H10W  10/00  \	0	0	5F032	H10W  10/00	202	֤ιʴ֤ˤȾƳʬΥΰΣ	Constructional details of integrated devices in chips, wafers or substrates[2026.01]
H10W  10/00  E	0	0	5F032	H10W  10/00	596	ԥħΤ	Characterised by epitaxy
H10W  10/00  P	0	0	5F032	H10W  10/00	311	ꥳ¿ѤѤ	Utilising silicon porosification techniques
H10W  10/00  R	0	0	5F032	H10W  10/00	517	ħΤ	Characterised by ion injection
H10W  10/00  S	0	0	5F032	H10W  10/00	2043	̤ɻߤħΤ	Characterised by the prevention of parasitic effects
H10W  10/00  Z	0	0	5F032	H10W  10/00	165	¾Τ	Others
H10W  10/00 101 \	1	1	5F084	H10W  10/00	1945	Ĥ˿ľʬΥ㡥ӣϣ	Separation in a direction perpendicular to the substrate, e.g., SOI
H10W  10/00 101 B	1	0	5F084	H10W  10/00	5223	巿ӣϣ	Adhesive-type SOI
H10W  10/00 101 C	1	0	5F084	H10W  10/00	259	³	Connections; wiring
H10W  10/00 101 D	1	0	5F084	H10W  10/00	105	ñ뾽	Single-crystal insulating films
H10W  10/00 101 E	1	0	5F084	H10W  10/00	903	ԥ뷿ץ㡥ӣɣͣϣ	Epitaxial type; insulating film formation by ion implantation, e.g., SIMOX
H10W  10/00 101 F	1	0	5F084	H10W  10/00	824	ǻʬΥΰʬΥ	Device isolation; area isolation
H10W  10/00 101 G	1	0	5F084	H10W  10/00	71	Ⱦ﷿㡥ǣ	Semi-insulating types, e.g., GaAs
H10W  10/00 101 H	1	0	5F084	H10W  10/00	173	¿뾽ٻ	Multicrystalline supports
H10W  10/00 101 L	1	0	5F084	H10W  10/00	387	֡쥤	Placements; layouts
H10W  10/00 101 P	1	0	5F084	H10W  10/00	112	¿뾽ǽưءե	Polycrystalline active layers; Amorphous layers
H10W  10/00 101 Q	1	0	5F084	H10W  10/00	5	Ķʻ	Superlattices
H10W  10/00 101 R	1	0	5F084	H10W  10/00	818	Ʒ뾽	Re-crystallisation
H10W  10/00 101 S	1	0	5F084	H10W  10/00	748	ӣϣ	SOS
H10W  10/00 101 T	1	0	5F084	H10W  10/00	180	ƥȡ	Testing; inspection
H10W  10/00 101 Z	1	0	5F084	H10W  10/00	3821	¾Τ	Others
H10W  10/10  \	1	1	5F032	H10W  10/10	4101	ͶźޤʬΥΰΣ	Isolation regions comprising dielectric materials[2026.01]
H10W  10/13  \	2	2	5F032	H10W  10/13	2936	ꥳζɽΣ̣ϣãϣӡϤˤΡ㡥̶߳ɽΣӣɣ̣ϡϤޤ¦ɥޥʬΥΣӣףͣɡϡΣ	formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI][2026.01]
H10W  10/17  \	2	2	5F032	H10W  10/17	7877	ͶźѤȥƽŶˤΡ㡥ȥʬΥΣ	formed using trench refilling with dielectric materials, e.g. shallow trench isolations[2026.01]
H10W  10/20  \	1	1	5F032	H10W  10/20	500	åסΣ	Air gaps[2026.01]
H10W  10/30  \	1	1	5F032	H10W  10/30	1530	УܹޤʬΥΰΣ	Isolation regions comprising PN junctions[2026.01]
H10W  10/40  \	1	1	5F032	H10W  10/40	214	¿뾽ȾƳκޤʬΥΰΣ	Isolation regions comprising polycrystalline semiconductor materials[2026.01]
H10W  10/50  \	1	1	5F032	H10W  10/50	598	ų̤˴ŤʬΥΰΣ	Isolation regions based on field-effect[2026.01]
H10W  15/00  \	0	0	5F032	H10W  15/00	885	֤ιǻ٤˥ɡפ줿ΰΣ	Highly-doped buried regions of integrated devices[2026.01]
H10W  20/00  \	0	0	5F033	H10W  20/00	619	åסϤޤϴĤˤ³Σ	Interconnections in chips, wafers or substrates[2026.01]
H10W  20/00  B	0	0	5F033	H10W  20/00	4694	ѥη˴ؤ	Related to the formation of wiring patterns
H10W  20/00  C	0	1	5F033	H10W  20/00	4346	Υå󥰤ˤ	by etching wiring materials
H10W  20/00  E	0	1	5F033	H10W  20/00	400	ˤ	by selective oxidation
H10W  20/00  F	0	1	5F033	H10W  20/00	1201	ơѡη˴ؤ	Related to the formation of tapered shapes
H10W  20/00  G	0	1	5F033	H10W  20/00	821	եȥդˤ	by lift-off
H10W  20/00  K	0	0	5F033	H10W  20/00	4562	ɽ̤ʿó˴ؤ	Related to the flattening of surfaces
H10W  20/00  Z	0	0	5F033	H10W  20/00	0	¾Τ	Others
H10W  20/20  \	1	1	5F033	H10W  20/20	3683	ޤϴˤ³㡥ꥳ̥ӥΣԣӣ֡ϡΣ	Interconnections within wafers or substrates, e.g. through-silicon vias [TSV][2026.01]
H10W  20/40  \	1	1	5F033	H10W  20/40	0	Ϥγ¦ޤϴĤγ¦ˤ³㡥ХåΣ£ţϣ̡ϤΥ᥿饤ޤϥŶˤ³ƤӥΣ	Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes[2026.01]
H10W  20/40  V	1	0	5F033	H10W  20/40	901	̡㡥ͥ롤ν˴ؤ	Related to the removal of parasitic effects, e.g., parasitic channels
H10W  20/40  W	1	0	5F033	H10W  20/40	509	θ򺹤˴ؤ	Related to the intersection of wiring
H10W  20/40  Z	1	0	5F033	H10W  20/40	294	¾Τ	Others
H10W  20/41  \	2	2	5F033	H10W  20/41	0	ƳʬħΤΡΣ	characterised by their conductive parts[2026.01]
H10W  20/41  A	2	0	5F033	H10W  20/41	1678	ѥ㡥ΰŪ¤˴ؤ	Related to wiring patterns, e.g., the general structure of wiring
H10W  20/41  B	2	0	5F033	H10W  20/41	10444	ش֤³˴ؤ	Related to connections between wiring layers
H10W  20/41  C	2	0	5F033	H10W  20/41	7683	ؤȾƳδĤȤ³˴ؤ	Related to the connections between wiring layers and semiconductor substrates
H10W  20/41  Z	2	0	5F033	H10W  20/41	0	¾Τ	Others
H10W  20/42  \	3	3	5F033	H10W  20/42	5172	ӥ㡥ӥץ饰Σ	Vias, e.g. via plugs[2026.01]
H10W  20/43  \	3	3	5F033	H10W  20/43	3966	³Υ쥤ȡΣ	Layouts of interconnections[2026.01]
H10W  20/44  \	3	3	5F033	H10W  20/44	0	ƳʬƳźħΤΡΣ	Conductive materials thereof[2026.01]
H10W  20/44  M	3	0	5F033	H10W  20/44	3612	ʬ°Ǥ	Comprising metallic materials as the main components
H10W  20/44  X	3	1	5F033	H10W  20/44	15209	ãޤϣãѤ	Using Cu or Cu alloys
H10W  20/44  N	3	1	5F033	H10W  20/44	2589	ޤϣѤ	Using Al or Al alloys
H10W  20/44  R	3	1	5F033	H10W  20/44	4287	°غѤ	Using metal laminate materials
H10W  20/44  Q	3	0	5F033	H10W  20/44	1957	°ڤȾƳΤʻѤΡ㡥ꥵɡݥꥵ	Using metals and semiconductors concurrently, e.g., silicides and polycides
H10W  20/44  P	3	0	5F033	H10W  20/44	1004	ȾƳΤѤ	Using semiconductors
H10W  20/44  Z	3	0	5F033	H10W  20/44	0	¾Τ	Others
H10W  20/45  \	2	2	5F033	H10W  20/45	0	ʬħΤΡΣ	characterised by their insulating parts[2026.01]
H10W  20/45  P	2	0	5F033	H10W  20/45	1569	¤ˡħΤ	Characterised by the manufacturing methods
H10W  20/45  Q	2	1	5F033	H10W  20/45	1170	ۤˤ	by applying
H10W  20/45  R	2	1	5F033	H10W  20/45	556	ͻ㡥եܤ	Performing melting processes, e.g., reflow
H10W  20/45  Z	2	0	5F033	H10W  20/45	1545	¾Τ	Others
H10W  20/46  \	3	3	5F033	H10W  20/46	1205	åפޤΡΣ	comprising air gaps[2026.01]
H10W  20/47  \	3	3	5F033	H10W  20/47	1592	ۤʤ㡥ۤʤͶΨͭ룲İʾͶؤޤΡΣ	comprising two or more dielectric layers having different properties, e.g. different dielectric constants[2026.01]
H10W  20/48  \	3	3	5F033	H10W  20/48	0	ʬħΤΡΣ	Insulating materials thereof[2026.01]
H10W  20/48  K	3	0	5F033	H10W  20/48	1648	̵ˤ	by inorganic materials
H10W  20/48  L	3	1	5F033	H10W  20/48	384	°ʪˤ	by metallic compounds
H10W  20/48  S	3	0	5F033	H10W  20/48	1981	ͭˤ	by organic materials
H10W  20/48  Z	3	0	5F033	H10W  20/48	0	¾Τ	Others
H10W  20/49  \	2	2	5F033	H10W  20/49	0	ŬѲǽ³㡥ҥ塼ޤϥҥ塼Σ	Adaptable interconnections, e.g. fuses or antifuses[2026.01]
H10W  20/49  S	2	0	5F033	H10W  20/49	3076	ʳŪͭƳؤ˴ؤΡ㡥ɡߡ	Related to conductive layers with purposes other than wiring, e.g., shields and dummies
H10W  20/49  T	2	0	5F033	H10W  20/49	4563	ü˴ؤΡ㡥ܥǥ󥰥ѥå	Related to wiring ends, e.g., bonding pads
H10W  20/49  U	2	0	5F033	H10W  20/49	679	ҥ塼ҥ塼	Fuses and anti-fuses
H10W  20/49  Z	2	0	5F033	H10W  20/49	0	¾Τ	Others
H10W  29/00  \	0	0	5F032	H10W  29/00	165	¾ʬवʤ֤ΰŪʡΣ	Generic parts of integrated devices, not otherwise provided for[2026.01]
H10W  40/00  \	0	0	5F136	H10W  40/00	15	ǮݸޤǮΤιǮݸ֤뽸֣ȣģˡΣ	Constructional details related to chips, wafers, substrates or packages[2026.01]
H10W  40/00 100 \	1	1	5F136	H10W  40/00	13623	¤ޤϽ	Manufacture or treatment
H10W  40/00 900 \	1	1	5F136	H10W  40/00	315	Τι	Structures for constant temperature
H10W  40/10  \	1	1	5F136	H10W  40/10	1066	ǮΤιΣ	Arrangements for heating[2026.01]
H10W  40/20  \	1	1	5F136	H10W  40/20	0	ѤΤιΣ	Arrangements for cooling[2026.01]
H10W  40/20  A	1	0	5F136	H10W  40/20	2826	ȾƳǻҡƴޤϥ꡼	Semiconductor devices, containers, or leads
H10W  40/20  B	1	0	5F136	H10W  40/20	2752	߷	Resin-sealed type
H10W  40/20  C	1	0	5F136	H10W  40/20	4088	ǮϩĤޤϥƥ	Thermally conductive circuit boards or stems
H10W  40/20  Z	1	0	5F136	H10W  40/20	6241	¾	Others
H10W  40/22  \	2	2	5F136	H10W  40/22	2	ѤΤιηħΤΡ㡥߿ޤϱͽͭΡΣ	characterised by their shape, e.g. having conical or cylindrical projections[2026.01]
H10W  40/25  \	2	2	5F136	H10W  40/25	5168	ѤΤικħΤΡΣ	characterised by their materials[2026.01]
H10W  40/28  \	2	2	5F136	H10W  40/28	1002	ڥ顼ʤΡΣ	comprising Peltier coolers[2026.01]
H10W  40/30  \	1	1	5F136	H10W  40/30	1164	ѥåΤʳή˿ƤΡ㡥㲹ήΤ˿Ƥ	wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
H10W  40/40  \	1	1	5F136	H10W  40/40	65	ήưήΤˤǮ򴹤ȼΡΣ	involving heat exchange by flowing fluids[2026.01]
H10W  40/43  \	2	2	5F136	H10W  40/43	2950	ήưΤˤΡ㡥Σ	by flowing gases, e.g. forced air cooling[2026.01]
H10W  40/43 100 \	3	3	5F136	H10W  40/43	190	֤Ѳθ	Detection of changes in the air cooling condition
H10W  40/47  \	2	2	5F136	H10W  40/47	6119	ήưΤˤΡ㡥Σ	by flowing liquids, e.g. forced water cooling[2026.01]
H10W  40/50  \	1	1	5F136	H10W  40/50	540	٤Τ뤿ιΣ	Arrangements for sensing temperature[2026.01]
H10W  40/60  \	1	1	5F136	H10W  40/60	1934	ǮޤѹʬΥǽ˼դʡ㡥סΣ	Securing means for detachable heating or cooling arrangements, e.g. clamps[2026.01]
H10W  40/60  A	1	0	5F136	H10W  40/60	1707	ץȴĤȤμդ	Mounting on printed circuit boards
H10W  40/60  B	1	0	5F136	H10W  40/60	209	Ǯե󥰥륤饤󷿤μդ	Mounting of single in-line types with heat sinks
H10W  40/60  C	1	0	5F136	H10W  40/60	339	ֵ	Position control
H10W  40/60  D	1	0	5F136	H10W  40/60	940	ܷ	Pressure welding type
H10W  40/60  E	1	0	5F136	H10W  40/60	1620	ˤդ	Mounting by clamping
H10W  40/60  F	1	0	5F136	H10W  40/60	1691	ܹؤˤդ	Mounting by bonding layers
H10W  40/60  M	1	0	5F136	H10W  40/60	6288	ȯǮΤǮδ֤ǮƳ	Thermal conductive materials between heating elements and heat sinks
H10W  40/60  Z	1	0	5F136	H10W  40/60	1952	¾	Others
H10W  40/70  \	1	1	5F136	H10W  40/70	0	ƴޤˤ롤ǮݸޤǮΤνŶޤΣ	Fillings or auxiliary members in containers or in encapsulations for thermal protection or control[2026.01]
H10W  40/73  \	2	2	5F136	H10W  40/73	218	ѲˤѡΣ	for cooling by change of state[2026.01]
H10W  40/73 100 \	3	3	5F136	H10W  40/73	1278	ʨƭ	Boiling cooling
H10W  40/73 200 \	3	3	5F136	H10W  40/73	2825	ҡȥѥ	Heat pipes
H10W  40/77  \	2	2	5F136	H10W  40/77	0	ħΤΣ	Auxiliary members characterised by their shape[2026.01]
H10W  40/80  \	1	1	5F136	H10W  40/80	1191	ѥåǮݸޤǮΤβϩΣ	Circuit arrangements for thermal protection or control of packages[2026.01]
H10W  42/00  \	0	0	5F069	H10W  42/00	287	֤ݸΤιǮݸΤιȣףˡΣ	
H10W  42/00 100 \	1	1	5F069	H10W  42/00	353	Ū»ݸ	
H10W  42/20  \	1	1	5F069	H10W  42/20	1901	żȤޤγݸ㡥åޤŻҡΣ	
H10W  42/25  \	2	2	5F069	H10W  42/25	495	եݸ㡥ѤΤΤΡΣ	
H10W  42/40  \	1	1	5F069	H10W  42/40	0	󤫤ݸ㡥ʸޤϥС󥸥˥󥰡Σ	
H10W  42/60  \	1	1	5F069	H10W  42/60	1150	Ų٤ޤŵŤݸ㡥եǡɡŵݸ֤뽸֡ȣģˡΣ	
H10W  42/80  \	1	1	5F069	H10W  42/80	351	ήޤϲ٤ݸ㡥ҥ塼ޤʬήŵݸ֤뽸֡ȣģˡΣ	
H10W  42/80 100 \	2	2	5F069	H10W  42/80	363	Űݸ	
H10W  44/00  \	0	0	5F065	H10W  44/00	0	ԡ󥹤ޤ礵뤿ŵŪΣ	Electrical arrangements for controlling or matching impedance[2026.01]
H10W  44/20  \	1	1	5F065	H10W  44/20	0	ȿΣȣơϤޤ̵ȿΣңơϤˤŵŪΣ	at high-frequency [HF] or radio frequency [RF][2026.01]
H10W  46/00  \	0	0	5F117	H10W  46/00	0	֤ŬѤޡ㡥ޤϼ̤뤿ΤΡΣ	Marks applied to devices, e.g. for alignment or identification[2026.01]
H10W  46/00 101 \	1	1	5F117	H10W  46/00	1810	Υϥ٥ޤϥåץ٥ϤΥޡ	Marks applied in the preceding process (wafer level or chip level)
H10W  46/00 201 \	1	1	5F065	H10W  46/00	2044	幩Υѥå٥ϤΥޡ	Marks applied in the subsequent process (package level)
H10W  70/00  \	0	0	5F034	H10W  70/00	0	ѥåġ󥿡ݡءΣңģ̡ϡΣ	Aspects of packages[2026.01]
H10W  70/00  B	0	0	5F034	H10W  70/00	2329	̡äޤϣҤޤ	Substrates including L, C or R
H10W  70/00  E	0	0	5F034	H10W  70/00	1701	Ϲ¤ޤŸ³¤ħΤ	Substrates characterised by grounding structures or power supply connection structures
H10W  70/00  F	0	0	5F034	H10W  70/00	4377	åפܤ뤿ι¤ħΤ	Substrates characterized by chip mounting structures
H10W  70/00  R	0	1	5F034	H10W  70/00	0	Ƴܹήɻ߼	Means to prevent the flow of conductive adhesives
H10W  70/00  G	0	0	5F034	H10W  70/00	90	饹߷֤δ	Substrates of glass-sealed type devices
H10W  70/00  H	0	0	5F034	H10W  70/00	351	ϥ֥åɣɣѴ	Substrates for hybrid IC
H10W  70/00  J	0	0	5F034	H10W  70/00	4537	Ǯ¤	Thermal dissipation structures
H10W  70/00  K	0	0	5F034	H10W  70/00	1105	꡼ɼդħΤ	Substrates characterised by external lead attaching
H10W  70/00  L	0	0	5F034	H10W  70/00	4112	꡼ɥ쥹åץꥢ	Leadless chip carriers
H10W  70/00  P	0	0	5F034	H10W  70/00	1111	ԥ󥰥åɥ쥤	Pin grid arrays
H10W  70/00  S	0	0	5F034	H10W  70/00	0	ĤƱΤܹħ	Characterised by the joining of components constituting substrates
H10W  70/00  W	0	0	5F034	H10W  70/00	833	磻ܥǥ󥰤˴ϢĹ¤	Substrate construction associated with wire bonding
H10W  70/00  X	0	0	5F034	H10W  70/00	148	żɺ	Electromagnetic shield materials
H10W  70/00  Z	0	0	5F034	H10W  70/00	1126	¾	Others
H10W  70/00 301 \	1	1	5F034	H10W  70/00	0	ǻҤΥޥ	Mounting of high-frequency elements
H10W  70/00 301 C	1	0	5F034	H10W  70/00	524	ͣɣôĤμդ	MIC substrate mounting
H10W  70/00 301 D	1	0	5F034	H10W  70/00	162	ޥȥɥޥ	Microwave diode mounting
H10W  70/00 301 L	1	0	5F034	H10W  70/00	494	꡼ɥ󥹤㸺	Lead inductance reduction
H10W  70/00 301 Z	1	0	5F034	H10W  70/00	3018	¾	Others
H10W  70/00 501 \	1	1	5F034	H10W  70/00	0	ѥåĤ͵Ŷˤͭ	The one that has a projection-shaped electrode on a package substrate
H10W  70/00 501 T	1	0	5F034	H10W  70/00	1306	ѥåüҤܡʳΤ	The one that the package terminal has a shape other than a ball shape
H10W  70/00 501 B	1	0	5F034	H10W  70/00	3337	͵Ŷˤˤäƥåפå礭ʥѥåĤ³	The one that connects a chip with the package substrate that is bigger than the width of the chip by the projection-shaped electrode
H10W  70/00 501 W	1	0	5F034	H10W  70/00	2939	磻ˤäƥåפå礭ʥѥåĤ³	The one that the chip is connected with the package substrate having a width bigger than that of the chip by the wire
H10W  70/00 501 S	1	0	5F034	H10W  70/00	903	ѥåĤФƥѥåüҤȥåפƱ¦ˤ	The one that a package terminal and the chip are provided on the same side as the package substrate
H10W  70/00 501 C	1	0	5F034	H10W  70/00	700	ѥåĤåʲΤϥѥåĤͭʤ	The one that a package substrate has a width smaller than that of the chip or the one that does not have the package substrate
H10W  70/00 501 V	1	1	5F034	H10W  70/00	305	磻ޤϥ꡼ɤѤ	The one that uses the wire or the lead
H10W  70/00 501 Z	1	0	5F034	H10W  70/00	1532	¾	Others
H10W  70/01  \	1	1	5F034	H10W  70/01	0	¤ޤϽΣ	Manufacture or treatment[2026.01]
H10W  70/02  \	2	2	5F034	H10W  70/02	0	ȤƵǽƳѥåĤ¤ޤϽ㡥°ġʥ꡼ɥե졼¤ޤϽȣף	of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W0070040000)
H10W  70/04  \	2	2	5F066	H10W  70/04	0	꡼ɥե졼¤ޤϽΣ	of leadframes[2026.01]
H10W  70/04 100 \	3	3	5F066	H10W  70/04	221	Ʊץ	for coaxial-type diodes
H10W  70/04 250 \	3	3	5F066	H10W  70/04	340	üǻ	for 3-terminal elements
H10W  70/04 500 \	3	3	5F067	H10W  70/04	0	Ѳϩ	for integrated circuits
H10W  70/04 500 B	3	0	5F067	H10W  70/04	2328	꡼ɤޤ	Lead shaping or cutting
H10W  70/04 500 C	3	0	5F067	H10W  70/04	466	꡼ɤζʤ긡Фޤ	Lead bending detection or reshaping
H10W  70/04 500 Z	3	0	5F067	H10W  70/04	2201	¾	Others
H10W  70/05  \	2	2	5F034	H10W  70/05	0	ѥåġ󥿡ݡޤϺؤ¤ޤϽʥ꡼ɥե졼¤ޤϽȣףˡΣ	of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W0070040000)[2026.01]
H10W  70/05 200 \	3	3	5F034	H10W  70/05	1702	ߥåĤޤϥ饹Ĥ¤ޤϽ	Manufacture or treatment of ceramic substrates or glass substrates
H10W  70/06  \	3	3	5F034	H10W  70/06	0	ŪٻΤѤΡΣ	using temporary auxiliary supports[2026.01]
H10W  70/08  \	3	3	5F034	H10W  70/08	0	åפޤϥϾؤѤΡ㡥åץեȣңģ̡Σ	by depositing layers on the chip or wafer, e.g. "chip-first" RDLs[2026.01]
H10W  70/09  \	4	4	5F034	H10W  70/09	0	åפޤϥϤβϤߤξرĹΡ㡥ե󥢥ȥϥ٥ѥåΣƣϣף̣Сϣңģ̡Σ	extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs[2026.01]
H10W  70/20  \	1	1	5F034	H10W  70/20	4130	ȤƵǽƳѥåġ㡥°ġʥ꡼ɥե졼ȣף	Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W0070400000)
H10W  70/40  \	1	1	5F066	H10W  70/40	0	꡼ɥե졼Σ	Leadframes[2026.01]
H10W  70/40  A	1	0	5F066	H10W  70/40	0	ե졼ޤߤ꡼	Frame sections or hanging leads
H10W  70/40  B	1	1	5F066	H10W  70/40	0	֥꡼	Tab leads
H10W  70/40  D	1	0	5F066	H10W  70/40	354	åޤȾդ	Plating or soldering
H10W  70/40  F	1	0	5F066	H10W  70/40	357	Ǯ	Heat dissipation
H10W  70/40  G	1	0	5F066	H10W  70/40	633	⡼	Moulding
H10W  70/40  H	1	1	5F066	H10W  70/40	243	Ű塤ޥ졼ɻߡѼޤϥ꡼ɤȴɻ	Improving withstand voltage, preventing migration, improving moisture resistance, or preventing lead pull-out
H10W  70/40  L	1	0	5F066	H10W  70/40	460	åؤΥ꡼ɤμդ	Attaching leads to chip mounting members
H10W  70/40  M	1	1	5F066	H10W  70/40	0	꡼ɤμħΤ	Characterised by the shapes of lead-attaching sections
H10W  70/40  N	1	0	5F066	H10W  70/40	398	ؤΥ꡼ɤμդ	Attaching leads to external components
H10W  70/40  R	1	0	5F066	H10W  70/40	0	꡼	Miniaturised leads
H10W  70/40  S	1	0	5F066	H10W  70/40	788	åפȥ꡼ɤ³	Chip-to-lead connections
H10W  70/40  U	1	0	5F066	H10W  70/40	291	å	Chip-mounting sections
H10W  70/40  V	1	0	5F066	H10W  70/40	813	꡼Ѻ	Lead materials
H10W  70/40  Z	1	0	5F066	H10W  70/40	397	¾	Others
H10W  70/40 100 \	2	2	5F066	H10W  70/40	277	Ʊץ	Coaxial-type diodes
H10W  70/40 110 \	3	3	5F066	H10W  70/40	221	ΤħΤ	Characterised by overall features
H10W  70/40 120 \	3	3	5F066	H10W  70/40	281	ڥåȸꡤٻŶˤޤŶݸ	Pellet fixation, supporting electrodes, or electrode protection
H10W  70/40 130 \	3	3	5F066	H10W  70/40	301	꡼ɸꡤΥ꡼ɤޤϥ⡼	Lead fixation, integrated leads, or moulds
H10W  70/40 140 \	3	3	5F066	H10W  70/40	154	꡼	Miniaturized leads
H10W  70/40 200 \	2	2	5F066	H10W  70/40	975	üǻѡƱץɡѤ	for 2-terminal elements (excluding coaxial-type diodes and high-power applications)
H10W  70/40 250 \	2	2	5F066	H10W  70/40	1406	üǻ	for 3-terminal elements
H10W  70/40 300 \	2	2	5F066	H10W  70/40	2415		for high-power applications
H10W  70/40 310 \	3	3	5F066	H10W  70/40	0	Ǽ	for case-insert types
H10W  70/40 400 \	2	2	5F066	H10W  70/40	971	ǻ	for optical elements
H10W  70/40 500 \	2	2	5F067	H10W  70/40	4111	Ѳϩ	for integrated circuit devices
H10W  70/40 500 A	2	0	5F067	H10W  70/40	0	ե졼ޤߤ꡼	Frame sections or hanging leads
H10W  70/40 500 B	2	1	5F067	H10W  70/40	770	֥꡼	Tab leads
H10W  70/40 500 D	2	0	5F067	H10W  70/40	2330	å	Plating
H10W  70/40 500 E	2	0	5F067	H10W  70/40	0	Ⱦդ	Soldering
H10W  70/40 500 F	2	0	5F067	H10W  70/40	856	Ǯ	Thermolysis
H10W  70/40 500 G	2	0	5F067	H10W  70/40	1120	⡼	Moulding
H10W  70/40 500 H	2	1	5F067	H10W  70/40	2306	Ű塤ޥ졼ɻߡѼޤϥ꡼ɤȴɻ	Improving withstand voltage, preventing migration, improving moisture resistance, or preventing lead pull-out
H10W  70/40 500 J	2	1	5F067	H10W  70/40	1154	Х	Burr removal
H10W  70/40 500 L	2	0	5F067	H10W  70/40	768	åؤΥ꡼ɤμդ	Attaching leads to chip mounting members
H10W  70/40 500 M	2	1	5F067	H10W  70/40	1470	꡼ɤμħΤ	Characterised by the shapes of lead-attaching sections
H10W  70/40 500 N	2	0	5F067	H10W  70/40	625	ؤΥ꡼ɤμդ	Attaching leads to external components
H10W  70/40 500 P	2	0	5F067	H10W  70/40	2786	ԥ󥿥ץ꡼	Pin-type leads
H10W  70/40 500 R	2	0	5F067	H10W  70/40	1231	꡼	Miniaturised leads
H10W  70/40 500 S	2	0	5F067	H10W  70/40	1819	åפȥ꡼ɤ³	Chip-to-lead connections
H10W  70/40 500 T	2	1	5F067	H10W  70/40	2175	ܿɻ	Prevention of unnecessary contacts
H10W  70/40 500 U	2	0	5F067	H10W  70/40	441	å	Chip mounting sections
H10W  70/40 500 V	2	0	5F067	H10W  70/40	2531	꡼Ѻ	Lead materials
H10W  70/40 500 W	2	0	5F067	H10W  70/40	950	إե졼ޤǻҤ³Τüҹ¤	Terminal structures for interconnecting laminated frames or elements
H10W  70/40 500 X	2	0	5F067	H10W  70/40	813	ü֤ޤϲϩŪħĤ	with terminal arrangement or circuitry characteristics
H10W  70/40 500 Y	2	0	5F067	H10W  70/40	1852	ʣ꡼ɤʪˤٻ	Support of multiple leads by insulation
H10W  70/40 500 Z	2	0	5F067	H10W  70/40	2070	¾	Others
H10W  70/60  \	1	1	5F034	H10W  70/60	0	ѥåġ󥿡ݡءʥ꡼ɥե졼ࡡȣףˡΣ	Insulating or insulated package substrates; Interposers; Redistribution layers  (leadframes H10W0070400000)[2026.01]
H10W  70/60 500 \	2	2	5F034	H10W  70/60	610	ѥåĤեޤϥơ׾Τ	The one that a package substrate has a film shape or a tape shape
H10W  70/62  \	2	2	5F034	H10W  70/62	4722	ѥåġ󥿡ݡޤϺؤħΤΡΣ	characterised by their interconnections[2026.01]
H10W  70/62 500 \	3	3	5F034	H10W  70/62	4466		Redistribution layers
H10W  70/63  \	3	3	5F034	H10W  70/63	1173	ӥ㡥ӥץ饰Σ	Vias, e.g. via plugs[2026.01]
H10W  70/65  \	3	3	5F034	H10W  70/65	0	ηޤ֡Σ	Shapes or dispositions of interconnections[2026.01]
H10W  70/652  \	4	4	5F034	H10W  70/652	0	̷Σ	Cross-sectional shapes[2026.01]
H10W  70/654  \	4	4	5F034	H10W  70/654	0	̻Υ쥤ȡΣ	Top-view layouts[2026.01]
H10W  70/655  \	5	5	5F034	H10W  70/655	0	ե󥢥ȤΥ쥤ȡΣ	Fan-out layouts[2026.01]
H10W  70/656  \	5	5	5F034	H10W  70/656	0	ե󥤥Υ쥤ȡΣ	Fan-in layouts[2026.01]
H10W  70/66  \	3	3	5F034	H10W  70/66	0	ƳźħΤΡΣ	Conductive materials thereof[2026.01]
H10W  70/67  \	2	2	5F034	H10W  70/67	0	ѥåġ󥿡ݡޤϺؤؤޤʬħΤΡΣ	characterised by their insulating layers or insulating parts[2026.01]
H10W  70/68  \	3	3	5F034	H10W  70/68	0	ؤޤʬηޤ֡Σ	Shapes or dispositions thereof[2026.01]
H10W  70/68 200 \	4	4	5F034	H10W  70/68	2503	ߥåĤޤϥ饹Ĥηޤ	The shape or arrangement of ceramic or glass substrates
H10W  70/685  \	4	4	5F034	H10W  70/685	5512	ʣؤޤΡΣ	comprising multiple insulating layers[2026.01]
H10W  70/69  \	3	3	5F034	H10W  70/69	130	ؤޤʬħΤΡΣ	Insulating materials thereof[2026.01]
H10W  70/69 100 \	4	4	5F034	H10W  70/69	79	ɴ	Diamond substrates
H10W  70/692  \	4	4	5F034	H10W  70/692	2274	ߥåޤϥ饹Σ	Ceramics or glasses[2026.01]
H10W  70/695  \	4	4	5F034	H10W  70/685	1937	ͭΣ	Organic materials[2026.01]
H10W  70/698  \	4	4	5F034	H10W  70/698	590	ŵŪ魯ȾƳκ㡥ɡץꥳΣ	Semiconductor materials that are electrically insulating, e.g. undoped silicon[2026.01]
H10W  72/00  \	0	0	5F144	H10W  72/00	1606	ѥå³ޤϥͥΣ	Interconnections or connectors in packages[2026.01]
H10W  72/00 101 \	1	1	5F144	H10W  72/00	0	եܥǥ󥰡Υեåץåס	Face bonding (flip chips)
H10W  72/00 101 Q	1	0	5F144	H10W  72/00	9001	եܥǥ󥰤ˤ³	Connection using face bonding
H10W  72/00 101 R	1	1	5F144	H10W  72/00	3948	ơץꥢؤ³	Connection to tape carriers
H10W  72/00 101 S	1	1	5F144	H10W  72/00	12094	Ĥؤ³åפؤ³	Connection to insulating substrates; connection to chips
H10W  72/00 101 T	1	0	5F144	H10W  72/00	4927	եܥǥ	Face bonding devices
H10W  72/00 101 W	1	0	5F144	H10W  72/00	4759	ơץꥢ	Tape carriers
H10W  72/00 101 Z	1	0	5F144	H10W  72/00	279	¾Τ	Others
H10W  72/00 102 \	1	1	5F144	H10W  72/00	0	ޤ¬˴ؤ	Related to inspections or measurements
H10W  72/00 102 Y	1	0	5F144	H10W  72/00	1255	ܥǥ󥰸ޤ¬	Bonding inspections or measurements
H10W  72/00 102 T	1	0	5F144	H10W  72/00	621	Х׸ޤ¬	Bump inspections or measurements
H10W  72/00 102 Z	1	0	5F144	H10W  72/00	0	¾Τ	Others
H10W  72/00 103 \	1	1	5F144	H10W  72/00	0	¾Υͥޤϥܥǥ	Other connectors or bonding
H10W  72/00 103 X	1	0	5F144	H10W  72/00	485		High-frequency devices
H10W  72/00 103 Z	1	0	5F144	H10W  72/00	1203	¾Τ	Others
H10W  72/00 201 \	1	1	5F144	H10W  72/00	1583	ϤŬѤޤΡ㡥Ǯ	Including the application of pressure, e.g., thermo-compression bonding
H10W  72/00 202 \	1	1	5F144	H10W  72/00	2056	ư㡥ĶȿưŬѤޤ	Involving the application of mechanical vibrations, e.g., ultrasonic vibrations
H10W  72/00 203 \	1	1	5F144	H10W  72/00	0	åפž̹ޤ	Including chip transfer processes
H10W  72/20  \	1	1	5F144	H10W  72/20	0	Хץͥ㡥ϤХפޤƼԥ顼ߡХסޥХסΣ	Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps[2026.01]
H10W  72/20 101 \	2	2	5F144	H10W  72/20	0	¤ħ	Characterised by its structure
H10W  72/20 101 A	2	0	5F144	H10W  72/20	2485	Хפι¤	Bump structure
H10W  72/20 101 G	2	0	5F144	H10W  72/20	1246	졤	Insulating films and substrates
H10W  72/20 101 N	2	0	5F144	H10W  72/20	438	ʣΥХŶˤ֥ѥħ	Characterised by the layout patterns of multiple bump electrodes
H10W  72/20 101 P	2	1	5F144	H10W  72/20	331	̤εǽĥХפŪ	Selectively arranging bumps with special functions
H10W  72/20 101 Q	2	1	5F144	H10W  72/20	280	ֲս˱ƷѲ	Modifying shapes according to the arrangement location
H10W  72/20 101 R	2	0	5F144	H10W  72/20	337	³ŶˤȤηȤ߹碌ħ	Characterised by the combinations of shapes, materials, etc., with the connecting electrode
H10W  72/20 101 Z	2	0	5F144	H10W  72/20	413	¾Τ	Others
H10W  72/20 102 \	2	2	5F144	H10W  72/20	0	ʬħ	Characterised by the selection of materials and compositions
H10W  72/20 102 A	2	0	5F144	H10W  72/20	1273	Хפκʬ	Materials and compositions of bumps
H10W  72/20 102 G	2	0	5F144	H10W  72/20	183	κʬ	Materials and components of insulating films
H10W  72/20 102 Z	2	0	5F144	H10W  72/20	68	¾Τ	Others
H10W  72/20 103 \	2	2	5F144	H10W  72/20	0	¤ˡħ	Characterised by manufacturing methods
H10W  72/20 103 A	2	0	5F144	H10W  72/20	3919	Х׼Τ¤	Manufacturing of bumps per se
H10W  72/20 103 B	2	0	5F144	H10W  72/20	86	Хפκ	Bump mounting and placement
H10W  72/20 103 C	2	1	5F144	H10W  72/20	1549	ܡХפκ	Ball bump mounting and placement
H10W  72/20 103 D	2	1	5F144	H10W  72/20	954	磻ܡ롤ʤåɥХס¤	Manufacturing and mounting of wire balls, i.e., stud bumps
H10W  72/20 103 G	2	0	5F144	H10W  72/20	753	졦եȥ쥸¤	Manufacturing of insulating films, photoresist, etc.
H10W  72/20 103 Z	2	0	5F144	H10W  72/20	875	¾Τ	Others
H10W  72/20 104 \	2	2	5F144	H10W  72/20	0	Хפˤ³եܥǥ󥰡Υեåץåס	Connection by bumps and face bonding (flip chip)
H10W  72/29  \	2	2	5F144	H10W  72/29	0	ΤäŬ礹ܥɥѥåɡΣ	Bond pads specially adapted therefor[2026.01]
H10W  72/29 101 \	3	3	5F144	H10W  72/29	1343	ѥåɡŶˡΣգ£͡Ϥι¤ħ	Characterised by the structure of pads and under bump metallization (UBM) electrodes
H10W  72/29 102 \	3	3	5F144	H10W  72/29	853	ѥåɡŶˡΣգ£͡Ϥκʬħ	Characterised by the selection of materials and compositions for pads and under bump metallization (UBM) electrodes
H10W  72/29 103 \	3	3	5F144	H10W  72/29	1141	ѥåɡŶˡΣգ£͡Ϥ¤ˡħ	Characterised by the manufacturing methods of pads and under bump metallization (UBM) electrodes
H10W  72/30  \	1	1	5F047	H10W  72/30	1714	åͥΣ	Die-attach connectors[2026.01]
H10W  72/30  A	1	0	5F047	H10W  72/30	4366	¤	Structures
H10W  72/30  B	1	1	5F047	H10W  72/30	1496		Limiting materials
H10W  72/30  C	1	0	5F047	H10W  72/30	2990	ˡ	Methods
H10W  72/30  D	1	1	5F047	H10W  72/30	1041		Material restrictions
H10W  72/30  E	1	0	5F047	H10W  72/30	4574		Adhesive materials
H10W  72/30  F	1	0	5F047	H10W  72/30	5209	ܥǥ	Die bonding devices
H10W  72/30  G	1	1	5F047	H10W  72/30	1161	ζ롦	Supply and application of adhesive materials
H10W  72/30  H	1	1	5F047	H10W  72/30	462	˲Ǯ	Local heating means
H10W  72/30  J	1	0	5F047	H10W  72/30	1517	ܷ	Pressure welding types
H10W  72/30  Z	1	0	5F047	H10W  72/30	112	¾Τ	Others
H10W  72/40  \	1	1	5F144	H10W  72/40	3134	ƳΣ	Anisotropic conductive adhesives[2026.01]
H10W  72/49  \	2	2	5F144	H10W  72/49	0	ΤäŬ礹ܥɥѥåɡΣ	Bond pads specially adapted therefor[2026.01]
H10W  72/50  \	1	1	5F144	H10W  72/50	0	ܥɥ磻Σ	Bond wires[2026.01]
H10W  72/50  A	1	0	5F144	H10W  72/50	4481	磻ˤ³	Internal connection by wire
H10W  72/50  B	1	1	5F144	H10W  72/50	1601	Ŷˤȥ꡼ɥե졼Ȥ³	Connection between electrodes and lead frames
H10W  72/50  C	1	0	5F144	H10W  72/50	1016	磻Υ硼ɻ	Prevention of wire shorts
H10W  72/50  D	1	0	5F144	H10W  72/50	2066	磻ܥǥˡ	Wire bonding methods
H10W  72/50  F	1	0	5F144	H10W  72/50	1674	磻ܥǥѶ°	Metal wires for wire bonding
H10W  72/50  G	1	0	5F144	H10W  72/50	2279	磻ܥǥ֤ξ	Upper mechanisms of wire bonding devices
H10W  72/50  H	1	1	5F144	H10W  72/50	652	磻ܡ	Wire ball formation
H10W  72/50  J	1	1	5F144	H10W  72/50	749	磻ĥĴѡ磻䶡	Wire tension adjustment; clamping; wire supply
H10W  72/50  K	1	0	5F144	H10W  72/50	1103	磻ܥǥ֤β	Lower mechanisms of wire bonding devices
H10W  72/50  L	1	0	5F144	H10W  72/50	1280	ܥǥ󥰰ָΡ	Bonding position detection and control
H10W  72/50  M	1	0	5F144	H10W  72/50	709	꡼ɥե졼¦ħ	Characterised by the side of the lead frame
H10W  72/50  Z	1	0	5F144	H10W  72/50	191	¾Τ	Others
H10W  72/59  \	2	2	5F144	H10W  72/59	0	ΤäŬ礹ܥɥѥåɡΣ	Bond pads specially adapted therefor[2026.01]
H10W  72/59  N	2	0	5F144	H10W  72/59	1891	ѥåɤη֤ħ	Characterised by the configuration and arrangement of pads
H10W  72/59  P	2	0	5F144	H10W  72/59	2534	ѥåɤηְʳħ	Characterised by features other than the configuration and arrangement of pads
H10W  72/59  Z	2	0	5F144	H10W  72/59	0	¾Τ	Others
H10W  72/60  \	1	1	5F144	H10W  72/60	0	ȥåץͥ㡥֤Ϥ뤿θƼåסΣ	Strap connectors, e.g. thick copper clips for grounding of power devices[2026.01]
H10W  72/60  E	1	0	5F144	H10W  72/60	2789	ȥåץͥѥå³Ǥ	Strap connectors internally connected within the package
H10W  72/60  V	1	0	5F144	H10W  72/60	463	ȥåץͥѥå³ʤӡ꡼ɤȤʤ	Strap connectors connected outside the package, i.e., as beam leads
H10W  72/60  Z	1	0	5F144	H10W  72/60	0	¾Τ	Others
H10W  72/90  \	1	1	5F144	H10W  72/90	0	ܥɥѥåɰ̡Σ	Bond pads, in general[2026.01]
H10W  74/00  \	0	0	4M109	H10W  74/00	0	ȡ㡥ݸʤΣ	Encapsulations, e.g. protective coatings[2026.01]
H10W  74/01  \	1	1	5F061	H10W  74/01	0	¤ޤϽΣ	Manufacture or treatment[2026.01]
H10W  74/01  R	1	0	5F061	H10W  74/01	4999		Resin sealing
H10W  74/01  T	1	1	5F061	H10W  74/01	7112	ȥ󥹥եޤϼͽˤ	by transfer moulding or injection moulding
H10W  74/01  B	1	2	5F061	H10W  74/01	371	꡼ɥե졼½	Lead frame transport in and out
H10W  74/01  C	1	1	5F061	H10W  74/01	544	ڥåȤޤϥ֥å	Resin pellets or tablets
H10W  74/01  S	1	1	5F061	H10W  74/01	0	饷ȤѤ	Using resin sheets
H10W  74/01  D	1	1	5F061	H10W  74/01	712	Х	Deburring
H10W  74/01  E	1	1	5F061	H10W  74/01	3119		Resin coating
H10W  74/01  G	1	0	5F061	H10W  74/01	132	饹	Glass sealing
H10W  74/01  F	1	0	5F061	H10W  74/01	38	ޤϥ饹ʳˤ	Sealing with materials other than resin or glass
H10W  74/01  H	1	0	5F061	H10W  74/01	1137	꡼ɤħ	Characterised by the leads
H10W  74/01  J	1	0	5F061	H10W  74/01	725	ȾƳ	for optical semiconductors
H10W  74/01  Z	1	0	5F061	H10W  74/01	755	¾	Others
H10W  74/10  \	1	1	4M109	H10W  74/10	0	Ȥηޤ֤ħΤΡΣ	characterised by their shape or disposition[2026.01]
H10W  74/10  A	1	0	4M109	H10W  74/10	3969	꡼ɤħ	Characterised by the leads
H10W  74/10  B	1	0	4M109	H10W  74/10	1648	ǮľΤ	on heat dissipation substrates
H10W  74/10  T	1	0	4M109	H10W  74/10	287	ĤιͽФ꡼ɤ˥ĥפܤ	Having chips mounted on leads protruding from the pores of the insulating substrate
H10W  74/10  C	1	0	4M109	H10W  74/10	1217	ήɻ߼	Means to prevent flow
H10W  74/10  F	1	0	4M109	H10W  74/10	969	ɽ̤Ƴؤͭ	with conductive layers on the surface
H10W  74/10  G	1	0	4M109	H10W  74/10	35	Ǯ̺ͭ	with heat shrink materials
H10W  74/10  H	1	0	4M109	H10W  74/10	300	ɽޤϼ	Indication or identification
H10W  74/10  J	1	0	4M109	H10W  74/10	2037	ħ	Characterised by external shapes
H10W  74/10  K	1	0	4M109	H10W  74/10	1589	Ǽ	Case-enclosed types
H10W  74/10  L	1	1	4M109	H10W  74/10	306	ǼߺޤϤ	Sealing materials for case-housing types or their layouts
H10W  74/10  D	1	0	4M109	H10W  74/10	1280	ȾƳ	for optical semiconductors
H10W  74/10  E	1	0	4M109	H10W  74/10	921	Ѳϩ	for hybrid integrated circuits
H10W  74/10  M	1	0	4M109	H10W  74/10	71	Ȥƻ	Mainly for clocks
H10W  74/10  N	1	0	4M109	H10W  74/10	242	΢̤Τߤݸ	Protection of the back surface only
H10W  74/10  Z	1	0	4M109	H10W  74/10	2775	¾	Others
H10W  74/15  \	2	2	4M109	H10W  74/15	1665	եåץå֤γɽ̤ξˤΡ㡥եΣ	on active surfaces of flip-chip devices, e.g. underfills[2026.01]
H10W  74/40  \	1	1	4M109	H10W  74/40	0	ȤκħΤΡΣ	characterised by their materials[2026.01]
H10W  74/40  A	1	0	4M109	H10W  74/40	273	եäΤΤ	For shielding against alpha rays
H10W  74/40  E	1	0	4M109	H10W  74/40	135	׸	Using light-blocking materials
H10W  74/40  F	1	0	4M109	H10W  74/40	2618	ȾƳ	for optical semiconductors
H10W  74/40  Z	1	0	4M109	H10W  74/40	568	¾	Others
H10W  74/43  \	2	2	4M109	H10W  74/43	0	ʪⲽʪޤúʪޤΡ㡥ߥåޤϥ饹Σ	comprising oxides, nitrides or carbides, e.g. ceramics or glasses[2026.01]
H10W  74/43 100 \	3	3	4M109	H10W  74/43	446	饹	Glass sealing
H10W  74/47  \	2	2	4M109	H10W  74/47	13717	ͭޤΡ㡥Σ	comprising organic materials, e.g. plastics or resins[2026.01]
H10W  74/47 100 \	3	3	4M109	H10W  74/47	2658	ʣμ	Multiple resin layers
H10W  74/47 200 \	3	3	4M109	H10W  74/47	259	ͥ륮ǽ顤㡥ŻޤϥǹŲ	Energy beam-sensitive resins, e.g., those which cure under light, electron beams, or ionization radiation
H10W  76/00  \	0	0	5F065	H10W  76/00	0	ƴŶޤϤΤࡨΣ	Containers; Fillings or auxiliary members therefor; Seals[2026.01]
H10W  76/01  \	1	1	5F065	H10W  76/01	569	¤ޤϽΣ	Manufacture or treatment[2026.01]
H10W  76/05  \	2	2	5F065	H10W  76/05	11	ƴؤνŶ㡥ŶΣ	Providing fillings in containers, e.g. gas filling[2026.01]
H10W  76/10  \	1	1	5F065	H10W  76/10	0	ƴޤϤʬΣ	Containers or parts thereof[2026.01]
H10W  76/10  S	1	0	5F065	H10W  76/10	0	żȼ	for electromagnetic wave shielding
H10W  76/10  A	1	0	5F065	H10W  76/10	207		for radiation shielding
H10W  76/10  E	1	0	5F065	H10W  76/10	698	Ѳϩ	for hybrid integrated circuits
H10W  76/10  F	1	0	5F065	H10W  76/10	3214	ȾƳ	for optical semiconductors
H10W  76/10  H	1	0	5F065	H10W  76/10	1744	ȾƳǻ	or high-frequency semiconductor devices
H10W  76/10  Y	1	0	5F065	H10W  76/10	0	ĶƳǻ	or superconducting devices
H10W  76/10  G	1	0	5F065	H10W  76/10	623	̹ͭ	Having through pores
H10W  76/10  J	1	0	5F065	H10W  76/10	2617	ħΤ	Characterised by lids
H10W  76/10  K	1	0	5F065	H10W  76/10	207	˾	Comprising buffer materials
H10W  76/10  Z	1	0	5F065	H10W  76/10	1163	¾	Others
H10W  76/12  \	2	2	5F065	H10W  76/12	0	ƴηħΤΡΣ	characterised by their shape[2026.01]
H10W  76/12  A	2	0	5F065	H10W  76/12	867	ãߤΤ	for CAN sealing
H10W  76/12  B	2	0	5F065	H10W  76/12	601	ʿΤ	Flat type
H10W  76/12  C	2	0	5F065	H10W  76/12	367	åɷΤ	Stud type
H10W  76/12  D	2	0	5F065	H10W  76/12	1037	ħΤ	Characterised by external shapes
H10W  76/12  E	2	0	5F065	H10W  76/12	2099	꡼ɤ˴Ϣ	Related to leads
H10W  76/12  Z	2	0	5F065	H10W  76/12	7012	¾	Others
H10W  76/13  \	3	3	5F065	H10W  76/13	0	ȤƵǽƳޤƴΣ	Containers comprising a conductive base serving as an interconnection[2026.01]
H10W  76/132  \	4	4	5F065	H10W  76/132	0	Ƴϩ̤¾ͭΡΣ	having other interconnections through an insulated passage in the conductive base[2026.01]
H10W  76/134  \	4	4	5F065	H10W  76/134	0	ƳФʿԤ¾ͭΡΣ	having other interconnections parallel to the conductive base[2026.01]
H10W  76/136  \	4	4	5F065	H10W  76/136	0	ƳФƿľ¾ͭΡΣ	having other interconnections perpendicular to the conductive base[2026.01]
H10W  76/138  \	4	4	5F065	H10W  76/138	0	ƳФʿԤʤĤˤ¾ͭΡ㡥ɥåΣ	having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type[2026.01]
H10W  76/15  \	3	3	5F065	H10W  76/15	0	ޤƴΣ	Containers comprising an insulating or insulated base[2026.01]
H10W  76/153  \	4	4	5F065	H10W  76/153	0	̤ϩͭΡΣ	having interconnections in passages through the insulating or insulated base[2026.01]
H10W  76/157  \	4	4	5F065	H10W  76/157	0	ФʿԤͭΡΣ	having interconnections parallel to the insulating or insulated base[2026.01]
H10W  76/17  \	2	2	5F065	H10W  76/17	0	ƴκħΤΡΣ	characterised by their materials[2026.01]
H10W  76/17  A	2	0	5F065	H10W  76/17	62	׸	Light-blocking materials
H10W  76/17  B	2	0	5F065	H10W  76/17	649	°ޤƳź	Metals or conductive materials
H10W  76/17  C	2	0	5F065	H10W  76/17	73		Magnetic materials
H10W  76/17  D	2	0	5F065	H10W  76/17	17		Shape memory alloys
H10W  76/17  Z	2	0	5F065	H10W  76/17	423	¾	Others
H10W  76/18  \	3	3	5F065	H10W  76/18	0	㡥顤饹ޤϥߥåΣ	Insulating materials, e.g. resins, glasses or ceramics[2026.01]
H10W  76/18  A	3	0	5F065	H10W  76/18	1291	ƴ	Resin containers
H10W  76/18  B	3	0	5F065	H10W  76/18	694	饹ƴ	Glass containers
H10W  76/18  C	3	0	5F065	H10W  76/18	1892	ߥåƴ	Ceramic containers
H10W  76/18  D	3	1	5F065	H10W  76/18	186	ʪޤ	Containing non-oxidic substances
H10W  76/18  Z	3	0	5F065	H10W  76/18	186	¾	Others
H10W  76/40  \	1	1	5F065	H10W  76/40	0	ƴνŶޤࡤ㡥󥿥ƴޤˤ롤ǮݸޤǮΤνŶޤࡡȣףˡΣ	Fillings or auxiliary members in containers, e.g. centering rings  (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W0040700000)[2026.01]
H10W  76/42  \	2	2	5F065	H10W  76/42	51	ŶΣ	Fillings[2026.01]
H10W  76/43  \	3	3	5F065	H10W  76/43	168	νŶΣ	Gaseous fillings[2026.01]
H10W  76/45  \	3	3	5F065	H10W  76/45	115	վνŶΣ	Liquid fillings[2026.01]
H10W  76/47  \	3	3	5F065	H10W  76/47	201	ΤޤϥνŶΣ	Solid or gel fillings[2026.01]
H10W  76/48  \	3	3	5F065	H10W  76/48	328	ޤ¾˾ޤʤʪۼ롤ޤϤȿޤོŶΣ	Fillings including materials for absorbing or reacting with moisture or other undesired substances[2026.01]
H10W  76/60  \	1	1	5F065	H10W  76/60	0	Σ	Seals[2026.01]
H10W  76/63  \	2	2	5F065	H10W  76/63	2404	ηޤ֤ħΤΡ㡥ƴγɤδ֤ΥΣ	characterised by their shape or disposition, e.g. between cap and walls of a container[2026.01]
H10W  76/63 100 \	3	3	5F065	H10W  76/63	863	饹Ѥ	Using glass materials
H10W  76/63 200 \	3	3	5F065	H10W  76/63	2554	°Ѥ	Using metal materials
H10W  76/67  \	2	2	5F065	H10W  76/67	1308	κħΤΡΣ	characterised by their materials[2026.01]
H10W  76/67 100 \	3	3	5F065	H10W  76/67	652	饹	Glass materials
H10W  76/67 200 \	3	3	5F065	H10W  76/67	711	°	Metallic materials
H10W  76/67 300 \	3	3	5F065	H10W  76/67	84	ץץ쥰	Prepregs
H10W  78/00  \	0	0	5F035	H10W  78/00	0	ưΥѥåٻ뤿ΡʬΥǽݻΣ	Detachable holders for supporting packaged chips in operation[2026.01]
H10W  78/00  A	0	0	5F035	H10W  78/00	3253	ɣåå	IC sockets
H10W  78/00  B	0	0	5F035	H10W  78/00	528	ѼޤϹ	Jigs and tools for mounting
H10W  78/00  C	0	0	5F035	H10W  78/00	1038	ãηޤϳüҷѥݥȥ󥸥μդ	Mounting of CAN-type or 3-terminal type power transistors
H10W  78/00  D	0	0	5F035	H10W  78/00	3172	ٻ³ޤϼպ	Supports, connections, or attaching bases
H10W  78/00  E	0	0	5F035	H10W  78/00	484	ȥ󥸥μդޤϻٻȾդ	Attaching or supporting processes of transistors (excluding soldering)
H10W  78/00  Z	0	0	5F035	H10W  78/00	57	¾	Others
H10W  80/00  \	0	0	5F120	H10W  80/00	0	åסϤޤϴĤΥ쥯ȥܥǥ󥰡Σ	Direct bonding of chips, wafers or substrates[2026.01]
H10W  80/00  A	0	0	5F120	H10W  80/00	0	ϥ֥åɥܥǥ󥰡ʬƳʬƱľܹ	Hybrid bonding; simultaneous direct bonding between insulating sections and conductive sections
H10W  80/00  Z	0	0	5F120	H10W  80/00	0	¾Τ	Others
H10W  90/00  \	0	0	5F037	H10W  90/00	6279	ѥåƱΤŪ֤ޤϥѥåƱΤŪ֡Σ	Package configurations[2026.01]
H10W  90/00 100 \	1	1	5F037	H10W  90/00	0	ΩΤ¤ޤϽ	Assembly manufacturing or processing
H10W  90/00 200 \	1	1	5F037	H10W  90/00	0	ƱΤΰֹ碌Τη¤¤ޤϽ	Shapes or structures for alignment between components
H10W  90/00 310 \	1	1	5F037	H10W  90/00	0	ޤϸ	Optical wiring or optical coupling
H10W  90/00 320 \	1	1	5F037	H10W  90/00	0	ͶƳޤ̷	Inductive coupling or capacitive coupling
H10W  90/00 330 \	1	1	5F037	H10W  90/00	0	ĶƳޤĶƳǻҤޤ	Including superconductive wiring or superconductive elements
H10W  90/00 400 \	1	1	5F037	H10W  90/00	0	å״	Inter-chip wiring
H10W  90/00 400 P	1	0	5F037	H10W  90/00	316	å״¤ޤϽ	Manufacturing or processing of inter-chip wiring
H10W  90/00 400 A	1	0	5F037	H10W  90/00	444	å״η¤ޤϥ쥤	Shapes, structures or layouts of inter-chip wiring
H10W  90/00 400 B	1	1	5F037	H10W  90/00	595	å״֤¿Ǥ	Multi-layer wiring among chips
H10W  90/00 400 C	1	1	5F037	H10W  90/00	795	ΩŪ֤줿ޥå״֤	Wiring among three-dimensionally arranged multichips
H10W  90/00 400 D	1	1	5F037	H10W  90/00	691	ʿŪ֤줿ޥå״֤	Wiring among multichips arranged in a planar configuration
H10W  90/00 400 Z	1	0	5F037	H10W  90/00	156	¾	Others
H10W  90/00 550 \	1	1	5F037	H10W  90/00	1025	ʣΥåܴĤޤΩ	Including multiple chip mounting substrates
H10W  90/00 600 \	1	1	5F037	H10W  90/00	3585	ʤȤ⣱ĤȾƳΤ¾θ֤ʤΩ	Assemblies consisting of at least one semiconductor and other solid-state devices
H10W  90/00 700 \	1	1	5F037	H10W  90/00	462	Ω	Diode assemblies
H10W  90/00 750 \	2	2	5F037	H10W  90/00	216	ξѤΤ	for vehicles
H10W  90/00 800 \	1	1	5F037	H10W  90/00	10567	ѥ⥸塼	Power modules
H10W  90/00 910 \	1	1	5F037	H10W  90/00	0	̤ƴޤȤ֤ͭޤΩ	Assembly including devices with individual containers or sealing
H10W  90/00 910 A	1	0	5F037	H10W  90/00	157	Ω	Diode assemblies
H10W  90/00 910 B	1	1	5F037	H10W  90/00	178	ξѤΤ	for vehicles
H10W  90/00 910 C	1	1	5F037	H10W  90/00	64	ƤľŪ³줿	All connected in series
H10W  90/00 910 D	1	0	5F037	H10W  90/00	77	åɷǻҤޤ	Including stud-shaped elements
H10W  90/00 910 Z	1	0	5F037	H10W  90/00	865	¾	Others
H10W  90/00 912 \	2	2	5F037	H10W  90/00	0	ĤζüҤĤ	Having one common terminal
H10W  90/00 912 A	2	0	5F037	H10W  90/00	91	ðʤΤ	with pressurising means
H10W  90/00 912 Z	2	0	5F037	H10W  90/00	58	¾	Others
H10W  90/00 914 \	2	2	5F037	H10W  90/00	0	Ѥ߽Ťͤ줿	Stacked arrays
H10W  90/00 914 A	2	0	5F037	H10W  90/00	531	ʿȾƳǻҤβðå	Pressurised stacks of flat semiconductor devices
H10W  90/00 914 B	2	1	5F037	H10W  90/00	118	ۤʤäǻҤޤ	Containing different devices
H10W  90/00 914 C	2	0	5F037	H10W  90/00	132	ʣðåΩ	Assemblies of multiple pressurised stacks
H10W  90/00 914 D	2	0	5F037	H10W  90/00	40	Ω	Diode assemblyies
H10W  90/00 914 Z	2	0	5F037	H10W  90/00	1811	¾	Others
H10W  90/10  \	1	1	5F037	H10W  90/10	6	ܤåפ֡Σ	Configurations of laterally-adjacent chips[2026.01]
H10W  90/15  \	2	2	5F037	H10W  90/15	0	ܤåפߤ˰ۤʤߤͭΡΣ	the laterally-adjacent chips having different thicknesses than each other[2026.01]
H10W  90/20  \	1	1	5F037	H10W  90/20	0	ؤ줿åפ֡Σ	Configurations of stacked chips[2026.01]
H10W  90/20  A	1	0	5F037	H10W  90/20	495	ή	Laminated rectifiers
H10W  90/20  B	1	0	5F037	H10W  90/20	1883	åƱΤ͵Ŷˤˤ³	Connecting chips to one another by protruding electrodes
H10W  90/20  C	1	0	5F037	H10W  90/20	1871	åפ̤Ƴӥˤ³	Connection with conductive vias passing through the chips
H10W  90/20  K	1	0	5F037	H10W  90/20	0	ġƴޤȤ̤Ƴӥˤ³	Connection with conductive vias passing through the substrate, container, or sealing
H10W  90/20  E	1	0	5F037	H10W  90/20	1799	ʣåפƱ̤˥磻³	Wire connection on the same side surfaces of multiple chips
H10W  90/20  F	1	0	5F037	H10W  90/20	502	ʣåפȿ̤˥磻³	Wire connection on the surfaces on the opposite side of multiple chips
H10W  90/20  G	1	0	5F037	H10W  90/20	399	Х³å׾˥磻³åפ	Stacking wire-connected chips on bump-connected chips
H10W  90/20  H	1	0	5F037	H10W  90/20	1005	󥿡ݡѤ	Stacked layouts using interposers
H10W  90/20  J	1	0	5F037	H10W  90/20	173	Ĥޤʤ	Stacked layouts with bent substrates
H10W  90/20  Z	1	0	5F037	H10W  90/20	5863	¾	Others
H10W  90/20 100 \	2	2	5F037	H10W  90/20	108	˴̤줿İʾξ˼դ줿	Perforated devices mounted on one or more rods with through holes
H10W  90/22  \	2	2	5F037	H10W  90/22	452	åפѥåġ󥿡ݡޤϣңģ̤ξ̤Ȳ̤ξˤΡΣ	the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL[2026.01]
H10W  90/24  \	2	2	5F037	H10W  90/24	0	ؤ줿åפξʤȤ⣱Ĥܤåפʿ˥եåȤƤΡ㡥ʾΤΡΣ	at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape[2026.01]
H10W  90/26  \	2	2	5F037	H10W  90/26	0	ƱΥåפؤ졤Υåפʿ˥եåȤʤΡ㡥ĹΤΡΣ	the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape[2026.01]
H10W  90/28  \	2	2	5F037	H10W  90/28	0	ۤʤ륵Υåפؤ줿Ρ㡥ԥߥåɷΤΡΣ	the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape[2026.01]
H10W  95/00  \	0	0	5F059	H10W  95/00	0	Υ֥饹¾Υ롼פޤʤѥåˡΣ	Packaging processes not covered by the other groups of this subclass[2026.01]
H10W  95/00  A	0	0	5F059	H10W  95/00	404	Ω	Assemblies
H10W  95/00  B	0	1	5F059	H10W  95/00	297	ʤȤܥǥ󥰤ȥ磻ܥǥ󥰤ޤΩ	Assemblies including at least die bonding and wire bonding
H10W  95/00  C	0	0	5F059	H10W  95/00	1112	ʤΰ	Transfer and supply of components
H10W  95/00  D	0	1	5F059	H10W  95/00	1087	꡼ɥե졼ΰ	Transfer and supply of lead frames
H10W  95/00  E	0	0	5F059	H10W  95/00	212	꡼ɥե졼μǼ	Storage of lead frames
H10W  95/00  F	0	0	5F059	H10W  95/00	340	ʤΰַ	Positioning of components
H10W  95/00  G	0	0	5F059	H10W  95/00	109		Sealing
H10W  95/00  H	0	0	5F059	H10W  95/00	51	ä	Plating
H10W  95/00  J	0	0	5F059	H10W  95/00	98	Ǯ	Heating
H10W  95/00  Z	0	0	5F059	H10W  95/00	492	¾Τ	Others
H10W  99/00  \	0	0	5F065	H10W  99/00	841	Υ֥饹¾Υ롼פޤʤΣ	Subject matter not otherwise provided for in this section[2026.01]
