B81B1/00	7	Devices without movable or flexible elements, e.g. microcapillary devices	B81B1/00	B81B1/00		715
B81B1/002	8	{Holes characterised by their shape, in either longitudinal or sectional plane}	B81B1/00	B81B1/00		153
B81B1/004	9	{Through-holes, i.e. extending from one face to the other face of the wafer}	B81B1/00	B81B1/00		100
B81B1/006	8	{Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters}	B81B1/00	B81B1/00		112
B81B1/008	9	{Microtips}	B81B1/00	B81B1/00		95
B81B3/00	7	Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B5/00 takes precedence)	B81B3/00	B81B3/00		727
B81B3/0002	8	{Arrangements for avoiding sticking of the flexible or moving parts}	B81B3/00	B81B3/00		23
B81B3/0005	9	{Anti-stiction coatings}	B81B3/00	B81B3/00		164
B81B3/0008	9	{Structures for avoiding electrostatic attraction, e.g. avoiding charge accumulation}	B81B3/00	B81B3/00		134
B81B3/001	9	{Structures having a reduced contact area, e.g. with bumps or with a textured surface}	B81B3/00	B81B3/00		279
B81B3/0013	9	{Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness}	B81B3/00	B81B3/00		77
B81B3/0016	9	{Arrangements for avoiding sticking of the flexible or moving parts not provided for in groups B81B3/0005&#160;-&#160;B81B3/0013}	B81B3/00	B81B3/00		40
B81B3/0018	8	{Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators}	B81B3/00	B81B3/00		462
B81B3/0021	9	{Transducers for transforming electrical into mechanical energy or vice versa(dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00)}	B81B3/00	B81B3/00		1395
B81B3/0024	9	{Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators (electric motors using thermal effects H02N10/00)}	B81B3/00	B81B3/00		149
B81B3/0027	9	{Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation}	B81B3/00	B81B3/00		216
B81B3/0029	9	{Transducers for transforming light into mechanical energy or viceversa}	B81B3/00	B81B3/00		54
B81B3/0032	9	{Structures for transforming energy not provided for in groups B81B3/0021&#160;-&#160;B81B3/0029}	B81B3/00	B81B3/00		69
B81B3/0035	8	{Constitution or structural means for controlling the movement of the flexible or deformable elements}	B81B3/00	B81B3/00		203
B81B3/0037	9	{For increasing stroke, i.e. achieve large displacement of actuated parts}	B81B3/00	B81B3/00		106
B81B3/004	9	{Angular deflection}	B81B3/00	B81B3/00		70
B81B3/0043	10	{Increasing angular deflection}	B81B3/00	B81B3/00		73
B81B3/0045	10	{Improve properties related to angular swinging, e.g. control resonance frequency}	B81B3/00	B81B3/00		153
B81B3/0048	10	{Constitution or structural means for controlling angular deflection not provided for in groups B81B3/0043&#160;-&#160;B81B3/0045}	B81B3/00	B81B3/00		37
B81B3/0051	9	{For defining the movement, i.e. structures that guide or limit the movement of an element (mechanical arrangements for preventing or damping vibration or shock H01H3/60)}	B81B3/00	B81B3/00		486
B81B3/0054	9	{For holding or placing an element in a given position}	B81B3/00	B81B3/00		118
B81B3/0056	9	{Adjusting the distance between two elements, at least one of them being movable, e.g. air-gap tuning}	B81B3/00	B81B3/00		69
B81B3/0059	9	{Constitution or structural means for controlling the movement not provided for in groups B81B3/0037&#160;-&#160;B81B3/0056}	B81B3/00	B81B3/00		81
B81B3/0062	8	{Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension}	B81B3/00	B81B3/00		227
B81B3/0064	8	{Constitution or structural means for improving or controlling the physical properties of a device}	B81B3/00	B81B3/00		50
B81B3/0067	9	{Mechanical properties}	B81B3/00	B81B3/00		98
B81B3/007	10	{For controlling stiffness, e.g. ribs}	B81B3/00	B81B3/00		351
B81B3/0072	10	{For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers}	B81B3/00	B81B3/00		625
B81B3/0075	10	{For improving wear resistance}	B81B3/00	B81B3/00		75
B81B3/0078	10	{Constitution or structural means for improving mechanical properties not provided for in B81B3/007&#160;-&#160;B81B3/0075}	B81B3/00	B81B3/00		216
B81B3/0081	9	{Thermal properties}	B81B3/00	B81B3/00		188
B81B3/0083	9	{Optical properties}	B81B3/00	B81B3/00		137
B81B3/0086	9	{Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage}	B81B3/00	B81B3/00		455
B81B3/0089	9	{Chemical or biological characteristics, e.g. layer which makes a surface chemically active}	B81B3/00	B81B3/00		40
B81B3/0091	9	{Magnetic properties, e.g. guiding magnetic flux}	B81B3/00	B81B3/00		21
B81B3/0094	9	{Constitution or structural means for improving or controlling physical properties not provided for in B81B3/0067&#160;-&#160;B81B3/0091}	B81B3/00	B81B3/00		66
B81B3/0097	8	{Devices comprising flexible or deformable elements not provided for in groups B81B3/0002&#160;-&#160;B81B3/0094}	B81B3/00	B81B3/00		48
B81B5/00	7	Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements	B81B5/00	B81B5/00		292
B81B7/00	7	Microstructural systems; {Auxiliary parts of microstructural devices or systems}	B81B7/00	B81B7/00		527
B81B7/0003	8	{MEMS mechanisms for assembling automatically hinged components, self-assembly devices (self-assembly processes B81C1/00007)}	B81B7/00	B81B7/00		48
B81B7/0006	8	{Interconnects}	B81B7/00	B81B7/00		636
B81B7/0009	8	{Structural features, others than packages, for protecting a device against environmental influences (B81C1/00777 takes precedence)}	B81B7/00	B81B7/00		363
B81B7/0012	9	{Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment}	B81B7/00	B81B7/00		67
B81B7/0016	9	{Protection against shocks or vibrations, e.g. vibration damping}	B81B7/00	B81B7/00		224
B81B7/0019	9	{Protection against thermal alteration or destruction (B81B7/0083 takes precedence)}	B81B7/00	B81B7/00		109
B81B7/0022	9	{Protection against electrostatic discharge (circuit arrangements for protecting electronic switching circuits used for pulse technique against overcurrent or overvoltage H03K17/08; electrostatic discharge protection for electronic semiconductor circuits H10D89/60)}	B81B7/00	B81B7/00		42
B81B7/0025	9	{Protection against chemical alteration}	B81B7/00	B81B7/00		85
B81B7/0029	9	{Protection against environmental influences not provided for in groups B81B7/0012&#160;-&#160;B81B7/0025}	B81B7/00	B81B7/00		119
B81B7/0032	8	{Packages or encapsulation (processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023)}	B81B7/00	B81B7/00		690
B81B7/0035	9	{for maintaining a controlled atmosphere inside of the chamber containing the MEMS}	B81B7/00	B81B7/00		143
B81B7/0038	10	{using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters}	B81B7/00	B81B7/00		369
B81B7/0041	10	{maintaining a controlled atmosphere with techniques not provided for in B81B7/0038}	B81B7/00	B81B7/00		215
B81B7/0045	9	{for reducing stress inside of the package structure}	B81B7/00	B81B7/00		123
B81B7/0048	10	{between the MEMS die and the substrate}	B81B7/00	B81B7/00		417
B81B7/0051	10	{between the package lid and the substrate}	B81B7/00	B81B7/00		125
B81B7/0054	10	{between other parts not provided for in B81B7/0048&#160;-&#160;B81B7/0051}	B81B7/00	B81B7/00		84
B81B7/0058	9	{for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations}	B81B7/00	B81B7/00		385
B81B7/0061	9	{suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}	B81B7/00	B81B7/00		517
B81B7/0064	9	{for protecting against electromagnetic or electrostatic interferences}	B81B7/00	B81B7/00		282
B81B7/0067	9	{for controlling the passage of optical signals through the package}	B81B7/00	B81B7/00		194
B81B7/007	9	{Interconnections between the MEMS and external electrical signals}	B81B7/00	B81B7/00		1048
B81B7/0074	9	{3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board}	B81B7/00	B81B7/00		167
B81B7/0077	9	{Other packages not provided for in groups B81B7/0035&#160;-&#160;B81B7/0074}	B81B7/00	B81B7/00		314
B81B7/008	8	{MEMS characterised by an electronic circuit specially adapted for controlling or driving the same (B81B7/0087 takes precedence; arrangements for starting, regulating, braking, or otherwise controlling an actuator H02N; control arrangements or circuits for visual indicators G09G3/00)}<br><br><u>NOTE</u><br><br>This group covers: only MEMS with an electronic circuit which is not specific to a particular application. <br>This group does not cover: electronic circuits per se, e.g. for controlling or driving application specific MEMS. 	B81B7/00	B81B7/00		421
B81B7/0083	8	{Temperature control}	B81B7/00	B81B7/00		50
B81B7/0087	9	{On-device systems and sensors for controlling, regulating or monitoring}	B81B7/00	B81B7/00		128
B81B7/009	9	{Maintaining a constant temperature by heating or cooling}	B81B7/00	B81B7/00		10
B81B7/0093	10	{by cooling}	B81B7/00	B81B7/00		100
B81B7/0096	10	{by heating}	B81B7/00	B81B7/00		93
B81B7/02	8	containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence)	B81B7/02	B81B7/02		4804
B81B7/04	8	Networks or arrays of similar microstructural devices	B81B7/04	B81B7/04		448
B81B2201/00	7	Specific applications of microelectromechanical systems	CPCONLY	B81B2201/00		40
B81B2201/01	8	Switches	CPCONLY	B81B2201/01		91
B81B2201/012	9	characterised by the shape	CPCONLY	B81B2201/012		11
B81B2201/014	10	having a cantilever fixed on one side connected to one or more dimples	CPCONLY	B81B2201/014		164
B81B2201/016	10	having a bridge fixed on two ends and connected to one or more dimples	CPCONLY	B81B2201/016		99
B81B2201/018	10	Switches not provided for in B81B2201/014&#160;-&#160;B81B2201/016	CPCONLY	B81B2201/018		137
B81B2201/02	8	Sensors	CPCONLY	B81B2201/02		538
B81B2201/0207	9	Bolometers	CPCONLY	B81B2201/0207		113
B81B2201/0214	9	Biosensors; Chemical sensors	CPCONLY	B81B2201/0214		419
B81B2201/0221	9	Variable capacitors	CPCONLY	B81B2201/0221		155
B81B2201/0228	9	Inertial sensors	CPCONLY	B81B2201/0228		175
B81B2201/0235	10	Accelerometers	CPCONLY	B81B2201/0235		1710
B81B2201/0242	10	Gyroscopes	CPCONLY	B81B2201/0242		916
B81B2201/025	10	Inertial sensors not provided for in B81B2201/0235&#160;-&#160;B81B2201/0242	CPCONLY	B81B2201/025		223
B81B2201/0257	9	Microphones or microspeakers	CPCONLY	B81B2201/0257		1780
B81B2201/0264	9	Pressure sensors	CPCONLY	B81B2201/0264		1743
B81B2201/0271	9	Resonators; ultrasonic resonators	CPCONLY	B81B2201/0271		551
B81B2201/0278	9	Temperature sensors	CPCONLY	B81B2201/0278		205
B81B2201/0285	9	Vibration sensors	CPCONLY	B81B2201/0285		78
B81B2201/0292	9	Sensors not provided for in B81B2201/0207&#160;-&#160;B81B2201/0285	CPCONLY	B81B2201/0292		419
B81B2201/03	8	Microengines and actuators	CPCONLY	B81B2201/03		105
B81B2201/031	9	Thermal actuators	CPCONLY	B81B2201/031		89
B81B2201/032	9	Bimorph and unimorph actuators, e.g. piezo and thermo	CPCONLY	B81B2201/032		276
B81B2201/033	9	Comb drives	CPCONLY	B81B2201/033		316
B81B2201/034	9	Electrical rotating micromachines	CPCONLY	B81B2201/034		59
B81B2201/035	9	Microgears	CPCONLY	B81B2201/035		120
B81B2201/036	9	Micropumps	CPCONLY	B81B2201/036		139
B81B2201/037	9	Microtransmissions	CPCONLY	B81B2201/037		43
B81B2201/038	9	Microengines and actuators not provided for in B81B2201/031&#160;-&#160;B81B2201/037	CPCONLY	B81B2201/038		185
B81B2201/04	8	Optical MEMS	CPCONLY	B81B2201/04		146
B81B2201/042	9	Micromirrors, not used as optical switches	CPCONLY	B81B2201/042		1135
B81B2201/045	9	Optical switches	CPCONLY	B81B2201/045		210
B81B2201/047	9	Optical MEMS not provided for in B81B2201/042&#160;-&#160;B81B2201/045	CPCONLY	B81B2201/047		427
B81B2201/05	8	Microfluidics	CPCONLY	B81B2201/05		130
B81B2201/051	9	Micromixers, microreactors	CPCONLY	B81B2201/051		149
B81B2201/052	9	Ink-jet print cartridges	CPCONLY	B81B2201/052		99
B81B2201/054	9	Microvalves	CPCONLY	B81B2201/054		104
B81B2201/055	9	Microneedles	CPCONLY	B81B2201/055		153
B81B2201/057	9	Micropipets, dropformers	CPCONLY	B81B2201/057		37
B81B2201/058	9	Microfluidics not provided for in B81B2201/051&#160;-&#160;B81B2201/054	CPCONLY	B81B2201/058		584
B81B2201/06	8	Bio-MEMS	CPCONLY	B81B2201/06		80
B81B2201/07	8	Data storage devices, static or dynamic memories	CPCONLY	B81B2201/07		22
B81B2201/10	8	Microfilters, e.g. for gas or fluids	CPCONLY	B81B2201/10		52
B81B2201/11	8	Read heads, write heads or micropositioners for hard- or optical disks	CPCONLY	B81B2201/11		16
B81B2201/12	8	STM or AFM microtips	CPCONLY	B81B2201/12		45
B81B2201/13	8	Mechanical connectors, i.e. not functioning as an electrical connector	CPCONLY	B81B2201/13		36
B81B2203/00	7	Basic microelectromechanical structures	CPCONLY	B81B2203/00		4
B81B2203/01	8	Suspended structures, i.e. structures allowing a movement	CPCONLY	B81B2203/01		27
B81B2203/0109	9	Bridges	CPCONLY	B81B2203/0109		440
B81B2203/0118	9	Cantilevers	CPCONLY	B81B2203/0118		717
B81B2203/0127	9	Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function	CPCONLY	B81B2203/0127		1325
B81B2203/0136	9	Comb structures	CPCONLY	B81B2203/0136		305
B81B2203/0145	9	Flexible holders	CPCONLY	B81B2203/0145		11
B81B2203/0154	10	Torsion bars	CPCONLY	B81B2203/0154		182
B81B2203/0163	10	Spring holders	CPCONLY	B81B2203/0163		334
B81B2203/0172	10	Flexible holders not provided for in B81B2203/0154&#160;-&#160;B81B2203/0163	CPCONLY	B81B2203/0172		44
B81B2203/0181	9	See-saws	CPCONLY	B81B2203/0181		126
B81B2203/019	9	characterized by their profile	CPCONLY	B81B2203/019		121
B81B2203/03	8	Static structures	CPCONLY	B81B2203/03		11
B81B2203/0307	9	Anchors	CPCONLY	B81B2203/0307		323
B81B2203/0315	9	Cavities	CPCONLY	B81B2203/0315		750
B81B2203/0323	9	Grooves	CPCONLY	B81B2203/0323		32
B81B2203/033	10	Trenches	CPCONLY	B81B2203/033		225
B81B2203/0338	10	Channels	CPCONLY	B81B2203/0338		248
B81B2203/0346	10	Grooves not provided for in B81B2203/033&#160;-&#160;B81B2203/0338	CPCONLY	B81B2203/0346		19
B81B2203/0353	9	Holes	CPCONLY	B81B2203/0353		251
B81B2203/0361	9	Tips, pillars	CPCONLY	B81B2203/0361		281
B81B2203/0369	9	characterized by their profile	CPCONLY	B81B2203/0369		3
B81B2203/0376	10	rounded profile	CPCONLY	B81B2203/0376		47
B81B2203/0384	10	sloped profile	CPCONLY	B81B2203/0384		98
B81B2203/0392	10	profiles not provided for in B81B2203/0376&#160;-&#160;B81B2203/0384	CPCONLY	B81B2203/0392		59
B81B2203/04	8	Electrodes	CPCONLY	B81B2203/04		826
B81B2203/05	8	Type of movement	CPCONLY	B81B2203/05		15
B81B2203/051	9	Translation according to an axis parallel to the substrate	CPCONLY	B81B2203/051		227
B81B2203/053	9	Translation according to an axis perpendicular to the substrate	CPCONLY	B81B2203/053		277
B81B2203/055	9	Translation in a plane parallel to the substrate, i.e. enabling movement along any direction in the plane	CPCONLY	B81B2203/055		69
B81B2203/056	9	Rotation in a plane parallel to the substrate	CPCONLY	B81B2203/056		100
B81B2203/058	9	Rotation out of a plane parallel to the substrate	CPCONLY	B81B2203/058		403
B81B2203/06	8	Devices comprising elements which are movable in relation to each other, e.g. slidable or rotatable	CPCONLY	B81B2203/06		45
B81B2207/00	7	Microstructural systems or auxiliary parts thereof	CPCONLY	B81B2207/00		8
B81B2207/01	8	comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS	CPCONLY	B81B2207/01		22
B81B2207/012	9	the micromechanical device and the control or processing electronics being separate parts in the same package	CPCONLY	B81B2207/012		773
B81B2207/015	9	the micromechanical device and the control or processing electronics being integrated on the same substrate	CPCONLY	B81B2207/015		335
B81B2207/017	9	Smart-MEMS not provided for in B81B2207/012&#160;-&#160;B81B2207/015	CPCONLY	B81B2207/017		21
B81B2207/03	8	Electronic circuits for micromechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting	CPCONLY	B81B2207/03		128
B81B2207/05	8	Arrays	CPCONLY	B81B2207/05		23
B81B2207/053	9	of movable structures	CPCONLY	B81B2207/053		127
B81B2207/056	9	of static structures	CPCONLY	B81B2207/056		154
B81B2207/07	8	Interconnects	CPCONLY	B81B2207/07		706
B81B2207/09	8	Packages	CPCONLY	B81B2207/09		90
B81B2207/091	9	Arrangements for connecting external electrical signals to mechanical structures inside the package	CPCONLY	B81B2207/091		22
B81B2207/092	10	Buried interconnects in the substrate or in the lid	CPCONLY	B81B2207/092		137
B81B2207/093	10	Conductive package seal	CPCONLY	B81B2207/093		61
B81B2207/094	10	Feed-through, via	CPCONLY	B81B2207/094		31
B81B2207/095	11	through the lid	CPCONLY	B81B2207/095		235
B81B2207/096	11	through the substrate	CPCONLY	B81B2207/096		349
B81B2207/097	10	Interconnects arranged on the substrate or the lid, and covered by the package seal	CPCONLY	B81B2207/097		158
B81B2207/098	10	Arrangements not provided for in groups B81B2207/092&#160;-&#160;B81B2207/097	CPCONLY	B81B2207/098		103
B81B2207/11	8	Structural features, others than packages, for protecting a device against environmental influences	CPCONLY	B81B2207/11		48
B81B2207/115	9	Protective layers applied directly to the device before packaging	CPCONLY	B81B2207/115		66
B81B2207/99	8	Microstructural systems or auxiliary parts thereof not provided for in B81B2207/01&#160;-&#160;B81B2207/115	CPCONLY	B81B2207/99		30
