H05K1/00	7	Printed circuits	H05K1/00	H05K1/00		556
H05K1/02	8	Details	H05K1/02	H05K1/02		6168
H05K1/0201	9	{Thermal arrangements, e.g. for cooling, heating or preventing overheating}	H05K1/02	H05K1/02		2529
H05K1/0203	10	{Cooling of mounted components (H05K1/0272 takes precedence)}	H05K1/02	H05K1/02		4273
H05K1/0204	11	{using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)}	H05K1/02	H05K1/02		1838
H05K1/0206	12	{by printed thermal vias}	H05K1/02	H05K1/02		1949
H05K1/0207	11	{using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes}	H05K1/02	H05K1/02		844
H05K1/0209	11	{External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings}	H05K1/02	H05K1/02		2124
H05K1/021	11	{Components thermally connected to metal substrates or heat-sinks by insert mounting}	H05K1/02	H05K1/02		1149
H05K1/0212	10	{Printed circuits or mounted components having integral heating means}	H05K1/02	H05K1/02		531
H05K1/0213	9	{Electrical arrangements not otherwise provided for}	H05K1/02	H05K1/02		1394
H05K1/0215	10	{Grounding of printed circuits by connection to external grounding means}	H05K1/02	H05K1/02		1250
H05K1/0216	10	{Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}	H05K1/02	H05K1/02		2655
H05K1/0218	11	{by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}	H05K1/02	H05K1/02		2922
H05K1/0219	12	{Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors}	H05K1/02	H05K1/02		1299
H05K1/0221	13	{Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines}	H05K1/02	H05K1/02		277
H05K1/0222	13	{for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence}	H05K1/02	H05K1/02		473
H05K1/0224	12	{Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence)}	H05K1/02	H05K1/02		787
H05K1/0225	13	{Single or multiple openings in a shielding, ground or power plane (H05K1/0227 takes precedence)}	H05K1/02	H05K1/02		388
H05K1/0227	13	{Split or nearly split shielding or ground planes}	H05K1/02	H05K1/02		195
H05K1/0228	11	{Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245)}	H05K1/02	H05K1/02		742
H05K1/023	11	{using auxiliary mounted passive components or auxiliary substances (printed passive components H05K1/16)}	H05K1/02	H05K1/02		467
H05K1/0231	12	{Capacitors or dielectric substances}	H05K1/02	H05K1/02		1560
H05K1/0233	12	{Filters, inductors or a magnetic substance}	H05K1/02	H05K1/02		808
H05K1/0234	12	{Resistors or by disposing resistive or lossy substances in or near power planes (H05K1/0246 takes precedence)}	H05K1/02	H05K1/02		186
H05K1/0236	11	{Electromagnetic band-gap structures}	H05K1/02	H05K1/02		288
H05K1/0237	10	{High frequency adaptations (H05K1/0216 takes precedence)}	H05K1/02	H05K1/02		2289
H05K1/0239	11	{Signal transmission by AC coupling}	H05K1/02	H05K1/02		282
H05K1/024	11	{Dielectric details, e.g. changing the dielectric material around a transmission line}	H05K1/02	H05K1/02		1126
H05K1/0242	11	{Structural details of individual signal conductors, e.g. related to the skin effect}	H05K1/02	H05K1/02		387
H05K1/0243	11	{Printed circuits associated with mounted high frequency components}	H05K1/02	H05K1/02		1842
H05K1/0245	11	{Lay-out of balanced signal pairs, e.g. differential lines or twisted lines}	H05K1/02	H05K1/02		1169
H05K1/0246	11	{Termination of transmission lines}	H05K1/02	H05K1/02		204
H05K1/0248	11	{Skew reduction or using delay lines}	H05K1/02	H05K1/02		253
H05K1/025	11	{Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20)}	H05K1/02	H05K1/02		1147
H05K1/0251	12	{related to vias or transitions between vias and transmission lines}	H05K1/02	H05K1/02		767
H05K1/0253	12	{Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence)}	H05K1/02	H05K1/02		506
H05K1/0254	10	{High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection (electrostatic discharge protection for electric apparatus in general H05K9/0067, H05K9/0079); Arrangements for regulating voltages or for using plural voltages}	H05K1/02	H05K1/02		590
H05K1/0256	11	{Electrical insulation details, e.g. around high voltage areas}	H05K1/02	H05K1/02		544
H05K1/0257	11	{Overvoltage protection}	H05K1/02	H05K1/02		203
H05K1/0259	12	{Electrostatic discharge [ESD] protection}	H05K1/02	H05K1/02		811
H05K1/026	12	{Spark gaps}	H05K1/02	H05K1/02		163
H05K1/0262	11	{Arrangements for regulating voltages or for using plural voltages}	H05K1/02	H05K1/02		388
H05K1/0263	10	{High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence)}	H05K1/02	H05K1/02		1355
H05K1/0265	11	{characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections}	H05K1/02	H05K1/02		691
H05K1/0266	9	{Marks, test patterns or identification means}	H05K1/02	H05K1/02		2707
H05K1/0268	10	{for electrical inspection or testing}	H05K1/02	H05K1/02		1786
H05K1/0269	10	{for visual or optical inspection}	H05K1/02	H05K1/02		1901
H05K1/0271	9	{Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}	H05K1/02	H05K1/02		3725
H05K1/0272	9	{Adaptations for fluid transport, e.g. channels, holes}	H05K1/02	H05K1/02		861
H05K1/0274	9	{Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}	H05K1/02	H05K1/02		2106
H05K1/0275	9	{Security details, e.g. tampering prevention or detection}	H05K1/02	H05K1/02		462
H05K1/0277	9	{Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)}	H05K1/02	H05K1/02		448
H05K1/0278	10	{Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material}	H05K1/02	H05K1/02		548
H05K1/028	10	{Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}	H05K1/02	H05K1/02		3470
H05K1/0281	11	{Reinforcement details thereof}	H05K1/02	H05K1/02		1240
H05K1/0283	10	{Stretchable printed circuits}	H05K1/02	H05K1/02		1030
H05K1/0284	9	{Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)}	H05K1/02	H05K1/02		1672
H05K1/0286	9	{Programmable, customizable or modifiable circuits (by programmable non-printed jumper connections H05K3/222)}	H05K1/02	H05K1/02		935
H05K1/0287	10	{having an universal lay-out, e.g. pad or land grid patterns or mesh patterns}	H05K1/02	H05K1/02		493
H05K1/0289	11	{having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes}	H05K1/02	H05K1/02		582
H05K1/029	10	{having a programmable lay-out, i.e. adapted for choosing between a few possibilities}	H05K1/02	H05K1/02		397
H05K1/0292	10	{having a modifiable lay-out, i.e. adapted for engineering changes or repair (H05K1/0293 takes precedence)}	H05K1/02	H05K1/02		237
H05K1/0293	10	{Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches}	H05K1/02	H05K1/02		592
H05K1/0295	10	{adapted for choosing between different types or different locations of mounted components}	H05K1/02	H05K1/02		401
H05K1/0296	9	{Conductive pattern lay-out details not covered by sub groups H05K1/02&#160;-&#160;H05K1/0295(H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)}	H05K1/02	H05K1/02		1394
H05K1/0298	10	{Multilayer circuits}	H05K1/02	H05K1/02		4857
H05K1/03	9	Use of materials for the substrate	H05K1/03	H05K1/03		3005
H05K1/0306	10	{Inorganic insulating substrates, e.g. ceramic, glass}	H05K1/03	H05K1/03		7549
H05K1/0313	10	{Organic insulating material}	H05K1/03	H05K1/03		1208
H05K1/032	11	{consisting of one material}<br><br><u>NOTE</u><br><br>In this group, in the absence of an indication to the contrary, a material is classified in the last appropriate place.	H05K1/03	H05K1/03		398
H05K1/0326	12	{containing O}	H05K1/03	H05K1/03		1680
H05K1/0333	12	{containing S}	H05K1/03	H05K1/03		186
H05K1/034	12	{containing halogen}	H05K1/03	H05K1/03		440
H05K1/0346	12	{containing N}	H05K1/03	H05K1/03		1947
H05K1/0353	11	{consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement}	H05K1/03	H05K1/03		1501
H05K1/036	12	{Multilayers with layers of different types}	H05K1/03	H05K1/03		1764
H05K1/0366	12	{reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}	H05K1/03	H05K1/03		3246
H05K1/0373	12	{containing additives, e.g. fillers (H05K1/036 takes precedence)}	H05K1/03	H05K1/03		3350
H05K1/038	10	{Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366)}	H05K1/03	H05K1/03		640
H05K1/0386	10	{Paper sheets (used as reinforcing materials for organic insulating substrates H05K1/0366)}	H05K1/03	H05K1/03		163
H05K1/0393	10	{Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}	H05K1/03	H05K1/03		5088
H05K1/05	10	Insulated {conductive substrates, e.g. insulated} metal substrate	H05K1/05	H05K1/05		2054
H05K1/053	11	{the metal substrate being covered by an inorganic insulating layer}	H05K1/05	H05K1/05		812
H05K1/056	11	{the metal substrate being covered by an organic insulating layer}	H05K1/05	H05K1/05		1842
H05K1/09	9	Use of materials for the {conductive, e.g. } metallic pattern	H05K1/09	H05K1/09		4339
H05K1/092	10	{Dispersed materials, e.g. conductive pastes or inks}	H05K1/09	H05K1/09		3570
H05K1/095	11	{for polymer thick films, i.e. having a permanent organic polymeric binder}	H05K1/09	H05K1/09		2404
H05K1/097	11	{Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence)}	H05K1/09	H05K1/09		1066
H05K1/11	9	Printed elements for providing electric connections to or between printed circuits	H05K1/11	H05K1/11		4581
H05K1/111	10	{Pads for surface mounting, e.g. lay-out}	H05K1/11	H05K1/11		5415
H05K1/112	11	{directly combined with via connections}	H05K1/11	H05K1/11		1298
H05K1/113	12	{Via provided in pad; Pad over filled via}	H05K1/11	H05K1/11		1689
H05K1/114	12	{Pad being close to via, but not surrounding the via}	H05K1/11	H05K1/11		448
H05K1/115	10	{Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}	H05K1/11	H05K1/11		5768
H05K1/116	11	{Lands, clearance holes or other lay-out details concerning the surrounding of a via}	H05K1/11	H05K1/11		2175
H05K1/117	10	{Pads along the edge of rigid circuit boards, e.g. for pluggable connectors}	H05K1/11	H05K1/11		2894
H05K1/118	10	{specially for flexible printed circuits, e.g. using folded portions}	H05K1/11	H05K1/11		3347
H05K1/119	10	{Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence)}	H05K1/11	H05K1/11		558
H05K1/14	9	Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00)	H05K1/14	H05K1/14		3415
H05K1/141	10	{One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}	H05K1/14	H05K1/14		5013
H05K1/142	10	{Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit}	H05K1/14	H05K1/14		1443
H05K1/144	10	{Stacked arrangements of planar printed circuit boards}	H05K1/14	H05K1/14		4458
H05K1/145	10	{Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules}	H05K1/14	H05K1/14		1108
H05K1/147	10	{at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)}	H05K1/14	H05K1/14		3899
H05K1/148	10	{Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means}	H05K1/14	H05K1/14		1107
H05K1/16	8	incorporating printed electric components, e.g. printed resistors, capacitors or inductors	H05K1/16	H05K1/16		2422
H05K1/162	9	{incorporating printed capacitors}	H05K1/16	H05K1/16		2590
H05K1/165	9	{incorporating printed inductors}	H05K1/16	H05K1/16		2773
H05K1/167	9	{incorporating printed resistors}	H05K1/16	H05K1/16		1919
H05K1/18	8	structurally associated with non-printed electric components (H05K1/16 takes precedence)	H05K1/18	H05K1/18		7219
H05K1/181	9	associated with surface mounted components	H05K1/181	H05K1/181		11354
H05K1/182	9	associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]	H05K1/182	H05K1/182		2988
H05K1/183	10	associated with components mounted in and supported by recessed areas of the PCBs	H05K1/183	H05K1/183		1955
H05K1/184	10	associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes	H05K1/184	H05K1/184		1364
H05K1/185	10	associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards	H05K1/185	H05K1/185		3273
H05K1/186	11	{manufactured by mounting on or connecting to patterned circuits before or during embedding}	H05K1/185	H05K1/18		880
H05K1/187	12	{the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier}	H05K1/185	H05K1/18		170
H05K1/188	11	{manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component}	H05K1/185	H05K1/18		298
H05K1/189	9	characterised by the use of flexible or folded printed circuits	H05K1/189	H05K1/189		6292
H05K3/00	7	Apparatus or processes for manufacturing printed circuits	H05K3/00	H05K3/00		4885
H05K3/0002	8	{for manufacturing artworks for printed circuits}	H05K3/00	H05K3/00		745
H05K3/0005	8	{for designing circuits by computer}	H05K3/00	H05K3/00		1360
H05K3/0008	8	{for aligning or positioning of tools relative to the circuit board (H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015)}	H05K3/00	H05K3/00		2449
H05K3/0011	8	{Working of insulating substrates or insulating layers}	H05K3/00	H05K3/00		1119
H05K3/0014	9	{Shaping of the substrate, e.g. by moulding}	H05K3/00	H05K3/00		1460
H05K3/0017	9	{Etching of the substrate by chemical or physical means}	H05K3/00	H05K3/00		722
H05K3/002	10	{by liquid chemical etching}	H05K3/00	H05K3/00		622
H05K3/0023	10	{by exposure and development of a photosensitive insulating layer}	H05K3/00	H05K3/00		976
H05K3/0026	10	{by laser ablation}	H05K3/00	H05K3/00		1193
H05K3/0029	11	{of inorganic insulating material}	H05K3/00	H05K3/00		289
H05K3/0032	11	{of organic insulating material}	H05K3/00	H05K3/00		707
H05K3/0035	12	{of blind holes, i.e. having a metal layer at the bottom}	H05K3/00	H05K3/00		760
H05K3/0038	12	{combined with laser drilling through a metal layer}	H05K3/00	H05K3/00		352
H05K3/0041	10	{by plasma etching}	H05K3/00	H05K3/00		339
H05K3/0044	9	{Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence)}	H05K3/00	H05K3/00		2944
H05K3/0047	10	{Drilling of holes}	H05K3/00	H05K3/00		3950
H05K3/005	10	{Punching of holes}	H05K3/00	H05K3/00		691
H05K3/0052	10	{Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards}	H05K3/00	H05K3/00		2728
H05K3/0055	9	{After-treatment, e.g. cleaning or desmearing of holes}	H05K3/00	H05K3/00		1149
H05K3/0058	8	{Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence)}	H05K3/00	H05K3/00		1951
H05K3/0061	9	{onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}	H05K3/00	H05K3/00		2348
H05K3/0064	9	{onto a polymeric substrate}	H05K3/00	H05K3/00		383
H05K3/0067	9	{onto an inorganic, non-metallic substrate}	H05K3/00	H05K3/00		144
H05K3/007	8	{Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)}	H05K3/00	H05K3/00		852
H05K3/0073	8	{Masks not provided for in groups H05K3/02&#160;-&#160;H05K3/46, e.g. for photomechanical production of patterned surfaces}	H05K3/00	H05K3/00		213
H05K3/0076	9	{characterised by the composition of the mask}	H05K3/00	H05K3/00		429
H05K3/0079	9	{characterised by the method of application or removal of the mask (H05K3/0091 takes precedence)}	H05K3/00	H05K3/00		566
H05K3/0082	9	{characterised by the exposure method of radiation-sensitive masks}	H05K3/00	H05K3/00		968
H05K3/0085	8	{Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02&#160;-&#160;H05K3/46; conveyors and holding means therefor (apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K13/00)}	H05K3/00	H05K3/00		687
H05K3/0088	9	{for treatment of holes}	H05K3/00	H05K3/00		217
H05K3/0091	8	{Apparatus for coating printed circuits using liquid non-metallic coating compositions}	H05K3/00	H05K3/00		587
H05K3/0094	8	{Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement}	H05K3/00	H05K3/00		1927
H05K3/0097	8	{Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)}	H05K3/00	H05K3/00		1998
H05K3/02	8	in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding	H05K3/02	H05K3/02		862
H05K3/022	9	{Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}	H05K3/02	H05K3/02		3105
H05K3/025	10	{by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper}	H05K3/02	H05K3/02		645
H05K3/027	9	{the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles}	H05K3/02	H05K3/02		859
H05K3/04	9	the conductive material being removed mechanically, e.g. by punching	H05K3/04	H05K3/04		401
H05K3/041	10	{by using a die for cutting the conductive material}	H05K3/04	H05K3/04		273
H05K3/043	10	{by using a moving tool for milling or cutting the conductive material}	H05K3/04	H05K3/04		189
H05K3/045	10	{by making a conductive layer having a relief pattern, followed by abrading of the raised portions}	H05K3/04	H05K3/04		266
H05K3/046	10	{by selective transfer or selective detachment of a conductive layer}	H05K3/04	H05K3/04		330
H05K3/048	11	{using a lift-off resist pattern or a release layer pattern}	H05K3/04	H05K3/04		363
H05K3/06	9	the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)}	H05K3/06	H05K3/06		3993
H05K3/061	10	{Etching masks}	H05K3/06	H05K3/06		1088
H05K3/062	11	{consisting of metals or alloys or metallic inorganic compounds (H05K3/065 takes precedence)}	H05K3/06	H05K3/06		626
H05K3/064	11	{Photoresists}	H05K3/06	H05K3/06		1559
H05K3/065	11	{applied by electrographic, electrophotographic or magnetographic methods}	H05K3/06	H05K3/06		121
H05K3/067	10	{Etchants}	H05K3/06	H05K3/06		806
H05K3/068	10	{Apparatus for etching printed circuits}	H05K3/06	H05K3/06		828
H05K3/07	10	being removed electrolytically	H05K3/07	H05K3/07		187
H05K3/08	9	the conductive material being removed by electric discharge, e.g. by spark erosion	H05K3/08	H05K3/08		87
H05K3/10	8	in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern	H05K3/10	H05K3/10		1404
H05K3/101	9	{by casting or moulding of conductive material}	H05K3/10	H05K3/10		328
H05K3/102	9	{by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence)}	H05K3/10	H05K3/10		526
H05K3/103	9	{by bonding or embedding conductive wires or strips}	H05K3/10	H05K3/10		573
H05K3/105	9	{by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam}	H05K3/10	H05K3/10		877
H05K3/106	10	{by photographic methods}	H05K3/10	H05K3/10		155
H05K3/107	9	{by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence)}	H05K3/10	H05K3/10		1555
H05K3/108	9	{by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)}	H05K3/10	H05K3/10		1830
H05K3/12	9	using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}	H05K3/12	H05K3/12		1711
H05K3/1208	10	{Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38)}	H05K3/12	H05K3/12		299
H05K3/1216	10	{by screen printing or stencil printing}	H05K3/12	H05K3/12		2504
H05K3/1225	11	{Screens or stencils; Holders therefor}	H05K3/12	H05K3/12		868
H05K3/1233	11	{Methods or means for supplying the conductive material and for forcing it through the screen or stencil}	H05K3/12	H05K3/12		775
H05K3/1241	10	{by ink-jet printing or drawing by dispensing}	H05K3/12	H05K3/12		675
H05K3/125	11	{by ink-jet printing}	H05K3/12	H05K3/12		1433
H05K3/1258	10	{by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern}	H05K3/12	H05K3/12		551
H05K3/1266	10	{by electrographic or magnetographic printing}	H05K3/12	H05K3/12		129
H05K3/1275	10	{by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing}	H05K3/12	H05K3/12		670
H05K3/1283	10	{After-treatment of the printed patterns, e.g. sintering or curing methods}	H05K3/12	H05K3/12		838
H05K3/1291	11	{Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets}	H05K3/12	H05K3/12		247
H05K3/14	9	using spraying techniques to apply the conductive material {, e.g. vapour evaporation}	H05K3/14	H05K3/14		421
H05K3/143	10	{Masks therefor (H05K3/048 takes precedence)}	H05K3/14	H05K3/14		290
H05K3/146	10	{By vapour deposition}	H05K3/14	H05K3/14		365
H05K3/16	10	by cathodic sputtering	H05K3/16	H05K3/16		344
H05K3/18	9	using precipitation techniques to apply the conductive material	H05K3/18	H05K3/18		1328
H05K3/181	10	{by electroless plating (adhesives therefor H05K3/387)}	H05K3/18	H05K3/18		1736
H05K3/182	11	{characterised by the patterning method}	H05K3/18	H05K3/18		556
H05K3/184	12	{using masks}	H05K3/18	H05K3/18		760
H05K3/185	12	{by making a catalytic pattern by photo-imaging}	H05K3/18	H05K3/18		643
H05K3/187	11	{means therefor, e.g. baths, apparatus}	H05K3/18	H05K3/18		319
H05K3/188	10	{by direct electroplating}	H05K3/18	H05K3/18		1485
H05K3/20	9	by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)}	H05K3/20	H05K3/20		1210
H05K3/202	10	{using self-supporting metal foil pattern}	H05K3/20	H05K3/20		1419
H05K3/205	10	{using a pattern electroplated or electroformed on a metallic carrier}	H05K3/20	H05K3/20		751
H05K3/207	10	{using a prefabricated paste pattern, ink pattern or powder pattern}	H05K3/20	H05K3/20		444
H05K3/22	8	Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)}	H05K3/22	H05K3/22		1469
H05K3/222	9	{Completing of printed circuits by adding non-printed jumper connections (printed jumper connections H05K3/4685)}	H05K3/22	H05K3/22		859
H05K3/225	9	{Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence)}	H05K3/22	H05K3/22		1497
H05K3/227	9	{Drying of printed circuits}	H05K3/22	H05K3/22		864
H05K3/24	9	Reinforcing of the conductive pattern {(by solder coating H05K3/3465)}	H05K3/24	H05K3/24		1056
H05K3/241	10	{characterised by the electroplating method; means therefor, e.g. baths or apparatus}	H05K3/24	H05K3/24		1150
H05K3/242	11	{characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated}	H05K3/24	H05K3/24		409
H05K3/243	10	{characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182)}	H05K3/24	H05K3/24		1094
H05K3/244	10	{Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)}	H05K3/24	H05K3/24		1632
H05K3/245	10	{Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques}	H05K3/24	H05K3/24		408
H05K3/246	11	{Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating}	H05K3/24	H05K3/24		486
H05K3/247	11	{Finish coating of conductors by using conductive pastes, inks or powders}	H05K3/24	H05K3/24		133
H05K3/248	12	{fired compositions for inorganic substrates}	H05K3/24	H05K3/24		91
H05K3/249	12	{comprising carbon particles as main constituent}	H05K3/24	H05K3/24		54
H05K3/26	9	Cleaning or polishing of the conductive pattern	H05K3/26	H05K3/26		2629
H05K3/28	9	Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}	H05K3/28	H05K3/28		5457
H05K3/281	10	{by means of a preformed insulating foil (H05K3/284 takes precedence)}	H05K3/28	H05K3/28		2097
H05K3/282	10	{for inhibiting the corrosion of the circuit, e.g. for preserving the solderability}	H05K3/28	H05K3/28		1610
H05K3/284	10	{for encapsulating mounted components (H05K1/185 takes precedence)}	H05K3/28	H05K3/28		4301
H05K3/285	10	{Permanent coating compositions}	H05K3/28	H05K3/28		999
H05K3/287	11	{Photosensitive compositions}	H05K3/28	H05K3/28		1089
H05K3/288	10	{Removal of non-metallic coatings, e.g. for repairing}	H05K3/28	H05K3/28		419
H05K3/30	8	Assembling printed circuits with electric components, e.g. with resistors	H05K3/30	H05K3/30		2134
H05K3/301	9	{by means of a mounting structure (H05K3/325 takes precedence)}	H05K3/30	H05K3/30		2988
H05K3/303	9	with surface mounted components (H05K3/32 takes precedence)	H05K3/303	H05K3/303		3550
H05K3/305	10	{Affixing by adhesive}	H05K3/303	H05K3/30		1911
H05K3/306	9	with lead-in-hole components (H05K3/32 takes precedence)	H05K3/306	H05K3/306		1809
H05K3/308	10	{Adaptations of leads (connectors to printed circuits H01R12/00)}	H05K3/306	H05K3/30		1777
H05K3/32	9	electrically connecting electric components or wires to printed circuits	H05K3/32	H05K3/32		1991
H05K3/321	10	by conductive adhesives	H05K3/321	H05K3/321		3586
H05K3/323	11	{by applying an anisotropic conductive adhesive layer over an array of pads}	H05K3/321	H05K3/32		2210
H05K3/325	10	by abutting or pinching; Mechanical auxiliary parts therefor	H05K3/325	H05K3/325		2896
H05K3/326	11	{the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits (H05K3/365 takes precedence)}	H05K3/325	H05K3/32		1196
H05K3/328	10	by welding	H05K3/328	H05K3/328		1451
H05K3/34	10	by soldering	H05K3/34	H05K3/34		4439
H05K3/3405	11	{Edge mounted components, e.g. terminals}	H05K3/34	H05K3/34		1479
H05K3/341	11	Surface mounted components	H05K3/341	H05K3/341		3141
H05K3/3415	12	{on both sides of the substrate or combined with lead-in-hole components}	H05K3/341	H05K3/341		752
H05K3/3421	12	{Leaded components}	H05K3/341	H05K3/34		4738
H05K3/3426	13	{characterised by the leads}	H05K3/341	H05K3/34		1545
H05K3/3431	12	{Leadless components}	H05K3/341	H05K3/34		2314
H05K3/3436	13	{having an array of bottom contacts, e.g. pad grid array or ball grid array components}	H05K3/341	H05K3/34		4186
H05K3/3442	13	{having edge contacts, e.g. leadless chip capacitors, chip carriers}	H05K3/341	H05K3/34		2095
H05K3/3447	11	Lead-in-hole components	H05K3/3447	H05K3/3447		4278
H05K3/3452	11	Solder masks	H05K3/3452	H05K3/3452		3205
H05K3/346	11	Solder materials or compositions specially adapted therefor	H05K3/346	H05K3/346		
H05K3/3465	11	Application of solder	H05K3/3465	H05K3/3465		
H05K3/3468	12	Application of molten solder, e.g. dip soldering	H05K3/3468	H05K3/3468		1477
H05K3/3473	12	Plating of solder	H05K3/3473	H05K3/3473		621
H05K3/3478	12	Application of solder preforms; Transferring prefabricated solder patterns	H05K3/3478	H05K3/3478		1684
H05K3/3485	12	Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)	H05K3/3485	H05K3/3485		2425
H05K3/3489	11	Composition of fluxes; Application thereof; Other processes of activating the contact surfaces	H05K3/3489	H05K3/3489		1270
H05K3/3494	11	Heating processes for reflow soldering	H05K3/3494	H05K3/3494		2792
H05K3/36	8	Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)}	H05K3/36	H05K3/36		1005
H05K3/361	9	{Assembling flexible printed circuits with other printed circuits}	H05K3/36	H05K3/36		4100
H05K3/363	10	{by soldering}	H05K3/36	H05K3/36		1606
H05K3/365	10	{by abutting, i.e. without alloying process}	H05K3/36	H05K3/36		760
H05K3/366	9	{substantially perpendicularly to each other (H05K3/361 takes precedence)}	H05K3/36	H05K3/36		1324
H05K3/368	9	{parallel to each other (H05K3/361 takes precedence)}	H05K3/36	H05K3/36		2593
H05K3/38	8	Improvement of the adhesion between the insulating substrate and the metal	H05K3/38	H05K3/38		1456
H05K3/381	9	{by special treatment of the substrate}	H05K3/38	H05K3/38		1632
H05K3/382	9	{by special treatment of the metal}	H05K3/38	H05K3/38		650
H05K3/383	10	{by microetching}	H05K3/38	H05K3/38		402
H05K3/384	10	{by plating}	H05K3/38	H05K3/38		714
H05K3/385	10	{by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer}	H05K3/38	H05K3/38		396
H05K3/386	9	{by the use of an organic polymeric bonding layer, e.g. adhesive}	H05K3/38	H05K3/38		2684
H05K3/387	10	{for electroless plating (H05K3/4661 takes precedence)}	H05K3/38	H05K3/38		426
H05K3/388	9	{by the use of a metallic or inorganic thin film adhesion layer}	H05K3/38	H05K3/38		1039
H05K3/389	9	{by the use of a coupling agent, e.g. silane}	H05K3/38	H05K3/38		581
H05K3/40	8	Forming printed elements for providing electric connections to or between printed circuits	H05K3/40	H05K3/40		986
H05K3/4007	9	{Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}	H05K3/40	H05K3/40		3144
H05K3/4015	10	{using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres}	H05K3/40	H05K3/40		808
H05K3/403	9	{Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence)}	H05K3/40	H05K3/40		1943
H05K3/4038	9	{Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}	H05K3/40	H05K3/40		2016
H05K3/4046	10	{using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire}	H05K3/40	H05K3/40		962
H05K3/4053	10	{by thick-film techniques}	H05K3/40	H05K3/40		296
H05K3/4061	11	{for via connections in inorganic insulating substrates}	H05K3/40	H05K3/40		549
H05K3/4069	11	{for via connections in organic insulating substrates}	H05K3/40	H05K3/40		1330
H05K3/4076	10	{by thin-film techniques}	H05K3/40	H05K3/40		270
H05K3/4084	10	{by deforming at least one of the conductive layers}	H05K3/40	H05K3/40		468
H05K3/4092	9	{Integral conductive tabs, i.e. conductive parts partly detached from the substrate}	H05K3/40	H05K3/40		1026
H05K3/42	9	Plated through-holes {or plated via connections}	H05K3/42	H05K3/42		2584
H05K3/421	10	{Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence)}	H05K3/42	H05K3/42		1002
H05K3/422	10	{characterised by electroless plating method; pretreatment therefor}	H05K3/42	H05K3/42		507
H05K3/423	10	{characterised by electroplating method}	H05K3/42	H05K3/42		1330
H05K3/424	11	{by direct electroplating}	H05K3/42	H05K3/42		566
H05K3/425	10	{characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern}	H05K3/42	H05K3/42		170
H05K3/426	11	{initial plating of through-holes in substrates without metal}	H05K3/42	H05K3/42		565
H05K3/427	11	{initial plating of through-holes in metal-clad substrates}	H05K3/42	H05K3/42		998
H05K3/428	11	{initial plating of through-holes in substrates having a metal pattern}	H05K3/42	H05K3/42		291
H05K3/429	10	{Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers}	H05K3/42	H05K3/42		3347
H05K3/44	8	Manufacturing insulated metal core circuits {or other insulated electrically conductive core circuits (H05K3/0058, H05K3/4608, and H05K3/4641 take precedence)}	H05K3/44	H05K3/44		583
H05K3/445	9	{having insulated holes or insulated via connections through the metal core}	H05K3/44	H05K3/44		490
H05K3/46	8	Manufacturing multilayer circuits	H05K3/46	H05K3/46		3757
H05K3/4602	9	{characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated}	H05K3/46	H05K3/46		1938
H05K3/4605	10	{made from inorganic insulating material}	H05K3/46	H05K3/46		320
H05K3/4608	10	{comprising an electrically conductive base or core}	H05K3/46	H05K3/46		335
H05K3/4611	9	{by laminating two or more circuit boards (H05K3/4652 takes precedence)}	H05K3/46	H05K3/46		3703
H05K3/4614	10	{the electrical connections between the circuit boards being made during lamination}	H05K3/46	H05K3/46		1096
H05K3/4617	11	{characterized by laminating only or mainly similar single-sided circuit boards}	H05K3/46	H05K3/46		405
H05K3/462	11	{characterized by laminating only or mainly similar double-sided circuit boards}	H05K3/46	H05K3/46		451
H05K3/4623	10	{the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence)}	H05K3/46	H05K3/46		1063
H05K3/4626	10	{characterised by the insulating layers or materials (H05K3/4688 takes precedence)}	H05K3/46	H05K3/46		847
H05K3/4629	11	{laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets}	H05K3/46	H05K3/46		1655
H05K3/4632	11	{laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets}	H05K3/46	H05K3/46		328
H05K3/4635	11	{laminating flexible circuit boards using additional insulating adhesive materials between the boards}	H05K3/46	H05K3/46		409
H05K3/4638	10	{Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits}	H05K3/46	H05K3/46		925
H05K3/4641	10	{having integrally laminated metal sheets or special power cores}	H05K3/46	H05K3/46		517
H05K3/4644	9	{by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)}	H05K3/46	H05K3/46		3087
H05K3/4647	10	{by applying an insulating layer around previously made via studs}	H05K3/46	H05K3/46		553
H05K3/465	10	{by applying an insulating layer having channels for the next circuit layer}	H05K3/46	H05K3/46		358
H05K3/4652	10	{Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)}	H05K3/46	H05K3/46		1590
H05K3/4655	11	{by using a laminate characterized by the insulating layer (general-purpose insulating materials H05K1/03, H05K3/4673)}	H05K3/46	H05K3/46		480
H05K3/4658	11	{characterized by laminating a prefabricated metal foil pattern, e.g. by transfer}	H05K3/46	H05K3/46		146
H05K3/4661	10	{Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387)}	H05K3/46	H05K3/46		592
H05K3/4664	10	{Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K3/4647 takes precedence)}	H05K3/46	H05K3/46		707
H05K3/4667	11	{characterized by using an inorganic intermediate insulating layer}	H05K3/46	H05K3/46		157
H05K3/467	10	{Adding a circuit layer by thin film methods (H05K3/4647 takes precedence)}	H05K3/46	H05K3/46		315
H05K3/4673	10	{Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28)}	H05K3/46	H05K3/46		351
H05K3/4676	11	{Single layer compositions}	H05K3/46	H05K3/46		814
H05K3/4679	10	{Aligning added circuit layers or via connections relative to previous circuit layers}	H05K3/46	H05K3/46		203
H05K3/4682	10	{Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil}	H05K3/46	H05K3/46		889
H05K3/4685	9	{Manufacturing of cross-over conductors}	H05K3/46	H05K3/46		475
H05K3/4688	9	{Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)}	H05K3/46	H05K3/46		722
H05K3/4691	10	{Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers}	H05K3/46	H05K3/46		1738
H05K3/4694	10	{Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density (H05K3/4691 takes precedence)}	H05K3/46	H05K3/46		274
H05K3/4697	9	{having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}	H05K3/46	H05K3/46		1845
H05K5/00	7	Casings, cabinets or drawers for electric apparatus	H05K5/00	H05K5/00		2095
H05K5/0017	8	{with operator interface units}	H05K5/00	H05K5/00		3961
H05K5/0018	9	{having an electronic display}	H05K5/00	H05K5/00		1225
H05K5/0026	8	{provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units}	H05K5/00	H05K5/00		947
H05K5/003	9	{having an integrally preformed housing}	H05K5/00	H05K5/00		117
H05K5/0034	9	{having an overmolded housing covering the PCB}	H05K5/00	H05K5/00		200
H05K5/0039	9	{having a tubular housing wherein the PCB is inserted longitudinally}	H05K5/00	H05K5/00		219
H05K5/0043	9	{comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing}	H05K5/00	H05K5/00		151
H05K5/0047	9	{having a two-part housing enclosing a PCB}	H05K5/00	H05K5/00		390
H05K5/0052	10	{characterized by joining features of the housing parts}	H05K5/00	H05K5/00		505
H05K5/0056	10	{characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors}	H05K5/00	H05K5/00		403
H05K5/006	10	{characterized by features for holding the PCB within the housing}	H05K5/00	H05K5/00		575
H05K5/0065	9	{wherein modules are associated together, e.g. electromechanical assemblies, modular structures}	H05K5/00	H05K5/00		331
H05K5/0069	9	{having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing}	H05K5/00	H05K5/00		1347
H05K5/0073	9	{having specific features for mounting the housing on an external structure}	H05K5/00	H05K5/00		384
H05K5/0078	9	{specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors}	H05K5/00	H05K5/00		113
H05K5/0082	9	{specially adapted for transmission control units, e.g. gearbox controllers}	H05K5/00	H05K5/00		422
H05K5/0086	8	{portable, e.g. battery operated apparatus (casings for switching devices H01H9/02)}	H05K5/00	H05K5/00		1525
H05K5/0091	8	{Housing specially adapted for small components (for resistors H01C; for capacitors H01G; for integrated circuits H10W99/00)}	H05K5/00	H05K5/00		571
H05K5/0095	9	{hermetically-sealed}	H05K5/00	H05K5/00		444
H05K5/02	8	Details	H05K5/02	H05K5/02		3426
H05K5/0204	9	{Mounting supporting structures on the outside of casings}	H05K5/02	H05K5/02		3563
H05K5/0208	9	{Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof}	H05K5/02	H05K5/02		901
H05K5/0209	9	{Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments}	H05K5/02	H05K5/02		319
H05K5/021	10	{specially adapted for data recorders, e.g. for flight recorders}	H05K5/02	H05K5/02		88
H05K5/0211	10	{Thermal buffers, e.g. latent heat absorbers}	H05K5/02	H05K5/02		56
H05K5/0212	9	{Condensation eliminators}	H05K5/02	H05K5/02		303
H05K5/0213	9	{Venting apertures; Constructional details thereof}	H05K5/02	H05K5/02		6049
H05K5/0214	10	{with means preventing penetration of rain water or dust (semi-permeable membranes H05K5/0215, H05K5/0216)}	H05K5/02	H05K5/02		1012
H05K5/0215	10	{with semi-permeable membranes attached to casings}	H05K5/02	H05K5/02		225
H05K5/0216	10	{Venting plugs comprising semi-permeable membranes}	H05K5/02	H05K5/02		209
H05K5/0217	9	{Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03)}	H05K5/02	H05K5/02		21234
H05K5/0221	10	{Locks; Latches}	H05K5/02	H05K5/02		2206
H05K5/0226	10	{Hinges}	H05K5/02	H05K5/02		2799
H05K5/023	10	{Handles; Grips}	H05K5/02	H05K5/02		1232
H05K5/0234	10	{Feet; Stands; Pedestals, e.g. wheels for moving casing on floor}	H05K5/02	H05K5/02		3636
H05K5/0243	10	{for decorative purposes}	H05K5/02	H05K5/02		1363
H05K5/0247	9	{Electrical details of casings, e.g. terminals, passages for cables or wiring}	H05K5/02	H05K5/02		6995
H05K5/0252	9	{Labels, e.g. for identification, markings or configuration store}	H05K5/02	H05K5/02		274
H05K5/0256	9	{of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms}	H05K5/02	H05K5/02		376
H05K5/026	10	{having standardized interfaces (flash memory cards G06K19/077)}	H05K5/02	H05K5/02		312
H05K5/0265	11	{of PCMCIA type}	H05K5/02	H05K5/02		140
H05K5/0269	12	{Card housings therefor, e.g. covers, frames, PCB}	H05K5/02	H05K5/02		272
H05K5/0273	12	{having extensions for peripherals, e.g. LAN, antennas (details of antennas H01Q1/2275)}	H05K5/02	H05K5/02		170
H05K5/0278	11	{of USB type (details relating to connectors H01R27/00)}	H05K5/02	H05K5/02		653
H05K5/0282	10	{Adapters for connecting cards having a first standard in receptacles having a second standard}	H05K5/02	H05K5/02		132
H05K5/0286	10	{Receptacles therefor, e.g. card slots, module sockets, card groundings}	H05K5/02	H05K5/02		476
H05K5/0291	11	{for multiple cards}	H05K5/02	H05K5/02		126
H05K5/0295	11	{having ejection mechanisms}	H05K5/02	H05K5/02		215
H05K5/03	9	Covers	H05K5/03	H05K5/03		9238
H05K5/04	8	Metal casings	H05K5/04	H05K5/04		2023
H05K5/06	8	Hermetically-sealed casings {(specially adapted for small components H05K5/0095)}	H05K5/06	H05K5/06		3033
H05K5/061	9	{sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing}	H05K5/06	H05K5/06		2282
H05K5/062	9	{sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ}	H05K5/06	H05K5/06		402
H05K5/063	9	{sealed by a labyrinth structure provided at the joining parts}	H05K5/06	H05K5/06		214
H05K5/064	9	{sealed by potting, e.g. waterproof resin poured in a rigid casing}	H05K5/06	H05K5/06		675
H05K5/065	9	{sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding}	H05K5/06	H05K5/06		567
H05K5/066	9	{sealed by fusion of the joining parts without bringing material; sealed by brazing}	H05K5/06	H05K5/06		174
H05K5/067	9	{containing a dielectric fluid}	H05K5/06	H05K5/06		77
H05K5/068	9	{having a pressure compensation device, e.g. membrane (venting means H05K5/0213)}	H05K5/06	H05K5/06		420
H05K5/069	9	{Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft}	H05K5/06	H05K5/06		2780
H05K5/10	8	comprising several parts forming a closed casing	H05K5/10	H05K5/10		1652
H05K5/13	9	assembled by screws	H05K5/13	H05K5/13		989
H05K5/15	9	assembled by resilient members	H05K5/15	H05K5/15		1208
H05K5/30	8	Side-by-side or stacked arrangements	H05K5/30	H05K5/30		1181
H05K7/00	7	Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K5/00)	H05K7/00	H05K7/00		797
H05K7/005	8	{arrangements of circuit components without supporting structure}	H05K7/00	H05K7/00		183
H05K7/02	8	Arrangements of circuit components or wiring on supporting structure	H05K7/02	H05K7/02		3253
H05K7/023	9	{Stackable modules}	H05K7/02	H05K7/02		557
H05K7/026	9	{Multiple connections subassemblies}	H05K7/02	H05K7/02		651
H05K7/04	9	on conductive chassis	H05K7/04	H05K7/04		310
H05K7/06	9	on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)}	H05K7/06	H05K7/06		926
H05K7/08	10	on perforated boards	H05K7/08	H05K7/08		269
H05K7/10	9	Plug-in assemblages of components {, e.g. IC sockets}	H05K7/10	H05K7/10		570
H05K7/1007	10	{with means for increasing contact pressure at the end of engagement of coupling parts}	H05K7/10	H05K7/10		571
H05K7/1015	10	{having exterior leads}	H05K7/10	H05K7/10		115
H05K7/1023	11	{co-operating by abutting, e.g. flat pack}	H05K7/10	H05K7/10		373
H05K7/103	11	{co-operating by sliding, e.g. DIP carriers}	H05K7/10	H05K7/10		138
H05K7/1038	12	{with spring contact pieces (H05K7/1046 takes precedence)}	H05K7/10	H05K7/10		129
H05K7/1046	12	{J-shaped leads}	H05K7/10	H05K7/10		73
H05K7/1053	10	{having interior leads}	H05K7/10	H05K7/10		410
H05K7/1061	11	{co-operating by abutting}	H05K7/10	H05K7/10		646
H05K7/1069	12	{with spring contact pieces}	H05K7/10	H05K7/10		614
H05K7/1076	11	{co-operating by sliding}	H05K7/10	H05K7/10		96
H05K7/1084	12	{pin grid array package carriers}	H05K7/10	H05K7/10		317
H05K7/1092	10	{with built-in components, e.g. intelligent sockets}	H05K7/10	H05K7/10		257
H05K7/12	9	Resilient or clamping means for holding component to structure	H05K7/12	H05K7/12		2456
H05K7/14	8	Mounting supporting structure in casing or on frame or rack	H05K7/14	H05K7/14		5576
H05K7/1401	9	{comprising clamping or extracting means (H05K7/10 takes precedence)}	H05K7/14	H05K7/14		1837
H05K7/1402	10	{for securing or extracting printed circuit boards}	H05K7/14	H05K7/14		794
H05K7/1404	11	{by edge clamping, e.g. wedges}	H05K7/14	H05K7/14		453
H05K7/1405	11	{by clips or resilient members, e.g. hooks}	H05K7/14	H05K7/14		891
H05K7/1407	11	{by turn-bolt or screw member}	H05K7/14	H05K7/14		538
H05K7/1408	11	{by a unique member which latches several boards, e.g. locking bars}	H05K7/14	H05K7/14		259
H05K7/1409	11	{by lever-type mechanisms}	H05K7/14	H05K7/14		819
H05K7/1411	10	{for securing or extracting box-type drawers}	H05K7/14	H05K7/14		543
H05K7/1412	11	{hold down mechanisms, e.g. avionic racks}	H05K7/14	H05K7/14		256
H05K7/1414	10	{with power interlock}	H05K7/14	H05K7/14		152
H05K7/1415	10	{manual gripping tools}	H05K7/14	H05K7/14		179
H05K7/1417	9	{having securing means for mounting boards, plates or wiring boards (H05K7/1461 takes precedence)}	H05K7/14	H05K7/14		1825
H05K7/1418	10	{Card guides, e.g. grooves (H05K7/1425 takes precedence)}	H05K7/14	H05K7/14		1009
H05K7/142	10	{Spacers not being card guides}	H05K7/14	H05K7/14		1319
H05K7/1421	9	{Drawers for printed circuit boards}	H05K7/14	H05K7/14		493
H05K7/1422	9	{Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames}	H05K7/14	H05K7/14		434
H05K7/1424	10	{Card cages}	H05K7/14	H05K7/14		465
H05K7/1425	11	{of standardised dimensions, e.g. 19"-subrack}	H05K7/14	H05K7/14		670
H05K7/1427	10	{Housings}	H05K7/14	H05K7/14		1411
H05K7/1428	11	{for small modular apparatus with terminal block}	H05K7/14	H05K7/14		149
H05K7/1429	11	{for circuits carrying a CPU and adapted to receive expansion cards}	H05K7/14	H05K7/14		300
H05K7/1431	12	{Retention mechanisms for CPU modules}	H05K7/14	H05K7/14		248
H05K7/1432	11	{specially adapted for power drive units or power converters}	H05K7/14	H05K7/14		1134
H05K7/14322	12	{wherein the control and power circuits of a power converter are arranged within the same casing}	H05K7/14	H05K7/14		756
H05K7/14324	12	{comprising modular units, e.g. DIN rail mounted units}	H05K7/14	H05K7/14		211
H05K7/14325	12	{for cabinets or racks}	H05K7/14	H05K7/14		343
H05K7/14327	12	{having supplementary functional units, e.g. data transfer modules or displays or user interfaces}	H05K7/14	H05K7/14		88
H05K7/14329	12	{specially adapted for the configuration of power bus bars}	H05K7/14	H05K7/14		874
H05K7/14337	12	{specially adapted for underwater operation}	H05K7/14	H05K7/14		74
H05K7/14339	12	{specially adapted for high voltage operation}	H05K7/14	H05K7/14		175
H05K7/1434	11	{for electronics exposed to high gravitational force; Cylindrical housings}	H05K7/14	H05K7/14		124
H05K7/1435	10	{Expandable constructions}	H05K7/14	H05K7/14		172
H05K7/1438	9	{Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion}	H05K7/14	H05K7/14		424
H05K7/1439	10	{Back panel mother boards}	H05K7/14	H05K7/14		190
H05K7/1441	11	{with a segmented structure}	H05K7/14	H05K7/14		99
H05K7/1442	11	{with a radial structure}	H05K7/14	H05K7/14		37
H05K7/1444	11	{Complex or three-dimensional-arrangements; Stepped or dual mother boards}	H05K7/14	H05K7/14		98
H05K7/1445	11	{with double-sided connections}	H05K7/14	H05K7/14		195
H05K7/1447	10	{External wirings; Wiring ducts; Laying cables}	H05K7/14	H05K7/14		312
H05K7/1448	11	{with connections to the front board}	H05K7/14	H05K7/14		91
H05K7/1449	11	{with connections to the back board}	H05K7/14	H05K7/14		168
H05K7/1451	11	{with connections between circuit boards or units}	H05K7/14	H05K7/14		150
H05K7/1452	10	{Mounting of connectors; Switching; Reinforcing of back panels}	H05K7/14	H05K7/14		383
H05K7/1454	11	{Alignment mechanisms; Drawout cases}	H05K7/14	H05K7/14		258
H05K7/1455	11	{Coding for prevention of wrong insertion}	H05K7/14	H05K7/14		140
H05K7/1457	10	{Power distribution arrangements}	H05K7/14	H05K7/14		450
H05K7/1458	10	{Active back panels; Back panels with filtering means}	H05K7/14	H05K7/14		46
H05K7/1459	10	{Circuit configuration, e.g. routing signals}	H05K7/14	H05K7/14		222
H05K7/1461	9	{Slidable card holders; Card stiffeners; Control or display means therefor}	H05K7/14	H05K7/14		841
H05K7/1462	9	{for programmable logic controllers [PLC] for automation or industrial process control}	H05K7/14	H05K7/14		240
H05K7/1464	10	{Functional units accommodated in the same PLC module housing}	H05K7/14	H05K7/14		41
H05K7/1465	10	{Modular PLC assemblies with separable functional units}	H05K7/14	H05K7/14		161
H05K7/1467	10	{PLC mounted in a cabinet or chassis}	H05K7/14	H05K7/14		117
H05K7/1468	10	{Mechanical features of input/output (I/O) modules}	H05K7/14	H05K7/14		219
H05K7/1469	11	{Terminal blocks for connecting sensors}	H05K7/14	H05K7/14		114
H05K7/1471	11	{Modules for controlling actuators}	H05K7/14	H05K7/14		74
H05K7/1472	11	{Bus coupling modules, e.g. bus distribution modules}	H05K7/14	H05K7/14		106
H05K7/1474	10	{Mounting of modules, e.g. on a base or rail or wall}	H05K7/14	H05K7/14		254
H05K7/1475	10	{Bus assemblies for establishing communication between PLC modules}	H05K7/14	H05K7/14		31
H05K7/1477	11	{including backplanes}	H05K7/14	H05K7/14		92
H05K7/1478	11	{including a segmented bus}	H05K7/14	H05K7/14		150
H05K7/1479	11	{including decentralized modules, e.g. connected to other modules using fieldbus}	H05K7/14	H05K7/14		47
H05K7/1481	10	{User interface, e.g. status displays; Programming interface, e.g. connector for computer programming; Monitoring}	H05K7/14	H05K7/14		133
H05K7/1482	10	{PLC power supply; PLC accessories, e.g. for safety}	H05K7/14	H05K7/14		48
H05K7/1484	10	{Electrical diagrams relating to constructional features, e.g. signal routing within PLC; Provisions for disaster recovery, e.g. redundant systems}	H05K7/14	H05K7/14		115
H05K7/1485	9	{Servers; Data center rooms, e.g. 19-inch computer racks}	H05K7/14	H05K7/14		265
H05K7/1487	10	{Blade assemblies, e.g. blade cases or inner arrangements within a blade}	H05K7/14	H05K7/14		1273
H05K7/1488	10	{Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures}	H05K7/14	H05K7/14		1366
H05K7/1489	11	{characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K7/1491 takes precedence)}	H05K7/14	H05K7/14		2219
H05K7/1491	11	{having cable management arrangements (management of optical cables G02B6/444; in telecommunication cabinets H04Q1/06)}	H05K7/14	H05K7/14		870
H05K7/1492	11	{having electrical distribution arrangements, e.g. power supply or data communications}	H05K7/14	H05K7/14		1285
H05K7/1494	11	{having hardware for monitoring blades, e.g. keyboards, displays (methods or software therefore H05K7/1498)}	H05K7/14	H05K7/14		203
H05K7/1495	11	{providing data protection in case of earthquakes, floods, storms, nuclear explosions, intrusions, fire}	H05K7/14	H05K7/14		231
H05K7/1497	10	{Rooms for data centers; Shipping containers therefor}	H05K7/14	H05K7/14		640
H05K7/1498	10	{Resource management, Optimisation arrangements, e.g. configuration, identification, tracking, physical location (thermal management H05K7/20836)}	H05K7/14	H05K7/14		480
H05K7/16	9	on hinges or pivots	H05K7/16	H05K7/16		661
H05K7/18	8	Construction of rack or frame	H05K7/18	H05K7/18		2683
H05K7/183	9	{support rails therefor}	H05K7/18	H05K7/18		1154
H05K7/186	9	{for supporting telecommunication equipment (selecting apparatus H04Q1/02)}	H05K7/18	H05K7/18		664
H05K7/20	8	Modifications to facilitate cooling, ventilating, or heating	H05K7/20	H05K7/20		9205
H05K7/20009	9	{using a gaseous coolant in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}	H05K7/20	H05K7/20		1175
H05K7/20127	10	{Natural convection}	H05K7/20	H05K7/20		1996
H05K7/20136	10	{Forced ventilation, e.g. by fans (H05K7/202 takes precedence)}	H05K7/20	H05K7/20		11398
H05K7/20145	11	{Means for directing air flow, e.g. ducts, deflectors, plenum or guides}	H05K7/20	H05K7/20		8149
H05K7/20154	11	{Heat dissipaters coupled to components}	H05K7/20	H05K7/20		1291
H05K7/20163	12	{the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels}	H05K7/20	H05K7/20		446
H05K7/20172	11	{Fan mounting or fan specifications}	H05K7/20	H05K7/20		6299
H05K7/20181	11	{Filters; Louvers}	H05K7/20	H05K7/20		3724
H05K7/2019	11	{Fan safe systems, e.g. mechanical devices for non stop cooling}	H05K7/20	H05K7/20		199
H05K7/202	10	{Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers}	H05K7/20	H05K7/20		486
H05K7/20209	10	{Thermal management, e.g. fan control}	H05K7/20	H05K7/20		4644
H05K7/20218	9	{using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}	H05K7/20	H05K7/20		2978
H05K7/20236	10	{by immersion}	H05K7/20	H05K7/20		1107
H05K7/20245	10	{by natural convection; Thermosiphons}	H05K7/20	H05K7/20		144
H05K7/20254	10	{Cold plates transferring heat from heat source to coolant}	H05K7/20	H05K7/20		2235
H05K7/20263	10	{Heat dissipaters releasing heat from coolant}	H05K7/20	H05K7/20		1438
H05K7/20272	10	{Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds}	H05K7/20	H05K7/20		7153
H05K7/20281	10	{Thermal management, e.g. liquid flow control}	H05K7/20	H05K7/20		1984
H05K7/2029	9	{using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}	H05K7/20	H05K7/20		1394
H05K7/203	10	{by immersion}	H05K7/20	H05K7/20		730
H05K7/20309	10	{Evaporators}	H05K7/20	H05K7/20		1592
H05K7/20318	10	{Condensers}	H05K7/20	H05K7/20		1836
H05K7/20327	10	{Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds}	H05K7/20	H05K7/20		2517
H05K7/20336	10	{Heat pipes, e.g. wicks or capillary pumps}	H05K7/20	H05K7/20		3318
H05K7/20345	10	{Sprayers; Atomizers}	H05K7/20	H05K7/20		345
H05K7/20354	10	{Refrigerating circuit comprising a compressor}	H05K7/20	H05K7/20		443
H05K7/20363	10	{Refrigerating circuit comprising a sorber}	H05K7/20	H05K7/20		46
H05K7/20372	10	{Cryogenic cooling; Nitrogen liquid cooling}	H05K7/20	H05K7/20		198
H05K7/20381	10	{Thermal management, e.g. evaporation control}	H05K7/20	H05K7/20		992
H05K7/2039	9	{characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}	H05K7/20	H05K7/20		9533
H05K7/20409	10	{Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing}	H05K7/20	H05K7/20		3374
H05K7/20418	11	{the radiating structures being additional and fastened onto the housing}	H05K7/20	H05K7/20		1258
H05K7/20427	11	{having radiation enhancing surface treatment, e.g. black coating}	H05K7/20	H05K7/20		91
H05K7/20436	10	{Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing}	H05K7/20	H05K7/20		1037
H05K7/20445	11	{the coupling element being an additional piece, e.g. thermal standoff}	H05K7/20	H05K7/20		917
H05K7/20454	12	{with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste}	H05K7/20	H05K7/20		503
H05K7/20463	12	{Filling compound, e.g. potted resin}	H05K7/20	H05K7/20		264
H05K7/20472	12	{Sheet interfaces}	H05K7/20	H05K7/20		832
H05K7/20481	13	{characterised by the material composition exhibiting specific thermal properties}	H05K7/20	H05K7/20		879
H05K7/2049	11	{Pressing means used to urge contact, e.g. springs}	H05K7/20	H05K7/20		630
H05K7/205	10	{Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)}	H05K7/20	H05K7/20		928
H05K7/20509	10	{Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}	H05K7/20	H05K7/20		2655
H05K7/20518	10	{Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots}	H05K7/20	H05K7/20		289
H05K7/20536	9	{for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment}	H05K7/20	H05K7/20		131
H05K7/20545	10	{Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards}	H05K7/20	H05K7/20		428
H05K7/20554	10	{Forced ventilation of a gaseous coolant (in closed loop H05K7/206 or H05K7/20609 or H05K7/20618)}	H05K7/20	H05K7/20		242
H05K7/20563	11	{within sub-racks for removing heat from electronic boards}	H05K7/20	H05K7/20		353
H05K7/20572	11	{within cabinets for removing heat from sub-racks, e.g. plenum}	H05K7/20	H05K7/20		600
H05K7/20581	12	{Cabinets including a drawer for fans}	H05K7/20	H05K7/20		206
H05K7/2059	11	{within rooms for removing heat from cabinets, e.g. by air conditioning device}	H05K7/20	H05K7/20		161
H05K7/206	10	{Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger}	H05K7/20	H05K7/20		428
H05K7/20609	10	{Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger}	H05K7/20	H05K7/20		209
H05K7/20618	10	{Air circulating in different modes under control of air guidance flaps}	H05K7/20	H05K7/20		78
H05K7/20627	10	{Liquid coolant without phase change}	H05K7/20	H05K7/20		105
H05K7/20636	11	{within sub-racks for removing heat from electronic boards}	H05K7/20	H05K7/20		191
H05K7/20645	11	{within cabinets for removing heat from sub-racks}	H05K7/20	H05K7/20		144
H05K7/20654	11	{within rooms for removing heat from cabinets}	H05K7/20	H05K7/20		35
H05K7/20663	10	{Liquid coolant with phase change, e.g. heat pipes}	H05K7/20	H05K7/20		80
H05K7/20672	11	{within sub-racks for removing heat from electronic boards}	H05K7/20	H05K7/20		110
H05K7/20681	11	{within cabinets for removing heat from sub-racks}	H05K7/20	H05K7/20		140
H05K7/2069	11	{within rooms for removing heat from cabinets}	H05K7/20	H05K7/20		40
H05K7/207	10	{Thermal management, e.g. cabinet temperature control}	H05K7/20	H05K7/20		322
H05K7/20709	9	{for server racks or cabinets; for data centers, e.g. 19-inch computer racks}	H05K7/20	H05K7/20		1148
H05K7/20718	10	{Forced ventilation of a gaseous coolant (in closed loop H05K7/20754)}	H05K7/20	H05K7/20		1362
H05K7/20727	11	{within server blades for removing heat from heat source}	H05K7/20	H05K7/20		1305
H05K7/20736	11	{within cabinets for removing heat from server blades}	H05K7/20	H05K7/20		1743
H05K7/20745	11	{within rooms for removing heat from cabinets, e.g. by air conditioning device}	H05K7/20	H05K7/20		2355
H05K7/20754	10	{Air circulating in closed loop within cabinets}	H05K7/20	H05K7/20		274
H05K7/20763	10	{Liquid cooling without phase change}	H05K7/20	H05K7/20		1291
H05K7/20772	11	{within server blades for removing heat from heat source}	H05K7/20	H05K7/20		1152
H05K7/20781	11	{within cabinets for removing heat from server blades}	H05K7/20	H05K7/20		1460
H05K7/2079	11	{within rooms for removing heat from cabinets}	H05K7/20	H05K7/20		682
H05K7/208	10	{Liquid cooling with phase change}	H05K7/20	H05K7/20		795
H05K7/20809	11	{within server blades for removing heat from heat source}	H05K7/20	H05K7/20		680
H05K7/20818	11	{within cabinets for removing heat from server blades}	H05K7/20	H05K7/20		681
H05K7/20827	11	{within rooms for removing heat from cabinets, e.g. air conditioning devices}	H05K7/20	H05K7/20		1016
H05K7/20836	10	{Thermal management, e.g. server temperature control}	H05K7/20	H05K7/20		4039
H05K7/20845	9	{for automotive electronic casings (H05K7/2089 takes precedence)}	H05K7/20	H05K7/20		385
H05K7/20854	10	{Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence)}	H05K7/20	H05K7/20		1055
H05K7/20863	10	{Forced ventilation, e.g. on heat dissipaters coupled to components}	H05K7/20	H05K7/20		604
H05K7/20872	10	{Liquid coolant without phase change}	H05K7/20	H05K7/20		856
H05K7/20881	10	{Liquid coolant with phase change}	H05K7/20	H05K7/20		219
H05K7/2089	9	{for power electronics, e.g. for inverters for controlling motor}	H05K7/20	H05K7/20		1490
H05K7/209	10	{Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)}	H05K7/20	H05K7/20		2987
H05K7/20909	10	{Forced ventilation, e.g. on heat dissipaters coupled to components}	H05K7/20	H05K7/20		3632
H05K7/20918	11	{the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels}	H05K7/20	H05K7/20		767
H05K7/20927	10	{Liquid coolant without phase change}	H05K7/20	H05K7/20		4234
H05K7/20936	10	{Liquid coolant with phase change}	H05K7/20	H05K7/20		1037
H05K7/20945	10	{Thermal management, e.g. inverter temperature control}	H05K7/20	H05K7/20		1121
H05K7/20954	9	{for display panels}	H05K7/20	H05K7/20		1162
H05K7/20963	10	{Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20972 takes precedence)}	H05K7/20	H05K7/20		1620
H05K7/20972	10	{Forced ventilation, e.g. on heat dissipaters coupled to components}	H05K7/20	H05K7/20		1461
H05K7/20981	10	{Liquid coolant without phase change}	H05K7/20	H05K7/20		284
H05K7/2099	10	{Liquid coolant with phase change}	H05K7/20	H05K7/20		223
H05K9/00	7	Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00)	H05K9/00	H05K9/00		3572
H05K9/0001	8	{Rooms or chambers (anechoic chambers G01R29/0821)}	H05K9/00	H05K9/00		523
H05K9/0003	9	{Shielded walls, floors, ceilings, e.g. wallpaper, wall panel, electro-conductive plaster, concrete, cement, mortar}	H05K9/00	H05K9/00		419
H05K9/0005	9	{Shielded windows}	H05K9/00	H05K9/00		147
H05K9/0007	8	{Casings (standardised racks H05K9/0062)}	H05K9/00	H05K9/00		2135
H05K9/0009	9	{with provisions to reduce EMI leakage through the joining parts}	H05K9/00	H05K9/00		368
H05K9/0015	9	{Gaskets or seals}	H05K9/00	H05K9/00		1204
H05K9/0016	10	{having a spring contact}	H05K9/00	H05K9/00		769
H05K9/0018	9	{with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables}	H05K9/00	H05K9/00		687
H05K9/002	9	{with localised screening}	H05K9/00	H05K9/00		797
H05K9/0022	10	{of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20)}	H05K9/00	H05K9/00		611
H05K9/0024	11	{Shield cases mounted on a PCB, e.g. cans or caps or conformal shields}	H05K9/00	H05K9/00		939
H05K9/0026	12	{integrally formed from metal sheet}	H05K9/00	H05K9/00		396
H05K9/0028	13	{with retainers or specific soldering features}	H05K9/00	H05K9/00		255
H05K9/0029	12	{made from non-conductive materials intermixed with electro-conductive particles (H05K9/0031 takes precedence)}	H05K9/00	H05K9/00		24
H05K9/003	12	{made from non-conductive materials comprising an electro-conductive coating (H05K9/0031 takes precedence)}	H05K9/00	H05K9/00		160
H05K9/0031	12	{combining different shielding materials}	H05K9/00	H05K9/00		72
H05K9/0032	12	{having multiple parts, e.g. frames mating with lids}	H05K9/00	H05K9/00		685
H05K9/0033	13	{disposed on both PCB faces}	H05K9/00	H05K9/00		101
H05K9/0035	13	{with retainers mounted beforehand on the PCB, e.g. clips}	H05K9/00	H05K9/00		160
H05K9/0037	11	{Housings with compartments containing a PCB, e.g. partitioning walls}	H05K9/00	H05K9/00		366
H05K9/0039	10	{Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing (printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218)}	H05K9/00	H05K9/00		862
H05K9/0041	9	{Ventilation panels having provisions for screening}	H05K9/00	H05K9/00		265
H05K9/0043	9	{being flexible containers, e.g. pouch, pocket, bag}	H05K9/00	H05K9/00		206
H05K9/0045	9	{being rigid plastic containers having a coating of shielding material}	H05K9/00	H05K9/00		265
H05K9/0047	9	{being rigid plastic containers having conductive particles, fibres or mesh embedded therein}	H05K9/00	H05K9/00		130
H05K9/0049	9	{being metallic containers}	H05K9/00	H05K9/00		532
H05K9/005	9	{being nesting containers}	H05K9/00	H05K9/00		62
H05K9/0052	9	{Shielding other than Faraday cages}	H05K9/00	H05K9/00		113
H05K9/0054	9	{specially adapted for display applications}	H05K9/00	H05K9/00		596
H05K9/0056	9	{specially adapted for microwave applications}	H05K9/00	H05K9/00		133
H05K9/0058	9	{specially adapted for optoelectronic applications}	H05K9/00	H05K9/00		356
H05K9/006	9	{specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier}	H05K9/00	H05K9/00		548
H05K9/0062	8	{Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications}	H05K9/00	H05K9/00		342
H05K9/0064	8	{Earth or grounding circuit}	H05K9/00	H05K9/00		941
H05K9/0066	8	{Constructional details of transient suppressor}	H05K9/00	H05K9/00		405
H05K9/0067	8	{Devices for protecting against damage from electrostatic discharge}	H05K9/00	H05K9/00		1154
H05K9/0069	8	{Methods for measuring the shielding efficiency; Apparatus therefor; Isolation container for testing}	H05K9/00	H05K9/00		151
H05K9/0071	8	{Active shielding}	H05K9/00	H05K9/00		326
H05K9/0073	8	{Shielding materials (H05K9/0003 takes precedence)}	H05K9/00	H05K9/00		439
H05K9/0075	9	{Magnetic shielding materials}	H05K9/00	H05K9/00		822
H05K9/0077	10	{comprising superconductors}	H05K9/00	H05K9/00		68
H05K9/0079	9	{Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges}	H05K9/00	H05K9/00		284
H05K9/0081	9	{Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence)}	H05K9/00	H05K9/00		5104
H05K9/0083	10	{comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers (H05K9/0086 takes precedence)}	H05K9/00	H05K9/00		1236
H05K9/0084	10	{comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition}	H05K9/00	H05K9/00		1427
H05K9/0086	10	{comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering}	H05K9/00	H05K9/00		492
H05K9/0088	10	{comprising a plurality of shielding layers; combining different shielding material structure}	H05K9/00	H05K9/00		1857
H05K9/009	10	{comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked}	H05K9/00	H05K9/00		1512
H05K9/0092	10	{comprising electro-conductive pigments, e.g. paint, ink, tampon printing}	H05K9/00	H05K9/00		161
H05K9/0094	9	{being light-transmitting, e.g. transparent, translucent}	H05K9/00	H05K9/00		204
H05K9/0096	10	{for television displays, e.g. plasma display panel}	H05K9/00	H05K9/00		644
H05K9/0098	9	{for shielding electrical cables}	H05K9/00	H05K9/00		748
H05K10/00	7	Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit	H05K10/00	H05K10/00		123
H05K11/00	7	Combinations of a radio or television receiver with apparatus having a different main function {(combined with clocks G04B47/00; controlled by a clock G04C21/28)}	H05K11/00	H05K11/00		330
H05K11/02	8	with vehicles	H05K11/02	H05K11/02		231
H05K13/00	7	Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components	H05K13/00	H05K13/00		1664
H05K13/0007	8	{using handtools (for mounting on a circuit board H05K13/0447)}	H05K13/00	H05K13/00		206
H05K13/0015	8	{Orientation; Alignment; Positioning}	H05K13/00	H05K13/00		1096
H05K13/003	8	{Placing of components on belts holding the terminals}	H05K13/00	H05K13/00		289
H05K13/0038	9	{placing the components in a predetermined order}	H05K13/00	H05K13/00		52
H05K13/0053	8	{Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting}	H05K13/00	H05K13/00		286
H05K13/0061	8	{Tools for holding the circuit boards during processing; handling transport of printed circuit boards}	H05K13/00	H05K13/00		1987
H05K13/0069	9	{Holders for printed circuit boards}	H05K13/00	H05K13/00		1150
H05K13/0076	9	{Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards}	H05K13/00	H05K13/00		60
H05K13/0084	8	{Containers and magazines for components, e.g. tube-like magazines}	H05K13/00	H05K13/00		1114
H05K13/0092	8	{Treatment of the terminal leads as a separate operation (during transport H05K13/0076, H05K13/023; during mounting H05K13/04)}	H05K13/00	H05K13/00		291
H05K13/02	8	Feeding of components	H05K13/02	H05K13/02		2413
H05K13/021	9	{Loading or unloading of containers (H05K13/028 takes precedence)}	H05K13/02	H05K13/02		1288
H05K13/0215	9	{Interconnecting of containers, e.g. splicing of tapes}	H05K13/02	H05K13/02		143
H05K13/022	9	{with orientation of the elements}	H05K13/02	H05K13/02		301
H05K13/023	9	{with bending or straightening of the terminal leads}	H05K13/02	H05K13/02		326
H05K13/024	10	{Straightening or aligning terminal leads}	H05K13/02	H05K13/02		47
H05K13/025	11	{of components having oppositely extending terminal leads}	H05K13/02	H05K13/02		36
H05K13/026	11	{of components having terminal leads in side by side relationship, e.g. using combing elements}	H05K13/02	H05K13/02		81
H05K13/027	9	{Fluid transport of components}	H05K13/02	H05K13/02		60
H05K13/028	9	{Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields}	H05K13/02	H05K13/02		380
H05K13/029	9	{Feeding axial lead components, e.g. using vibrating bowls, magnetic fields (H05K13/022 takes precedence)}	H05K13/02	H05K13/02		87
H05K13/04	8	Mounting of components {, e.g. of leadless components}	H05K13/04	H05K13/04		2898
H05K13/0404	9	{Pick-and-place heads or apparatus, e.g. with jaws}	H05K13/04	H05K13/04		845
H05K13/0406	10	{Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping}	H05K13/04	H05K13/04		475
H05K13/0408	10	{Incorporating a pick-up tool}	H05K13/04	H05K13/04		1098
H05K13/0409	11	{Sucking devices}	H05K13/04	H05K13/04		1727
H05K13/041	11	{having multiple pick-up tools}	H05K13/04	H05K13/04		589
H05K13/0411	10	{having multiple mounting heads}	H05K13/04	H05K13/04		177
H05K13/0413	10	{with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools}	H05K13/04	H05K13/04		1149
H05K13/0417	9	{Feeding with belts or tapes}	H05K13/04	H05K13/04		1386
H05K13/0419	10	{tape feeders}	H05K13/04	H05K13/04		969
H05K13/0421	10	{with treatment of the terminal leads}	H05K13/04	H05K13/04		107
H05K13/0426	10	{for components being oppositely extending terminal leads (H05K13/0421 takes precedence)}	H05K13/04	H05K13/04		55
H05K13/043	9	{Feeding one by one by other means than belts}	H05K13/04	H05K13/04		374
H05K13/0434	10	{with containers}	H05K13/04	H05K13/04		305
H05K13/0439	10	{incorporating means for treating the terminal leads only before insertion}	H05K13/04	H05K13/04		90
H05K13/0443	10	{incorporating means for treating the terminal leads before and after insertion or only after insertion}	H05K13/04	H05K13/04		51
H05K13/0447	9	{Hand tools therefor}	H05K13/04	H05K13/04		184
H05K13/0452	9	{Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place (H05K13/0406, H05K13/041 take precedence)}	H05K13/04	H05K13/04		250
H05K13/0456	9	{simultaneously punching the circuit board}	H05K13/04	H05K13/04		73
H05K13/046	9	{Surface mounting (surface mounted components H05K3/341)}	H05K13/04	H05K13/04		1293
H05K13/0465	10	{by soldering (H05K13/0469 takes precedence)}	H05K13/04	H05K13/04		1311
H05K13/0469	10	{by applying a glue or viscous material}	H05K13/04	H05K13/04		620
H05K13/0473	9	{Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board}	H05K13/04	H05K13/04		332
H05K13/0478	9	{Simultaneously mounting of different components}	H05K13/04	H05K13/04		169
H05K13/0482	10	{using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached}	H05K13/04	H05K13/04		117
H05K13/0486	9	{Replacement and removal of components}	H05K13/04	H05K13/04		567
H05K13/0491	10	{Hand tools therefor}	H05K13/04	H05K13/04		211
H05K13/0495	9	{having a plurality of work-stations}	H05K13/04	H05K13/04		180
H05K13/06	8	Wiring by machine	H05K13/06	H05K13/06		455
H05K13/065	9	{Accessories therefor, e.g. light spots}	H05K13/06	H05K13/06		57
H05K13/08	8	Monitoring manufacture of assemblages	H05K13/08	H05K13/08		1575
H05K13/081	9	{Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines}	H05K13/08	H05K13/08		544
H05K13/0812	10	{the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement}	H05K13/08	H05K13/08		1294
H05K13/0813	10	{Controlling of single components prior to mounting, e.g. orientation, component geometry (H05K13/0812 takes precedence)}	H05K13/08	H05K13/08		464
H05K13/0815	10	{Controlling of component placement on the substrate during or after manufacturing}	H05K13/08	H05K13/08		514
H05K13/0817	10	{Monitoring of soldering processes (inspection of solder joints or of printed solder paste G01N21/95684)}	H05K13/08	H05K13/08		233
H05K13/0818	10	{Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts}	H05K13/08	H05K13/08		86
H05K13/082	9	{Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays}	H05K13/08	H05K13/08		480
H05K13/083	9	{Quality monitoring using results from monitoring devices, e.g. feedback loops (H05K13/084 takes precedence)}	H05K13/08	H05K13/08		363
H05K13/084	9	{Product tracking, e.g. of substrates during the manufacturing process; Component traceability}	H05K13/08	H05K13/08		161
H05K13/085	9	{Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level}	H05K13/08	H05K13/08		391
H05K13/0853	10	{Determination of transport trajectories inside mounting machines}	H05K13/08	H05K13/08		84
H05K13/0857	10	{Product-specific machine setup; Changeover of machines or assembly lines to new product type}	H05K13/08	H05K13/08		82
H05K13/086	9	{Supply management, e.g. supply of components or of substrates}	H05K13/08	H05K13/08		481
H05K13/087	9	{Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads}	H05K13/08	H05K13/08		139
H05K13/0882	9	{Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such (H05K13/083 takes precedence)}	H05K13/08	H05K13/08		390
H05K13/0885	9	{Power supply}	H05K13/08	H05K13/08		50
H05K13/0888	9	{Ergonomics; Operator safety; Training; Failsafe systems}	H05K13/08	H05K13/08		52
H05K13/089	9	{Calibration, teaching or correction of mechanical systems, e.g. of the mounting head}	H05K13/08	H05K13/08		249
H05K13/0895	9	{Maintenance systems or processes, e.g. indicating need for maintenance}	H05K13/08	H05K13/08		124
H05K2201/00	7	Indexing scheme relating to printed circuits covered by H05K1/00	CPCONLY	H05K2201/00		6
H05K2201/01	8	Dielectrics	CPCONLY	H05K2201/01		13
H05K2201/0104	9	Properties and characteristics in general	CPCONLY	H05K2201/0104		40
H05K2201/0108	10	Transparent	CPCONLY	H05K2201/0108		1131
H05K2201/0112	10	Absorbing light, e.g. dielectric layer with carbon filler for laser processing	CPCONLY	H05K2201/0112		259
H05K2201/0116	10	Porous, e.g. foam	CPCONLY	H05K2201/0116		582
H05K2201/012	10	Flame-retardant; Preventing of inflammation	CPCONLY	H05K2201/012		508
H05K2201/0125	10	Shrinkable, e.g. heat-shrinkable polymer	CPCONLY	H05K2201/0125		58
H05K2201/0129	10	Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer	CPCONLY	H05K2201/0129		1327
H05K2201/0133	10	Elastomeric or compliant polymer	CPCONLY	H05K2201/0133		1195
H05K2201/0137	9	Materials	CPCONLY	H05K2201/0137		108
H05K2201/0141	10	Liquid crystal polymer [LCP]	CPCONLY	H05K2201/0141		689
H05K2201/0145	10	Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]	CPCONLY	H05K2201/0145		764
H05K2201/015	10	Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]	CPCONLY	H05K2201/015		758
H05K2201/0154	10	Polyimide	CPCONLY	H05K2201/0154		2528
H05K2201/0158	10	Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]	CPCONLY	H05K2201/0158		351
H05K2201/0162	10	Silicon containing polymer, e.g. silicone	CPCONLY	H05K2201/0162		409
H05K2201/0166	10	Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching	CPCONLY	H05K2201/0166		262
H05K2201/017	10	Glass ceramic coating, e.g. formed on inorganic substrate	CPCONLY	H05K2201/017		168
H05K2201/0175	10	Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor	CPCONLY	H05K2201/0175		438
H05K2201/0179	10	Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor	CPCONLY	H05K2201/0179		351
H05K2201/0183	9	Dielectric layers	CPCONLY	H05K2201/0183		73
H05K2201/0187	10	with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties	CPCONLY	H05K2201/0187		855
H05K2201/0191	10	wherein the thickness of the dielectric plays an important role	CPCONLY	H05K2201/0191		574
H05K2201/0195	10	Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure	CPCONLY	H05K2201/0195		1341
H05K2201/02	8	Fillers; Particles; Fibers; Reinforcement materials	CPCONLY	H05K2201/02		14
H05K2201/0203	9	Fillers and particles	CPCONLY	H05K2201/0203		20
H05K2201/0206	10	Materials	CPCONLY	H05K2201/0206		22
H05K2201/0209	11	Inorganic, non-metallic particles	CPCONLY	H05K2201/0209		2537
H05K2201/0212	11	Resin particles	CPCONLY	H05K2201/0212		442
H05K2201/0215	11	Metallic fillers	CPCONLY	H05K2201/0215		402
H05K2201/0218	11	Composite particles, i.e. first metal coated with second metal	CPCONLY	H05K2201/0218		192
H05K2201/0221	11	Insulating particles having an electrically conductive coating	CPCONLY	H05K2201/0221		201
H05K2201/0224	11	Conductive particles having an insulating coating	CPCONLY	H05K2201/0224		183
H05K2201/0227	11	Insulating particles having an insulating coating	CPCONLY	H05K2201/0227		29
H05K2201/023	11	Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode	CPCONLY	H05K2201/023		65
H05K2201/0233	11	Deformable particles	CPCONLY	H05K2201/0233		77
H05K2201/0236	11	Plating catalyst as filler in insulating material	CPCONLY	H05K2201/0236		208
H05K2201/0239	11	Coupling agent for particles	CPCONLY	H05K2201/0239		219
H05K2201/0242	10	Shape of an individual particle	CPCONLY	H05K2201/0242		19
H05K2201/0245	11	Flakes, flat particles or lamellar particles	CPCONLY	H05K2201/0245		255
H05K2201/0248	11	Needles or elongated particles; Elongated cluster of chemically bonded particles	CPCONLY	H05K2201/0248		92
H05K2201/0251	11	Non-conductive microfibers	CPCONLY	H05K2201/0251		119
H05K2201/0254	11	Microballoons or hollow filler particles	CPCONLY	H05K2201/0254		93
H05K2201/0257	11	Nanoparticles	CPCONLY	H05K2201/0257		371
H05K2201/026	11	Nanotubes or nanowires	CPCONLY	H05K2201/026		453
H05K2201/0263	10	Details about a collection of particles	CPCONLY	H05K2201/0263		16
H05K2201/0266	11	Size distribution	CPCONLY	H05K2201/0266		200
H05K2201/0269	11	Non-uniform distribution or concentration of particles	CPCONLY	H05K2201/0269		96
H05K2201/0272	11	Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape	CPCONLY	H05K2201/0272		246
H05K2201/0275	9	Fibers and reinforcement materials	CPCONLY	H05K2201/0275		56
H05K2201/0278	10	Polymeric fibers	CPCONLY	H05K2201/0278		284
H05K2201/0281	10	Conductive fibers	CPCONLY	H05K2201/0281		343
H05K2201/0284	10	Paper, e.g. as reinforcement	CPCONLY	H05K2201/0284		183
H05K2201/0287	10	Unidirectional or parallel fibers	CPCONLY	H05K2201/0287		48
H05K2201/029	10	Woven fibrous reinforcement or textile	CPCONLY	H05K2201/029		651
H05K2201/0293	10	Non-woven fibrous reinforcement	CPCONLY	H05K2201/0293		283
H05K2201/0296	10	Fibers with a special cross-section, e.g. elliptical	CPCONLY	H05K2201/0296		11
H05K2201/03	8	Conductive materials	CPCONLY	H05K2201/03		18
H05K2201/0302	9	Properties and characteristics in general	CPCONLY	H05K2201/0302		38
H05K2201/0305	10	Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns	CPCONLY	H05K2201/0305		606
H05K2201/0308	10	Shape memory alloy [SMA]	CPCONLY	H05K2201/0308		52
H05K2201/0311	10	Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact	CPCONLY	H05K2201/0311		374
H05K2201/0314	10	Elastomeric connector or conductor, e.g. rubber with metallic filler	CPCONLY	H05K2201/0314		352
H05K2201/0317	10	Thin film conductor layer; Thin film passive component	CPCONLY	H05K2201/0317		556
H05K2201/032	9	Materials	CPCONLY	H05K2201/032		125
H05K2201/0323	10	Carbon	CPCONLY	H05K2201/0323		958
H05K2201/0326	10	Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]	CPCONLY	H05K2201/0326		354
H05K2201/0329	10	Intrinsically conductive polymer [ICP]; Semiconductive polymer	CPCONLY	H05K2201/0329		360
H05K2201/0332	9	Structure of the conductor	CPCONLY	H05K2201/0332		16
H05K2201/0335	10	Layered conductors or foils	CPCONLY	H05K2201/0335		32
H05K2201/0338	11	Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer	CPCONLY	H05K2201/0338		840
H05K2201/0341	11	Intermediate metal, e.g. before reinforcing of conductors by plating	CPCONLY	H05K2201/0341		111
H05K2201/0344	11	Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer	CPCONLY	H05K2201/0344		210
H05K2201/0347	11	Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias	CPCONLY	H05K2201/0347		840
H05K2201/035	11	Paste overlayer, i.e. conductive paste or solder paste over conductive layer	CPCONLY	H05K2201/035		310
H05K2201/0352	11	Differences between the conductors of different layers of a multilayer	CPCONLY	H05K2201/0352		386
H05K2201/0355	11	Metal foils	CPCONLY	H05K2201/0355		2707
H05K2201/0358	11	Resin coated copper [RCC]	CPCONLY	H05K2201/0358		286
H05K2201/0361	11	Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched	CPCONLY	H05K2201/0361		98
H05K2201/0364	10	Conductor shape	CPCONLY	H05K2201/0364		48
H05K2201/0367	11	Metallic bump or raised conductor not used as solder bump	CPCONLY	H05K2201/0367		1200
H05K2201/037	11	Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides	CPCONLY	H05K2201/037		104
H05K2201/0373	11	Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool	CPCONLY	H05K2201/0373		454
H05K2201/0376	11	Flush conductors, i.e. flush with the surface of the printed circuit	CPCONLY	H05K2201/0376		529
H05K2201/0379	11	Stacked conductors	CPCONLY	H05K2201/0379		262
H05K2201/0382	11	Continuously deformed conductors	CPCONLY	H05K2201/0382		444
H05K2201/0385	11	Displaced conductors	CPCONLY	H05K2201/0385		13
H05K2201/0388	10	Other aspects of conductors	CPCONLY	H05K2201/0388		14
H05K2201/0391	11	Using different types of conductors	CPCONLY	H05K2201/0391		278
H05K2201/0394	11	Conductor crossing over a hole in the substrate or a gap between two separate substrate parts	CPCONLY	H05K2201/0394		1015
H05K2201/0397	11	Tab	CPCONLY	H05K2201/0397		644
H05K2201/04	8	Assemblies of printed circuits	CPCONLY	H05K2201/04		77
H05K2201/041	9	Stacked PCBs, i.e. having neither an empty space nor mounted components in between	CPCONLY	H05K2201/041		539
H05K2201/042	9	Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other	CPCONLY	H05K2201/042		1421
H05K2201/043	9	Stacked PCBs with their backs attached to each other without electrical connection	CPCONLY	H05K2201/043		84
H05K2201/044	9	Details of backplane or midplane for mounting orthogonal PCBs	CPCONLY	H05K2201/044		471
H05K2201/045	9	Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important	CPCONLY	H05K2201/045		159
H05K2201/046	9	Planar parts of folded PCBs making an angle relative to each other	CPCONLY	H05K2201/046		146
H05K2201/047	9	Box-like arrangements of PCBs	CPCONLY	H05K2201/047		168
H05K2201/048	9	Second PCB mounted on first PCB by inserting in window or holes of the first PCB	CPCONLY	H05K2201/048		386
H05K2201/049	9	PCB for one component, e.g. for mounting onto mother PCB	CPCONLY	H05K2201/049		723
H05K2201/05	8	Flexible printed circuits [FPCs]	CPCONLY	H05K2201/05		1279
H05K2201/051	9	Rolled	CPCONLY	H05K2201/051		197
H05K2201/052	9	Branched	CPCONLY	H05K2201/052		263
H05K2201/053	9	Tails	CPCONLY	H05K2201/053		257
H05K2201/055	9	Folded back on itself	CPCONLY	H05K2201/055		686
H05K2201/056	9	Folded around rigid support or component	CPCONLY	H05K2201/056		758
H05K2201/057	9	Shape retainable	CPCONLY	H05K2201/057		98
H05K2201/058	9	Direct connection between two or more FPCs or between flexible parts of rigid PCBs	CPCONLY	H05K2201/058		267
H05K2201/06	8	Thermal details	CPCONLY	H05K2201/06		252
H05K2201/062	9	Means for thermal insulation, e.g. for protection of parts	CPCONLY	H05K2201/062		308
H05K2201/064	9	Fluid cooling, e.g. by integral pipes	CPCONLY	H05K2201/064		525
H05K2201/066	9	Heatsink mounted on the surface of the printed circuit board [PCB]	CPCONLY	H05K2201/066		1698
H05K2201/068	9	wherein the coefficient of thermal expansion is important	CPCONLY	H05K2201/068		1232
H05K2201/07	8	Electric details	CPCONLY	H05K2201/07		29
H05K2201/0707	9	Shielding	CPCONLY	H05K2201/0707		141
H05K2201/0715	10	provided by an outer layer of PCB	CPCONLY	H05K2201/0715		1339
H05K2201/0723	10	provided by an inner layer of PCB	CPCONLY	H05K2201/0723		334
H05K2201/073	9	High voltage adaptations	CPCONLY	H05K2201/073		7
H05K2201/0738	10	Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials	CPCONLY	H05K2201/0738		88
H05K2201/0746	10	Protection against transients, e.g. layout adapted for plugging of connector	CPCONLY	H05K2201/0746		59
H05K2201/0753	9	Insulation	CPCONLY	H05K2201/0753		37
H05K2201/0761	10	Insulation resistance, e.g. of the surface of the PCB between the conductors	CPCONLY	H05K2201/0761		157
H05K2201/0769	10	Anti metal-migration, e.g. avoiding tin whisker growth	CPCONLY	H05K2201/0769		194
H05K2201/0776	9	Resistance and impedance	CPCONLY	H05K2201/0776		114
H05K2201/0784	10	Uniform resistance, i.e. equalizing the resistance of a number of conductors	CPCONLY	H05K2201/0784		73
H05K2201/0792	10	Means against parasitic impedance; Means against eddy currents	CPCONLY	H05K2201/0792		205
H05K2201/08	8	Magnetic details	CPCONLY	H05K2201/08		51
H05K2201/083	9	Magnetic materials	CPCONLY	H05K2201/083		307
H05K2201/086	10	for inductive purposes, e.g. printed inductor with ferrite core	CPCONLY	H05K2201/086		865
H05K2201/09	8	Shape and layout	CPCONLY	H05K2201/09		14
H05K2201/09009	9	Substrate related	CPCONLY	H05K2201/09009		71
H05K2201/09018	10	Rigid curved substrate	CPCONLY	H05K2201/09018		334
H05K2201/09027	10	Non-rectangular flat PCB, e.g. circular	CPCONLY	H05K2201/09027		577
H05K2201/09036	10	Recesses or grooves in insulating substrate	CPCONLY	H05K2201/09036		1917
H05K2201/09045	10	Locally raised area or protrusion of insulating substrate	CPCONLY	H05K2201/09045		547
H05K2201/09054	10	Raised area or protrusion of metal substrate	CPCONLY	H05K2201/09054		336
H05K2201/09063	10	Holes or slots in insulating substrate not used for electrical connections	CPCONLY	H05K2201/09063		2722
H05K2201/09072	10	Hole or recess under component or special relationship between hole and component	CPCONLY	H05K2201/09072		782
H05K2201/09081	10	Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure	CPCONLY	H05K2201/09081		446
H05K2201/0909	10	Preformed cutting or breaking line	CPCONLY	H05K2201/0909		664
H05K2201/091	10	Locally and permanently deformed areas including dielectric material	CPCONLY	H05K2201/091		408
H05K2201/09109	10	Locally detached layers, e.g. in multilayer	CPCONLY	H05K2201/09109		162
H05K2201/09118	10	Moulded substrate	CPCONLY	H05K2201/09118		1225
H05K2201/09127	10	PCB or component having an integral separable or breakable part	CPCONLY	H05K2201/09127		364
H05K2201/09136	10	Means for correcting warpage	CPCONLY	H05K2201/09136		359
H05K2201/09145	9	Edge details	CPCONLY	H05K2201/09145		562
H05K2201/09154	10	Bevelled, chamferred or tapered edge	CPCONLY	H05K2201/09154		311
H05K2201/09163	10	Slotted edge	CPCONLY	H05K2201/09163		245
H05K2201/09172	10	Notches between edge pads	CPCONLY	H05K2201/09172		306
H05K2201/09181	10	Notches in edge pads	CPCONLY	H05K2201/09181		630
H05K2201/0919	10	Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes	CPCONLY	H05K2201/0919		432
H05K2201/092	10	Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes	CPCONLY	H05K2201/092		54
H05K2201/09209	9	Shape and layout details of conductors	CPCONLY	H05K2201/09209		82
H05K2201/09218	10	Conductive traces	CPCONLY	H05K2201/09218		124
H05K2201/09227	11	Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting	CPCONLY	H05K2201/09227		837
H05K2201/09236	11	Parallel layout	CPCONLY	H05K2201/09236		1259
H05K2201/09245	11	Crossing layout	CPCONLY	H05K2201/09245		239
H05K2201/09254	11	Branched layout	CPCONLY	H05K2201/09254		309
H05K2201/09263	11	Meander	CPCONLY	H05K2201/09263		844
H05K2201/09272	11	Layout details of angles or corners	CPCONLY	H05K2201/09272		173
H05K2201/09281	11	Layout details of a single conductor	CPCONLY	H05K2201/09281		160
H05K2201/0929	10	Conductive planes	CPCONLY	H05K2201/0929		57
H05K2201/093	11	Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein	CPCONLY	H05K2201/093		767
H05K2201/09309	11	Core having two or more power planes; Capacitive laminate of two power planes	CPCONLY	H05K2201/09309		833
H05K2201/09318	11	Core having one signal plane and one power plane	CPCONLY	H05K2201/09318		133
H05K2201/09327	11	Special sequence of power, ground and signal layers in multilayer PCB	CPCONLY	H05K2201/09327		174
H05K2201/09336	11	Signal conductors in same plane as power plane	CPCONLY	H05K2201/09336		281
H05K2201/09345	11	Power and ground in the same plane; Power planes for two voltages in one plane	CPCONLY	H05K2201/09345		91
H05K2201/09354	11	Ground conductor along edge of main surface	CPCONLY	H05K2201/09354		203
H05K2201/09363	11	wherein only contours around conductors are removed for insulation	CPCONLY	H05K2201/09363		119
H05K2201/09372	10	Pads and lands	CPCONLY	H05K2201/09372		219
H05K2201/09381	11	Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component	CPCONLY	H05K2201/09381		700
H05K2201/0939	11	Curved pads, e.g. semi-circular or elliptical pads or lands	CPCONLY	H05K2201/0939		179
H05K2201/094	11	Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads	CPCONLY	H05K2201/094		729
H05K2201/09409	11	Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components	CPCONLY	H05K2201/09409		562
H05K2201/09418	11	Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation	CPCONLY	H05K2201/09418		351
H05K2201/09427	11	Special relation between the location or dimension of a pad or land and the location or dimension of a terminal	CPCONLY	H05K2201/09427		313
H05K2201/09436	11	Pads or lands on permanent coating which covers the other conductors	CPCONLY	H05K2201/09436		211
H05K2201/09445	11	Pads for connections not located at the edge of the PCB, e.g. for flexible circuits	CPCONLY	H05K2201/09445		227
H05K2201/09454	11	Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB	CPCONLY	H05K2201/09454		175
H05K2201/09463	11	Partial lands, i.e. lands or conductive rings not completely surrounding the hole	CPCONLY	H05K2201/09463		63
H05K2201/09472	11	Recessed pad for surface mounting; Recessed electrode of component	CPCONLY	H05K2201/09472		666
H05K2201/09481	11	Via in pad; Pad over filled via	CPCONLY	H05K2201/09481		635
H05K2201/0949	11	Pad close to a hole, not surrounding the hole	CPCONLY	H05K2201/0949		216
H05K2201/095	10	Conductive through-holes or vias	CPCONLY	H05K2201/095		213
H05K2201/09509	11	Blind vias, i.e. vias having one side closed	CPCONLY	H05K2201/09509		1298
H05K2201/09518	12	Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer	CPCONLY	H05K2201/09518		216
H05K2201/09527	12	Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms	CPCONLY	H05K2201/09527		115
H05K2201/09536	11	Buried plated through-holes, i.e. plated through-holes formed in a core before lamination	CPCONLY	H05K2201/09536		751
H05K2201/09545	11	Plated through-holes or blind vias without lands	CPCONLY	H05K2201/09545		212
H05K2201/09554	11	Via connected to metal substrate	CPCONLY	H05K2201/09554		231
H05K2201/09563	11	Metal filled via	CPCONLY	H05K2201/09563		1293
H05K2201/09572	11	Solder filled plated through-hole in the final product	CPCONLY	H05K2201/09572		246
H05K2201/09581	11	Applying an insulating coating on the walls of holes	CPCONLY	H05K2201/09581		239
H05K2201/0959	11	Plated through-holes or plated blind vias filled with insulating material	CPCONLY	H05K2201/0959		968
H05K2201/096	11	Vertically aligned vias, holes or stacked vias	CPCONLY	H05K2201/096		1461
H05K2201/09609	11	Via grid, i.e. two-dimensional array of vias or holes in a single plane	CPCONLY	H05K2201/09609		564
H05K2201/09618	11	Via fence, i.e. one-dimensional array of vias	CPCONLY	H05K2201/09618		674
H05K2201/09627	11	Special connections between adjacent vias, not for grounding vias	CPCONLY	H05K2201/09627		378
H05K2201/09636	11	Details of adjacent, not connected vias	CPCONLY	H05K2201/09636		185
H05K2201/09645	11	Patterning on via walls; Plural lands around one hole	CPCONLY	H05K2201/09645		389
H05K2201/09654	10	covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095	CPCONLY	H05K2201/09654		14
H05K2201/09663	11	Divided layout, i.e. conductors divided in two or more parts	CPCONLY	H05K2201/09663		656
H05K2201/09672	11	Superposed layout, i.e. in different planes	CPCONLY	H05K2201/09672		822
H05K2201/09681	11	Mesh conductors, e.g. as a ground plane	CPCONLY	H05K2201/09681		580
H05K2201/0969	11	Apertured conductors	CPCONLY	H05K2201/0969		854
H05K2201/097	11	Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components	CPCONLY	H05K2201/097		318
H05K2201/09709	11	Staggered pads, lands or terminals; Parallel conductors in different planes	CPCONLY	H05K2201/09709		488
H05K2201/09718	11	Clearance holes	CPCONLY	H05K2201/09718		301
H05K2201/09727	11	Varying width along a single conductor; Conductors or pads having different widths	CPCONLY	H05K2201/09727		856
H05K2201/09736	11	Varying thickness of a single conductor; Conductors in the same plane having different thicknesses	CPCONLY	H05K2201/09736		550
H05K2201/09745	11	Recess in conductor, e.g. in pad or in metallic substrate	CPCONLY	H05K2201/09745		610
H05K2201/09754	11	Connector integrally incorporated in the printed circuit board [PCB] or in housing	CPCONLY	H05K2201/09754		199
H05K2201/09763	11	Printed component having superposed conductors, but integrated in one circuit layer	CPCONLY	H05K2201/09763		212
H05K2201/09772	11	Conductors directly under a component but not electrically connected to the component	CPCONLY	H05K2201/09772		170
H05K2201/09781	11	Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components	CPCONLY	H05K2201/09781		2057
H05K2201/0979	11	Redundant conductors or connections, i.e. more than one current path between two points	CPCONLY	H05K2201/0979		594
H05K2201/098	11	Special shape of the cross-section of conductors, e.g. very thick plated conductors	CPCONLY	H05K2201/098		364
H05K2201/09809	11	Coaxial layout	CPCONLY	H05K2201/09809		612
H05K2201/09818	9	Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809	CPCONLY	H05K2201/09818		43
H05K2201/09827	10	Tapered, e.g. tapered hole, via or groove	CPCONLY	H05K2201/09827		885
H05K2201/09836	10	Oblique hole, via or bump	CPCONLY	H05K2201/09836		114
H05K2201/09845	10	Stepped hole, via, edge, bump or conductor	CPCONLY	H05K2201/09845		992
H05K2201/09854	10	Hole or via having special cross-section, e.g. elliptical	CPCONLY	H05K2201/09854		503
H05K2201/09863	10	Concave hole or via	CPCONLY	H05K2201/09863		72
H05K2201/09872	10	Insulating conformal coating	CPCONLY	H05K2201/09872		277
H05K2201/09881	10	Coating only between conductors, i.e. flush with the conductors	CPCONLY	H05K2201/09881		359
H05K2201/0989	10	Coating free areas, e.g. areas other than pads or lands free of solder resist	CPCONLY	H05K2201/0989		527
H05K2201/099	10	Coating over pads, e.g. solder resist partly over pads	CPCONLY	H05K2201/099		543
H05K2201/09909	10	Special local insulating pattern, e.g. as dam around component	CPCONLY	H05K2201/09909		709
H05K2201/09918	10	Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components	CPCONLY	H05K2201/09918		674
H05K2201/09927	10	Machine readable code, e.g. bar code	CPCONLY	H05K2201/09927		160
H05K2201/09936	10	Marks, inscriptions, etc. for information	CPCONLY	H05K2201/09936		439
H05K2201/09945	10	Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer	CPCONLY	H05K2201/09945		181
H05K2201/09954	10	More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads	CPCONLY	H05K2201/09954		405
H05K2201/09963	10	Programming circuit by using small elements, e.g. small PCBs	CPCONLY	H05K2201/09963		63
H05K2201/09972	10	Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently	CPCONLY	H05K2201/09972		611
H05K2201/09981	10	Metallised walls	CPCONLY	H05K2201/09981		414
H05K2201/09985	10	Hollow waveguide combined with printed circuit	CPCONLY	H05K2201/09985		26
H05K2201/0999	10	Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing	CPCONLY	H05K2201/0999		590
H05K2201/10	8	Details of components or other objects attached to or integrated in a printed circuit board	CPCONLY	H05K2201/10		67
H05K2201/10007	9	Types of components	CPCONLY	H05K2201/10007		84
H05K2201/10015	10	Non-printed capacitor	CPCONLY	H05K2201/10015		2148
H05K2201/10022	10	Non-printed resistor	CPCONLY	H05K2201/10022		892
H05K2201/1003	10	Non-printed inductor	CPCONLY	H05K2201/1003		1349
H05K2201/10037	10	Printed or non-printed battery	CPCONLY	H05K2201/10037		755
H05K2201/10045	10	Mounted network component having plural terminals	CPCONLY	H05K2201/10045		97
H05K2201/10053	10	Switch	CPCONLY	H05K2201/10053		988
H05K2201/1006	10	Non-printed filter	CPCONLY	H05K2201/1006		379
H05K2201/10068	10	Non-printed resonator	CPCONLY	H05K2201/10068		104
H05K2201/10075	10	Non-printed oscillator	CPCONLY	H05K2201/10075		120
H05K2201/10083	10	Electromechanical or electro-acoustic component, e.g. microphone	CPCONLY	H05K2201/10083		562
H05K2201/1009	10	Electromotor	CPCONLY	H05K2201/1009		150
H05K2201/10098	10	Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas	CPCONLY	H05K2201/10098		1694
H05K2201/10106	10	Light emitting diode [LED]	CPCONLY	H05K2201/10106		5212
H05K2201/10113	10	Lamp	CPCONLY	H05K2201/10113		237
H05K2201/10121	10	Optical component, e.g. opto-electronic component	CPCONLY	H05K2201/10121		1678
H05K2201/10128	10	Display	CPCONLY	H05K2201/10128		2143
H05K2201/10136	11	Liquid Crystal display [LCD]	CPCONLY	H05K2201/10136		679
H05K2201/10143	10	Solar cell	CPCONLY	H05K2201/10143		76
H05K2201/10151	10	Sensor	CPCONLY	H05K2201/10151		2916
H05K2201/10159	10	Memory	CPCONLY	H05K2201/10159		1201
H05K2201/10166	10	Transistor	CPCONLY	H05K2201/10166		1729
H05K2201/10174	10	Diode	CPCONLY	H05K2201/10174		324
H05K2201/10181	10	Fuse	CPCONLY	H05K2201/10181		427
H05K2201/10189	10	Non-printed connector	CPCONLY	H05K2201/10189		3579
H05K2201/10196	10	Variable component, e.g. variable resistor	CPCONLY	H05K2201/10196		229
H05K2201/10204	10	Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning	CPCONLY	H05K2201/10204		252
H05K2201/10212	10	Programmable component	CPCONLY	H05K2201/10212		232
H05K2201/10219	10	Thermoelectric component	CPCONLY	H05K2201/10219		149
H05K2201/10227	9	Other objects, e.g. metallic pieces	CPCONLY	H05K2201/10227		116
H05K2201/10234	10	Metallic balls	CPCONLY	H05K2201/10234		339
H05K2201/10242	10	Metallic cylinders	CPCONLY	H05K2201/10242		259
H05K2201/1025	10	Metallic discs	CPCONLY	H05K2201/1025		49
H05K2201/10257	10	Hollow pieces of metal, e.g. used in connection between component and PCB	CPCONLY	H05K2201/10257		74
H05K2201/10265	10	Metallic coils or springs, e.g. as part of a connection element	CPCONLY	H05K2201/10265		424
H05K2201/10272	10	Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors	CPCONLY	H05K2201/10272		774
H05K2201/1028	10	Thin metal strips as connectors or conductors	CPCONLY	H05K2201/1028		474
H05K2201/10287	10	Metal wires as connectors or conductors	CPCONLY	H05K2201/10287		1364
H05K2201/10295	10	Metallic connector elements partly mounted in a hole of the PCB	CPCONLY	H05K2201/10295		534
H05K2201/10303	11	Pin-in-hole mounted pins	CPCONLY	H05K2201/10303		1069
H05K2201/1031	10	Surface mounted metallic connector elements	CPCONLY	H05K2201/1031		498
H05K2201/10318	11	Surface mounted metallic pins	CPCONLY	H05K2201/10318		447
H05K2201/10325	10	Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support	CPCONLY	H05K2201/10325		721
H05K2201/10333	10	Individual female type metallic connector elements	CPCONLY	H05K2201/10333		233
H05K2201/1034	10	Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]	CPCONLY	H05K2201/1034		521
H05K2201/10348	10	Fuzz&apos;s as connector elements, i.e. small pieces of metallic fiber to make connection	CPCONLY	H05K2201/10348		13
H05K2201/10356	10	Cables	CPCONLY	H05K2201/10356		774
H05K2201/10363	10	Jumpers, i.e. non-printed cross-over connections	CPCONLY	H05K2201/10363		321
H05K2201/10371	10	Shields or metal cases	CPCONLY	H05K2201/10371		1051
H05K2201/10378	10	Interposers	CPCONLY	H05K2201/10378		1747
H05K2201/10386	10	Clip leads; Terminals gripping the edge of a substrate	CPCONLY	H05K2201/10386		352
H05K2201/10393	10	Clamping a component by an element or a set of elements	CPCONLY	H05K2201/10393		457
H05K2201/10401	10	Eyelets, i.e. rings inserted into a hole through a circuit board	CPCONLY	H05K2201/10401		260
H05K2201/10409	10	Screws	CPCONLY	H05K2201/10409		1260
H05K2201/10416	10	Metallic blocks or heatsinks completely inserted in a PCB	CPCONLY	H05K2201/10416		867
H05K2201/10424	10	Frame holders	CPCONLY	H05K2201/10424		719
H05K2201/10431	9	Details of mounted components	CPCONLY	H05K2201/10431		44
H05K2201/10439	10	Position of a single component	CPCONLY	H05K2201/10439		20
H05K2201/10446	11	Mounted on an edge	CPCONLY	H05K2201/10446		707
H05K2201/10454	11	Vertically mounted	CPCONLY	H05K2201/10454		233
H05K2201/10462	11	Flat component oriented parallel to the PCB surface	CPCONLY	H05K2201/10462		125
H05K2201/10469	11	Asymmetrically mounted component	CPCONLY	H05K2201/10469		37
H05K2201/10477	11	Inverted	CPCONLY	H05K2201/10477		330
H05K2201/10484	11	Obliquely mounted	CPCONLY	H05K2201/10484		137
H05K2201/10492	11	Electrically connected to another device	CPCONLY	H05K2201/10492		68
H05K2201/105	11	Mechanically attached to another device	CPCONLY	H05K2201/105		69
H05K2201/10507	10	Involving several components	CPCONLY	H05K2201/10507		37
H05K2201/10515	11	Stacked components	CPCONLY	H05K2201/10515		969
H05K2201/10522	11	Adjacent components	CPCONLY	H05K2201/10522		893
H05K2201/1053	11	Mounted components directly electrically connected to each other, i.e. not via the PCB	CPCONLY	H05K2201/1053		545
H05K2201/10537	11	Attached components	CPCONLY	H05K2201/10537		129
H05K2201/10545	11	Related components mounted on both sides of the PCB	CPCONLY	H05K2201/10545		728
H05K2201/10553	10	Component over metal, i.e. metal plate in between bottom of component and surface of PCB	CPCONLY	H05K2201/10553		134
H05K2201/1056	10	Metal over component, i.e. metal plate over component mounted on or embedded in PCB	CPCONLY	H05K2201/1056		204
H05K2201/10568	10	Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element	CPCONLY	H05K2201/10568		536
H05K2201/10575	10	Insulating foil under component	CPCONLY	H05K2201/10575		67
H05K2201/10583	10	Cylindrically shaped component; Fixing means therefore	CPCONLY	H05K2201/10583		178
H05K2201/1059	10	Connections made by press-fit insertion	CPCONLY	H05K2201/1059		1043
H05K2201/10598	10	Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB	CPCONLY	H05K2201/10598		748
H05K2201/10606	10	Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]	CPCONLY	H05K2201/10606		406
H05K2201/10613	9	Details of electrical connections of non-printed components, e.g. special leads	CPCONLY	H05K2201/10613		23
H05K2201/10621	10	Components characterised by their electrical contacts	CPCONLY	H05K2201/10621		45
H05K2201/10628	11	Leaded surface mounted device	CPCONLY	H05K2201/10628		189
H05K2201/10636	11	Leadless chip, e.g. chip capacitor or resistor	CPCONLY	H05K2201/10636		1895
H05K2201/10643	11	Disc shaped leadless component	CPCONLY	H05K2201/10643		117
H05K2201/10651	11	Component having two leads, e.g. resistor, capacitor	CPCONLY	H05K2201/10651		623
H05K2201/10659	11	Different types of terminals for the same component, e.g. solder balls combined with leads	CPCONLY	H05K2201/10659		181
H05K2201/10666	11	Plated through-hole for surface mounting on PCB	CPCONLY	H05K2201/10666		240
H05K2201/10674	11	Flip chip	CPCONLY	H05K2201/10674		2194
H05K2201/10681	11	Tape Carrier Package [TCP]; Flexible sheet connector	CPCONLY	H05K2201/10681		704
H05K2201/10689	11	Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]	CPCONLY	H05K2201/10689		1886
H05K2201/10696	11	Single-in-line [SIL] package	CPCONLY	H05K2201/10696		57
H05K2201/10704	11	Pin grid array [PGA]	CPCONLY	H05K2201/10704		300
H05K2201/10712	11	Via grid array, e.g. via grid array capacitor	CPCONLY	H05K2201/10712		48
H05K2201/10719	11	Land grid array [LGA]	CPCONLY	H05K2201/10719		373
H05K2201/10727	11	Leadless chip carrier [LCC], e.g. chip-modules for cards	CPCONLY	H05K2201/10727		595
H05K2201/10734	11	Ball grid array [BGA]; Bump grid array	CPCONLY	H05K2201/10734		2475
H05K2201/10742	10	Details of leads	CPCONLY	H05K2201/10742		16
H05K2201/1075	11	Shape details	CPCONLY	H05K2201/1075		11
H05K2201/10757	12	Bent leads	CPCONLY	H05K2201/10757		433
H05K2201/10765	13	Leads folded back, i.e. bent with an angle of 180 deg	CPCONLY	H05K2201/10765		85
H05K2201/10772	13	Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering	CPCONLY	H05K2201/10772		71
H05K2201/1078	12	Leads having locally deformed portion, e.g. for retention	CPCONLY	H05K2201/1078		86
H05K2201/10787	12	Leads having protrusions, e.g. for retention or insert stop	CPCONLY	H05K2201/10787		96
H05K2201/10795	12	Details of lead tips, e.g. pointed	CPCONLY	H05K2201/10795		51
H05K2201/10803	12	Tapered leads, i.e. leads having changing width or diameter	CPCONLY	H05K2201/10803		41
H05K2201/1081	12	Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land	CPCONLY	H05K2201/1081		93
H05K2201/10818	12	Flat leads	CPCONLY	H05K2201/10818		136
H05K2201/10825	13	Distorted or twisted flat leads, i.e. deformed by torque	CPCONLY	H05K2201/10825		28
H05K2201/10833	13	having a curved or folded cross-section	CPCONLY	H05K2201/10833		31
H05K2201/1084	12	Notched leads	CPCONLY	H05K2201/1084		155
H05K2201/10848	12	Thinned leads	CPCONLY	H05K2201/10848		56
H05K2201/10856	12	Divided leads, e.g. by slot in length direction of lead, or by branching of the lead	CPCONLY	H05K2201/10856		140
H05K2201/10863	12	Adaptations of leads or holes for facilitating insertion	CPCONLY	H05K2201/10863		80
H05K2201/10871	12	Leads having an integral insert stop	CPCONLY	H05K2201/10871		205
H05K2201/10878	12	Means for retention of a lead in a hole	CPCONLY	H05K2201/10878		268
H05K2201/10886	11	Other details	CPCONLY	H05K2201/10886		10
H05K2201/10893	12	Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator	CPCONLY	H05K2201/10893		35
H05K2201/10901	12	Lead partly inserted in hole or via	CPCONLY	H05K2201/10901		57
H05K2201/10909	12	Materials of terminal, e.g. of leads or electrodes of components	CPCONLY	H05K2201/10909		216
H05K2201/10916	12	Terminals having auxiliary metallic piece, e.g. for soldering	CPCONLY	H05K2201/10916		159
H05K2201/10924	12	Leads formed from a punched metal foil	CPCONLY	H05K2201/10924		252
H05K2201/10931	12	Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead, e.g. for soldering purposes	CPCONLY	H05K2201/10931		47
H05K2201/10939	12	Lead of component used as a connector	CPCONLY	H05K2201/10939		56
H05K2201/10946	12	Leads attached onto leadless component after manufacturing the component	CPCONLY	H05K2201/10946		293
H05K2201/10954	10	Other details of electrical connections	CPCONLY	H05K2201/10954		24
H05K2201/10962	11	Component not directly connected to the PCB	CPCONLY	H05K2201/10962		466
H05K2201/10969	11	Metallic case or integral heatsink of component electrically connected to a pad on PCB	CPCONLY	H05K2201/10969		579
H05K2201/10977	11	Encapsulated connections	CPCONLY	H05K2201/10977		1248
H05K2201/10984	11	Component carrying a connection agent, e.g. solder, adhesive	CPCONLY	H05K2201/10984		547
H05K2201/10992	11	Using different connection materials, e.g. different solders, for the same connection	CPCONLY	H05K2201/10992		317
H05K2201/20	8	Details of printed circuits not provided for in H05K2201/01 - H05K2201/10	CPCONLY	H05K2201/20		28
H05K2201/2009	9	Reinforced areas, e.g. for a specific part of a flexible printed circuit	CPCONLY	H05K2201/2009		1405
H05K2201/2018	9	Presence of a frame in a printed circuit or printed circuit assembly	CPCONLY	H05K2201/2018		673
H05K2201/2027	9	Guiding means, e.g. for guiding flexible circuits	CPCONLY	H05K2201/2027		165
H05K2201/2036	9	Permanent spacer or stand-off in a printed circuit or printed circuit assembly	CPCONLY	H05K2201/2036		1214
H05K2201/2045	9	Protection against vibrations	CPCONLY	H05K2201/2045		404
H05K2201/2054	9	Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics	CPCONLY	H05K2201/2054		507
H05K2201/2063	9	mixed adhesion layer containing metallic/inorganic and polymeric materials	CPCONLY	H05K2201/2063		38
H05K2201/2072	9	Anchoring, i.e. one structure gripping into another	CPCONLY	H05K2201/2072		375
H05K2201/2081	9	Compound repelling a metal, e.g. solder	CPCONLY	H05K2201/2081		248
H05K2201/209	9	Auto-mechanical connection between a component and a PCB or between two PCBs	CPCONLY	H05K2201/209		179
H05K2203/00	7	Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00	CPCONLY	H05K2203/00		1
H05K2203/01	8	Tools for processing; Objects used during processing	CPCONLY	H05K2203/01		23
H05K2203/0104	9	for patterning or coating	CPCONLY	H05K2203/0104		62
H05K2203/0108	10	Male die used for patterning, punching or transferring	CPCONLY	H05K2203/0108		584
H05K2203/0113	10	Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern	CPCONLY	H05K2203/0113		527
H05K2203/0117	10	Pattern shaped electrode used for patterning, e.g. plating or etching	CPCONLY	H05K2203/0117		87
H05K2203/0121	10	Patterning, e.g. plating or etching by moving electrode	CPCONLY	H05K2203/0121		56
H05K2203/0126	10	Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes	CPCONLY	H05K2203/0126		766
H05K2203/013	10	Inkjet printing, e.g. for printing insulating material or resist	CPCONLY	H05K2203/013		973
H05K2203/0134	10	Drum, e.g. rotary drum or dispenser with a plurality of openings	CPCONLY	H05K2203/0134		46
H05K2203/0139	10	Blade or squeegee, e.g. for screen printing or filling of holes	CPCONLY	H05K2203/0139		466
H05K2203/0143	10	Using a roller; Specific shape thereof; Providing locally adhesive portions thereon	CPCONLY	H05K2203/0143		498
H05K2203/0147	9	Carriers and holders	CPCONLY	H05K2203/0147		108
H05K2203/0152	10	Temporary metallic carrier, e.g. for transferring material	CPCONLY	H05K2203/0152		546
H05K2203/0156	10	Temporary polymeric carrier or foil, e.g. for processing or transferring	CPCONLY	H05K2203/0156		554
H05K2203/016	10	Temporary inorganic, non-metallic carrier, e.g. for processing or transferring	CPCONLY	H05K2203/016		273
H05K2203/0165	10	Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing	CPCONLY	H05K2203/0165		773
H05K2203/0169	10	Using a temporary frame during processing	CPCONLY	H05K2203/0169		162
H05K2203/0173	10	Template for holding a PCB having mounted components thereon	CPCONLY	H05K2203/0173		134
H05K2203/0178	9	Projectile, e.g. for perforating substrate	CPCONLY	H05K2203/0178		7
H05K2203/0182	9	Using a temporary spacer element or stand-off during processing	CPCONLY	H05K2203/0182		63
H05K2203/0186	9	Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof	CPCONLY	H05K2203/0186		54
H05K2203/0191	9	Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste	CPCONLY	H05K2203/0191		596
H05K2203/0195	9	Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure	CPCONLY	H05K2203/0195		1300
H05K2203/02	8	Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound	CPCONLY	H05K2203/02		154
H05K2203/0207	9	Partly drilling through substrate until a controlled depth, e.g. with end-point detection	CPCONLY	H05K2203/0207		333
H05K2203/0214	9	Back-up or entry material, e.g. for mechanical drilling	CPCONLY	H05K2203/0214		535
H05K2203/0221	9	Perforating	CPCONLY	H05K2203/0221		220
H05K2203/0228	9	Cutting, sawing, milling or shearing	CPCONLY	H05K2203/0228		1041
H05K2203/0235	9	Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires	CPCONLY	H05K2203/0235		82
H05K2203/0242	9	Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH	CPCONLY	H05K2203/0242		132
H05K2203/025	9	Abrading, e.g. grinding or sand blasting	CPCONLY	H05K2203/025		941
H05K2203/0257	9	Brushing, e.g. cleaning the conductive pattern by brushing or wiping	CPCONLY	H05K2203/0257		122
H05K2203/0264	9	Peeling insulating layer, e.g. foil, or separating mask	CPCONLY	H05K2203/0264		317
H05K2203/0271	9	Mechanical force other than pressure, e.g. shearing or pulling	CPCONLY	H05K2203/0271		189
H05K2203/0278	9	Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive	CPCONLY	H05K2203/0278		1132
H05K2203/0285	9	Using ultrasound, e.g. for cleaning, soldering or wet treatment	CPCONLY	H05K2203/0285		519
H05K2203/0292	9	Using vibration, e.g. during soldering or screen printing	CPCONLY	H05K2203/0292		126
H05K2203/03	8	Metal processing	CPCONLY	H05K2203/03		41
H05K2203/0307	9	Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites	CPCONLY	H05K2203/0307		533
H05K2203/0315	9	Oxidising metal	CPCONLY	H05K2203/0315		805
H05K2203/0323	9	Working metal substrate or core, e.g. by etching, deforming	CPCONLY	H05K2203/0323		228
H05K2203/033	9	Punching metal foil, e.g. solder foil	CPCONLY	H05K2203/033		90
H05K2203/0338	9	Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component	CPCONLY	H05K2203/0338		559
H05K2203/0346	9	Deburring, rounding, bevelling or smoothing conductor edges	CPCONLY	H05K2203/0346		144
H05K2203/0353	9	Making conductive layer thin, e.g. by etching	CPCONLY	H05K2203/0353		199
H05K2203/0361	9	Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser	CPCONLY	H05K2203/0361		371
H05K2203/0369	9	Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist	CPCONLY	H05K2203/0369		375
H05K2203/0376	9	Etching temporary metallic carrier substrate	CPCONLY	H05K2203/0376		176
H05K2203/0384	9	Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer	CPCONLY	H05K2203/0384		209
H05K2203/0392	9	Pretreatment of metal, e.g. before finish plating, etching	CPCONLY	H05K2203/0392		189
H05K2203/04	8	Soldering or other types of metallurgic bonding	CPCONLY	H05K2203/04		275
H05K2203/0405	9	Solder foil, tape or wire	CPCONLY	H05K2203/0405		134
H05K2203/041	9	Solder preforms in the shape of solder balls	CPCONLY	H05K2203/041		909
H05K2203/0415	9	Small preforms other than balls, e.g. discs, cylinders or pillars	CPCONLY	H05K2203/0415		311
H05K2203/042	9	Remote solder depot on the PCB, the solder flowing to the connections from this depot	CPCONLY	H05K2203/042		43
H05K2203/0425	9	Solder powder or solder coated metal powder	CPCONLY	H05K2203/0425		260
H05K2203/043	9	Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste	CPCONLY	H05K2203/043		873
H05K2203/0435	9	Metal coated solder, e.g. for passivation of solder balls	CPCONLY	H05K2203/0435		50
H05K2203/044	9	Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering	CPCONLY	H05K2203/044		318
H05K2203/0445	9	Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking	CPCONLY	H05K2203/0445		54
H05K2203/045	9	Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing	CPCONLY	H05K2203/045		61
H05K2203/0455	9	PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting	CPCONLY	H05K2203/0455		254
H05K2203/046	9	Means for drawing solder, e.g. for removing excess solder from pads	CPCONLY	H05K2203/046		108
H05K2203/0465	9	Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads	CPCONLY	H05K2203/0465		211
H05K2203/047	9	Soldering with different solders, e.g. two different solders on two sides of the PCB	CPCONLY	H05K2203/047		88
H05K2203/0475	9	Molten solder just before placing the component	CPCONLY	H05K2203/0475		43
H05K2203/048	9	Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor	CPCONLY	H05K2203/048		225
H05K2203/0485	9	Tacky flux, e.g. for adhering components during mounting	CPCONLY	H05K2203/0485		114
H05K2203/049	9	Wire bonding	CPCONLY	H05K2203/049		880
H05K2203/0495	9	Cold welding	CPCONLY	H05K2203/0495		31
H05K2203/05	8	Patterning and lithography; Masks; Details of resist	CPCONLY	H05K2203/05		29
H05K2203/0502	9	Patterning and lithography	CPCONLY	H05K2203/0502		194
H05K2203/0505	10	Double exposure of the same photosensitive layer	CPCONLY	H05K2203/0505		98
H05K2203/0508	10	Flood exposure	CPCONLY	H05K2203/0508		27
H05K2203/0511	10	Diffusion patterning	CPCONLY	H05K2203/0511		14
H05K2203/0514	10	Photodevelopable thick film, e.g. conductive or insulating paste	CPCONLY	H05K2203/0514		184
H05K2203/0517	10	Electrographic patterning	CPCONLY	H05K2203/0517		143
H05K2203/052	10	Magnetographic patterning	CPCONLY	H05K2203/052		197
H05K2203/0522	10	Using an adhesive pattern	CPCONLY	H05K2203/0522		218
H05K2203/0525	10	Patterning by phototackifying or by photopatterning adhesive	CPCONLY	H05K2203/0525		90
H05K2203/0528	10	Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser	CPCONLY	H05K2203/0528		215
H05K2203/0531	10	Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate	CPCONLY	H05K2203/0531		69
H05K2203/0534	10	Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member	CPCONLY	H05K2203/0534		121
H05K2203/0537	10	Transfer of pre-fabricated insulating pattern	CPCONLY	H05K2203/0537		169
H05K2203/054	10	Continuous temporary metal layer over resist, e.g. for selective electroplating	CPCONLY	H05K2203/054		186
H05K2203/0542	10	Continuous temporary metal layer over metal pattern	CPCONLY	H05K2203/0542		122
H05K2203/0545	10	Pattern for applying drops or paste; Applying a pattern made of drops or paste	CPCONLY	H05K2203/0545		206
H05K2203/0548	9	Masks	CPCONLY	H05K2203/0548		64
H05K2203/0551	10	Exposure mask directly printed on the PCB	CPCONLY	H05K2203/0551		106
H05K2203/0554	10	Metal used as mask for etching vias, e.g. by laser ablation	CPCONLY	H05K2203/0554		380
H05K2203/0557	10	Non-printed masks	CPCONLY	H05K2203/0557		448
H05K2203/056	10	Using an artwork, i.e. a photomask for exposing photosensitive layers	CPCONLY	H05K2203/056		449
H05K2203/0562	9	Details of resist	CPCONLY	H05K2203/0562		37
H05K2203/0565	10	Resist used only for applying catalyst, not for plating itself	CPCONLY	H05K2203/0565		72
H05K2203/0568	10	Resist used for applying paste, ink or powder	CPCONLY	H05K2203/0568		214
H05K2203/0571	10	Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist	CPCONLY	H05K2203/0571		167
H05K2203/0574	10	Stacked resist layers used for different processes	CPCONLY	H05K2203/0574		166
H05K2203/0577	10	Double layer of resist having the same pattern	CPCONLY	H05K2203/0577		226
H05K2203/058	10	Additional resists used for the same purpose but in different areas, i.e. not stacked	CPCONLY	H05K2203/058		48
H05K2203/0582	10	Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist	CPCONLY	H05K2203/0582		134
H05K2203/0585	10	Second resist used as mask for selective stripping of first resist	CPCONLY	H05K2203/0585		81
H05K2203/0588	10	Second resist used as pattern over first resist	CPCONLY	H05K2203/0588		140
H05K2203/0591	10	Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability	CPCONLY	H05K2203/0591		63
H05K2203/0594	10	Insulating resist or coating with special shaped edges	CPCONLY	H05K2203/0594		116
H05K2203/0597	10	Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating	CPCONLY	H05K2203/0597		128
H05K2203/06	8	Lamination	CPCONLY	H05K2203/06		297
H05K2203/061	9	of previously made multilayered subassemblies	CPCONLY	H05K2203/061		538
H05K2203/063	9	of preperforated insulating layer	CPCONLY	H05K2203/063		790
H05K2203/065	9	Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB	CPCONLY	H05K2203/065		165
H05K2203/066	9	Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern	CPCONLY	H05K2203/066		269
H05K2203/068	9	Features of the lamination press or of the lamination process, e.g. using special separator sheets	CPCONLY	H05K2203/068		977
H05K2203/07	8	Treatments involving liquids, e.g. plating, rinsing	CPCONLY	H05K2203/07		18
H05K2203/0703	9	Plating	CPCONLY	H05K2203/0703		78
H05K2203/0706	10	Inactivating or removing catalyst, e.g. on surface of resist	CPCONLY	H05K2203/0706		17
H05K2203/0709	10	Catalytic ink or adhesive for electroless plating	CPCONLY	H05K2203/0709		177
H05K2203/0713	10	Plating poison, e.g. for selective plating or for preventing plating on resist	CPCONLY	H05K2203/0713		48
H05K2203/0716	10	Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts	CPCONLY	H05K2203/0716		126
H05K2203/072	10	Electroless plating, e.g. finish plating or initial plating	CPCONLY	H05K2203/072		644
H05K2203/0723	10	Electroplating, e.g. finish plating	CPCONLY	H05K2203/0723		1420
H05K2203/0726	10	Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure	CPCONLY	H05K2203/0726		280
H05K2203/073	10	Displacement plating, substitution plating or immersion plating, e.g. for finish plating	CPCONLY	H05K2203/073		103
H05K2203/0733	10	Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls	CPCONLY	H05K2203/0733		490
H05K2203/0736	9	Methods for applying liquids, e.g. spraying	CPCONLY	H05K2203/0736		170
H05K2203/074	10	Features related to the fluid pressure	CPCONLY	H05K2203/074		88
H05K2203/0743	10	Mechanical agitation of fluid, e.g. during cleaning of the conductive pattern	CPCONLY	H05K2203/0743		61
H05K2203/0746	10	Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet	CPCONLY	H05K2203/0746		195
H05K2203/075	10	Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles	CPCONLY	H05K2203/075		209
H05K2203/0753	10	Reversing fluid direction, e.g. in holes	CPCONLY	H05K2203/0753		13
H05K2203/0756	9	Uses of liquids, e.g. rinsing, coating, dissolving	CPCONLY	H05K2203/0756		56
H05K2203/0759	10	Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer	CPCONLY	H05K2203/0759		436
H05K2203/0763	10	Treating individual holes or single row of holes, e.g. by nozzle	CPCONLY	H05K2203/0763		80
H05K2203/0766	10	Rinsing, e.g. after cleaning or polishing a conductive pattern	CPCONLY	H05K2203/0766		191
H05K2203/0769	10	Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure	CPCONLY	H05K2203/0769		305
H05K2203/0773	10	Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler	CPCONLY	H05K2203/0773		139
H05K2203/0776	10	Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773	CPCONLY	H05K2203/0776		220
H05K2203/0779	9	characterised by the specific liquids involved	CPCONLY	H05K2203/0779		61
H05K2203/0783	10	Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity	CPCONLY	H05K2203/0783		494
H05K2203/0786	10	Using an aqueous solution, e.g. for cleaning or during drilling of holes	CPCONLY	H05K2203/0786		239
H05K2203/0789	11	Aqueous acid solution, e.g. for cleaning or etching	CPCONLY	H05K2203/0789		342
H05K2203/0793	11	Aqueous alkaline solution, e.g. for cleaning or etching	CPCONLY	H05K2203/0793		377
H05K2203/0796	11	Oxidant in aqueous solution, e.g. permanganate	CPCONLY	H05K2203/0796		290
H05K2203/08	8	Treatments involving gases	CPCONLY	H05K2203/08		21
H05K2203/081	9	Blowing of gas, e.g. for cooling or for providing heat during solder reflowing	CPCONLY	H05K2203/081		447
H05K2203/082	9	Suction, e.g. for holding solder balls or components	CPCONLY	H05K2203/082		522
H05K2203/083	9	Evaporation or sublimation of a compound, e.g. gas bubble generating agent	CPCONLY	H05K2203/083		75
H05K2203/085	9	Using vacuum or low pressure	CPCONLY	H05K2203/085		364
H05K2203/086	9	Using an inert gas	CPCONLY	H05K2203/086		172
H05K2203/087	9	Using a reactive gas	CPCONLY	H05K2203/087		193
H05K2203/088	9	Using a vapour or mist, e.g. cleaning using water vapor	CPCONLY	H05K2203/088		81
H05K2203/09	8	Treatments involving charged particles	CPCONLY	H05K2203/09		22
H05K2203/092	9	Particle beam, e.g. using an electron beam or an ion beam	CPCONLY	H05K2203/092		172
H05K2203/095	9	Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes	CPCONLY	H05K2203/095		732
H05K2203/097	10	Corona discharge	CPCONLY	H05K2203/097		44
H05K2203/10	8	Using electric, magnetic and electromagnetic fields; Using laser light	CPCONLY	H05K2203/10		35
H05K2203/101	9	Using electrical induction, e.g. for heating during soldering	CPCONLY	H05K2203/101		133
H05K2203/102	9	Using microwaves, e.g. for curing ink patterns or adhesive	CPCONLY	H05K2203/102		73
H05K2203/104	9	Using magnetic force, e.g. to align particles or for a temporary connection during processing	CPCONLY	H05K2203/104		232
H05K2203/105	9	Using an electrical field; Special methods of applying an electric potential	CPCONLY	H05K2203/105		244
H05K2203/107	9	Using laser light	CPCONLY	H05K2203/107		2640
H05K2203/108	10	Using a plurality of lasers or laser light with a plurality of wavelengths	CPCONLY	H05K2203/108		142
H05K2203/11	8	Treatments characterised by their effect, e.g. heating, cooling, roughening	CPCONLY	H05K2203/11		149
H05K2203/1105	9	Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating	CPCONLY	H05K2203/1105		1380
H05K2203/111	9	Preheating, e.g. before soldering	CPCONLY	H05K2203/111		182
H05K2203/1115	9	Resistance heating, e.g. by current through the PCB conductors or through a metallic mask	CPCONLY	H05K2203/1115		259
H05K2203/1121	9	Cooling, e.g. specific areas of a PCB being cooled during reflow soldering	CPCONLY	H05K2203/1121		288
H05K2203/1126	9	Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents	CPCONLY	H05K2203/1126		202
H05K2203/1131	9	Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity	CPCONLY	H05K2203/1131		591
H05K2203/1136	9	Conversion of insulating material into conductive material, e.g. by pyrolysis	CPCONLY	H05K2203/1136		104
H05K2203/1142	9	Conversion of conductive material into insulating material or into dissolvable compound	CPCONLY	H05K2203/1142		139
H05K2203/1147	9	Sealing or impregnating, e.g. of pores	CPCONLY	H05K2203/1147		358
H05K2203/1152	9	Replicating the surface structure of a sacrificial layer, e.g. for roughening	CPCONLY	H05K2203/1152		210
H05K2203/1157	9	Using means for chemical reduction	CPCONLY	H05K2203/1157		334
H05K2203/1163	9	Chemical reaction, e.g. heating solder by exothermic reaction	CPCONLY	H05K2203/1163		154
H05K2203/1168	9	Graft-polymerization	CPCONLY	H05K2203/1168		47
H05K2203/1173	9	Differences in wettability, e.g. hydrophilic or hydrophobic areas	CPCONLY	H05K2203/1173		278
H05K2203/1178	9	Means for venting or for letting gases escape	CPCONLY	H05K2203/1178		297
H05K2203/1184	9	Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching	CPCONLY	H05K2203/1184		173
H05K2203/1189	9	Pressing leads, bumps or a die through an insulating layer	CPCONLY	H05K2203/1189		545
H05K2203/1194	9	Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging	CPCONLY	H05K2203/1194		94
H05K2203/12	8	Using specific substances	CPCONLY	H05K2203/12		33
H05K2203/121	9	Metallo-organic compounds	CPCONLY	H05K2203/121		336
H05K2203/122	9	Organic non-polymeric compounds, e.g. oil, wax or thiol	CPCONLY	H05K2203/122		446
H05K2203/124	10	Heterocyclic organic compounds, e.g. azole, furan	CPCONLY	H05K2203/124		264
H05K2203/125	9	Inorganic compounds, e.g. silver salt	CPCONLY	H05K2203/125		217
H05K2203/127	9	Lubricants, e.g. during drilling of holes	CPCONLY	H05K2203/127		90
H05K2203/128	9	Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder	CPCONLY	H05K2203/128		254
H05K2203/13	8	Moulding and encapsulation; Deposition techniques; Protective layers	CPCONLY	H05K2203/13		15
H05K2203/1305	9	Moulding and encapsulation	CPCONLY	H05K2203/1305		128
H05K2203/1311	10	Foil encapsulation, e.g. of mounted components	CPCONLY	H05K2203/1311		212
H05K2203/1316	10	Moulded encapsulation of mounted components	CPCONLY	H05K2203/1316		1049
H05K2203/1322	10	Encapsulation comprising more than one layer	CPCONLY	H05K2203/1322		259
H05K2203/1327	10	Moulding over PCB locally or completely	CPCONLY	H05K2203/1327		637
H05K2203/1333	9	Deposition techniques, e.g. coating	CPCONLY	H05K2203/1333		43
H05K2203/1338	10	Chemical vapour deposition	CPCONLY	H05K2203/1338		95
H05K2203/1344	10	Spraying small metal particles or droplets of molten metal	CPCONLY	H05K2203/1344		172
H05K2203/135	10	Electrophoretic deposition of insulating material	CPCONLY	H05K2203/135		201
H05K2203/1355	10	Powder coating of insulating material	CPCONLY	H05K2203/1355		87
H05K2203/1361	10	Coating by immersion in coating bath	CPCONLY	H05K2203/1361		56
H05K2203/1366	10	Spraying coating	CPCONLY	H05K2203/1366		191
H05K2203/1372	10	Coating by using a liquid wave	CPCONLY	H05K2203/1372		9
H05K2203/1377	9	Protective layers	CPCONLY	H05K2203/1377		231
H05K2203/1383	10	Temporary protective insulating layer	CPCONLY	H05K2203/1383		249
H05K2203/1388	10	Temporary protective conductive layer	CPCONLY	H05K2203/1388		44
H05K2203/1394	10	Covering open PTHs, e.g. by dry film resist or by metal disc	CPCONLY	H05K2203/1394		223
H05K2203/14	8	Related to the order of processing steps	CPCONLY	H05K2203/14		80
H05K2203/1407	9	Applying catalyst before applying plating resist	CPCONLY	H05K2203/1407		71
H05K2203/1415	9	Applying catalyst after applying plating resist	CPCONLY	H05K2203/1415		65
H05K2203/1423	9	Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit	CPCONLY	H05K2203/1423		22
H05K2203/143	9	Treating holes before another process, e.g. coating holes before coating the substrate	CPCONLY	H05K2203/143		69
H05K2203/1438	9	Treating holes after another process, e.g. coating holes after coating the substrate	CPCONLY	H05K2203/1438		71
H05K2203/1446	9	Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering	CPCONLY	H05K2203/1446		112
H05K2203/1453	9	Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors	CPCONLY	H05K2203/1453		266
H05K2203/1461	9	Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors	CPCONLY	H05K2203/1461		309
H05K2203/1469	10	Circuit made after mounting or encapsulation of the components	CPCONLY	H05K2203/1469		465
H05K2203/1476	9	Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning	CPCONLY	H05K2203/1476		1446
H05K2203/1484	9	Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components	CPCONLY	H05K2203/1484		54
H05K2203/1492	9	Periodical treatments, e.g. pulse plating of through-holes	CPCONLY	H05K2203/1492		85
H05K2203/15	8	Position of the PCB during processing	CPCONLY	H05K2203/15		286
H05K2203/1509	9	Horizontally held PCB	CPCONLY	H05K2203/1509		548
H05K2203/1518	9	Vertically held PCB	CPCONLY	H05K2203/1518		209
H05K2203/1527	9	Obliquely held PCB	CPCONLY	H05K2203/1527		33
H05K2203/1536	9	Temporarily stacked PCBs	CPCONLY	H05K2203/1536		337
H05K2203/1545	9	Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path	CPCONLY	H05K2203/1545		1188
H05K2203/1554	9	Rotating or turning the PCB in a continuous manner	CPCONLY	H05K2203/1554		75
H05K2203/1563	9	Reversing the PCB	CPCONLY	H05K2203/1563		230
H05K2203/1572	9	Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides	CPCONLY	H05K2203/1572		1299
H05K2203/1581	9	Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside	CPCONLY	H05K2203/1581		272
H05K2203/159	9	Using gravitational force; Processing against the gravity direction; Using centrifugal force	CPCONLY	H05K2203/159		96
H05K2203/16	8	Inspection; Monitoring; Aligning	CPCONLY	H05K2203/16		279
H05K2203/161	9	Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection	CPCONLY	H05K2203/161		279
H05K2203/162	9	Testing a finished product, e.g. heat cycle testing of solder joints	CPCONLY	H05K2203/162		788
H05K2203/163	9	Monitoring a manufacturing process	CPCONLY	H05K2203/163		1232
H05K2203/165	9	Stabilizing, e.g. temperature stabilization	CPCONLY	H05K2203/165		92
H05K2203/166	9	Alignment or registration; Control of registration	CPCONLY	H05K2203/166		932
H05K2203/167	9	Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment	CPCONLY	H05K2203/167		1237
H05K2203/168	9	Wrong mounting prevention	CPCONLY	H05K2203/168		214
H05K2203/17	8	Post-manufacturing processes	CPCONLY	H05K2203/17		59
H05K2203/171	9	Tuning, e.g. by trimming of printed components or high frequency circuits	CPCONLY	H05K2203/171		233
H05K2203/173	9	Adding connections between adjacent pads or conductors, e.g. for modifying or repairing	CPCONLY	H05K2203/173		397
H05K2203/175	9	Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections	CPCONLY	H05K2203/175		785
H05K2203/176	9	Removing, replacing or disconnecting component; Easily removable component	CPCONLY	H05K2203/176		487
H05K2203/178	9	Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials	CPCONLY	H05K2203/178		194
H05K2203/30	8	Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17	CPCONLY	H05K2203/30		15
H05K2203/302	9	Bending a rigid substrate; Breaking rigid substrates by bending	CPCONLY	H05K2203/302		419
H05K2203/304	9	Protecting a component during manufacturing	CPCONLY	H05K2203/304		323
H05K2203/306	9	Lifting the component during or after mounting; Increasing the gap between component and PCB	CPCONLY	H05K2203/306		63
H05K2203/308	9	Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs	CPCONLY	H05K2203/308		401
