C23C2/00	7	Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor	C23C2/00	C23C2/00		765
C23C2/003	8	{Apparatus}	C23C2/00	C23C2/00		2014
C23C2/0032	9	{specially adapted for batch coating of substrate}	C23C2/00	C23C2/00		39
C23C2/00322	10	{Details of mechanisms for immersing or removing substrate from molten liquid bath, e.g. basket or lifting mechanism}	C23C2/00	C23C2/00		198
C23C2/0034	9	{Details related to elements immersed in bath}	C23C2/00	C23C2/00		218
C23C2/00342	10	{Moving elements, e.g. pumps or mixers}	C23C2/00	C23C2/00		161
C23C2/00344	11	{Means for moving substrates, e.g. immersed rollers or immersed bearings}	C23C2/00	C23C2/00		760
C23C2/00348	10	{Fixed work supports or guides}	C23C2/00	C23C2/00		68
C23C2/0035	9	{Means for continuously moving substrate through, into or out of the bath (C23C2/00344 takes precedence)}	C23C2/00	C23C2/00		709
C23C2/0036	9	{Crucibles}	C23C2/00	C23C2/00		388
C23C2/00361	10	{characterised by structures including means for immersing or extracting the substrate through confining wall area}	C23C2/00	C23C2/00		115
C23C2/00362	11	{Details related to seals, e.g. magnetic means}	C23C2/00	C23C2/00		65
C23C2/0038	9	{characterised by the pre-treatment chambers located immediately upstream of the bath or occurring locally before the dipping process}	C23C2/00	C23C2/00		593
C23C2/004	10	{Snouts}	C23C2/00	C23C2/00		385
C23C2/006	8	{Pattern or selective deposits}	C23C2/00	C23C2/00		157
C23C2/0062	9	{without pre-treatment of the material to be coated, e.g. using masking elements such as casings, shields, fixtures or blocking elements}	C23C2/00	C23C2/00		203
C23C2/0064	9	{using masking layers}	C23C2/00	C23C2/00		48
C23C2/02	8	Pretreatment of the material to be coated, e.g. for coating on selected surface areas (C23C2/30 takes precedence)	C23C2/02	C23C2/02		2627
C23C2/022	9	{by heating}	C23C2/02	C23C2/02		823
C23C2/0222	10	{in a reactive atmosphere, e.g. oxidising or reducing atmosphere (C23C2/024 takes precedence)}	C23C2/02	C23C2/02		546
C23C2/0224	10	{Two or more thermal pretreatments}	C23C2/02	C23C2/02		1264
C23C2/024	9	{by cleaning or etching}	C23C2/02	C23C2/02		1592
C23C2/026	9	{Deposition of sublayers, e.g. adhesion layers or pre-applied alloying elements or corrosion protection}	C23C2/02	C23C2/02		280
C23C2/04	8	characterised by the coating material	C23C2/04	C23C2/04		751
C23C2/06	9	Zinc or cadmium or alloys based thereon	C23C2/06	C23C2/06		8339
C23C2/08	9	Tin or alloys based thereon	C23C2/08	C23C2/08		1144
C23C2/10	9	Lead or alloys based thereon	C23C2/10	C23C2/10		251
C23C2/12	9	Aluminium or alloys based thereon	C23C2/12	C23C2/12		2136
C23C2/14	8	Removing excess of molten coatings; Controlling or regulating the coating thickness	C23C2/14	C23C2/14		443
C23C2/16	9	using fluids under pressure, e.g. air knives	C23C2/16	C23C2/16		335
C23C2/18	10	Removing excess of molten coatings from elongated material	C23C2/18	C23C2/18		168
C23C2/185	11	{Tubes; Wires}	C23C2/18	C23C2/18		145
C23C2/20	11	Strips; Plates	C23C2/20	C23C2/20		1200
C23C2/22	9	by rubbing, e.g. using knives {, e.g. rubbing solids}	C23C2/22	C23C2/22		331
C23C2/24	9	using magnetic or electric fields	C23C2/24	C23C2/24		219
C23C2/26	8	After-treatment (C23C2/14 takes precedence)	C23C2/26	C23C2/26		2262
C23C2/261	9	{in a gas atmosphere, e.g. inert or reducing atmosphere}	C23C2/26	C23C2/26		397
C23C2/265	9	{by applying solid particles to the molten coating}	C23C2/26	C23C2/26		144
C23C2/28	9	Thermal after-treatment, e.g. treatment in oil bath	C23C2/28	C23C2/28		1961
C23C2/285	10	{for remelting the coating}	C23C2/28	C23C2/28		147
C23C2/29	10	{Cooling or quenching}	C23C2/28	C23C2/29		1315
C23C2/30	8	Fluxes or coverings on molten baths (C23C2/22 takes precedence)	C23C2/30	C23C2/30		433
C23C2/32	8	using vibratory energy applied to the bath or substrate (C23C2/14 takes precedence)	C23C2/32	C23C2/32		164
C23C2/325	8	{Processes or devices for cleaning the bath}	C23C2/00	C23C2/32		265
C23C2/34	8	characterised by the shape of the material to be treated (C23C2/14 takes precedence)	C23C2/34	C23C2/34		352
C23C2/36	9	Elongated material	C23C2/36	C23C2/36		270
C23C2/38	10	Wires; Tubes	C23C2/38	C23C2/38		1548
C23C2/385	11	{Tubes of specific length}	C23C2/38	C23C2/38		113
C23C2/40	10	Plates; Strips	C23C2/40	C23C2/40		4682
C23C2/405	11	{Plates of specific length}	C23C2/40	C23C2/40		165
C23C2/50	8	{Controlling or regulating the coating processes (C23C2/14 takes precedence)}	C23C2/00	C23C2/50		328
C23C2/51	9	{Computer-controlled implementation}	C23C2/00	C23C2/51		162
C23C2/52	9	{with means for measuring or sensing}	C23C2/00	C23C2/52		260
C23C2/521	10	{Composition of the bath}	C23C2/00	C23C2/521		47
C23C2/522	10	{Temperature of the bath}	C23C2/00	C23C2/522		147
C23C2/523	10	{Bath level or amount}	C23C2/00	C23C2/523		59
C23C2/524	10	{Position of the substrate}	C23C2/00	C23C2/524		45
C23C2/5245	11	{for reducing vibrations of the substrate}	C23C2/00	C23C2/5245		51
C23C2/525	10	{Speed of the substrate}	C23C2/00	C23C2/525		27
C23C2/526	10	{for visually inspecting the surface quality of the substrate}	C23C2/00	C23C2/526		36
C23C2/54	9	{of the mixing or stirring the bath}	C23C2/00	C23C2/54		7
C23C2/542	10	{using static devices separate from the substrate, e.g. a fixed plate}	C23C2/00	C23C2/542		3
C23C2/544	10	{using moving mixing devices separate from the substrate, e.g. an impeller of blade}	C23C2/00	C23C2/544		10
C23C4/00	7	Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge (build-up welding B23K, e.g. B23K5/18, B23K9/04)	C23C4/00	C23C4/00		639
C23C4/01	8	Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated	C23C4/01	C23C4/01		669
C23C4/02	8	Pretreatment of the material to be coated, e.g. for coating on selected surface areas	C23C4/02	C23C4/02		4147
C23C4/04	8	characterised by the coating material	C23C4/04	C23C4/04		1415
C23C4/06	9	Metallic material	C23C4/06	C23C4/06		4155
C23C4/067	10	containing free particles of non-metal elements, e.g. carbon, silicon, boron, phosphorus or arsenic	C23C4/067	C23C4/067		810
C23C4/073	10	containing MCrAl or MCrAlY alloys, where M is nickel, cobalt or iron, with or without non-metal elements	C23C4/073	C23C4/073		985
C23C4/08	10	containing only metal elements (C23C4/073 takes precedence)	C23C4/08	C23C4/08		3185
C23C4/10	9	Oxides, borides, carbides, nitrides or silicides; Mixtures thereof	C23C4/10	C23C4/10		2202
C23C4/11	10	Oxides	C23C4/11	C23C4/11		2639
C23C4/12	8	characterised by the method of spraying	C23C4/12	C23C4/12		2002
C23C4/123	9	Spraying molten metal	C23C4/123	C23C4/123		1103
C23C4/126	9	Detonation spraying	C23C4/126	C23C4/126		321
C23C4/129	9	Flame spraying	C23C4/129	C23C4/129		2410
C23C4/131	9	Wire arc spraying	C23C4/131	C23C4/131		1434
C23C4/134	9	Plasma spraying	C23C4/134	C23C4/134		4746
C23C4/137	9	Spraying in vacuum or in an inert atmosphere	C23C4/137	C23C4/137		347
C23C4/14	9	for coating elongate material	C23C4/14	C23C4/14		255
C23C4/16	10	Wires; Tubes	C23C4/16	C23C4/16		479
C23C4/18	8	After-treatment	C23C4/18	C23C4/18		3646
C23C4/185	9	{Separation of the coating from the substrate}	C23C4/18	C23C4/18		401
C23C6/00	7	Coating by casting molten material on the substrate	C23C6/00	C23C6/00		299
C23C8/00	7	Solid state diffusion of only non-metal elements into metallic material surfaces (diffusion of silicon C23C10/00); Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals (C23C14/00 takes precedence)	C23C8/00	C23C8/00		868
C23C8/02	8	Pretreatment of the material to be coated (C23C8/04 takes precedence)	C23C8/02	C23C8/02		2420
C23C8/04	8	Treatment of selected surface areas, e.g. using masks	C23C8/04	C23C8/04		643
C23C8/06	8	using gases (C23C8/36 takes precedence)	C23C8/06	C23C8/06		536
C23C8/08	9	only one element being applied	C23C8/08	C23C8/08		340
C23C8/10	10	Oxidising	C23C8/10	C23C8/10		1427
C23C8/12	11	using elemental oxygen or ozone	C23C8/12	C23C8/12		467
C23C8/14	12	Oxidising of ferrous surfaces	C23C8/14	C23C8/14		352
C23C8/16	11	using oxygen-containing compounds, e.g. water, carbon dioxide	C23C8/16	C23C8/16		351
C23C8/18	12	Oxidising of ferrous surfaces	C23C8/18	C23C8/18		440
C23C8/20	10	Carburising	C23C8/20	C23C8/20		881
C23C8/22	11	of ferrous surfaces	C23C8/22	C23C8/22		1943
C23C8/24	10	Nitriding	C23C8/24	C23C8/24		1109
C23C8/26	11	of ferrous surfaces	C23C8/26	C23C8/26		1943
C23C8/28	9	more than one element being applied in one step	C23C8/28	C23C8/28		258
C23C8/30	10	Carbo-nitriding	C23C8/30	C23C8/30		273
C23C8/32	11	of ferrous surfaces	C23C8/32	C23C8/32		914
C23C8/34	9	more than one element being applied in more than one step	C23C8/34	C23C8/34		546
C23C8/36	9	using ionised gases, e.g. ionitriding	C23C8/36	C23C8/36		1355
C23C8/38	10	Treatment of ferrous surfaces	C23C8/38	C23C8/38		741
C23C8/40	8	using liquids, e.g. salt baths, liquid suspensions	C23C8/40	C23C8/40		302
C23C8/42	9	only one element being applied	C23C8/42	C23C8/42		228
C23C8/44	10	Carburising	C23C8/44	C23C8/44		105
C23C8/46	11	of ferrous surfaces	C23C8/46	C23C8/46		305
C23C8/48	10	Nitriding	C23C8/48	C23C8/48		133
C23C8/50	11	of ferrous surfaces	C23C8/50	C23C8/50		350
C23C8/52	9	more than one element being applied in one step	C23C8/52	C23C8/52		88
C23C8/54	10	Carbo-nitriding	C23C8/54	C23C8/54		105
C23C8/56	11	of ferrous surfaces	C23C8/56	C23C8/56		123
C23C8/58	9	more than one element being applied in more than one step	C23C8/58	C23C8/58		163
C23C8/60	8	using solids, e.g. powders, pastes (using liquid suspensions of solids C23C8/40)	C23C8/60	C23C8/60		180
C23C8/62	9	only one element being applied	C23C8/62	C23C8/62		137
C23C8/64	10	Carburising	C23C8/64	C23C8/64		212
C23C8/66	11	of ferrous surfaces	C23C8/66	C23C8/66		538
C23C8/68	10	Boronising	C23C8/68	C23C8/68		168
C23C8/70	11	of ferrous surfaces	C23C8/70	C23C8/70		207
C23C8/72	9	more than one element being applied in one step	C23C8/72	C23C8/72		51
C23C8/74	10	Carbo-nitriding	C23C8/74	C23C8/74		17
C23C8/76	11	of ferrous surfaces	C23C8/76	C23C8/76		35
C23C8/78	9	more than one element being applied in more than one step	C23C8/78	C23C8/78		24
C23C8/80	8	After-treatment	C23C8/80	C23C8/80		2363
C23C10/00	7	Solid state diffusion of only metal elements or silicon into metallic material surfaces	C23C10/00	C23C10/00		239
C23C10/02	8	Pretreatment of the material to be coated (C23C10/04 takes precedence)	C23C10/02	C23C10/02		736
C23C10/04	8	Diffusion into selected surface areas, e.g. using masks	C23C10/04	C23C10/04		249
C23C10/06	8	using gases	C23C10/06	C23C10/06		188
C23C10/08	9	only one element being diffused	C23C10/08	C23C10/08		350
C23C10/10	10	Chromising	C23C10/10	C23C10/10		84
C23C10/12	11	of ferrous surfaces	C23C10/12	C23C10/12		60
C23C10/14	9	more than one element being diffused in one step	C23C10/14	C23C10/14		93
C23C10/16	9	more than one element being diffused in more than one step	C23C10/16	C23C10/16		39
C23C10/18	8	using liquids, e.g. salt baths, liquid suspensions	C23C10/18	C23C10/18		172
C23C10/20	9	only one element being diffused	C23C10/20	C23C10/20		139
C23C10/22	10	Metal melt containing the element to be diffused	C23C10/22	C23C10/22		253
C23C10/24	10	Salt bath containing the element to be diffused	C23C10/24	C23C10/24		147
C23C10/26	9	more than one element being diffused	C23C10/26	C23C10/26		157
C23C10/28	8	using solids, e.g. powders, pastes	C23C10/28	C23C10/28		823
C23C10/30	9	using a layer of powder or paste on the surface (using liquid suspensions of solids C23C10/18)	C23C10/30	C23C10/30		512
C23C10/32	10	Chromising	C23C10/32	C23C10/32		113
C23C10/34	9	Embedding in a powder mixture, i.e. pack cementation	C23C10/34	C23C10/34		310
C23C10/36	10	only one element being diffused	C23C10/36	C23C10/36		276
C23C10/38	11	Chromising	C23C10/38	C23C10/38		112
C23C10/40	12	of ferrous surfaces	C23C10/40	C23C10/40		121
C23C10/42	13	in the presence of volatile transport additives, e.g. halogenated substances	C23C10/42	C23C10/42		152
C23C10/44	11	Siliconising	C23C10/44	C23C10/44		86
C23C10/46	12	of ferrous surfaces	C23C10/46	C23C10/46		66
C23C10/48	11	Aluminising	C23C10/48	C23C10/48		304
C23C10/50	12	of ferrous surfaces	C23C10/50	C23C10/50		159
C23C10/52	10	more than one element being diffused in one step	C23C10/52	C23C10/52		386
C23C10/54	11	Diffusion of at least chromium	C23C10/54	C23C10/54		93
C23C10/56	12	and at least aluminium	C23C10/56	C23C10/56		138
C23C10/58	10	more than one element being diffused in more than one step	C23C10/58	C23C10/58		174
C23C10/60	8	After-treatment	C23C10/60	C23C10/60		689
C23C12/00	7	Solid state diffusion of at least one non-metal element other than silicon and at least one metal element or silicon into metallic material surfaces	C23C12/00	C23C12/00		373
C23C12/02	8	Diffusion in one step	C23C12/02	C23C12/02		446
C23C14/00	7	Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material	C23C14/00	C23C14/00		631
C23C14/0005	8	{Separation of the coating from the substrate}	C23C14/00	C23C14/00		599
C23C14/001	8	{Coating on a liquid substrate}	C23C14/00	C23C14/00		16
C23C14/0015	8	{characterized by the colour of the layer}	C23C14/00	C23C14/00		1022
C23C14/0021	8	{Reactive sputtering or evaporation}	C23C14/00	C23C14/00		1815
C23C14/0026	9	{Activation or excitation of reactive gases outside the coating chamber}	C23C14/00	C23C14/00		58
C23C14/0031	10	{Bombardment of substrates by reactive ion beams}	C23C14/00	C23C14/00		69
C23C14/0036	9	{Reactive sputtering}	C23C14/00	C23C14/00		3279
C23C14/0042	10	{Controlling partial pressure or flow rate of reactive or inert gases with feedback of measurements}	C23C14/00	C23C14/00		392
C23C14/0047	10	{Activation or excitation of reactive gases outside the coating chamber}	C23C14/00	C23C14/00		45
C23C14/0052	11	{Bombardment of substrates by reactive ion beams}	C23C14/00	C23C14/00		53
C23C14/0057	10	{using reactive gases other than O2, H2O, N2, NH3 or CH4}	C23C14/00	C23C14/00		574
C23C14/0063	10	{characterised by means for introducing or removing gases}	C23C14/00	C23C14/00		217
C23C14/0068	10	{characterised by means for confinement of gases or sputtered material, e.g. screens, baffles}	C23C14/00	C23C14/00		128
C23C14/0073	10	{by exposing the substrates to reactive gases intermittently}	C23C14/00	C23C14/00		87
C23C14/0078	11	{by moving the substrates between spatially separate sputtering and reaction stations}	C23C14/00	C23C14/00		100
C23C14/0084	10	{Producing gradient compositions}	C23C14/00	C23C14/00		268
C23C14/0089	10	{in metallic mode}	C23C14/00	C23C14/00		65
C23C14/0094	10	{in transition mode}	C23C14/00	C23C14/00		56
C23C14/02	8	Pretreatment of the material to be coated (C23C14/04 takes precedence)	C23C14/02	C23C14/02		1319
C23C14/021	9	{Cleaning or etching treatments}	C23C14/02	C23C14/02		1797
C23C14/022	10	{by means of bombardment with energetic particles or radiation}	C23C14/02	C23C14/02		3103
C23C14/024	9	{Deposition of sublayers, e.g. to promote adhesion of the coating (C23C14/027 takes precedence)}	C23C14/02	C23C14/02		1959
C23C14/025	10	{Metallic sublayers}	C23C14/02	C23C14/02		1890
C23C14/027	9	{Graded interfaces}	C23C14/02	C23C14/02		354
C23C14/028	9	{Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing}	C23C14/02	C23C14/02		864
C23C14/04	8	Coating on selected surface areas, e.g. using masks	C23C14/04	C23C14/04		1400
C23C14/042	9	{using masks}	C23C14/04	C23C14/04		6816
C23C14/044	10	{using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient}	C23C14/04	C23C14/04		553
C23C14/046	9	{Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates}	C23C14/04	C23C14/04		941
C23C14/048	9	{using irradiation by energy or particles}	C23C14/04	C23C14/04		392
C23C14/06	8	characterised by the coating material ({C23C14/0021} , C23C14/04 take precedence)	C23C14/06	C23C14/06		2778
C23C14/0605	9	{Carbon}	C23C14/06	C23C14/06		2234
C23C14/0611	10	{Diamond}	C23C14/06	C23C14/06		311
C23C14/0617	9	{AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi}	C23C14/06	C23C14/06		608
C23C14/0623	9	{Sulfides, selenides or tellurides}	C23C14/06	C23C14/06		1124
C23C14/0629	10	{of zinc, cadmium or mercury}	C23C14/06	C23C14/06		458
C23C14/0635	9	{Carbides}	C23C14/06	C23C14/06		1385
C23C14/0641	9	{Nitrides (C23C14/0617 takes precedence)}	C23C14/06	C23C14/06		4748
C23C14/0647	10	{Boron nitride}	C23C14/06	C23C14/06		260
C23C14/0652	10	{Silicon nitride}	C23C14/06	C23C14/06		661
C23C14/0658	10	{Carbon nitride}	C23C14/06	C23C14/06		82
C23C14/0664	9	{Carbonitrides}	C23C14/06	C23C14/06		782
C23C14/067	9	{Borides}	C23C14/06	C23C14/06		325
C23C14/0676	9	{Oxynitrides}	C23C14/06	C23C14/06		719
C23C14/0682	9	{Silicides}	C23C14/06	C23C14/06		196
C23C14/0688	9	{Cermets, e.g. mixtures of metal and one or more of carbides, nitrides, oxides or borides}	C23C14/06	C23C14/06		522
C23C14/0694	9	{Halides}	C23C14/06	C23C14/06		765
C23C14/08	9	Oxides (C23C14/10 takes precedence)	C23C14/08	C23C14/08		4268
C23C14/081	10	{of aluminium, magnesium or beryllium}	C23C14/08	C23C14/08		1803
C23C14/082	10	{of alkaline earth metals}	C23C14/08	C23C14/08		97
C23C14/083	10	{of refractory metals or yttrium}	C23C14/08	C23C14/08		3318
C23C14/085	10	{of iron group metals}	C23C14/08	C23C14/08		327
C23C14/086	10	{of zinc, germanium, cadmium, indium, tin, thallium or bismuth}	C23C14/08	C23C14/08		2839
C23C14/087	10	{of copper or solid solutions thereof}	C23C14/08	C23C14/08		362
C23C14/088	10	{of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal}	C23C14/08	C23C14/08		374
C23C14/10	9	Glass or silica	C23C14/10	C23C14/10		2400
C23C14/12	9	Organic material	C23C14/12	C23C14/12		3628
C23C14/14	9	Metallic material, boron or silicon	C23C14/14	C23C14/14		4315
C23C14/16	10	on metallic substrates or on substrates of boron or silicon	C23C14/16	C23C14/16		3611
C23C14/165	11	{by cathodic sputtering}	C23C14/16	C23C14/16		4012
C23C14/18	10	on other inorganic substrates	C23C14/18	C23C14/18		1997
C23C14/185	11	{by cathodic sputtering}	C23C14/18	C23C14/18		2775
C23C14/20	10	on organic substrates	C23C14/20	C23C14/20		2390
C23C14/205	11	{by cathodic sputtering}	C23C14/20	C23C14/20		1613
C23C14/22	8	characterised by the process of coating	C23C14/22	C23C14/22		1828
C23C14/221	9	{Ion beam deposition (C23C14/46, C23C14/48 take precedence)}	C23C14/22	C23C14/22		806
C23C14/223	9	{specially adapted for coating particles}	C23C14/22	C23C14/22		495
C23C14/225	9	{Oblique incidence of vaporised material on substrate}	C23C14/22	C23C14/22		698
C23C14/226	10	{in order to form films with columnar structure}	C23C14/22	C23C14/22		136
C23C14/228	9	{Gas flow assisted PVD deposition}	C23C14/22	C23C14/22		811
C23C14/24	9	Vacuum evaporation	C23C14/24	C23C14/24		9817
C23C14/243	10	{Crucibles for source material (C23C14/28, C23C14/30 take precedence)}	C23C14/24	C23C14/24		3232
C23C14/246	10	{Replenishment of source material}	C23C14/24	C23C14/24		938
C23C14/26	10	by resistance or inductive heating of the source	C23C14/26	C23C14/26		2125
C23C14/28	10	by wave energy or particle radiation (C23C14/32&#160;-&#160;C23C14/48 take precedence)	C23C14/28	C23C14/28		1813
C23C14/30	11	by electron bombardment	C23C14/30	C23C14/30		3021
C23C14/32	10	by explosion; by evaporation and subsequent ionisation of the vapours {, e.g. ion-plating}(C23C14/34&#160;-&#160;C23C14/48 take precedence)	C23C14/32	C23C14/32		1715
C23C14/325	11	{Electric arc evaporation}	C23C14/32	C23C14/32		3383
C23C14/34	9	Sputtering	C23C14/34	C23C14/34		7428
C23C14/3407	10	{Cathode assembly for sputtering apparatus, e.g. Target}	C23C14/34	C23C14/34		4299
C23C14/3414	11	{Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy}	C23C14/34	C23C14/34		5616
C23C14/3421	11	{using heated targets}	C23C14/34	C23C14/34		74
C23C14/3428	11	{using liquid targets}	C23C14/34	C23C14/34		34
C23C14/3435	10	{Applying energy to the substrate during sputtering}	C23C14/34	C23C14/34		110
C23C14/3442	11	{using an ion beam}	C23C14/34	C23C14/34		242
C23C14/345	11	{using substrate bias}	C23C14/34	C23C14/34		1038
C23C14/3457	10	{using other particles than noble gas ions (C23C14/0036, C23C14/46 take precedence)}	C23C14/34	C23C14/34		156
C23C14/3464	10	{using more than one target (C23C14/56 takes precedence)}	C23C14/34	C23C14/34		1647
C23C14/3471	10	{Introduction of auxiliary energy into the plasma}	C23C14/34	C23C14/34		233
C23C14/3478	11	{using electrons, e.g. triode sputtering}	C23C14/34	C23C14/34		79
C23C14/3485	10	{using pulsed power to the target}	C23C14/34	C23C14/34		890
C23C14/3492	10	{Variation of parameters during sputtering}	C23C14/34	C23C14/34		519
C23C14/35	10	by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)}	C23C14/35	C23C14/35		11769
C23C14/351	11	{using a magnetic field in close vicinity to the substrate}	C23C14/35	C23C14/35		298
C23C14/352	11	{using more than one target (C23C14/56 takes precedence)}	C23C14/35	C23C14/35		3767
C23C14/354	11	{Introduction of auxiliary energy into the plasma}	C23C14/35	C23C14/35		184
C23C14/355	12	{using electrons, e.g. triode sputtering}	C23C14/35	C23C14/35		137
C23C14/357	12	{Microwaves, e.g. electron cyclotron resonance enhanced sputtering}	C23C14/35	C23C14/35		92
C23C14/358	12	{Inductive energy}	C23C14/35	C23C14/35		166
C23C14/46	10	by ion beam produced by an external ion source	C23C14/46	C23C14/46		758
C23C14/48	9	Ion implantation	C23C14/48	C23C14/48		1847
C23C14/50	9	Substrate holders	C23C14/50	C23C14/50		3808
C23C14/505	10	{for rotation of the substrates}	C23C14/50	C23C14/50		3110
C23C14/52	9	Means for observation of the coating process	C23C14/52	C23C14/52		604
C23C14/54	9	Controlling or regulating the coating process	C23C14/54	C23C14/54		4352
C23C14/541	10	{Heating or cooling of the substrates}	C23C14/54	C23C14/54		2076
C23C14/542	10	{Controlling the film thickness or evaporation rate}	C23C14/54	C23C14/54		1207
C23C14/543	11	{using measurement on the vapor source}	C23C14/54	C23C14/54		339
C23C14/544	11	{using measurement in the gas phase}	C23C14/54	C23C14/54		233
C23C14/545	11	{using measurement on deposited material}	C23C14/54	C23C14/54		487
C23C14/546	12	{using crystal oscillators}	C23C14/54	C23C14/54		403
C23C14/547	12	{using optical methods}	C23C14/54	C23C14/54		541
C23C14/548	10	{Controlling the composition}	C23C14/54	C23C14/54		846
C23C14/56	9	Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks	C23C14/56	C23C14/56		2752
C23C14/562	10	{for coating elongated substrates}	C23C14/56	C23C14/56		3221
C23C14/564	10	{Means for minimising impurities in the coating chamber such as dust, moisture, residual gases}	C23C14/56	C23C14/56		2661
C23C14/566	11	{using a load-lock chamber}	C23C14/56	C23C14/56		658
C23C14/568	10	{Transferring the substrates through a series of coating stations (C23C14/562 takes precedence)}	C23C14/56	C23C14/56		2141
C23C14/58	8	After-treatment	C23C14/58	C23C14/58		1465
C23C14/5806	9	{Thermal treatment}	C23C14/58	C23C14/58		3599
C23C14/5813	10	{using lasers}	C23C14/58	C23C14/58		280
C23C14/582	10	{using electron bombardment}	C23C14/58	C23C14/58		60
C23C14/5826	9	{Treatment with charged particles (C23C14/582 takes precedence)}	C23C14/58	C23C14/58		339
C23C14/5833	10	{Ion beam bombardment}	C23C14/58	C23C14/58		340
C23C14/584	9	{Non-reactive treatment}	C23C14/58	C23C14/58		263
C23C14/5846	9	{Reactive treatment}	C23C14/58	C23C14/58		606
C23C14/5853	10	{Oxidation}	C23C14/58	C23C14/58		871
C23C14/586	10	{Nitriding}	C23C14/58	C23C14/58		169
C23C14/5866	10	{Treatment with sulfur, selenium or tellurium}	C23C14/58	C23C14/58		223
C23C14/5873	9	{Removal of material}	C23C14/58	C23C14/58		1069
C23C14/588	10	{by mechanical treatment}	C23C14/58	C23C14/58		170
C23C14/5886	9	{Mechanical treatment (involving removal of material C23C14/588)}	C23C14/58	C23C14/58		241
C23C14/5893	9	{Mixing of deposited material}	C23C14/58	C23C14/58		218
C23C16/00	7	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C14/00)	C23C16/00	C23C16/00		818
C23C16/003	8	{Coating on a liquid substrate}	C23C16/00	C23C16/00		34
C23C16/006	8	{characterized by the colour of the layer}	C23C16/00	C23C16/00		154
C23C16/01	8	on temporary substrates, e.g. substrates subsequently removed by etching	C23C16/01	C23C16/01		1007
C23C16/02	8	Pretreatment of the material to be coated (C23C16/04 takes precedence)	C23C16/02	C23C16/02		842
C23C16/0209	9	{by heating}	C23C16/02	C23C16/02		545
C23C16/0218	10	{in a reactive atmosphere (C23C16/0227 takes precedence)}	C23C16/02	C23C16/02		273
C23C16/0227	9	{by cleaning or etching}	C23C16/02	C23C16/02		1130
C23C16/0236	10	{by etching with a reactive gas}	C23C16/02	C23C16/02		305
C23C16/0245	10	{by etching with a plasma}	C23C16/02	C23C16/02		872
C23C16/0254	9	{Physical treatment to alter the texture of the surface, e.g. scratching or polishing}	C23C16/02	C23C16/02		361
C23C16/0263	10	{Irradiation with laser or particle beam}	C23C16/02	C23C16/02		132
C23C16/0272	9	{Deposition of sub-layers, e.g. to promote the adhesion of the main coating}	C23C16/02	C23C16/02		2180
C23C16/0281	10	{of metallic sub-layers (C23C16/029 takes precedence)}	C23C16/02	C23C16/02		761
C23C16/029	10	{Graded interfaces}	C23C16/02	C23C16/02		229
C23C16/04	8	Coating on selected surface areas, e.g. using masks	C23C16/04	C23C16/04		1291
C23C16/042	9	{using masks}	C23C16/04	C23C16/04		1524
C23C16/045	9	{Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates}	C23C16/04	C23C16/04		2992
C23C16/047	9	{using irradiation by energy or particles}	C23C16/04	C23C16/04		383
C23C16/06	8	characterised by the deposition of metallic material	C23C16/06	C23C16/06		1893
C23C16/08	9	from metal halides	C23C16/08	C23C16/08		524
C23C16/10	10	Deposition of chromium only	C23C16/10	C23C16/10		33
C23C16/12	10	Deposition of aluminium only	C23C16/12	C23C16/12		119
C23C16/14	10	Deposition of only one other metal element	C23C16/14	C23C16/14		839
C23C16/16	9	from metal carbonyl compounds	C23C16/16	C23C16/16		542
C23C16/18	9	from metallo-organic compounds	C23C16/18	C23C16/18		2272
C23C16/20	10	Deposition of aluminium only	C23C16/20	C23C16/20		194
C23C16/22	8	characterised by the deposition of inorganic material, other than metallic material	C23C16/22	C23C16/22		599
C23C16/24	9	Deposition of silicon only	C23C16/24	C23C16/24		2667
C23C16/26	9	Deposition of carbon only	C23C16/26	C23C16/26		4885
C23C16/27	10	Diamond only	C23C16/27	C23C16/27		1026
C23C16/271	11	{using hot filaments}	C23C16/27	C23C16/27		637
C23C16/272	11	{using DC, AC or RF discharges}	C23C16/27	C23C16/27		178
C23C16/274	11	{using microwave discharges}	C23C16/27	C23C16/27		787
C23C16/275	11	{using combustion torches}	C23C16/27	C23C16/27		29
C23C16/276	11	{using plasma jets}	C23C16/27	C23C16/27		202
C23C16/277	11	{using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets}	C23C16/27	C23C16/27		232
C23C16/278	11	{doping or introduction of a secondary phase in the diamond}	C23C16/27	C23C16/27		299
C23C16/279	11	{control of diamond crystallography}	C23C16/27	C23C16/27		202
C23C16/28	9	Deposition of only one other non-metal element	C23C16/28	C23C16/28		259
C23C16/30	9	Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides	C23C16/30	C23C16/30		2256
C23C16/301	10	{AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi}	C23C16/30	C23C16/30		341
C23C16/303	11	{Nitrides}	C23C16/30	C23C16/30		905
C23C16/305	10	{Sulfides, selenides, or tellurides}	C23C16/30	C23C16/30		919
C23C16/306	11	{AII BVI compounds, where A is Zn, Cd or Hg and B is S, Se or Te}	C23C16/30	C23C16/30		162
C23C16/308	10	{Oxynitrides}	C23C16/30	C23C16/30		830
C23C16/32	10	Carbides	C23C16/32	C23C16/32		1031
C23C16/325	11	{Silicon carbide}	C23C16/32	C23C16/32		1572
C23C16/34	10	Nitrides {(C23C16/303 takes precedence)}	C23C16/34	C23C16/34		3012
C23C16/342	11	{Boron nitride}	C23C16/34	C23C16/34		512
C23C16/345	11	{Silicon nitride}	C23C16/34	C23C16/34		2717
C23C16/347	11	{Carbon nitride}	C23C16/34	C23C16/34		85
C23C16/36	10	Carbonitrides	C23C16/36	C23C16/36		1154
C23C16/38	10	Borides	C23C16/38	C23C16/38		233
C23C16/40	10	Oxides	C23C16/40	C23C16/40		2708
C23C16/401	11	{containing silicon}	C23C16/40	C23C16/40		2768
C23C16/402	12	{Silicon dioxide}	C23C16/40	C23C16/40		2254
C23C16/403	11	{of aluminium, magnesium or beryllium}	C23C16/40	C23C16/40		2266
C23C16/404	11	{of alkaline earth metals}	C23C16/40	C23C16/40		77
C23C16/405	11	{of refractory metals or yttrium}	C23C16/40	C23C16/40		2196
C23C16/406	11	{of iron group metals}	C23C16/40	C23C16/40		171
C23C16/407	11	{of zinc, germanium, cadmium, indium, tin, thallium or bismuth}	C23C16/40	C23C16/40		975
C23C16/408	11	{of copper or solid solutions thereof}	C23C16/40	C23C16/40		176
C23C16/409	11	{of the type ABO3 with A representing alkali, alkaline earth metal or lead and B representing a refractory metal, nickel, scandium or a lanthanide}	C23C16/40	C23C16/40		356
C23C16/42	10	Silicides	C23C16/42	C23C16/42		652
C23C16/44	8	characterised by the method of coating (C23C16/04 takes precedence)	C23C16/44	C23C16/44		3381
C23C16/4401	9	{Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber}	C23C16/44	C23C16/44		1966
C23C16/4402	10	{Reduction of impurities in the source gas}	C23C16/44	C23C16/44		379
C23C16/4404	10	{Coatings or surface treatment on the inside of the reaction chamber or on parts thereof}	C23C16/44	C23C16/44		1402
C23C16/4405	10	{Cleaning of reactor or parts inside the reactor by using reactive gases}	C23C16/44	C23C16/44		2182
C23C16/4407	10	{Cleaning of reactor or reactor parts by using wet or mechanical methods}	C23C16/44	C23C16/44		406
C23C16/4408	10	{by purging residual gases from the reaction chamber or gas lines}	C23C16/44	C23C16/44		1465
C23C16/4409	10	{characterised by sealing means}	C23C16/44	C23C16/44		698
C23C16/4411	9	{Cooling of the reaction chamber walls (C23C16/45572 takes precedence)}	C23C16/44	C23C16/44		452
C23C16/4412	9	{Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps}	C23C16/44	C23C16/44		4210
C23C16/4414	9	{Electrochemical vapour deposition [EVD]}	C23C16/44	C23C16/44		35
C23C16/4415	9	{Acoustic wave CVD}	C23C16/44	C23C16/44		28
C23C16/4417	9	{Methods specially adapted for coating powder}	C23C16/44	C23C16/44		907
C23C16/4418	9	{Methods for making free-standing articles (C23C16/01 takes precedence)}	C23C16/44	C23C16/44		212
C23C16/442	9	using fluidised bed process	C23C16/442	C23C16/442		404
C23C16/448	9	characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials	C23C16/448	C23C16/448		1299
C23C16/4481	10	{by evaporation using carrier gas in contact with the source material (C23C16/4486 takes precedence)}	C23C16/448	C23C16/448		1280
C23C16/4482	11	{by bubbling of carrier gas through liquid source material}	C23C16/448	C23C16/448		437
C23C16/4483	11	{using a porous body}	C23C16/448	C23C16/448		89
C23C16/4485	10	{by evaporation without using carrier gas in contact with the source material (C23C16/4486 takes precedence)}	C23C16/448	C23C16/448		549
C23C16/4486	10	{by producing an aerosol and subsequent evaporation of the droplets or particles}	C23C16/448	C23C16/448		577
C23C16/4487	10	{by using a condenser}	C23C16/448	C23C16/448		24
C23C16/4488	10	{by in situ generation of reactive gas by chemical or electrochemical reaction}	C23C16/448	C23C16/448		480
C23C16/452	10	by activating reactive gas streams before {their} introduction into the reaction chamber, e.g. by {ionisation} or addition of reactive species	C23C16/452	C23C16/452		1203
C23C16/453	9	passing the reaction gases through burners or torches, e.g. atmospheric pressure CVD (C23C16/513 takes precedence; for flame or plasma spraying of coating material in the molten state C23C4/00)	C23C16/453	C23C16/453		396
C23C16/455	9	characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber	C23C16/455	C23C16/455		4210
C23C16/45502	10	{Flow conditions in reaction chamber}	C23C16/455	C23C16/455		629
C23C16/45504	11	{Laminar flow}	C23C16/455	C23C16/455		397
C23C16/45506	11	{Turbulent flow}	C23C16/455	C23C16/455		83
C23C16/45508	11	{Radial flow}	C23C16/455	C23C16/455		305
C23C16/4551	11	{Jet streams}	C23C16/455	C23C16/455		78
C23C16/45512	10	{Premixing before introduction in the reaction chamber}	C23C16/455	C23C16/455		576
C23C16/45514	10	{Mixing in close vicinity to the substrate}	C23C16/455	C23C16/455		241
C23C16/45517	10	{Confinement of gases to vicinity of substrate}	C23C16/455	C23C16/455		235
C23C16/45519	10	{Inert gas curtains}	C23C16/455	C23C16/455		628
C23C16/45521	11	{the gas, other than thermal contact gas, being introduced the rear of the substrate to flow around its periphery}	C23C16/455	C23C16/455		236
C23C16/45523	10	{Pulsed gas flow or change of composition over time}	C23C16/455	C23C16/455		1190
C23C16/45525	11	{Atomic layer deposition [ALD]}	C23C16/455	C23C16/455		3306
C23C16/45527	12	{characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations}	C23C16/455	C23C16/455		1517
C23C16/45529	13	{specially adapted for making a layer stack of alternating different compositions or gradient compositions}	C23C16/455	C23C16/455		630
C23C16/45531	13	{specially adapted for making ternary or higher compositions}	C23C16/455	C23C16/455		748
C23C16/45534	13	{Use of auxiliary reactants other than used for contributing to the composition of the main film, e.g. catalysts, activators or scavengers}	C23C16/455	C23C16/455		828
C23C16/45536	13	{Use of plasma, radiation or electromagnetic fields}	C23C16/455	C23C16/455		1725
C23C16/45538	14	{Plasma being used continuously during the ALD cycle}	C23C16/455	C23C16/455		164
C23C16/4554	14	{Plasma being used non-continuously in between ALD reactions (C23C16/56 takes precedence)}	C23C16/455	C23C16/455		408
C23C16/45542	14	{Plasma being used non-continuously during the ALD reactions}	C23C16/455	C23C16/455		822
C23C16/45544	12	{characterized by the apparatus}	C23C16/455	C23C16/455		3035
C23C16/45546	13	{specially adapted for a substrate stack in the ALD reactor}	C23C16/455	C23C16/455		627
C23C16/45548	13	{having arrangements for gas injection at different locations of the reactor for each ALD half-reaction}	C23C16/455	C23C16/455		310
C23C16/45551	14	{for relative movement of the substrate and the gas injectors or half-reaction reactor compartments}	C23C16/455	C23C16/455		955
C23C16/45553	12	{characterized by the use of precursors specially adapted for ALD}	C23C16/455	C23C16/455		2800
C23C16/45555	12	{applied in non-semiconductor technology}	C23C16/455	C23C16/455		754
C23C16/45557	10	{Pulsed pressure or control pressure}	C23C16/455	C23C16/455		770
C23C16/45559	10	{Diffusion of reactive gas to substrate}	C23C16/455	C23C16/455		298
C23C16/45561	10	{Gas plumbing upstream of the reaction chamber}	C23C16/455	C23C16/455		1986
C23C16/45563	10	{Gas nozzles}	C23C16/455	C23C16/455		1629
C23C16/45565	11	{Shower nozzles}	C23C16/455	C23C16/455		3714
C23C16/45568	11	{Porous nozzles}	C23C16/455	C23C16/455		269
C23C16/4557	11	{Heated nozzles}	C23C16/455	C23C16/455		607
C23C16/45572	11	{Cooled nozzles}	C23C16/455	C23C16/455		435
C23C16/45574	11	{Nozzles for more than one gas}	C23C16/455	C23C16/455		1507
C23C16/45576	11	{Coaxial inlets for each gas}	C23C16/455	C23C16/455		214
C23C16/45578	11	{Elongated nozzles, tubes with holes}	C23C16/455	C23C16/455		1167
C23C16/4558	11	{Perforated rings}	C23C16/455	C23C16/455		308
C23C16/45582	10	{Expansion of gas before it reaches the substrate}	C23C16/455	C23C16/455		133
C23C16/45585	10	{Compression of gas before it reaches the substrate}	C23C16/455	C23C16/455		65
C23C16/45587	10	{Mechanical means for changing the gas flow}	C23C16/455	C23C16/455		253
C23C16/45589	11	{Movable means, e.g. fans}	C23C16/455	C23C16/455		346
C23C16/45591	11	{Fixed means, e.g. wings, baffles}	C23C16/455	C23C16/455		930
C23C16/45593	10	{Recirculation of reactive gases}	C23C16/455	C23C16/455		148
C23C16/45595	10	{Atmospheric CVD gas inlets with no enclosed reaction chamber}	C23C16/455	C23C16/455		189
C23C16/45597	10	{Reactive back side gas}	C23C16/455	C23C16/455		70
C23C16/458	9	characterised by the method used for supporting substrates in the reaction chamber	C23C16/458	C23C16/458		1681
C23C16/4581	10	{characterised by material of construction or surface finish of the means for supporting the substrate}	C23C16/458	C23C16/458		1484
C23C16/4582	10	{Rigid and flat substrates, e.g. plates or discs (C23C16/4581 takes precedence)}	C23C16/458	C23C16/458		244
C23C16/4583	11	{the substrate being supported substantially horizontally}	C23C16/458	C23C16/458		1797
C23C16/4584	12	{the substrate being rotated}	C23C16/458	C23C16/458		2091
C23C16/4585	12	{Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds}	C23C16/458	C23C16/458		1320
C23C16/4586	12	{Elements in the interior of the support, e.g. electrodes, heating or cooling devices}	C23C16/458	C23C16/458		2206
C23C16/4587	11	{the substrate being supported substantially vertically}	C23C16/458	C23C16/458		349
C23C16/4588	12	{the substrate being rotated}	C23C16/458	C23C16/458		230
C23C16/46	9	characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence)	C23C16/46	C23C16/46		3785
C23C16/463	10	{Cooling of the substrate}	C23C16/46	C23C16/46		638
C23C16/466	11	{using thermal contact gas}	C23C16/46	C23C16/46		197
C23C16/48	9	by irradiation, e.g. photolysis, radiolysis, particle radiation	C23C16/48	C23C16/48		245
C23C16/481	10	{by radiant heating of the substrate}	C23C16/48	C23C16/48		696
C23C16/482	10	{using incoherent light, UV to IR, e.g. lamps}	C23C16/48	C23C16/48		665
C23C16/483	10	{using coherent light, UV to IR, e.g. lasers}	C23C16/48	C23C16/48		549
C23C16/484	10	{using X-ray radiation}	C23C16/48	C23C16/48		9
C23C16/485	10	{using synchrotron radiation}	C23C16/48	C23C16/48		4
C23C16/486	10	{using ion beam radiation}	C23C16/48	C23C16/48		123
C23C16/487	10	{using electron radiation}	C23C16/48	C23C16/48		137
C23C16/488	10	{Protection of windows for introduction of radiation into the coating chamber}	C23C16/48	C23C16/48		154
C23C16/50	9	using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)}	C23C16/50	C23C16/50		4355
C23C16/503	10	using DC or AC discharges	C23C16/503	C23C16/503		479
C23C16/505	10	using radio frequency discharges	C23C16/505	C23C16/505		2534
C23C16/507	11	using external electrodes, e.g. in tunnel type reactors	C23C16/507	C23C16/507		535
C23C16/509	11	using internal electrodes	C23C16/509	C23C16/509		1330
C23C16/5093	12	{Coaxial electrodes}	C23C16/509	C23C16/509		125
C23C16/5096	12	{Flat-bed apparatus}	C23C16/509	C23C16/509		1189
C23C16/511	10	using microwave discharges	C23C16/511	C23C16/511		1610
C23C16/513	10	using plasma jets	C23C16/513	C23C16/513		1388
C23C16/515	10	using pulsed discharges	C23C16/515	C23C16/515		576
C23C16/517	10	using a combination of discharges covered by two or more of groups C23C16/503&#160;-&#160;C23C16/515	C23C16/517	C23C16/517		451
C23C16/52	9	Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)}	C23C16/52	C23C16/52		7943
C23C16/54	9	Apparatus specially adapted for continuous coating	C23C16/54	C23C16/54		2920
C23C16/545	10	{for coating elongated substrates}	C23C16/54	C23C16/54		1633
C23C16/56	8	After-treatment	C23C16/56	C23C16/56		4976
C23C18/00	7	Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating<br><br><u>NOTE</u><br><br>This groups covers also suspensions containing reactive liquids and non-reactive solid particles.	C23C18/00	C23C18/00		334
C23C18/02	8	by thermal decomposition	C23C18/02	C23C18/02		292
C23C18/04	9	Pretreatment of the material to be coated (C23C18/06 takes precedence)	C23C18/04	C23C18/04		371
C23C18/06	9	Coating on selected surface areas, e.g. using masks	C23C18/06	C23C18/06		339
C23C18/08	9	characterised by the deposition of metallic material	C23C18/08	C23C18/08		814
C23C18/10	10	Deposition of aluminium only	C23C18/10	C23C18/10		38
C23C18/12	9	characterised by the deposition of inorganic material other than metallic material	C23C18/12	C23C18/12		226
C23C18/1204	10	{inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds}	C23C18/12	C23C18/12		757
C23C18/1208	11	{Oxides, e.g. ceramics}	C23C18/12	C23C18/12		475
C23C18/1212	12	{Zeolites, glasses}	C23C18/12	C23C18/12		414
C23C18/1216	12	{Metal oxides (C23C18/1212 takes precedence)}	C23C18/12	C23C18/12		2372
C23C18/122	11	{Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes}	C23C18/12	C23C18/12		490
C23C18/1225	10	{Deposition of multilayers of inorganic material}	C23C18/12	C23C18/12		551
C23C18/1229	10	{Composition of the substrate}	C23C18/12	C23C18/12		61
C23C18/1233	11	{Organic substrates}	C23C18/12	C23C18/12		144
C23C18/1237	12	{Composite substrates, e.g. laminated, premixed}	C23C18/12	C23C18/12		16
C23C18/1241	11	{Metallic substrates}	C23C18/12	C23C18/12		770
C23C18/1245	11	{Inorganic substrates other than metallic}	C23C18/12	C23C18/12		553
C23C18/125	10	{Process of deposition of the inorganic material}	C23C18/12	C23C18/12		164
C23C18/1254	11	{Sol or sol-gel processing}	C23C18/12	C23C18/12		1209
C23C18/1258	11	{Spray pyrolysis}	C23C18/12	C23C18/12		143
C23C18/1262	11	{involving particles, e.g. carbon nanotubes [CNT], flakes}	C23C18/12	C23C18/12		65
C23C18/1266	12	{Particles formed in situ}	C23C18/12	C23C18/12		42
C23C18/127	12	{Preformed particles}	C23C18/12	C23C18/12		392
C23C18/1275	11	{performed under inert atmosphere}	C23C18/12	C23C18/12		199
C23C18/1279	11	{performed under reactive atmosphere, e.g. oxidising or reducing atmospheres}	C23C18/12	C23C18/12		363
C23C18/1283	11	{Control of temperature, e.g. gradual temperature increase, modulation of temperature}	C23C18/12	C23C18/12		371
C23C18/1287	11	{with flow inducing means, e.g. ultrasonic}	C23C18/12	C23C18/12		68
C23C18/1291	11	{by heating of the substrate}	C23C18/12	C23C18/12		283
C23C18/1295	11	{with after-treatment of the deposited inorganic material}	C23C18/12	C23C18/12		662
C23C18/14	8	Decomposition by irradiation, e.g. photolysis, particle radiation {or by mixed irradiation sources}	C23C18/14	C23C18/14		121
C23C18/143	9	{Radiation by light, e.g. photolysis or pyrolysis}	C23C18/14	C23C18/14		566
C23C18/145	9	{Radiation by charged particles, e.g. electron beams or ion irradiation}	C23C18/14	C23C18/14		121
C23C18/16	8	by reduction or substitution, e.g. electroless plating (C23C18/54 takes precedence)	C23C18/16	C23C18/16		471
C23C18/1601	9	{Process or apparatus}	C23C18/16	C23C18/16		129
C23C18/1603	10	{coating on selected surface areas}	C23C18/16	C23C18/16		240
C23C18/1605	11	{by masking}	C23C18/16	C23C18/16		722
C23C18/1607	11	{by direct patterning}	C23C18/16	C23C18/16		125
C23C18/1608	12	{from pretreatment step, i.e. selective pre-treatment}	C23C18/16	C23C18/16		952
C23C18/161	12	{from plating step, e.g. inkjet}	C23C18/16	C23C18/16		126
C23C18/1612	12	{through irradiation means}	C23C18/16	C23C18/16		505
C23C18/1614	11	{plating on one side}	C23C18/16	C23C18/16		31
C23C18/1616	12	{interior or inner surface}	C23C18/16	C23C18/16		103
C23C18/1617	10	{Purification and regeneration of coating baths}	C23C18/16	C23C18/16		459
C23C18/1619	10	{Apparatus for electroless plating}	C23C18/16	C23C18/16		488
C23C18/1621	11	{Protection of inner surfaces of the apparatus}	C23C18/16	C23C18/16		21
C23C18/1623	12	{through electrochemical processes}	C23C18/16	C23C18/16		16
C23C18/1625	12	{through chemical processes}	C23C18/16	C23C18/16		22
C23C18/1626	12	{through mechanical processes}	C23C18/16	C23C18/16		3
C23C18/1628	11	{Specific elements or parts of the apparatus}	C23C18/16	C23C18/16		330
C23C18/163	12	{Supporting devices for articles to be coated}	C23C18/16	C23C18/16		336
C23C18/1632	11	{Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells}	C23C18/16	C23C18/16		364
C23C18/1633	10	{Process of electroless plating}	C23C18/16	C23C18/16		169
C23C18/1635	11	{Composition of the substrate}	C23C18/16	C23C18/16		270
C23C18/1637	12	{metallic substrate}	C23C18/16	C23C18/16		435
C23C18/1639	12	{Substrates other than metallic, e.g. inorganic or organic or non-conductive}	C23C18/16	C23C18/16		324
C23C18/1641	13	{Organic substrates, e.g. resin, plastic}	C23C18/16	C23C18/16		840
C23C18/1642	13	{semiconductor (semiconductor H10P14/48)}	C23C18/16	C23C18/16		144
C23C18/1644	12	{porous substrates}	C23C18/16	C23C18/16		192
C23C18/1646	11	{Characteristics of the product obtained}	C23C18/16	C23C18/16		157
C23C18/1648	12	{Porous product}	C23C18/16	C23C18/16		113
C23C18/165	12	{Multilayered product (layered product B32B)}	C23C18/16	C23C18/16		457
C23C18/1651	13	{Two or more layers only obtained by electroless plating}	C23C18/16	C23C18/16		959
C23C18/1653	13	{Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating}	C23C18/16	C23C18/16		1615
C23C18/1655	11	{Process features}	C23C18/16	C23C18/16		95
C23C18/1657	12	{Electroless forming, i.e. substrate removed or destroyed at the end of the process}	C23C18/16	C23C18/16		184
C23C18/1658	12	{with two steps starting with metal deposition followed by addition of reducing agent}	C23C18/16	C23C18/16		253
C23C18/166	12	{with two steps starting with addition of reducing agent followed by metal deposition}	C23C18/16	C23C18/16		158
C23C18/1662	12	{Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires}	C23C18/16	C23C18/16		469
C23C18/1664	12	{with additional means during the plating process}	C23C18/16	C23C18/16		67
C23C18/1666	13	{Ultrasonics}	C23C18/16	C23C18/16		119
C23C18/1667	13	{Radiant energy, e.g. laser}	C23C18/16	C23C18/16		119
C23C18/1669	13	{Agitation, e.g. air introduction}	C23C18/16	C23C18/16		267
C23C18/1671	13	{Electric field}	C23C18/16	C23C18/16		72
C23C18/1673	13	{Magnetic field}	C23C18/16	C23C18/16		21
C23C18/1675	11	{Process conditions}	C23C18/16	C23C18/16		196
C23C18/1676	12	{Heating of the solution}	C23C18/16	C23C18/16		205
C23C18/1678	12	{Heating of the substrate}	C23C18/16	C23C18/16		111
C23C18/168	12	{Control of temperature, e.g. temperature of bath, substrate}	C23C18/16	C23C18/16		214
C23C18/1682	12	{Control of atmosphere}	C23C18/16	C23C18/16		97
C23C18/1683	12	{Control of electrolyte composition, e.g. measurement, adjustment (regeneration of bath C23C18/1617)}	C23C18/16	C23C18/16		275
C23C18/1685	12	{with supercritical condition, e.g. chemical fluid deposition}	C23C18/16	C23C18/16		26
C23C18/1687	12	{with ionic liquid}	C23C18/16	C23C18/16		19
C23C18/1689	11	{After-treatment}	C23C18/16	C23C18/16		573
C23C18/1691	12	{Cooling, e g. forced or controlled cooling}	C23C18/16	C23C18/16		11
C23C18/1692	12	{Heat-treatment}	C23C18/16	C23C18/16		490
C23C18/1694	13	{Sequential heat treatment}	C23C18/16	C23C18/16		27
C23C18/1696	13	{Control of atmosphere}	C23C18/16	C23C18/16		92
C23C18/1698	13	{Control of temperature}	C23C18/16	C23C18/16		30
C23C18/18	9	Pretreatment of the material to be coated	C23C18/18	C23C18/18		262
C23C18/1803	10	{of metallic material surfaces or of a non-specific material surfaces}	C23C18/18	C23C18/18		125
C23C18/1806	11	{by mechanical pretreatment, e.g. grinding, sanding}	C23C18/18	C23C18/18		203
C23C18/181	12	{by formation of electrostatic charges, e.g. tribofriction}	C23C18/18	C23C18/18		1
C23C18/1813	11	{by radiant energy}	C23C18/18	C23C18/18		5
C23C18/1817	12	{Heat}	C23C18/18	C23C18/18		47
C23C18/182	12	{Radiation, e.g. UV, laser}	C23C18/18	C23C18/18		65
C23C18/1824	11	{by chemical pretreatment}	C23C18/18	C23C18/18		70
C23C18/1827	12	{only one step pretreatment}	C23C18/18	C23C18/18		44
C23C18/1831	13	{Use of metal, e.g. activation, sensitisation with noble metals}	C23C18/18	C23C18/18		255
C23C18/1834	13	{Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers}	C23C18/18	C23C18/18		278
C23C18/1837	12	{Multistep pretreatment}	C23C18/18	C23C18/18		130
C23C18/1841	13	{with use of metal first}	C23C18/18	C23C18/18		143
C23C18/1844	13	{with use of organic or inorganic compounds other than metals, first}	C23C18/18	C23C18/18		706
C23C18/1848	11	{by electrochemical pretreatment}	C23C18/18	C23C18/18		87
C23C18/1851	10	{of surfaces of non-metallic or semiconducting in organic material}	C23C18/18	C23C18/18		148
C23C18/1855	11	{by mechanical pretreatment, e.g. grinding, sanding}<br><br><u>WARNING</u><br> the groups C23C18/1855&#160;-&#160;C23C18/1896 are not complete, pending reorganisation. See also C23C18/18	C23C18/18	C23C18/18		88
C23C18/1858	12	{by formation of electrostatic charges, e.g. tribofriction}	C23C18/18	C23C18/18		7
C23C18/1862	11	{by radiant energy}	C23C18/18	C23C18/18		5
C23C18/1865	12	{Heat}	C23C18/18	C23C18/18		156
C23C18/1868	12	{Radiation, e.g. UV, laser}	C23C18/18	C23C18/18		136
C23C18/1872	11	{by chemical pretreatment}	C23C18/18	C23C18/18		32
C23C18/1875	12	{only one step pretreatment}	C23C18/18	C23C18/18		23
C23C18/1879	13	{Use of metal, e.g. activation, sensitisation with noble metals}	C23C18/18	C23C18/18		365
C23C18/1882	13	{Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers}	C23C18/18	C23C18/18		225
C23C18/1886	12	{Multistep pretreatment}	C23C18/18	C23C18/18		64
C23C18/1889	13	{with use of metal first}	C23C18/18	C23C18/18		272
C23C18/1893	13	{with use of organic or inorganic compounds other than metals, first}	C23C18/18	C23C18/18		770
C23C18/1896	11	{by electrochemical pretreatment}	C23C18/18	C23C18/18		22
C23C18/20	10	of organic surfaces, e.g. resins	C23C18/20	C23C18/20		277
C23C18/2006	11	{by other methods than those of C23C18/22&#160;-&#160;C23C18/30}	C23C18/20	C23C18/20		274
C23C18/2013	12	{by mechanical pretreatment, e.g. grinding, sanding}<br><br><u>WARNING</u><br> the groups C23C18/2013&#160;-&#160;C23C18/2093 are not complete, pending reorganisation. See also C23C18/2006	C23C18/20	C23C18/20		141
C23C18/202	13	{by formation of electrostatic charges, e.g. tribofriction}	C23C18/20	C23C18/20		8
C23C18/2026	12	{by radiant energy}	C23C18/20	C23C18/20		13
C23C18/2033	13	{Heat}	C23C18/20	C23C18/20		201
C23C18/204	13	{Radiation, e.g. UV, laser}	C23C18/20	C23C18/20		391
C23C18/2046	12	{by chemical pretreatment}	C23C18/20	C23C18/20		31
C23C18/2053	13	{only one step pretreatment}	C23C18/20	C23C18/20		33
C23C18/206	14	{Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals (sensitising with tin C23C18/285, sensitising with noble metals C23C18/30)}	C23C18/20	C23C18/20		252
C23C18/2066	14	{Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers}	C23C18/20	C23C18/20		284
C23C18/2073	13	{Multistep pretreatment}	C23C18/20	C23C18/20		91
C23C18/208	14	{with use of metal first}	C23C18/20	C23C18/20		441
C23C18/2086	14	{with use of organic or inorganic compounds other than metals, first}	C23C18/20	C23C18/20		1001
C23C18/2093	12	{by electrochemical pretreatment}	C23C18/20	C23C18/20		20
C23C18/22	11	Roughening, e.g. by etching	C23C18/22	C23C18/22		562
C23C18/24	12	using acid aqueous solutions	C23C18/24	C23C18/24		686
C23C18/26	12	using organic liquids	C23C18/26	C23C18/26		147
C23C18/28	11	Sensitising or activating	C23C18/28	C23C18/28		534
C23C18/285	12	{Sensitising or activating with tin based compound or composition}	C23C18/28	C23C18/28		668
C23C18/30	12	Activating {or accelerating or sensitising with palladium or other noble metal}	C23C18/30	C23C18/30		1831
C23C18/31	9	Coating with metals	C23C18/31	C23C18/31		1453
C23C18/32	10	Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence)	C23C18/32	C23C18/32		1739
C23C18/34	11	using reducing agents	C23C18/34	C23C18/34		940
C23C18/36	12	using hypophosphites	C23C18/36	C23C18/36		2033
C23C18/38	10	Coating with copper	C23C18/38	C23C18/38		1301
C23C18/40	11	using reducing agents	C23C18/40	C23C18/40		1037
C23C18/405	12	{Formaldehyde}	C23C18/40	C23C18/40		856
C23C18/42	10	Coating with noble metals	C23C18/42	C23C18/42		1077
C23C18/44	11	using reducing agents	C23C18/44	C23C18/44		1518
C23C18/48	9	Coating with alloys	C23C18/48	C23C18/48		520
C23C18/50	10	with alloys based on iron, cobalt or nickel	C23C18/50	C23C18/50		794
C23C18/52	9	using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32&#160;-&#160;C23C18/50	C23C18/52	C23C18/52		607
C23C18/54	8	Contact plating, i.e. electroless electrochemical plating	C23C18/54	C23C18/54		961
C23C20/00	7	Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating<br><br><u>NOTE</u><br><br>This group covers also suspensions containing non-reactive liquids and reactive solid particles.	C23C20/00	C23C20/00		43
C23C20/02	8	Coating with metallic material	C23C20/02	C23C20/02		12
C23C20/04	9	with metals	C23C20/04	C23C20/04		39
C23C20/06	8	Coating with inorganic material, other than metallic material	C23C20/06	C23C20/06		27
C23C20/08	9	with compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides	C23C20/08	C23C20/08		80
C23C22/00	7	Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals<br><br><u>NOTE</u><br><br>This group covers also suspensions containing reactive liquids and non-reactive solid particles.<br> In groups C23C22/02&#160;-&#160;C23C22/86, in the absence of an indication to the contrary, classification is made in the last appropriate place. <br>Rejuvenating of the bath is classified in the appropriate place for the specific bath composition.	C23C22/00	C23C22/00		1469
C23C22/02	8	using non-aqueous solutions	C23C22/02	C23C22/02		537
C23C22/03	9	containing phosphorus compounds	C23C22/03	C23C22/03		264
C23C22/04	9	containing hexavalent chromium compounds	C23C22/04	C23C22/04		46
C23C22/05	8	using aqueous solutions	C23C22/05	C23C22/05		773
C23C22/06	9	using aqueous acidic solutions with pH less than 6	C23C22/06	C23C22/06		384
C23C22/07	10	containing phosphates	C23C22/07	C23C22/07		826
C23C22/08	11	Orthophosphates	C23C22/08	C23C22/08		992
C23C22/10	12	containing oxidants	C23C22/10	C23C22/10		254
C23C22/12	12	containing zinc cations	C23C22/12	C23C22/12		420
C23C22/13	13	containing also nitrate or nitrite anions	C23C22/13	C23C22/13		316
C23C22/14	13	containing also chlorate anions	C23C22/14	C23C22/14		84
C23C22/16	13	containing also peroxy-compounds	C23C22/16	C23C22/16		65
C23C22/17	13	containing also organic acids	C23C22/17	C23C22/17		194
C23C22/18	12	containing manganese cations	C23C22/18	C23C22/18		266
C23C22/182	13	{containing also zinc cations}	C23C22/18	C23C22/18		143
C23C22/184	14	{containing also nickel cations}	C23C22/18	C23C22/18		112
C23C22/186	13	{containing also copper cations}	C23C22/18	C23C22/18		28
C23C22/188	13	{containing also magnesium cations}	C23C22/18	C23C22/18		44
C23C22/20	12	containing aluminium cations	C23C22/20	C23C22/20		220
C23C22/22	12	containing alkaline earth metal cations	C23C22/22	C23C22/22		392
C23C22/23	11	Condensed phosphates	C23C22/23	C23C22/23		213
C23C22/24	10	containing hexavalent chromium compounds	C23C22/24	C23C22/24		697
C23C22/26	11	containing also organic compounds	C23C22/26	C23C22/26		37
C23C22/27	12	Acids	C23C22/27	C23C22/27		92
C23C22/28	12	Macromolecular compounds	C23C22/28	C23C22/28		94
C23C22/30	11	containing also trivalent chromium	C23C22/30	C23C22/30		229
C23C22/32	11	containing also pulverulent metals	C23C22/32	C23C22/32		13
C23C22/33	11	containing also phosphates	C23C22/33	C23C22/33		405
C23C22/34	10	containing fluorides or complex fluorides	C23C22/34	C23C22/34		1586
C23C22/36	11	containing also phosphates	C23C22/36	C23C22/36		311
C23C22/361	12	{containing titanium, zirconium or hafnium compounds}	C23C22/36	C23C22/36		280
C23C22/362	12	{containing also zinc cations}	C23C22/36	C23C22/36		278
C23C22/364	12	{containing also manganese cations}	C23C22/36	C23C22/36		130
C23C22/365	13	{containing also zinc and nickel cations}	C23C22/36	C23C22/36		116
C23C22/367	12	{containing alkaline earth metal cations}	C23C22/36	C23C22/36		41
C23C22/368	12	{containing magnesium cations}	C23C22/36	C23C22/36		86
C23C22/37	11	containing also hexavalent chromium compounds	C23C22/37	C23C22/37		283
C23C22/38	12	containing also phosphates	C23C22/38	C23C22/38		145
C23C22/40	10	containing molybdates, tungstates or vanadates	C23C22/40	C23C22/40		484
C23C22/42	11	containing also phosphates	C23C22/42	C23C22/42		489
C23C22/43	11	containing also hexavalent chromium compounds	C23C22/43	C23C22/43		49
C23C22/44	11	containing also fluorides or complex fluorides	C23C22/44	C23C22/44		553
C23C22/46	10	containing oxalates	C23C22/46	C23C22/46		376
C23C22/47	11	containing also phosphates	C23C22/47	C23C22/47		194
C23C22/48	10	not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates	C23C22/48	C23C22/48		493
C23C22/50	11	Treatment of iron or alloys based thereon	C23C22/50	C23C22/50		747
C23C22/52	11	Treatment of copper or alloys based thereon	C23C22/52	C23C22/52		402
C23C22/53	11	Treatment of zinc or alloys based thereon	C23C22/53	C23C22/53		501
C23C22/54	11	Treatment of refractory metals or alloys based thereon	C23C22/54	C23C22/54		61
C23C22/56	11	Treatment of aluminium or alloys based thereon	C23C22/56	C23C22/56		483
C23C22/57	11	Treatment of magnesium or alloys based thereon	C23C22/57	C23C22/57		146
C23C22/58	11	Treatment of other metallic material	C23C22/58	C23C22/58		140
C23C22/60	9	using alkaline aqueous solutions with pH greater than 8	C23C22/60	C23C22/60		668
C23C22/62	10	Treatment of iron or alloys based thereon	C23C22/62	C23C22/62		555
C23C22/63	10	Treatment of copper or alloys based thereon	C23C22/63	C23C22/63		350
C23C22/64	10	Treatment of refractory metals or alloys based thereon	C23C22/64	C23C22/64		116
C23C22/66	10	Treatment of aluminium or alloys based thereon	C23C22/66	C23C22/66		447
C23C22/67	11	with solutions containing hexavalent chromium	C23C22/67	C23C22/67		64
C23C22/68	9	using aqueous solutions with pH between 6 and 8	C23C22/68	C23C22/68		1275
C23C22/70	8	using melts	C23C22/70	C23C22/70		81
C23C22/72	9	Treatment of iron or alloys based thereon	C23C22/72	C23C22/72		73
C23C22/73	8	characterised by the process	C23C22/73	C23C22/73		2217
C23C22/74	9	for obtaining burned-in conversion coatings	C23C22/74	C23C22/74		1050
C23C22/76	9	Applying the liquid by spraying	C23C22/76	C23C22/76		510
C23C22/77	9	Controlling or regulating of the coating process	C23C22/77	C23C22/77		436
C23C22/78	8	Pretreatment of the material to be coated	C23C22/78	C23C22/78		2411
C23C22/80	9	with solutions containing titanium or zirconium compounds	C23C22/80	C23C22/80		238
C23C22/82	8	After-treatment	C23C22/82	C23C22/82		818
C23C22/83	9	Chemical after-treatment	C23C22/83	C23C22/83		1845
C23C22/84	9	Dyeing	C23C22/84	C23C22/84		153
C23C22/86	8	Regeneration of coating baths	C23C22/86	C23C22/86		336
C23C24/00	7	Coating starting from inorganic powder (spraying of the coating material in molten state C23C4/00; solid state diffusion C23C8/00 - C23C12/00)	C23C24/00	C23C24/00		1088
C23C24/02	8	by application of pressure only	C23C24/02	C23C24/02		255
C23C24/04	9	Impact or kinetic deposition of particles	C23C24/04	C23C24/04		3211
C23C24/045	10	{by trembling using impacting inert media}	C23C24/04	C23C24/04		212
C23C24/06	9	Compressing powdered coating material, e.g. by milling	C23C24/06	C23C24/06		199
C23C24/08	8	by application of heat or pressure and heat (C23C24/04 takes precedence)	C23C24/08	C23C24/08		1388
C23C24/082	9	{without intermediate formation of a liquid in the layer}	C23C24/08	C23C24/08		458
C23C24/085	10	{Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides}	C23C24/08	C23C24/08		355
C23C24/087	11	{Coating with metal alloys or metal elements only}	C23C24/08	C23C24/08		430
C23C24/10	9	with intermediate formation of a liquid phase in the layer	C23C24/10	C23C24/10		2125
C23C24/103	10	{Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides}	C23C24/10	C23C24/10		3977
C23C24/106	11	{Coating with metal alloys or metal elements only}	C23C24/10	C23C24/10		1740
C23C26/00	7	Coating not provided for in groups C23C2/00&#160;-&#160;C23C24/00	C23C26/00	C23C26/00		5017
C23C26/02	8	applying molten material to the substrate	C23C26/02	C23C26/02		1591
C23C28/00	7	Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00&#160;-&#160;C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D	C23C28/00	C23C28/00		4641
C23C28/02	8	only coatings {only including layers} of metallic material	C23C28/02	C23C28/02		852
C23C28/021	9	{including at least one metal alloy layer}	C23C28/02	C23C28/02		1780
C23C28/022	10	{with at least one MCrAlX layer}	C23C28/02	C23C28/02		162
C23C28/023	9	{only coatings of metal elements only}	C23C28/02	C23C28/02		2417
C23C28/025	10	{with at least one zinc-based layer}	C23C28/02	C23C28/02		575
C23C28/026	9	{including at least one amorphous metallic material layer}	C23C28/02	C23C28/02		40
C23C28/027	9	{including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC.}	C23C28/02	C23C28/02		348
C23C28/028	9	{Including graded layers in composition or in physical properties, e.g. density, porosity, grain size}	C23C28/02	C23C28/02		380
C23C28/04	8	only coatings of inorganic non-metallic material	C23C28/04	C23C28/04		1924
C23C28/042	9	{including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides}	C23C28/04	C23C28/04		1685
C23C28/044	9	{coatings specially adapted for cutting tools or wear applications}	C23C28/04	C23C28/04		1611
C23C28/046	9	{with at least one amorphous inorganic material layer, e.g. DLC, a-C:H, a-C:Me, the layer being doped or not}	C23C28/04	C23C28/04		431
C23C28/048	9	{with layers graded in composition or physical properties}	C23C28/04	C23C28/04		611
C23C28/30	8	{Coatings combining at least one metallic layer and at least one inorganic non-metallic layer}	C23C28/00	C23C28/30		589
C23C28/32	9	{including at least one pure metallic layer}	C23C28/00	C23C28/32		784
C23C28/321	10	{with at least one metal alloy layer}	C23C28/00	C23C28/321		2041
C23C28/3215	11	{at least one MCrAlX layer}	C23C28/00	C23C28/3215		1006
C23C28/322	10	{only coatings of metal elements only}	C23C28/00	C23C28/322		2284
C23C28/3225	11	{with at least one zinc-based layer}	C23C28/00	C23C28/3225		755
C23C28/323	10	{with at least one amorphous metallic material layer}	C23C28/00	C23C28/323		47
C23C28/324	10	{with at least one metal matrix material layer comprising a mixture of at least two metals or metal phases or a metal-matrix material with hard embedded particles, e.g. WC-Me}	C23C28/00	C23C28/324		325
C23C28/325	10	{with layers graded in composition or in physical properties}	C23C28/00	C23C28/325		339
C23C28/34	9	{including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates}	C23C28/00	C23C28/34		1881
C23C28/341	10	{with at least one carbide layer}	C23C28/00	C23C28/341		476
C23C28/343	10	{with at least one DLC or an amorphous carbon based layer, the layer being doped or not}	C23C28/00	C23C28/343		451
C23C28/345	10	{with at least one oxide layer}	C23C28/00	C23C28/345		2822
C23C28/3455	11	{with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer}	C23C28/00	C23C28/3455		1887
C23C28/347	10	{with layers adapted for cutting tools or wear applications}	C23C28/00	C23C28/347		547
C23C28/36	9	{including layers graded in composition or physical properties}	C23C28/00	C23C28/36		502
C23C28/40	8	{Coatings including alternating layers following a pattern, a periodic or defined repetition}	C23C28/00	C23C28/40		256
C23C28/42	9	{characterized by the composition of the alternating layers}	C23C28/00	C23C28/42		973
C23C28/44	9	{characterized by a measurable physical property of the alternating layer or system, e.g. thickness, density, hardness}	C23C28/00	C23C28/44		263
C23C30/00	7	Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C26/00, C23C28/00 take precedence)	C23C30/00	C23C30/00		4285
C23C30/005	8	{on hard metal substrates}	C23C30/00	C23C30/00		2592
C23C2222/00	7	Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium	CPCONLY	C23C2222/00		16
C23C2222/10	8	Use of solutions containing trivalent chromium but free of hexavalent chromium	CPCONLY	C23C2222/10		752
C23C2222/20	8	Use of solutions containing silanes	CPCONLY	C23C2222/20		1968
