H05K   1/00		ϩΣ	Printed circuits	17128
H05K   1/02		Σ	Details	108879
H05K   1/03		ѺλѡΣ	Use of materials for the substrate	40127
H05K   1/05		°ΡΣ	Insulated metal substrate	7592
H05K   1/09		°ѥΤκλѡΣ	Use of materials for the metallic pattern	18586
H05K   1/11		ϩؤΡޤϰϩ֤ŵŪ³ΤΰǡΣ	Printed elements for providing electric connections to or between printed circuits	42212
H05K   1/14		İʾΰϩι¤ŪʰϩФޤϰϩ֤ŵŪ³򤹤뤿ΤΣȣˣȣңˡΣ	Structural association of two or more printed circuits(providing electric connection to or between printed circuits <b>H05K1/11</b>, <b>H01R12/00</b>)	31981
H05K   1/16		ŵʡ㡥񹳴ǥϰΡΣ	incorporating printed electric components, e.g. printed resistors, capacitors or inductors	15189
H05K   1/18		ˤʤŵʤȹ¤Ū˷礷ΡʣȣˣͥˡΣ	structurally associated with non-printed electric components (<b>H05K1/16</b> takes precedence)	67081
H05K   1/181		ɽ̼ʤȷ礷ΡΣ	associated with surface mounted components	
H05K   1/182		ץȴġΣУã¡˼줿ʡ㡥ʡΣɣͣáϡȷ礷ΡΣ	associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]	
H05K   1/183		Уã¤α˼ڤӻٻ줿ʤȷ礷ΡΣ	associated with components mounted in and supported by recessed areas of the PCBs	
H05K   1/184		Уã¤δ̹줿ʤȷ礷ΤǤäơʤüҤϡδ̹̾㤷Ϥüΰ³Ƥ뤫ϡδ̹ĶƼ㤷Ϥδ̹ͽФƤΣ	associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes	
H05K   1/185		Уã¤줿ʤȷ礷Ρ¿إץȴĤȤ߹ޤ줿ʤȷ礷ΡΣ	associated with components encapsulated in the insulating substrate of the PCBs; associated with components  incorporated in internal layers of multilayer circuit boards	
H05K   1/189		ե쥭֥ޤꤿ߰ϩλѤħȤΡΣ	characterised by the use of flexible or folded printed circuits	
H05K   3/00		ϩ¤뤿֤ޤˡΣ	Apparatus or processes for manufacturing printed circuits	83771
H05K   3/02		Ƴʪٻɽ̤˻ܤ줽θήƳפؤΤ˻Ȥʤʬɽ̤ΡΣ	in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding	7113
H05K   3/04		ƳʪŪ˼Ρ㡥ѥˤΡΣ	the conductive material being removed mechanically, e.g. by punching	2406
H05K   3/06		ƳʪŪˤޤŵʬˤΡ㡥ۥȥåˡΣ	the conductive material being removed chemically or electrolytically, e.g. by photo-etch process	17969
H05K   3/07		ŵʬˤΡΣ	being removed electrolytically	299
H05K   3/08		ƳʪŤˤäƼΡ㡥вŤοΣ	the conductive material being removed by electric discharge, e.g. by spark erosion	649
H05K   3/10		Ƴʪ˾Ƴͤ褦ٻ˻ܤΡΣ	in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern	12027
H05K   3/12		Ƴʪ夹Τ˰ѤѤΡΣ	using printing techniques to apply the conductive material	14852
H05K   3/14		Ƴʪ夹Τ˥ץ쵻ѤѤΡΣ	using spraying techniques to apply the conductive material	1783
H05K   3/16		ɥѥå󥰤ˤΡΣ	by cathodic sputtering	600
H05K   3/18		Ƴʪ夹ΤǤ󵻽ѤѤΡΣ	using precipitation techniques to apply the conductive material	14664
H05K   3/20		餫ȤΩƤƳͤŽ夹ΡΣ	by affixing prefabricated conductor pattern	5945
H05K   3/22		ϩΣŪΣ	Secondary treatment of printed circuits	9616
H05K   3/24		Ƴͤ䶯Σ	Reinforcing of the conductive pattern	9107
H05K   3/26		ƳͤޤϸΣ	Cleaning or polishing of the conductive pattern	6994
H05K   3/28		°ݸʤܤȡΣ	Applying non-metallic protective coatings	26546
H05K   3/30		ŵʡ㡥񹳴ϩ˼դ뤳ȡΣ	Assembling printed circuits with electric components, e.g. with resistors	25152
H05K   3/303		ɽ̼ʤդ뤳ȡʣȣˣͥˡΣ	with surface mounted components(<b>H05K3/32</b> takes precedence)	
H05K   3/306		꡼ʤդ뤳ȡʣȣˣͥˡΣ	with lead-in-hole components(<b>H05K3/32</b> takes precedence)	
H05K   3/32		ϩФŵŵŪ³Σ	electrically connecting electric components or wires to printed circuits	18864
H05K   3/321		ƳޤˤΡΣ	by conductive adhesives	
H05K   3/325		͹礻϶ˤΡΤεŪʡΣ	by abutting or pinching;  Mechanical auxiliary parts therefor	
H05K   3/328		ܤˤΡΣ	by welding	
H05K   3/34		ϤդˤΡΣ	by soldering	71249
H05K   3/341		ɽ̼ʡΣ	Surface mounted components	
H05K   3/3447		꡼ʡΣ	Lead-in-hole components	
H05K   3/3452		ϤޥΣ	Solder masks	
H05K   3/346		ϤκϤκΤäŬ礷Σ	Solder materials or compositions specially adapted therefor	
H05K   3/3465		ϤΣ	Application of solder	
H05K   3/3468		ͻϤۡ㡥ǥåפϤդΣ	Application of molten solder, e.g. dip soldering	
H05K   3/3473		ϤΤäΣ	Plating of solder	
H05K   3/3478		Ϥͽʪ塨äƷ줿Ϥͤž̡Σ	Application of solder preforms; Transferring prefabricated solder patterns	
H05K   3/3485		Ϥڡȡ꡼ʴΤƳ夵뤳Ȥǰϩν˾Ƴѥ뤿˰ѤѤΡȣˣˡΣ	Application of solder paste, slurry or powder(using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material <b>H05K3/12</b>)	
H05K   3/3489		եå塨̤ܿ뤿¾ˡΣ	Composition of fluxes; Application thereof; Other processes of activating the contact surfaces	
H05K   3/3494		եϤդβǮˡΣ	Heating processes for reflow soldering	
H05K   3/36		ϩ¾ΰϩȤ߹碌Σ	Assembling printed circuits with other printed circuits	15085
H05K   3/38		Τȶ°֤βɡΣ	Improvement of the adhesion between the insulating substrate and the metal	13508
H05K   3/40		ϩؤΡޤϰϩ֤ŵŪ³ΤΰǤηΣ	Forming printed elements for providing electric connections to or between printed circuits	18378
H05K   3/42		å줿̹Σ	Plated through-holes	13097
H05K   3/44		蘆줿°ϩ¤Σ	Manufacturing insulated metal core circuits	2456
H05K   3/46		¿زϩ¤Σ	Manufacturing multi-layer circuits	56675
H05K   5/00		ŵ֤ΤȢΡӥͥåȤޤϰФΣ	Casings, cabinets or drawers for electric apparatus	60804
H05K   5/02		Σ	Details	236090
H05K   5/03		СΣ	Covers	35847
H05K   5/04		°Σ	Metal casings	7567
H05K   5/06		̩Ĥ줿Σ	Hermetically-sealed casings	41182
H05K   5/10		ĤȢΤʣʬޤΡΣ	comprising several parts forming a closed casing	343
H05K   5/13		ͤˤȤΩƤΡΣ	assembled by screws	70
H05K   5/15		ˤȤΩƤΡΣ	assembled by resilient members	32
H05K   5/30		֤ޤ֡Σ	Side-by-side or stacked arrangements	129
H05K   7/00		ۤʤ뷿ŵ֤˶̤ι¤ŪʥӥͥåȡФȣˣˡΣ	Constructional details common to different types of electric apparatus(casings, cabinets, drawers <b>H05K5/00</b>)	29775
H05K   7/02		ٻ־βϩǻҤޤ֡Σ	Arrangements of circuit components or wiring on supporting structure	26324
H05K   7/04		Ƴ㥷ˤΡΣ	on conductive chassis	2820
H05K   7/06		ľˤΡΣ	on insulating boards	3929
H05K   7/08		ꤢľˤΡΣ	on perforated boards	2091
H05K   7/10		ϩǻҤΥץ饰ˤȤΩơΣ	Plug-in assemblages of components	6659
H05K   7/12		¤ʪФʤޤϥפˤռʡΣ	Resilient or clamping means for holding component to structure	20816
H05K   7/14		ޤϥե졼⤷ϲ;ؤλٻ֤μդΣ	Mounting supporting structure in casing or on frame or rack	101927
H05K   7/16		ҥ󥸤ޤϥԥܥåȾؤμդΣ	on hinges or pivots	5807
H05K   7/18		ͤޤϥե졼ι¤Σ	Construction of rack or frame	22198
H05K   7/20		ѡޤϲǮưפˤ뤿ѷΣ	Modifications to facilitate cooling, ventilating, or heating	332263
H05K   9/00		žޤϼФ֤ޤʤμפؤʥƥʤռͤۼ뤿֣ȣѣ	Screening of apparatus or components against electric or magnetic fields(devices for absorbing radiation from an antenna <b>H01Q17/00</b>)	78150
H05K  10/00		Ż֤ư뤿֡㡥Ʊͤͽ֤ߤΡΣ	Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar stand-by unit	1674
H05K  11/00		饸ޤϥƥӥȤϰۤʤäפʵǽ֤ȥ饸ޤϥƥӥȤȤ߹碌	Combinations of a radio or television receiver with apparatus having a different main function	1781
H05K  11/02		֤Ĥ	with vehicles	726
H05K  13/00		ŵʤΩΤ¤ޤĴäŬ֤ޤˡΣ	Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components	19226
H05K  13/02		ʤζΣ	Feeding of components	22216
H05K  13/04		ʤμդΣ	Mounting of components	39349
H05K  13/06		ˤΣ	Wiring by machine	2165
H05K  13/08		ΩΤ¤δƻΣ	Monitoring manufacture of assemblages	13983
