˥ݥԤʤ΢ġ	Separation or removal from series of parts or tape (separation and removal by the mounting head R 14/04 A to D, lead wire formed along with separation and removal R 13/04 A to D)
H05K  13/02  D	1	0	5E353	H05K  13/02	1731	Ϣơݥװʳμʤˤ缡	Sequential supply by a means other than series of parts or tape
H05K  13/02  E	1	1	5E353	H05K  13/02	729	ޥ󤫤μФ	Removal from the magazine
H05K  13/02  F	1	1	5E353	H05K  13/02	226	žΤ	Supply using a rotor
H05K  13/02  G	1	1	5E353	H05K  13/02	199	ģɣǻҤζ̣šͥ	Supply of the DIP device (13/02 E and F take precedence.)
H05K  13/02  J	1	0	5E353	H05K  13/02	243	ʣʤƱ	Simultaneous supply of multiple parts
H05K  13/02  K	1	1	5E353	H05K  13/02	160	ʣΥޥ	using multiple magazines
H05K  13/02  L	1	1	5E353	H05K  13/02	269	Ĥ	using an arrangement plate
H05K  13/02  M	1	2	5E353	H05K  13/02	50	ĥͭĤ	using an arrangement plate having a shutter
H05K  13/02  P	1	0	5E353	H05K  13/02	394	ʤ󤷤ʤ鶡뤹	Supply by arranging the part direction
H05K  13/02  Q	1	1	5E353	H05K  13/02	201	Ѥ	utilising magnetism
H05K  13/02  R	1	1	5E353	H05K  13/02	258	ʤηѤ	utilising the part shape
H05K  13/02  T	1	0	5E353	H05K  13/02	522	ġϩĤѹߡѹߤ	Loading or unloading of the printed wiring board or circuit board
H05K  13/02  U	1	0	5E353	H05K  13/02	1274	Ĥΰ	Transfer of the printed wiring board
H05K  13/02  V	1	1	5E353	H05K  13/02	394	ΰĤλٻ	Supporting of the printed wiring board during transfer
H05K  13/02  W	1	0	5E353	H05K  13/02	377	ʡĤ̡ʬ	Sorting or categorisation of parts or printed wiring boards
H05K  13/02  Z	1	0	5E353	H05K  13/02	1455	¾Τ	Others
H05K  13/04  \	1	1	5E353	H05K  13/04	123	ʤμդΣ	Mounting of components
H05K  13/04  A	1	0	5E353	H05K  13/04	4110	إĥɤˤʤμդ	Installation of parts by the mounting head
H05K  13/04  B	1	1	5E353	H05K  13/04	4928	ɽ̼ˤ	using surface mounting
H05K  13/04  C	1	1	5E353	H05K  13/04	1397	ˤ	using insertion mounting
H05K  13/04  D	1	2	5E353	H05K  13/04	110	ģɣǻҤΤΤ	for DIP devices
H05K  13/04  F	1	0	5E353	H05K  13/04	551	ĤؤΥݥ޶ʡạ̇̄ͥ	Bending or cutting the lead wire before installation on the printed wiring board (13/04 A takes precedence.)
H05K  13/04  G	1	1	5E353	H05K  13/04	304	ݥζ	Lead wire correction
H05K  13/04  J	1	0	5E353	H05K  13/04	321	ĤؤμոΥݥ޶ʡạ̇̄ͥ	Bending or cutting the lead wire before installation on the printed wiring board (13/04 A takes precedence.)
H05K  13/04  K	1	1	5E353	H05K  13/04	300	դƱ˹ԤΡ̣ͥ	performed simultaneously with installation (13/04 A takes precedence.)
H05K  13/04  L	1	1	5E353	H05K  13/04	226	žĥݤˤ	Cutting by a rotary cutter
H05K  13/04  M	1	0	5E353	H05K  13/04	3549	ʤμհ֤ΰַ	Alignment of the part installed position
H05K  13/04  N	1	0	5E353	H05K  13/04	161	չؤΥݥΰ	Tool for guiding the lead wire to the installation hole
H05K  13/04  P	1	0	5E353	H05K  13/04	1862	Ĥλٻַ	Supporting or alignment of the printed wiring board
H05K  13/04  Q	1	1	5E353	H05K  13/04	431	Ĥѷɻ	Prevention of board deformation
H05K  13/04  R	1	0	5E353	H05K  13/04	246	ʤμդΤμ깩ʤΰȴơ	Manual tool for installation of parts (part removal R 13/00 F)
H05K  13/04  S	1	0	5E353	H05K  13/04	158	ݥ޶ʡǤΤμ깩	Manual too for bending or cutting the lead wire
H05K  13/04  Z	1	0	5E353	H05K  13/04	3138	¾Τ	Others
H05K  13/06  \	1	1	5E353	H05K  13/06	3	ˤΣ	Wiring by machine
H05K  13/06  A	1	0	5E353	H05K  13/06	117	ȤˤΤɽؼ	Indication or instruction for manual wiring
H05K  13/06  B	1	0	5E353	H05K  13/06	285		Wiring device
H05K  13/06  C	1	1	5E353	H05K  13/06	166	磻ݥϡݥͥΤΤ	for the wire harness
H05K  13/06  Z	1	0	5E353	H05K  13/06	88	¾Τ	Others
H05K  13/08  \	1	1	5E353	H05K  13/08	35	ΩΤ¤δƻΣ	Monitoring manufacture of assemblages
H05K  13/08  A	1	0	5E353	H05K  13/08	1374	ʤζδƻ	Monitoring supply of parts
H05K  13/08  K	1	1	5E353	H05K  13/08	150	ʥݥɤζʤθ	Detection of part's lead bending
H05K  13/08  L	1	1	5E353	H05K  13/08	68	ʤζ򸡽	Detection of part's polarity
H05K  13/08  B	1	0	5E353	H05K  13/08	1168	ʤμդδƻĻδƻ	Monitoring part's installation (monitoring of holding and adsorption)
H05K  13/08  M	1	1	5E353	H05K  13/08	35	˴ؤΡʸ󥵡Ѥʤ	related to insertion (not using the optical sensor and camera)
H05K  13/08  N	1	1	5E353	H05K  13/08	92	̼˴ؤΡʸ󥵡Ѥʤ	related to surface mounting (not using the optical sensor and camera)
H05K  13/08  P	1	1	5E353	H05K  13/08	431	󥵡ݤѤ	using an optical sensor
H05K  13/08  Q	1	1	5E353	H05K  13/08	2850	ʱˤˤ	using a camera (video processing)
H05K  13/08  C	1	0	5E353	H05K  13/08	104	δƻ	Monitoring of wiring
H05K  13/08  D	1	0	5E353	H05K  13/08	1108	ΩΤθ	Inspection of an assembly
H05K  13/08  T	1	1	5E353	H05K  13/08	81	Ʃˤ	using transmitting light
H05K  13/08  U	1	1	5E353	H05K  13/08	656	ȿ͸ˤ	using reflected light
H05K  13/08  Z	1	0	5E353	H05K  13/08	285	¾Τ	Others
