H10W10/00	7	Isolation regions in semiconductor bodies between components of integrated devices	H10W10/00	H10W10/00		3241
H10W10/01	8	{Manufacture or treatment}	H10W10/00	H10W10/01		3253
H10W10/011	9	{of isolation regions comprising dielectric materials}	H10W10/00	H10W10/011		1923
H10W10/012	10	{using local oxidation of silicon [LOCOS]}	H10W10/00	H10W10/012		1727
H10W10/0121	11	{in regions recessed from the surface, e.g. in trenches or grooves}	H10W10/00	H10W10/0121		1029
H10W10/0123	12	{using auxiliary pillars in the regions}	H10W10/00	H10W10/0123		99
H10W10/0124	12	{the regions having non-rectangular shapes, e.g. rounded (H10W10/0123 takes precedence)}	H10W10/00	H10W10/0124		261
H10W10/0125	11	{comprising introducing electrical impurities in local oxidation regions, e.g. to alter LOCOS oxide growth characteristics}	H10W10/00	H10W10/0125		350
H10W10/0126	12	{introducing electrical active impurities in local oxidation regions to create channel stoppers}	H10W10/00	H10W10/0126		551
H10W10/0127	13	{using both n-type and p-type impurities, e.g. for isolation of complementary doped regions}	H10W10/00	H10W10/0127		124
H10W10/0128	11	{comprising multiple local oxidation process steps}	H10W10/00	H10W10/0128		165
H10W10/014	10	{using trench refilling with dielectric materials, e.g. shallow trench isolations}	H10W10/00	H10W10/014		10914
H10W10/0142	11	{the dielectric materials being chemical transformed from non-dielectric materials}	H10W10/00	H10W10/0142		325
H10W10/0143	11	{comprising concurrently refilling multiple trenches having different shapes or dimensions}	H10W10/00	H10W10/0143		2327
H10W10/0145	11	{of trenches having shapes other than rectangular or V-shape (H10W10/0143 takes precedence)}	H10W10/00	H10W10/0145		2422
H10W10/0147	12	{the shapes being altered by a local oxidation of silicon process, e.g. trench corner rounding by LOCOS}	H10W10/00	H10W10/0147		510
H10W10/0148	11	{comprising introducing impurities in side walls or bottom walls of trenches, e.g. for forming channel stoppers}	H10W10/00	H10W10/0148		1197
H10W10/018	10	{using selective deposition of crystalline silicon, e.g. using epitaxial growth of silicon}	H10W10/00	H10W10/018		332
H10W10/019	10	{using epitaxial passivated integrated circuit [EPIC] processes}	H10W10/00	H10W10/019		511
H10W10/021	9	{of air gaps}	H10W10/00	H10W10/021		1692
H10W10/031	9	{of isolation regions comprising PN junctions}	H10W10/00	H10W10/031		1830
H10W10/041	9	{of isolation regions comprising polycrystalline semiconductor materials}	H10W10/00	H10W10/041		1185
H10W10/051	9	{of isolation region based on field-effect}	H10W10/00	H10W10/051		418
H10W10/061	9	{using SOI processes together with lateral isolation, e.g. combinations of SOI and shallow trench isolations}	H10W10/00	H10W10/061		2498
H10W10/10	8	Isolation regions comprising dielectric materials	H10W10/10	H10W10/10		2751
H10W10/13	9	formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI]	H10W10/13	H10W10/13		3832
H10W10/17	9	formed using trench refilling with dielectric materials, e.g. shallow trench isolations	H10W10/17	H10W10/17		15946
H10W10/181	9	{Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers}	H10W10/10	H10W10/181		7621
H10W10/20	8	Air gaps	H10W10/20	H10W10/20		1693
H10W10/30	8	Isolation regions comprising PN junctions	H10W10/30	H10W10/30		1830
H10W10/40	8	Isolation regions comprising polycrystalline semiconductor materials	H10W10/40	H10W10/40		1185
H10W10/50	8	Isolation regions based on field-effect	H10W10/50	H10W10/50		418
H10W15/00	7	Highly-doped buried regions of integrated devices	H10W15/00	H10W15/00		882
H10W15/01	8	{Manufacture or treatment}	H10W15/00	H10W15/01		878
H10W20/00	7	Interconnections in chips, wafers or substrates<br><br><u>NOTE</u><br><br>This group covers: <br>interconnections in chips;<br>interconnections in or on wafers;<br>interconnections in or on substrates.<br>This group does not cover interconnections in packages, such as in or on package substrates, which are covered by subgroups H10W70/00 or H10W72/00.	H10W20/00	H10W20/00		6
H10W20/01	8	{Manufacture or treatment}	H10W20/00	H10W20/01		4144
H10W20/021	9	{of interconnections within wafers or substrates}	H10W20/00	H10W20/021		1600
H10W20/023	10	{the interconnections being through-semiconductor vias}<br><br><u>WARNING</u><br>Group H10W20/023 is impacted by reclassification into groups H10W20/0234, H10W20/0238, H10W20/0242, H10W20/0245, H10W20/0249, H10W20/0253, H10W20/0257, H10W20/0261 and H10W20/0265. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W20/00	H10W20/023		7006
H10W20/0234	11	{comprising etching via holes that stop on pads or on electrodes}<br><br><u>WARNING</u><br>Groups H10W20/0234 - H10W20/0265 are incomplete pending reclassification of documents from group H10W20/023. <br>Groups H10W20/023 and H10W20/0234 - H10W20/0265 should be considered in order to perform a complete search.	H10W20/00	H10W20/0234		2190
H10W20/0238	11	{comprising etching via holes through pads or through electrodes}	H10W20/00	H10W20/0238		486
H10W20/0242	11	{comprising etching via holes from the back sides of the chips, wafers or substrates}	H10W20/00	H10W20/0242		2092
H10W20/0245	11	{comprising use of blind vias during the manufacture}	H10W20/00	H10W20/0245		2719
H10W20/0249	11	{wherein the through-semiconductor via protrudes from backsides of the chips, wafers or substrates during the manufacture}	H10W20/00	H10W20/0249		715
H10W20/0253	11	{comprising forming the through-semiconductor vias after stacking of the chips, wafers or substrates}	H10W20/00	H10W20/0253		361
H10W20/0257	11	{comprising using a sacrificial placeholder, e.g. using a sacrificial plug}	H10W20/00	H10W20/0257		106
H10W20/0261	11	{characterised by the filling method or the material of the conductive fill}	H10W20/00	H10W20/0261		694
H10W20/0265	11	{characterised by the sidewall insulation}	H10W20/00	H10W20/0265		532
H10W20/031	9	{of conductive parts of the interconnections}	H10W20/00	H10W20/031		5000
H10W20/032	10	{of conductive barrier, adhesion or liner layers}	H10W20/00	H10W20/032		1448
H10W20/033	11	{in openings in dielectrics}	H10W20/00	H10W20/033		6660
H10W20/034	12	{bottomless barrier, adhesion or liner layers}	H10W20/00	H10W20/034		878
H10W20/035	12	{combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers}	H10W20/00	H10W20/035		2391
H10W20/036	12	{the barrier, adhesion or liner layers being within a main fill metal}	H10W20/00	H10W20/036		775
H10W20/037	12	{the barrier, adhesion or liner layers being on top of a main fill metal}<br><br><u>WARNING</u><br>Group H10W20/037 is impacted by reclassification into group H10W20/0372. <br>Groups H10W20/037 and H10W20/0372 should be considered in order to perform a complete search.	H10W20/00	H10W20/037		1954
H10W20/0372	13	{comprising multiple barrier, adhesion or liner layers}<br><br><u>WARNING</u><br>Group H10W20/0372 is incomplete pending reclassification of documents from group H10W20/037. <br>Groups H10W20/037 and H10W20/0372 should be considered in order to perform a complete search.	H10W20/00	H10W20/0372		101
H10W20/0375	11	{comprising multiple stacked thin barrier, adhesion or liner layers not being formed in openings in dielectrics}	H10W20/00	H10W20/0375		135
H10W20/038	11	{covering conductive structures (H10W20/037 takes precedence)}	H10W20/00	H10W20/038		1341
H10W20/039	12	{also covering sidewalls of the conductive structures}	H10W20/00	H10W20/039		701
H10W20/041	11	{the barrier, adhesion or liner layers being discontinuous}	H10W20/00	H10W20/041		240
H10W20/042	11	{the barrier, adhesion or liner layers being seed or nucleation layers}	H10W20/00	H10W20/042		702
H10W20/0425	12	{comprising multiple stacked seed or nucleation layers}	H10W20/00	H10W20/0425		329
H10W20/043	12	{for electroplating}	H10W20/00	H10W20/043		1487
H10W20/044	12	{for electroless plating}	H10W20/00	H10W20/044		512
H10W20/045	12	{for deposition from the gaseous phase, e.g. for chemical vapour deposition [CVD]}	H10W20/00	H10W20/045		975
H10W20/046	11	{the barrier, adhesion or liner layers being associated with interconnections of capacitors}	H10W20/00	H10W20/046		545
H10W20/047	11	{by introducing additional elements therein}	H10W20/00	H10W20/047		1033
H10W20/048	12	{by using plasmas or gaseous environments, e.g. by nitriding}	H10W20/00	H10W20/048		1264
H10W20/049	12	{by diffusing alloying elements}	H10W20/00	H10W20/049		394
H10W20/051	12	{by ion implantation}	H10W20/00	H10W20/051		279
H10W20/052	11	{by treatments not introducing additional elements therein}	H10W20/00	H10W20/052		219
H10W20/0523	12	{by irradiating with ultraviolet or particle radiation}	H10W20/00	H10W20/0523		571
H10W20/0526	12	{by thermal treatment thereof}	H10W20/00	H10W20/0526		1025
H10W20/054	11	{by selectively removing parts thereof (H10W20/034 takes precedence)}	H10W20/00	H10W20/054		1143
H10W20/055	11	{by formation methods other than physical vapour deposition [PVD], chemical vapour deposition [CVD] or liquid deposition}	H10W20/00	H10W20/055		557
H10W20/0552	12	{by diffusing metallic dopants to react with dielectrics}	H10W20/00	H10W20/0552		256
H10W20/0554	10	{of nanotubes or nanowires}	H10W20/00	H10W20/0554		317
H10W20/056	10	{by filling conductive material into holes, grooves or trenches}<br><br><u>WARNING</u><br>Group H10W20/056 is impacted by reclassification into group H10W20/0595. <br>Groups H10W20/056 and H10W20/0595 should be considered in order to perform a complete search.	H10W20/00	H10W20/056		13734
H10W20/057	11	{by selectively depositing, e.g. by using selective CVD or plating}	H10W20/00	H10W20/057		2734
H10W20/058	11	{by depositing on sacrificial masks, e.g. using lift-off}	H10W20/00	H10W20/058		331
H10W20/059	11	{by reflowing or applying pressure}	H10W20/00	H10W20/059		653
H10W20/0595	11	{by using multiple deposition steps separated by etching steps}<br><br><u>WARNING</u><br>Group H10W20/0595 is incomplete pending reclassification of documents from group H10W20/056. <br>Groups H10W20/056 and H10W20/0595 should be considered in order to perform a complete search.	H10W20/00	H10W20/0595		101
H10W20/062	10	{by smoothing of conductive parts, e.g. by planarisation}	H10W20/00	H10W20/062		3820
H10W20/063	10	{by forming conductive members before forming protective insulating material}<br><br><u>WARNING</u><br>Group H10W20/063 is impacted by reclassification into groups H10W20/0633 and H10W20/0636. <br>Groups H10W20/063, H10W20/0633 and H10W20/0636 should be considered in order to perform a complete search.	H10W20/00	H10W20/063		2913
H10W20/0633	11	{using subtractive patterning of the conductive members}<br><br><u>WARNING</u><br>Groups H10W20/0633 - H10W20/0636 are incomplete pending reclassification of documents from group H10W20/063. <br>Groups H10W20/063 and H10W20/0633 - H10W20/0636 should be considered in order to perform a complete search.	H10W20/00	H10W20/0633		953
H10W20/0636	11	{the conductive members being on sidewalls}	H10W20/00	H10W20/0636		100
H10W20/064	10	{by modifying the conductivity of conductive parts, e.g. by alloying}	H10W20/00	H10W20/064		931
H10W20/065	11	{by making at least a portion of the conductive part non-conductive, e.g. by oxidation}	H10W20/00	H10W20/065		574
H10W20/066	11	{by forming silicides of refractory metals}	H10W20/00	H10W20/066		736
H10W20/067	10	{by modifying the pattern of conductive parts}	H10W20/00	H10W20/067		506
H10W20/068	11	{by using a laser, e.g. laser cutting or laser direct writing}	H10W20/00	H10W20/068		337
H10W20/069	10	{by forming self-aligned vias or self-aligned contact plugs}<br><br><u>WARNING</u><br>Group H10W20/069 is impacted by reclassification into groups H10W20/0693 and H10W20/0696. <br>Groups H10W20/069, H10W20/0693 and H10W20/0696 should be considered in order to perform a complete search.	H10W20/00	H10W20/069		10156
H10W20/0693	11	{by forming self-aligned vias}<br><br><u>WARNING</u><br>Groups H10W20/0693 - H10W20/0696 are incomplete pending reclassification of documents from group H10W20/069. <br>Groups H10W20/069 and H10W20/0693 - H10W20/0696 should be considered in order to perform a complete search.	H10W20/00	H10W20/0693		1041
H10W20/0696	11	{by using sacrificial placeholders, e.g. using sacrificial plugs}	H10W20/00	H10W20/0696		523
H10W20/0698	10	{Local interconnections}	H10W20/00	H10W20/0698		5503
H10W20/071	9	{of dielectric parts thereof}	H10W20/00	H10W20/071		3063
H10W20/072	10	{of dielectric parts comprising air gaps}	H10W20/00	H10W20/072		2907
H10W20/074	10	{of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers}	H10W20/00	H10W20/074		3962
H10W20/075	11	{of multilayered thin functional dielectric layers}	H10W20/00	H10W20/075		2466
H10W20/076	11	{in via holes or trenches}	H10W20/00	H10W20/076		4797
H10W20/0765	12	{the thin functional dielectric layers being temporary, e.g. sacrificial layers}	H10W20/00	H10W20/0765		481
H10W20/077	11	{on sidewalls or on top surfaces of conductors (H10W20/076 takes precedence)}	H10W20/00	H10W20/077		4521
H10W20/081	10	{by forming openings in the dielectric parts}	H10W20/00	H10W20/081		11461
H10W20/082	11	{the openings being tapered via holes}	H10W20/00	H10W20/082		2127
H10W20/083	11	{the openings being via holes penetrating underlying conductors}	H10W20/00	H10W20/083		2529
H10W20/084	11	{for dual-damascene structures}	H10W20/00	H10W20/084		3188
H10W20/085	12	{involving intermediate temporary filling with material}	H10W20/00	H10W20/085		1385
H10W20/086	12	{involving buried masks}	H10W20/00	H10W20/086		476
H10W20/087	12	{involving multiple stacked pre-patterned masks}	H10W20/00	H10W20/087		938
H10W20/088	12	{involving partial etching of via holes}	H10W20/00	H10W20/088		968
H10W20/0882	12	{wherein the dual damascene structure is in a photoresist layer}	H10W20/00	H10W20/0882		75
H10W20/0884	12	{involving forming vias by burying sacrificial pillars in the dielectric parts and removing the pillars}	H10W20/00	H10W20/0884		95
H10W20/0886	12	{involving forming a via in a via-level dielectric prior to deposition of a trench-level dielectric}	H10W20/00	H10W20/0886		183
H10W20/0888	12	{wherein via-level dielectrics are compositionally different than trench-level dielectrics}	H10W20/00	H10W20/0888		179
H10W20/089	11	{using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning}	H10W20/00	H10W20/089		4886
H10W20/091	11	{by printing or stamping}	H10W20/00	H10W20/091		136
H10W20/092	10	{by smoothing the dielectric parts}	H10W20/00	H10W20/092		2598
H10W20/093	10	{by modifying materials of the dielectric parts}	H10W20/00	H10W20/093		215
H10W20/094	11	{by transforming insulators into conductors}	H10W20/00	H10W20/094		136
H10W20/095	11	{by irradiating with electromagnetic or particle radiation (plasma treatment H10W20/096)}	H10W20/00	H10W20/095		1171
H10W20/096	11	{by contacting with gases, liquids or plasmas}	H10W20/00	H10W20/096		1829
H10W20/097	11	{by thermally treating}	H10W20/00	H10W20/097		1273
H10W20/098	10	{by filling between adjacent conductive parts}	H10W20/00	H10W20/098		1736
H10W20/20	8	Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]<br><br><u>WARNING</u><br>Group H10W20/20 is incomplete pending reclassification of documents from group H10W72/823. Group H10W20/20 is also impacted by reclassification into groups H10W20/211, H10W20/212, H10W20/2125, H10W20/2128, H10W20/213, H10W20/2134, H10W20/215, H10W20/216, H10W20/217, H10W20/218, H10W20/222 and H10W20/233. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W20/20	H10W20/20		14918
H10W20/211	9	{Through-semiconductor vias, e.g. TSVs}<br><br><u>WARNING</u><br>Groups H10W20/211 and H10W20/215 are incomplete pending reclassification of documents from groups H10W20/20 and H10W72/823. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W20/20	H10W20/211		8
H10W20/212	10	{Top-view shapes or dispositions, e.g. top-view layouts of the vias}<br><br><u>WARNING</u><br>Groups H10W20/212, H10W20/2125 and H10W20/2128 are incomplete pending reclassification of documents from group H10W20/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W20/20	H10W20/212		486
H10W20/2125	11	{Top-view shapes}	H10W20/20	H10W20/2125		1103
H10W20/2128	12	{Coaxial through-semiconductor vias}	H10W20/20	H10W20/2128		175
H10W20/213	10	{Cross-sectional shapes or dispositions}<br><br><u>WARNING</u><br>Groups H10W20/213 and H10W20/2134 are incomplete pending reclassification of documents from group H10W20/20. <br>Groups H10W20/20, H10W20/213 and H10W20/2134 should be considered in order to perform a complete search.	H10W20/20	H10W20/213		4
H10W20/2134	11	{TSVs extending from the semiconductor wafer into back-end-of-line layers}	H10W20/20	H10W20/2134		1608
H10W20/215	10	{characterised by thin functional layers between the through-semiconductor vias and sidewalls of the via holes, e.g. barrier layers or adhesion layers}	H10W20/20	H10W20/215		
H10W20/216	10	{characterised by dielectric material at least partially filling the via holes, e.g. covering the through-semiconductor vias in the via holes}<br><br><u>WARNING</u><br>Groups H10W20/216 - H10W20/218 are incomplete pending reclassification of documents from group H10W20/20. <br>Groups H10W20/20 and H10W20/216 - H10W20/218 should be considered in order to perform a complete search.	H10W20/20	H10W20/216		429
H10W20/217	10	{comprising ring-shaped isolation structures outside of the via holes}	H10W20/20	H10W20/217		425
H10W20/218	10	{in silicon-on-insulator [SOI] wafers}	H10W20/20	H10W20/218		300
H10W20/222	9	{Vias through non-semiconductor substrates, e.g. through-glass vias}<br><br><u>WARNING</u><br>Group H10W20/222 is incomplete pending reclassification of documents from groups H10W20/20 and H10W72/823. <br>Groups H10W20/20, H10W72/823 and H10W20/222 should be considered in order to perform a complete search.	H10W20/20	H10W20/222		1
H10W20/233	9	{parallel to the active surface, e.g. horizontal traces in trenches in the surface of the wafer}<br><br><u>WARNING</u><br>Group H10W20/233 is incomplete pending reclassification of documents from group H10W20/20. <br>Groups H10W20/20 and H10W20/233 should be considered in order to perform a complete search.	H10W20/20	H10W20/233		1
H10W20/40	8	Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes<br><br><u>WARNING</u><br>Group H10W20/40 is impacted by reclassification into groups H10W20/41, H10W20/42, H10W20/421, H10W20/422, H10W20/423, H10W20/425, H10W20/427, H10W20/43, H10W20/432, H10W20/435, H10W20/438, H10W20/44, H10W20/4403, H10W20/4405, H10W20/4407, H10W20/4421, H10W20/4424, H10W20/4432, H10W20/4435, H10W20/4441, H10W20/4446, H10W20/4451, H10W20/4462, H10W20/4473, H10W20/4484, H10W20/45, H10W20/455, H10W20/46, H10W20/47, H10W20/48, H10W20/481, H10W20/482, H10W70/60, H10W70/611, H10W70/614, H10W70/616, H10W70/62, H10W70/63, H10W70/635, H10W70/641, H10W70/644, H10W70/65, H10W70/652, H10W70/6523, H10W70/6525, H10W70/6528, H10W70/654, H10W70/655, H10W70/656, H10W70/657, H10W70/658, H10W70/66, H10W70/662, H10W70/664, H10W70/666, H10W70/668, H10W70/67, H10W70/68, H10W70/681, H10W70/682, H10W70/685, H10W70/688, H10W70/69, H10W70/692, H10W70/695, H10W70/698 and H10W72/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W20/40	H10W20/40		10529
H10W20/41	9	characterised by their conductive parts<br><br><u>WARNING</u><br>Groups H10W20/41, H10W20/423, H10W20/427, H10W20/43, H10W20/432, H10W20/435, H10W20/438, H10W20/44, H10W20/4405, H10W20/4407, H10W20/4421, H10W20/4424, H10W20/4432, H10W20/4435, H10W20/4441, H10W20/4446, H10W20/4451, H10W20/4462, H10W20/4473 and H10W20/4484 are incomplete pending reclassification of documents from group H10W20/40. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W20/41	H10W20/41		2
H10W20/42	10	Vias, e.g. via plugs<br><br><u>WARNING</u><br>Group H10W20/42 is incomplete pending reclassification of documents from groups H10W20/40 and H10W20/482. Group H10W20/42 is also impacted by reclassification into groups H10W20/421 and H10W20/422. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W20/42	H10W20/42		11031
H10W20/421	11	{Skip vias, i.e. vias that do not connect all metallization layers that they pass through}<br><br><u>WARNING</u><br>Group H10W20/421 is incomplete pending reclassification of documents from groups H10W20/40 and H10W20/42. <br>Groups H10W20/40, H10W20/42 and H10W20/421 should be considered in order to perform a complete search.	H10W20/42	H10W20/42		166
H10W20/422	11	{Vias connecting to electrodes, e.g. contact plugs}<br><br><u>WARNING</u><br>Group H10W20/422 is incomplete pending reclassification of documents from groups H10W20/40 and H10W20/42. <br>Groups H10W20/40, H10W20/42 and H10W20/422 should be considered in order to perform a complete search.	H10W20/42	H10W20/42		8
H10W20/423	10	{Shielding layers}	H10W20/41	H10W20/42		844
H10W20/425	10	{Barrier, adhesion or liner layers}<br><br><u>WARNING</u><br>Group H10W20/425 is incomplete pending reclassification of documents from group H10W20/40. Group H10W20/425 is also impacted by reclassification into group H10W20/455. <br>Groups H10W20/40, H10W20/425 and H10W20/455 should be considered in order to perform a complete search.	H10W20/41	H10W20/42		5704
H10W20/427	10	{Power or ground buses}	H10W20/41	H10W20/42		4125
H10W20/43	10	Layouts of interconnections	H10W20/43	H10W20/43		7536
H10W20/432	11	{comprising crossing interconnections}	H10W20/43	H10W20/43		306
H10W20/435	10	{Cross-sectional shapes or dispositions of interconnections}	H10W20/41	H10W20/43		6836
H10W20/438	10	{Interconnections with multiple fill metals, e.g. having different metals in wide and narrow interconnections, or having different metals in vias and in trenches}	H10W20/41	H10W20/43		202
H10W20/44	10	Conductive materials thereof	H10W20/44	H10W20/44		186
H10W20/4403	11	{based on metals, e.g. alloys, metal silicides (H10W20/4484 takes precedence)}<br><br><u>WARNING</u><br>Group H10W20/4403 is incomplete pending reclassification of documents from group H10W20/40. Group H10W20/4403 is also impacted by reclassification into group H10W20/4437. <br>Groups H10W20/40, H10W20/4403 and H10W20/4437 should be considered in order to perform a complete search.	H10W20/44	H10W20/44		1219
H10W20/4405	12	{the principal metal being aluminium}	H10W20/44	H10W20/44		504
H10W20/4407	13	{Aluminium alloys}	H10W20/44	H10W20/44		317
H10W20/4421	12	{the principal metal being copper}	H10W20/44	H10W20/44		1221
H10W20/4424	13	{Copper alloys}	H10W20/44	H10W20/44		492
H10W20/4432	12	{the principal metal being a noble metal, e.g. gold}	H10W20/44	H10W20/44		518
H10W20/4435	13	{Noble-metal alloys}	H10W20/44	H10W20/44		94
H10W20/4437	12	{the principal metal being a transition metal}<br><br><u>WARNING</u><br>Group H10W20/4437 is incomplete pending reclassification of documents from group H10W20/4403. <br>Groups H10W20/4403 and H10W20/4437 should be considered in order to perform a complete search.	H10W20/44	H10W20/44		385
H10W20/4441	13	{the principal metal being a refractory metal}	H10W20/44	H10W20/44		991
H10W20/4446	14	{Refractory-metal alloys}	H10W20/44	H10W20/44		156
H10W20/4451	11	{Semiconductor materials, e.g. polysilicon}	H10W20/44	H10W20/44		680
H10W20/4462	11	{Carbon or carbon-containing materials, e.g. graphene}	H10W20/44	H10W20/44		499
H10W20/4473	11	{Conductive organic materials, e.g. conductive adhesives or conductive inks}	H10W20/44	H10W20/44		186
H10W20/4484	11	{Superconducting materials}	H10W20/44	H10W20/44		139
H10W20/45	9	characterised by their insulating parts<br><br><u>WARNING</u><br>Groups H10W20/45, H10W20/46, H10W20/47 and H10W20/48 are incomplete pending reclassification of documents from group H10W20/40. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W20/45	H10W20/45		
H10W20/455	10	{Thin functional dielectric layers}<br><br><u>WARNING</u><br>Group H10W20/455 is incomplete pending reclassification of documents from groups H10W20/40 and H10W20/425. <br>Groups H10W20/40, H10W20/425 and H10W20/455 should be considered in order to perform a complete search.	H10W20/45	H10W20/45		4
H10W20/46	10	comprising air gaps	H10W20/46	H10W20/46		2861
H10W20/47	10	comprising two or more dielectric layers having different properties, e.g. different dielectric constants	H10W20/47	H10W20/47		3417
H10W20/48	10	Insulating materials thereof	H10W20/48	H10W20/48		3736
H10W20/481	9	{on the rear surfaces of the wafers or substrates}<br><br><u>WARNING</u><br>Group H10W20/481 is incomplete pending reclassification of documents from group H10W20/40. <br>Groups H10W20/40 and H10W20/481 should be considered in order to perform a complete search.	H10W20/40	H10W20/48		1209
H10W20/482	9	{for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors}<br><br><u>WARNING</u><br>Group H10W20/482 is incomplete pending reclassification of documents from group H10W20/40. <br>Groups H10W20/40 and H10W20/482 should be considered in order to perform a complete search.	H10W20/40	H10W20/48		2
H10W20/483	10	{Interconnections over air gaps, e.g. air bridges}	H10W20/40	H10W20/48		251
H10W20/484	10	{Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes}	H10W20/40	H10W20/48		1686
H10W20/49	9	Adaptable interconnections, e.g. fuses or antifuses	H10W20/49	H10W20/49		1876
H10W20/491	10	{Antifuses, i.e. interconnections changeable from non-conductive to conductive}	H10W20/49	H10W20/49		1385
H10W20/492	11	{changeable by the use of an external beam, e.g. laser beam or ion beam}	H10W20/49	H10W20/49		115
H10W20/493	10	{Fuses, i.e. interconnections changeable from conductive to non-conductive}	H10W20/49	H10W20/49		2021
H10W20/494	11	{changeable by the use of an external beam, e.g. laser beam or ion beam}	H10W20/49	H10W20/49		1180
H10W20/495	9	{Capacitive arrangements or effects of, or between wiring layers}	H10W20/40	H10W20/49		2092
H10W20/496	10	{Capacitor integral with wiring layers}	H10W20/40	H10W20/49		3324
H10W20/497	9	{Inductive arrangements or effects of, or between, wiring layers}	H10W20/40	H10W20/49		2358
H10W20/498	9	{Resistive arrangements or effects of, or between, wiring layers}	H10W20/40	H10W20/49		949
H10W29/00	7	Generic parts of integrated devices, not otherwise provided for	H10W29/00	H10W29/00		82
H10W29/01	8	{Manufacture or treatment}	H10W29/00	H10W29/01		82
H10W40/00	7	Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)<br><br><u>WARNING</u><br>Group H10W40/00 is incomplete pending reclassification of documents from group H10W99/00. Group H10W40/00 is also impacted by reclassification into groups H10W40/20 and H10W40/50. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W40/00	H10W40/00		3136
H10W40/01	8	{Manufacture or treatment}<br><br><u>WARNING</u><br>Group H10W40/01 is incomplete pending reclassification of documents from group H10W99/00. <br>Groups H10W99/00 and H10W40/01 should be considered in order to perform a complete search.	H10W40/00	H10W40/01		
H10W40/03	9	{of arrangements for cooling}<br><br><u>WARNING</u><br>Group H10W40/03 is incomplete pending reclassification of documents from group H10W70/02. <br>Groups H10W70/02 and H10W40/03 should be considered in order to perform a complete search.	H10W40/00	H10W40/03		1
H10W40/033	10	{using mechanical treatments, e.g. deforming, punching or cutting}<br><br><u>WARNING</u><br>Group H10W40/033 is incomplete pending reclassification of documents from group H10W70/027. <br>Groups H10W70/027 and H10W40/033 should be considered in order to perform a complete search.	H10W40/00	H10W40/033		1
H10W40/037	10	{Assembling together parts thereof}	H10W40/00	H10W40/037		2299
H10W40/10	8	Arrangements for heating<br><br><u>WARNING</u><br>Group H10W40/10 is impacted by reclassification into group H10W40/20. <br>Groups H10W40/10 and H10W40/20 should be considered in order to perform a complete search.	H10W40/10	H10W40/10		6668
H10W40/20	8	Arrangements for cooling<br><br><u>WARNING</u><br>Group H10W40/20 is incomplete pending reclassification of documents from groups H10W40/00 and H10W40/10. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W40/20	H10W40/20		15
H10W40/22	9	characterised by their shape, e.g. having conical or cylindrical projections<br><br><u>WARNING</u><br>Group H10W40/22 is impacted by reclassification into groups H10W40/226, H10W40/228, H10W40/231, H10W40/233, H10W40/235, H10W40/237 and H10W40/242. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W40/22	H10W40/22		11914
H10W40/226	10	{characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)}<br><br><u>WARNING</u><br>Groups H10W40/226 and H10W40/228 are incomplete pending reclassification of documents from group H10W40/22. <br>Groups H10W40/22, H10W40/226 and H10W40/228 should be considered in order to perform a complete search.	H10W40/22	H10W40/22		5493
H10W40/228	11	{the projecting parts being wire-shaped or pin-shaped}	H10W40/22	H10W40/22		4519
H10W40/231	9	{characterised by their places of attachment or cooling paths}<br><br><u>WARNING</u><br>Groups H10W40/231, H10W40/233, H10W40/235, H10W40/237 and H10W40/242 are incomplete pending reclassification of documents from group H10W40/22. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W40/20	H10W40/231		678
H10W40/233	10	{attached to chips}	H10W40/20	H10W40/233		190
H10W40/235	10	{attached to package parts}	H10W40/20	H10W40/235		834
H10W40/237	10	{attached to additional arrangements for cooling}	H10W40/20	H10W40/237		330
H10W40/242	10	{comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders}	H10W40/20	H10W40/242		305
H10W40/25	9	characterised by their materials	H10W40/25	H10W40/25		3115
H10W40/251	10	{Organics}	H10W40/25	H10W40/25		2680
H10W40/253	10	{Semiconductors}	H10W40/25	H10W40/25		635
H10W40/254	10	{Diamond}	H10W40/25	H10W40/25		1002
H10W40/255	10	{having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}	H10W40/25	H10W40/25		6331
H10W40/257	10	{having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)}	H10W40/25	H10W40/25		1243
H10W40/258	10	{Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}	H10W40/25	H10W40/25		3943
H10W40/259	10	{Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}	H10W40/25	H10W40/25		1179
H10W40/28	9	comprising Peltier coolers	H10W40/28	H10W40/28		1250
H10W40/30	8	wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid	H10W40/30	H10W40/30		446
H10W40/305	9	{the fluid being a liquefied gas, e.g. liquid nitrogen}	H10W40/30	H10W40/30		145
H10W40/40	8	involving heat exchange by flowing fluids	H10W40/40	H10W40/40		690
H10W40/43	9	by flowing gases, e.g. forced air cooling	H10W40/43	H10W40/43		5234
H10W40/47	9	by flowing liquids, e.g. forced water cooling	H10W40/47	H10W40/47		8128
H10W40/475	10	{using jet impingement (H10W40/776 takes precedence)}	H10W40/47	H10W40/47		505
H10W40/50	8	Arrangements for sensing temperature<br><br><u>WARNING</u><br>Group H10W40/50 is incomplete pending reclassification of documents from group H10W40/00. <br>Groups H10W40/00 and H10W40/50 should be considered in order to perform a complete search.	H10W40/50	H10W40/50		
H10W40/60	8	Securing means for detachable heating or cooling arrangements, e.g. clamps	H10W40/60	H10W40/60		2394
H10W40/611	9	{Bolts or screws}	H10W40/60	H10W40/611		3577
H10W40/613	10	{for stacked arrangements of a plurality of semiconductor devices}	H10W40/60	H10W40/613		299
H10W40/625	9	{Clamping parts not primarily conducting heat}	H10W40/60	H10W40/625		534
H10W40/641	9	{Snap-on arrangements, e.g. clips}	H10W40/60	H10W40/641		2367
H10W40/70	8	Fillings or auxiliary members in containers or in encapsulations for thermal protection or control	H10W40/70	H10W40/70		2650
H10W40/73	9	for cooling by change of state	H10W40/73	H10W40/73		6504
H10W40/735	10	{by melting or evaporation of solids}	H10W40/73	H10W40/73		560
H10W40/77	9	Auxiliary members characterised by their shape	H10W40/77	H10W40/77		1167
H10W40/772	10	{Bellows}	H10W40/77	H10W40/77		109
H10W40/774	10	{Pistons, e.g. spring-loaded members}	H10W40/77	H10W40/77		292
H10W40/776	10	{Arrangements for jet impingement, e.g. for spraying}	H10W40/77	H10W40/77		124
H10W40/778	10	{in encapsulations}	H10W40/77	H10W40/77		3461
H10W40/80	8	Circuit arrangements for thermal protection or control of packages<br><br><u>WARNING</u><br>Group H10W40/80 is incomplete pending reclassification of documents from group H10W42/00. <br>Groups H10W42/00 and H10W40/80 should be considered in order to perform a complete search.	H10W40/80	H10W40/80		
H10W42/00	7	Arrangements for protection of devices (arrangements for thermal protection H10W40/00)<br><br><u>WARNING</u><br>Group H10W42/00 is incomplete pending reclassification of documents from group H10W99/00. Group H10W42/00 is also impacted by reclassification into groups H10W42/101, H10W40/80 and H10W99/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W42/00	H10W42/00		4943
H10W42/101	8	{protecting against moisture, e.g. getters (fillers in containers for absorbing or reacting with moisture or other undesired substances H10W76/48)}<br><br><u>WARNING</u><br>Group H10W42/101 is incomplete pending reclassification of documents from group H10W42/00. <br>Groups H10W42/00 and H10W42/101 should be considered in order to perform a complete search.	H10W42/00	H10W42/101		
H10W42/121	8	{protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}	H10W42/00	H10W42/121		6298
H10W42/20	8	protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons<br><br><u>WARNING</u><br>Group H10W42/20 is impacted by reclassification into groups H10W42/40, H10W42/261, H10W42/263, H10W42/265, H10W42/267, H10W42/271, H10W42/273, H10W42/276, H10W42/281, H10W42/284 and H10W42/287. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W42/20	H10W42/20		8135
H10W42/25	9	against alpha rays, e.g. for outer space applications	H10W42/25	H10W42/25		397
H10W42/261	9	{characterised by their shapes or dispositions}<br><br><u>WARNING</u><br>Groups H10W42/261, H10W42/263, H10W42/265, H10W42/267, H10W42/271, H10W42/273 and H10W42/276 are incomplete pending reclassification of documents from group H10W42/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W42/20	H10W42/261		1
H10W42/263	10	{Shielding bumps}	H10W42/20	H10W42/263		91
H10W42/265	10	{Shielding wires, e.g. constant potential wires}	H10W42/20	H10W42/265		58
H10W42/267	10	{Patterned shielding planes}	H10W42/20	H10W42/267		182
H10W42/271	10	{the arrangements being between stacked chips}	H10W42/20	H10W42/271		319
H10W42/273	10	{the arrangements being between laterally adjacent chips, e.g. walls between chips}	H10W42/20	H10W42/273		401
H10W42/276	10	{the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}	H10W42/20	H10W42/276		2056
H10W42/281	9	{characterised by their materials}<br><br><u>WARNING</u><br>Groups H10W42/281, H10W42/284 and H10W42/287 are incomplete pending reclassification of documents from group H10W42/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W42/20	H10W42/281		1
H10W42/284	10	{shielding resins}	H10W42/20	H10W42/284		269
H10W42/287	10	{materials for magnetic shielding, e.g. ferromagnetic materials}	H10W42/20	H10W42/287		423
H10W42/40	8	protecting against tampering, e.g. unauthorised inspection or reverse engineering<br><br><u>WARNING</u><br>Group H10W42/40 is incomplete pending reclassification of documents from group H10W42/20. <br>Groups H10W42/20 and H10W42/40 should be considered in order to perform a complete search.	H10W42/40	H10W42/40		725
H10W42/405	9	{using active circuits}	H10W42/40	H10W42/40		559
H10W42/60	8	protecting against electrostatic charges or discharges, e.g. Faraday shields (integrated devices comprising arrangements for electrical protection H10D89/60)	H10W42/60	H10W42/60		3344
H10W42/80	8	protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60)	H10W42/80	H10W42/80		1295
H10W44/00	7	Electrical arrangements for controlling or matching impedance	H10W44/00	H10W44/00		717
H10W44/20	8	at high-frequency [HF] or radio frequency [RF]	H10W44/20	H10W44/20		7672
H10W44/203	9	{Electrical connections}	H10W44/20	H10W44/20		133
H10W44/206	10	{Wires}	H10W44/20	H10W44/20		1005
H10W44/209	10	{Vertical interconnections, e.g. vias}	H10W44/20	H10W44/20		738
H10W44/212	11	{Coaxial feed-throughs in substrates}	H10W44/20	H10W44/212		398
H10W44/216	10	{Waveguides, e.g. strip lines}	H10W44/20	H10W44/216		1279
H10W44/219	11	{characterised by transitions between different types of waveguides}	H10W44/20	H10W44/219		109
H10W44/223	10	{Differential pair signal lines}	H10W44/20	H10W44/223		193
H10W44/226	9	{for HF amplifiers}	H10W44/20	H10W44/226		872
H10W44/231	10	{Arrangements for applying bias}	H10W44/20	H10W44/231		191
H10W44/234	10	{Arrangements for impedance matching}	H10W44/20	H10W44/234		897
H10W44/241	9	{for passive devices or passive elements}	H10W44/20	H10W44/241		385
H10W44/243	10	{for decoupling, e.g. bypass capacitors}	H10W44/20	H10W44/243		93
H10W44/248	10	{for antennas}	H10W44/20	H10W44/248		2934
H10W44/251	9	{for monolithic microwave integrated circuits [MMIC]}	H10W44/20	H10W44/251		407
H10W44/255	9	{for operation at multiple different frequencies}	H10W44/20	H10W44/255		164
H10W44/259	9	{Optical signal interface}	H10W44/20	H10W44/259		27
H10W44/401	8	{Resistive arrangements (H10W44/20, H10W42/80 take precedence)}	H10W44/00	H10W44/401		678
H10W44/501	8	{Inductive arrangements (H10W44/20 takes precedence)}	H10W44/00	H10W44/501		2529
H10W44/601	8	{Capacitive arrangements (H10W44/20 takes precedence)}	H10W44/00	H10W44/601		2516
H10W46/00	7	Marks applied to devices, e.g. for alignment or identification<br><br><u>NOTE</u><br><br>This group covers marks in or on chips, wafers, substrates or packages.	H10W46/00	H10W46/00		9505
H10W46/101	8	{characterised by the type of information, e.g. logos or symbols}	H10W46/00	H10W46/101		1272
H10W46/103	9	{alphanumeric information, e.g. words, letters or serial numbers}	H10W46/00	H10W46/103		750
H10W46/106	9	{digital information, e.g. bar codes}	H10W46/00	H10W46/106		419
H10W46/201	8	{located on the periphery of wafers, e.g. orientation notches or lot numbers}	H10W46/00	H10W46/201		717
H10W46/301	8	{for alignment}	H10W46/00	H10W46/301		4127
H10W46/401	8	{for identification or tracking}	H10W46/00	H10W46/401		947
H10W46/403	9	{for non-wireless electrical read out}	H10W46/00	H10W46/403		328
H10W46/407	9	{for wireless electrical read out}	H10W46/00	H10W46/407		32
H10W46/501	8	{for use before dicing}	H10W46/00	H10W46/501		1597
H10W46/503	9	{Located in scribe lines}	H10W46/00	H10W46/503		1011
H10W46/507	9	{Located in dummy chips or in reference chips}	H10W46/00	H10W46/507		125
H10W46/601	8	{for use after dicing}	H10W46/00	H10W46/601		1160
H10W46/603	9	{Formed on wafers or substrates before dicing and remaining on chips after dicing}	H10W46/00	H10W46/603		608
H10W46/607	9	{Located on parts of packages, e.g. on encapsulations or on package substrates}	H10W46/00	H10W46/607		1240
H10W70/00	7	Package substrates; Interposers; Redistribution layers [RDL]<br><br><u>WARNING</u><br>Groups H10W70/00, H10W70/01 and H10W70/04 are incomplete pending reclassification of documents from group H10W99/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/00	H10W70/00		4
H10W70/01	8	Manufacture or treatment	H10W70/01	H10W70/01		6
H10W70/02	9	of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)<br><br><u>WARNING</u><br>Group H10W70/02 is incomplete pending reclassification of documents from group H10W99/00. Group H10W70/02 is also impacted by reclassification into group H10W40/03. <br>Groups H10W99/00, H10W70/02 and H10W40/03 should be considered in order to perform a complete search.	H10W70/02	H10W70/02		1457
H10W70/023	10	{Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps}	H10W70/02	H10W70/02		222
H10W70/027	10	{Mechanical treatments, e.g. deforming, punching or cutting}<br><br><u>WARNING</u><br>Group H10W70/027 is impacted by reclassification into group H10W40/033. <br>Groups H10W70/027 and H10W40/033 should be considered in order to perform a complete search.	H10W70/02	H10W70/02		409
H10W70/04	9	of leadframes	H10W70/04	H10W70/04		1532
H10W70/041	10	{Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps}	H10W70/04	H10W70/04		1019
H10W70/042	10	{Etching}	H10W70/04	H10W70/04		1309
H10W70/045	10	{Cleaning}	H10W70/04	H10W70/04		215
H10W70/047	10	{Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]}	H10W70/04	H10W70/04		315
H10W70/048	10	{Mechanical treatments, e.g. punching, cutting, deforming or cold welding}	H10W70/04	H10W70/04		1375
H10W70/05	9	of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)<br><br><u>WARNING</u><br>Group H10W70/05 is incomplete pending reclassification of documents from group H10W99/00. Group H10W70/05 is also impacted by reclassification into groups H10W70/06, H10W70/08, H10W70/09, H10W70/092, H10W70/093, H10W70/095, H10W70/096, H10W70/097 and H10W70/098. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/05	H10W70/05		10243
H10W70/06	10	using temporary auxiliary supports<br><br><u>WARNING</u><br>Group H10W70/06 is incomplete pending reclassification of documents from groups H10W70/05 and H10W99/00. <br>Groups H10W70/05, H10W99/00 and H10W70/06 should be considered in order to perform a complete search.	H10W70/06	H10W70/06		2
H10W70/08	10	by depositing layers on the chip or wafer, e.g. "chip-first" RDLs<br><br><u>WARNING</u><br>Groups H10W70/08 and H10W70/09 are incomplete pending reclassification of documents from groups H10W70/05 and H10W99/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/08	H10W70/08		
H10W70/09	11	extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs	H10W70/09	H10W70/09		7236
H10W70/092	10	{Adapting interconnections, e.g. making engineering charges, repairing}<br><br><u>WARNING</u><br>Groups H10W70/092 - H10W70/098 are incomplete pending reclassification of documents from group H10W70/05. <br>Groups H10W70/05 and H10W70/092 - H10W70/098 should be considered in order to perform a complete search.	H10W70/05	H10W70/09		314
H10W70/093	10	{Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps}	H10W70/05	H10W70/09		9816
H10W70/095	10	{of vias therein}	H10W70/05	H10W70/09		5035
H10W70/096	10	{Cutting or separating}	H10W70/05	H10W70/09		1
H10W70/097	10	{Cleaning}	H10W70/05	H10W70/09		223
H10W70/098	10	{Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)}	H10W70/05	H10W70/09		996
H10W70/099	8	{Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}	H10W70/00	H10W70/09		3006
H10W70/20	8	Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)	H10W70/20	H10W70/20		1338
H10W70/22	9	{having an heterogeneous or anisotropic structure}	H10W70/20	H10W70/22		149
H10W70/24	9	{characterised by materials}	H10W70/20	H10W70/24		474
H10W70/26	10	{Semiconductor materials}	H10W70/20	H10W70/26		59
H10W70/28	10	{Carbon-containing materials}	H10W70/20	H10W70/28		46
H10W70/40	8	Leadframes	H10W70/40	H10W70/40		2866
H10W70/411	9	{Chip-supporting parts, e.g. die pads}	H10W70/40	H10W70/411		2624
H10W70/413	10	{Insulating or insulated substrates serving as die pads (H10W70/468 takes precedence)}	H10W70/40	H10W70/413		237
H10W70/415	10	{Leadframe inner leads serving as die pads}	H10W70/40	H10W70/415		1825
H10W70/417	10	{Bonding materials between chips and die pads}	H10W70/40	H10W70/417		1735
H10W70/421	9	{Shapes or dispositions}	H10W70/40	H10W70/421		4848
H10W70/424	10	{Cross-sectional shapes (H10W70/481 takes precedence)}	H10W70/40	H10W70/424		3037
H10W70/427	11	{Bent parts}	H10W70/40	H10W70/427		1373
H10W70/429	12	{being the outer leads}	H10W70/40	H10W70/429		1062
H10W70/433	10	{of deformation-absorbing parts, e.g. leads having meandering shapes (H10W70/481 takes precedence)}	H10W70/40	H10W70/433		212
H10W70/435	10	{of insulating layers on leadframes, e.g. bridging members}	H10W70/40	H10W70/435		641
H10W70/438	10	{of side rails, e.g. having holes}	H10W70/40	H10W70/438		527
H10W70/442	10	{of multiple leadframes in a single chip}	H10W70/40	H10W70/442		1103
H10W70/451	9	{Multilayered leadframes}	H10W70/40	H10W70/451		411
H10W70/453	9	{comprising flexible metallic tapes}	H10W70/40	H10W70/453		1006
H10W70/456	9	{Materials}	H10W70/40	H10W70/456		558
H10W70/457	10	{of metallic layers on leadframes}	H10W70/40	H10W70/457		2240
H10W70/458	10	{of insulating layers on leadframes}	H10W70/40	H10W70/458		521
H10W70/461	9	{specially adapted for cooling}	H10W70/40	H10W70/461		2090
H10W70/464	9	{Additional interconnections in combination with leadframes}	H10W70/40	H10W70/464		837
H10W70/465	10	{Bumps or wires}	H10W70/40	H10W70/465		2030
H10W70/466	10	{Tape carriers or flat leads}	H10W70/40	H10W70/466		1489
H10W70/467	10	{Multilayered additional interconnections}	H10W70/40	H10W70/467		140
H10W70/468	10	{Circuit boards}	H10W70/40	H10W70/468		962
H10W70/474	9	{Batteries in combination with leadframes}	H10W70/40	H10W70/474		42
H10W70/475	9	{Capacitors in combination with leadframes}	H10W70/40	H10W70/475		511
H10W70/476	9	{Oscillators in combination with leadframes}	H10W70/40	H10W70/476		41
H10W70/479	9	{on or in insulating or insulated package substrates, interposers, or redistribution layers}	H10W70/40	H10W70/479		1678
H10W70/481	9	{for devices being provided for in groups H10D8/00 - H10D48/00}	H10W70/40	H10W70/481		4261
H10W70/60	8	Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)<br><br><u>WARNING</u><br>Group H10W70/60 is incomplete pending reclassification of documents from group H10W20/40. Group H10W70/60 is also impacted by reclassification into groups H10W70/611, H10W70/614, H10W70/616, H10W70/618, H10W70/62, H10W70/63, H10W70/635, H10W70/641, H10W70/644, H10W70/65, H10W70/652, H10W70/6523, H10W70/6525, H10W70/6528, H10W70/654, H10W70/655, H10W70/656, H10W70/6565, H10W70/657, H10W70/658, H10W70/66, H10W70/662, H10W70/664, H10W70/666, H10W70/668, H10W70/67, H10W70/68, H10W70/681, H10W70/682, H10W70/685, H10W70/686, H10W70/687, H10W70/69, H10W70/692, H10W70/695, H10W70/698 and H10W70/699. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/60	H10W70/60		24414
H10W70/611	9	{for connecting multiple chips together}<br><br><u>WARNING</u><br>Groups H10W70/611, H10W70/614 and H10W70/616 are incomplete pending reclassification of documents from groups H10W20/40 and H10W70/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/60	H10W70/611		15782
H10W70/614	10	{the multiple chips being integrally enclosed}	H10W70/60	H10W70/614		7360
H10W70/616	10	{package substrates, interposers or redistribution layers combined with bridge chips}	H10W70/60	H10W70/616		3
H10W70/618	11	{the bridge chips being embedded in the package substrates, interposers or redistribution layers}<br><br><u>WARNING</u><br>Group H10W70/618 is incomplete pending reclassification of documents from group H10W70/60. <br>Groups H10W70/60 and H10W70/618 should be considered in order to perform a complete search.	H10W70/60	H10W70/618		617
H10W70/62	9	characterised by their interconnections<br><br><u>WARNING</u><br>Groups H10W70/62, H10W70/63, H10W70/635, H10W70/641 and H10W70/644 are incomplete pending reclassification of documents from groups H10W20/40 and H10W70/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/62	H10W70/62		4
H10W70/63	10	Vias, e.g. via plugs	H10W70/63	H10W70/63		3435
H10W70/635	11	{Through-vias}	H10W70/63	H10W70/63		13763
H10W70/641	10	{Adaptable interconnections, e.g. fuses or antifuses}	H10W70/62	H10W70/641		454
H10W70/644	10	{Elastic or compliant interconnections, e.g. springs, cantilevers or elastic pads}	H10W70/62	H10W70/644		104
H10W70/65	10	Shapes or dispositions of interconnections<br><br><u>WARNING</u><br>Group H10W70/65 is incomplete pending reclassification of documents from groups H10W20/40 and H10W70/60. Group H10W70/65 is also impacted by reclassification into groups H10W70/652, H10W70/6523, H10W70/6525, H10W70/6528, H10W70/654, H10W70/655, H10W70/656, H10W70/6565, H10W70/657 and H10W70/658. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/65	H10W70/65		19807
H10W70/652	11	Cross-sectional shapes<br><br><u>WARNING</u><br>Groups H10W70/652, H10W70/6523, H10W70/6525 and H10W70/6528 are incomplete pending reclassification of documents from groups H10W20/40, H10W70/60 and H10W70/65. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/652	H10W70/652		1927
H10W70/6523	12	{for connecting to pads at different heights at the same side of the package substrate, interposer or RDL}	H10W70/652	H10W70/652		240
H10W70/6525	12	{for securing the interconnections to the substrate, e.g. to prevent peeling}	H10W70/652	H10W70/652		158
H10W70/6528	12	{of the portions that connect to chips, wafers or package parts}	H10W70/652	H10W70/652		1117
H10W70/654	11	Top-view layouts<br><br><u>WARNING</u><br>Groups H10W70/654, H10W70/655 and H10W70/656 are incomplete pending reclassification of documents from groups H10W20/40, H10W70/60 and H10W70/65. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/654	H10W70/654		731
H10W70/655	12	Fan-out layouts	H10W70/655	H10W70/655		4891
H10W70/656	12	Fan-in layouts	H10W70/656	H10W70/656		1466
H10W70/6565	11	{recessed into the surface of the package substrates, interposers, or redistribution layers}<br><br><u>WARNING</u><br>Group H10W70/6565 is incomplete pending reclassification of documents from groups H10W70/60 and H10W70/65. <br>Groups H10W70/60, H10W70/65 and H10W70/6565 should be considered in order to perform a complete search.	H10W70/65	H10W70/656		64
H10W70/657	11	{on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers}<br><br><u>WARNING</u><br>Groups H10W70/657 - H10W70/658 are incomplete pending reclassification of documents from groups H10W20/40, H10W70/60 and H10W70/65. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/65	H10W70/65		1251
H10W70/658	11	{for devices provided for in groups H10D8/00 - H10D48/00}	H10W70/65	H10W70/65		1393
H10W70/66	10	Conductive materials thereof<br><br><u>WARNING</u><br>Group H10W70/66 is incomplete pending reclassification of documents from groups H10W20/40 and H10W70/60. Group H10W70/66 is also impacted by reclassification into groups H10W70/662, H10W70/664, H10W70/666 and H10W70/668. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/66	H10W70/66		2350
H10W70/662	11	{Semiconductor materials}<br><br><u>WARNING</u><br>Groups H10W70/662 - H10W70/668 are incomplete pending reclassification of documents from groups H10W20/40, H10W70/60 and H10W70/66. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/66	H10W70/66		81
H10W70/664	11	{Carbon-based materials, e.g. fullerenes}	H10W70/66	H10W70/66		95
H10W70/666	11	{Organic materials or pastes}	H10W70/66	H10W70/66		539
H10W70/668	11	{Superconducting materials}	H10W70/66	H10W70/66		100
H10W70/67	9	characterised by their insulating layers or insulating parts<br><br><u>WARNING</u><br>Groups H10W70/67, H10W70/68, H10W70/681 and H10W70/682 are incomplete pending reclassification of documents from groups H10W20/40 and H10W70/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/67	H10W70/67		2
H10W70/68	10	Shapes or dispositions thereof	H10W70/68	H10W70/68		7166
H10W70/681	11	{comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage}	H10W70/68	H10W70/68		1683
H10W70/682	11	{comprising holes having chips therein}	H10W70/68	H10W70/68		7410
H10W70/685	11	comprising multiple insulating layers<br><br><u>WARNING</u><br>Group H10W70/685 is incomplete pending reclassification of documents from groups H10W20/40 and H10W70/60. Group H10W70/685 is also impacted by reclassification into groups H10W70/686 and H10W70/687. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/685	H10W70/685		13611
H10W70/686	12	{the multiple insulating layers having different compositions, e.g. polymer layer on glass substrate}<br><br><u>WARNING</u><br>Group H10W70/686 is incomplete pending reclassification of documents from groups H10W70/60, H10W70/685 and H10W70/69. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/685	H10W70/68		64
H10W70/687	12	{characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage}<br><br><u>WARNING</u><br>Group H10W70/687 is incomplete pending reclassification of documents from groups H10W70/60 and H10W70/685. <br>Groups H10W70/60, H10W70/685 and H10W70/687 should be considered in order to perform a complete search.	H10W70/685	H10W70/68		478
H10W70/6875	11	{being on a metallic substrate, e.g. insulated metal substrates [IMS]}	H10W70/68	H10W70/68		1223
H10W70/688	10	{Flexible insulating substrates}<br><br><u>WARNING</u><br>Group H10W70/688 is incomplete pending reclassification of documents from group H10W20/40. <br>Groups H10W20/40 and H10W70/688 should be considered in order to perform a complete search.	H10W70/67	H10W70/68		3283
H10W70/69	10	Insulating materials thereof<br><br><u>WARNING</u><br>Group H10W70/69 is incomplete pending reclassification of documents from groups H10W20/40 and H10W70/60. Group H10W70/69 is also impacted by reclassification into groups H10W70/692, H10W70/695, H10W70/698 and H10W70/686. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/69	H10W70/69		4066
H10W70/692	11	Ceramics or glasses<br><br><u>WARNING</u><br>Groups H10W70/692 - H10W70/698 are incomplete pending reclassification of documents from groups H10W20/40, H10W70/60 and H10W70/69. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W70/692	H10W70/692		3499
H10W70/695	11	Organic materials	H10W70/695	H10W70/695		1766
H10W70/698	11	Semiconductor materials that are electrically insulating, e.g. undoped silicon	H10W70/698	H10W70/698		1455
H10W70/699	9	{for flat cards, e.g. credit cards}<br><br><u>WARNING</u><br>Group H10W70/699 is incomplete pending reclassification of documents from group H10W70/60. <br>Groups H10W70/60 and H10W70/699 should be considered in order to perform a complete search.	H10W70/60	H10W70/69		917
H10W72/00	7	Interconnections or connectors in packages<br><br><u>NOTE</u><br><br>In this group, bond pads in general, i.e. where the nature of a related connector is unspecified or generic to multiple types of connectors, are classified in group H10W72/90. Bond pads specially adapted for a specific type of connector are classified in the group covering the connector type. For example, bond pads specially adapted for wire connectors are classified in group H10W72/59.<br><br><u>WARNING</u><br>Group H10W72/00 is incomplete pending reclassification of documents from groups H10W20/40, H10W72/07232, H10W72/07233 and H10W72/07236. Group H10W72/00 is also impacted by reclassification into groups H10W72/20, H10W72/221, H10W72/222, H10W72/223, H10W72/224, H10W72/225, H10W72/227, H10W72/228, H10W72/231, H10W72/232, H10W72/234, H10W72/235, H10W72/237, H10W72/241, H10W72/242, H10W72/244, H10W72/245, H10W72/247, H10W72/248, H10W72/251, H10W72/252, H10W72/253, H10W72/255, H10W72/257, H10W72/2524, H10W72/2528, H10W72/261, H10W72/263, H10W72/265, H10W72/267, H10W72/281, H10W72/283, H10W72/285, H10W72/287, H10W72/30, H10W72/321, H10W72/322, H10W72/323, H10W72/324, H10W72/325, H10W72/327, H10W72/328, H10W72/331, H10W72/332, H10W72/334, H10W72/335, H10W72/337, H10W72/341, H10W72/342, H10W72/344, H10W72/345, H10W72/347, H10W72/348, H10W72/351, H10W72/352, H10W72/353, H10W72/354, H10W72/355, H10W72/357, H10W72/3524, H10W72/3528, H10W72/361, H10W72/365, H10W72/367, H10W72/381, H10W72/383, H10W72/385, H10W72/387, H10W72/40, H10W72/49, H10W72/50, H10W72/521, H10W72/522, H10W72/523, H10W72/524, H10W72/525, H10W72/527, H10W72/528, H10W72/531, H10W72/533, H10W72/534, H10W72/535, H10W72/537, H10W72/536, H10W72/5363, H10W72/5366, H10W72/5368, H10W72/541, H10W72/543, H10W72/547, H10W72/5434, H10W72/5438, H10W72/5473, H10W72/5475, H10W72/5445, H10W72/5449, H10W72/5453, H10W72/551, H10W72/552, H10W72/5522, H10W72/5524, H10W72/5525, H10W72/553, H10W72/555, H10W72/557, H10W72/5528, H10W72/581, H10W72/583, H10W72/585, H10W72/60, H10W72/621, H10W72/622, H10W72/623, H10W72/624, H10W72/625, H10W72/627, H10W72/631, H10W72/634, H10W72/635, H10W72/637, H10W72/641, H10W72/645, H10W72/647, H10W72/646, H10W72/642, H10W72/643, H10W72/6478, H10W72/651, H10W72/652, H10W72/653, H10W72/6528, H10W72/655, H10W72/657, H10W72/681, H10W72/683, H10W72/685 and H10W72/691. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/00		21228
H10W72/01	8	{Manufacture or treatment}<br><br><u>WARNING</u><br>Group H10W72/01 is impacted by reclassification into groups H10W72/011, H10W72/0112, H10W72/0113, H10W72/0115, H10W72/0116, H10W72/012, H10W72/01204, H10W72/01208, H10W72/01212, H10W72/01215, H10W72/01221, H10W72/01223, H10W72/01225, H10W72/01231, H10W72/01233, H10W72/01235, H10W72/01236, H10W72/01238, H10W72/01251, H10W72/01253, H10W72/01255, H10W72/01257, H10W72/01261, H10W72/01265, H10W72/01271, H10W72/013, H10W72/01304, H10W72/01308, H10W72/01315, H10W72/01321, H10W72/01323, H10W72/01325, H10W72/01331, H10W72/01333, H10W72/01335, H10W72/01336, H10W72/01338, H10W72/01351, H10W72/01353, H10W72/01355, H10W72/01357, H10W72/01359, H10W72/01361, H10W72/01365, H10W72/01371, H10W72/014, H10W72/015, H10W72/01504, H10W72/01515, H10W72/01551, H10W72/01553, H10W72/01561, H10W72/01565, H10W72/01571, H10W72/016, H10W72/01604, H10W72/01615, H10W72/01651, H10W72/01653, H10W72/01661, H10W72/01665, H10W72/01671, H10W72/019, H10W72/01904, H10W72/01908, H10W72/01921, H10W72/01923, H10W72/01925, H10W72/01931, H10W72/01933, H10W72/01935, H10W72/01936, H10W72/01938, H10W72/01951, H10W72/01953, H10W72/01955, H10W72/01961, H10W72/01971 and H10W72/0198. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01		2311
H10W72/011	9	{Apparatus therefor}<br><br><u>WARNING</u><br>Groups H10W72/011, H10W72/0112, H10W72/0113, H10W72/0115 and H10W72/0116 are incomplete pending reclassification of documents from group H10W72/01. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/011		645
H10W72/0112	10	{Apparatus for manufacturing bump connectors}	H10W72/00	H10W72/0112		914
H10W72/0113	10	{Apparatus for manufacturing die-attach connectors}	H10W72/00	H10W72/0113		1804
H10W72/0115	10	{Apparatus for manufacturing bond wires}	H10W72/00	H10W72/0115		263
H10W72/0116	10	{Apparatus for manufacturing strap connectors}	H10W72/00	H10W72/0116		159
H10W72/012	9	{of bump connectors, dummy bumps or thermal bumps}<br><br><u>WARNING</u><br>Group H10W72/012 is incomplete pending reclassification of documents from group H10W72/01. Group H10W72/012 is also impacted by reclassification into groups H10W72/01204, H10W72/01208, H10W72/01212, H10W72/01215, H10W72/01221, H10W72/01223, H10W72/01225, H10W72/01231, H10W72/01233, H10W72/01235, H10W72/01236, H10W72/01238, H10W72/01251, H10W72/01253, H10W72/01255, H10W72/01257, H10W72/01261, H10W72/01265 and H10W72/01271. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/012		12234
H10W72/01204	10	{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}<br><br><u>WARNING</u><br>Groups H10W72/01204 - H10W72/01215 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/012. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01204		1264
H10W72/01208	10	{using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks}	H10W72/00	H10W72/01208		298
H10W72/01212	10	{at a different location than on the final device, e.g. forming as prepeg}	H10W72/00	H10W72/01212		649
H10W72/01215	10	{forming coatings}	H10W72/00	H10W72/01215		679
H10W72/01221	10	{using local deposition}<br><br><u>WARNING</u><br>Groups H10W72/01221, H10W72/01223 and H10W72/01225 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/012. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01221		57
H10W72/01223	11	{in liquid form, e.g. by dispensing droplets or by screen printing}	H10W72/00	H10W72/01223		998
H10W72/01225	11	{in solid form, e.g. by using a powder or by stud bumping}	H10W72/00	H10W72/01225		3326
H10W72/01231	10	{using blanket deposition}<br><br><u>WARNING</u><br>Groups H10W72/01231, H10W72/01233, H10W72/01235, H10W72/01236 and H10W72/01238 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/012. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01231		212
H10W72/01233	11	{in liquid form, e.g. spin coating, spray coating or immersion coating}	H10W72/00	H10W72/01233		138
H10W72/01235	12	{by plating, e.g. electroless plating or electroplating}	H10W72/00	H10W72/01235		2116
H10W72/01236	11	{in solid form, e.g. by using a powder or by laminating a foil}	H10W72/00	H10W72/01236		126
H10W72/01238	11	{in gaseous form, e.g. by CVD or PVD}	H10W72/00	H10W72/01238		543
H10W72/01251	10	{Changing the shapes of bumps}<br><br><u>WARNING</u><br>Groups H10W72/01251, H10W72/01253, H10W72/01255 and H10W72/01257 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/012. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01251		828
H10W72/01253	11	{by etching}	H10W72/00	H10W72/01253		182
H10W72/01255	11	{by using masks}	H10W72/00	H10W72/01255		2681
H10W72/01257	11	{by reflowing}	H10W72/00	H10W72/01257		1519
H10W72/01261	10	{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01251)}<br><br><u>WARNING</u><br>Groups H10W72/01261 - H10W72/01271 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/012. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01261		327
H10W72/01265	10	{Thermally treating (reflowing H10W72/01257)}	H10W72/00	H10W72/01265		133
H10W72/01271	10	{Cleaning, e.g. oxide removal or de-smearing}	H10W72/00	H10W72/01271		727
H10W72/013	9	{of die-attach connectors}<br><br><u>WARNING</u><br>Group H10W72/013 is incomplete pending reclassification of documents from group H10W72/01. Group H10W72/013 is also impacted by reclassification into groups H10W72/01304, H10W72/01308, H10W72/01315, H10W72/01321, H10W72/01323, H10W72/01325, H10W72/01331, H10W72/01333, H10W72/01335, H10W72/01336, H10W72/01338, H10W72/01351, H10W72/01353, H10W72/01355, H10W72/01357, H10W72/01359, H10W72/01361, H10W72/01365 and H10W72/01371. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/013		2937
H10W72/01304	10	{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}<br><br><u>WARNING</u><br>Groups H10W72/01304 - H10W72/01315 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/013. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01304		397
H10W72/01308	10	{using permanent auxiliary members, e.g. using alignment marks}	H10W72/00	H10W72/01308		1170
H10W72/01315	10	{Forming coatings}	H10W72/00	H10W72/01315		156
H10W72/01321	10	{using local deposition}<br><br><u>WARNING</u><br>Groups H10W72/01321, H10W72/01323 and H10W72/01325 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/013. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01321		14
H10W72/01323	11	{in liquid form, e.g. by dispensing droplets or by screen printing}	H10W72/00	H10W72/01323		671
H10W72/01325	11	{in solid form}	H10W72/00	H10W72/01325		375
H10W72/01331	10	{using blanket deposition}<br><br><u>WARNING</u><br>Groups H10W72/01331, H10W72/01333, H10W72/01335, H10W72/01336 and H10W72/01338 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/013. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01331		942
H10W72/01333	11	{in liquid form, e.g. spin coating, spray coating or immersion coating}	H10W72/00	H10W72/01333		289
H10W72/01335	12	{by plating, e.g. electroless plating or electroplating}	H10W72/00	H10W72/01335		202
H10W72/01336	11	{in solid form, e.g. by using a powder or by laminating a foil}	H10W72/00	H10W72/01336		584
H10W72/01338	11	{in gaseous form, e.g. by CVD or PVD}	H10W72/00	H10W72/01338		188
H10W72/01351	10	{Changing the shapes of die-attach connectors}<br><br><u>WARNING</u><br>Groups H10W72/01351, H10W72/01353, H10W72/01355, H10W72/01357 and H10W72/01359 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/013. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01351		377
H10W72/01353	11	{by etching}	H10W72/00	H10W72/01353		150
H10W72/01355	11	{by use of masks}	H10W72/00	H10W72/01355		57
H10W72/01357	11	{by reflowing or heating}	H10W72/00	H10W72/01357		78
H10W72/01359	11	{by planarisation, e.g. chemical-mechanical polishing [CMP]}	H10W72/00	H10W72/01359		39
H10W72/01361	10	{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01351)}<br><br><u>WARNING</u><br>Groups H10W72/01361 - H10W72/01371 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/013. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01361		232
H10W72/01365	10	{Thermally treating (reflowing H10W72/01357)}	H10W72/00	H10W72/01365		532
H10W72/01371	10	{Cleaning, e.g. oxide removal or de-smearing}	H10W72/00	H10W72/01371		260
H10W72/014	9	{of anisotropic conductive adhesives}<br><br><u>WARNING</u><br>Group H10W72/014 is incomplete pending reclassification of documents from groups H10W72/01 and H10W72/30. <br>Groups H10W72/01, H10W72/30 and H10W72/014 should be considered in order to perform a complete search.	H10W72/00	H10W72/014		
H10W72/015	9	{of bond wires}<br><br><u>WARNING</u><br>Group H10W72/015 is incomplete pending reclassification of documents from group H10W72/01. Group H10W72/015 is also impacted by reclassification into groups H10W72/01504, H10W72/01515, H10W72/01551, H10W72/01553, H10W72/01561, H10W72/01565 and H10W72/01571. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/015		2305
H10W72/01504	10	{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}<br><br><u>WARNING</u><br>Groups H10W72/01504 - H10W72/01571 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/015. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01504		8
H10W72/01515	10	{Forming coatings}	H10W72/00	H10W72/01515		4670
H10W72/01551	10	{Changing the shapes of bond wires}	H10W72/00	H10W72/01551		2440
H10W72/01553	11	{by etching}	H10W72/00	H10W72/01553		13
H10W72/01561	10	{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01551)}	H10W72/00	H10W72/01561		57
H10W72/01565	10	{Thermally treating}	H10W72/00	H10W72/01565		562
H10W72/01571	10	{Cleaning, e.g. oxide removal or de-smearing}	H10W72/00	H10W72/01571		389
H10W72/016	9	{of strap connectors}<br><br><u>WARNING</u><br>Group H10W72/016 is incomplete pending reclassification of documents from group H10W72/01. Group H10W72/016 is also impacted by reclassification into groups H10W72/01604, H10W72/01615, H10W72/01651, H10W72/01653, H10W72/01661, H10W72/01665 and H10W72/01671. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/016		732
H10W72/01604	10	{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}<br><br><u>WARNING</u><br>Groups H10W72/01604 - H10W72/01671 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/016. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01604		4
H10W72/01615	10	{Forming coatings}	H10W72/00	H10W72/01615		38
H10W72/01651	10	{Changing the shapes of strap connectors}	H10W72/00	H10W72/01651		20
H10W72/01653	11	{by etching}	H10W72/00	H10W72/01653		11
H10W72/01661	10	{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01651)}	H10W72/00	H10W72/01661		33
H10W72/01665	10	{Thermally treating}	H10W72/00	H10W72/01665		
H10W72/01671	10	{Cleaning, e.g. oxide removal or de-smearing}	H10W72/00	H10W72/01671		11
H10W72/019	9	{of bond pads}<br><br><u>WARNING</u><br>Group H10W72/019 is incomplete pending reclassification of documents from group H10W72/01. Group H10W72/019 is also impacted by reclassification into groups H10W72/01904, H10W72/01908, H10W72/01921, H10W72/01923, H10W72/01925, H10W72/01931, H10W72/01933, H10W72/01935, H10W72/01936, H10W72/01938, H10W72/01951, H10W72/01953, H10W72/01955, H10W72/01961 and H10W72/01971. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/019		8308
H10W72/01904	10	{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}<br><br><u>WARNING</u><br>Groups H10W72/01904 - H10W72/01908 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/019. <br>Groups H10W72/01, H10W72/019 and H10W72/01904 should be considered in order to perform a complete search.	H10W72/00	H10W72/01904		518
H10W72/01908	10	{using permanent auxiliary members, e.g. using alignment marks}	H10W72/00	H10W72/01908		234
H10W72/01921	10	{using local deposition}<br><br><u>WARNING</u><br>Groups H10W72/01921, H10W72/01923 and H10W72/01925 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/019. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01921		34
H10W72/01923	11	{in liquid form, e.g. by dispensing droplets or by screen printing}	H10W72/00	H10W72/01923		160
H10W72/01925	11	{in solid form}	H10W72/00	H10W72/01925		124
H10W72/01931	10	{using blanket deposition}<br><br><u>WARNING</u><br>Groups H10W72/01931, H10W72/01933, H10W72/01935, H10W72/01936 and H10W72/01938 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/019. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01931		209
H10W72/01933	11	{in liquid form, e.g. spin coating, spray coating or immersion coating}	H10W72/00	H10W72/01933		103
H10W72/01935	12	{by plating, e.g. electroless plating or electroplating}	H10W72/00	H10W72/01935		1713
H10W72/01936	11	{in solid form, e.g. by using a powder or by laminating a foil}	H10W72/00	H10W72/01936		118
H10W72/01938	11	{in gaseous form, e.g. by CVD or PVD}	H10W72/00	H10W72/01938		1571
H10W72/01951	10	{Changing the shapes of bond pads}<br><br><u>WARNING</u><br>Groups H10W72/01951, H10W72/01953 and H10W72/01955 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/019. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01951		1005
H10W72/01953	11	{by etching}	H10W72/00	H10W72/01953		1189
H10W72/01955	11	{by using masks}	H10W72/00	H10W72/01955		729
H10W72/01961	10	{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01951)}<br><br><u>WARNING</u><br>Groups H10W72/01961 - H10W72/01971 are incomplete pending reclassification of documents from groups H10W72/01 and H10W72/019. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/01961		239
H10W72/01971	10	{Cleaning, e.g. oxide removal}	H10W72/00	H10W72/01971		208
H10W72/0198	9	{batch processes}<br><br><u>WARNING</u><br>Group H10W72/0198 is incomplete pending reclassification of documents from group H10W72/01. <br>Groups H10W72/01 and H10W72/0198 should be considered in order to perform a complete search.	H10W72/00	H10W72/0198		25011
H10W72/071	8	{Connecting or disconnecting}	H10W72/00	H10W72/071		8535
H10W72/0711	9	{Apparatus therefor}	H10W72/00	H10W72/0711		12965
H10W72/07113	10	{Means for calibration}	H10W72/00	H10W72/07113		52
H10W72/07118	10	{Means for cleaning, e.g. brushes}	H10W72/00	H10W72/07118		302
H10W72/07125	10	{Means for controlling the bonding environment, e.g. valves or vacuum pumps}	H10W72/00	H10W72/07125		406
H10W72/07131	10	{Means for applying material, e.g. for deposition or forming coatings}	H10W72/00	H10W72/07131		490
H10W72/07139	10	{Means for protection against electrical discharge}	H10W72/00	H10W72/07139		12
H10W72/07141	10	{Means for applying energy, e.g. ovens or lasers}	H10W72/00	H10W72/07141		10128
H10W72/07152	10	{Means for cooling}	H10W72/00	H10W72/07152		192
H10W72/07163	10	{Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling}	H10W72/00	H10W72/07163		273
H10W72/07168	10	{Means for storing or moving the material for the connector}	H10W72/00	H10W72/07168		1251
H10W72/07173	10	{Means for moving chips, wafers or other parts, e.g. conveyor belts}	H10W72/00	H10W72/07173		1540
H10W72/07178	10	{Means for aligning}	H10W72/00	H10W72/07178		2287
H10W72/07183	10	{Means for monitoring}	H10W72/00	H10W72/07183		866
H10W72/07188	10	{Apparatus chuck}	H10W72/00	H10W72/07188		254
H10W72/072	9	{of bump connectors}	H10W72/00	H10W72/072		15723
H10W72/07202	10	{using auxiliary members}	H10W72/00	H10W72/07202		260
H10W72/07204	11	{using temporary auxiliary members, e.g. sacrificial coatings}<br><br><u>WARNING</u><br>Group H10W72/07204 is impacted by reclassification into group H10W72/07207. <br>Groups H10W72/07204 and H10W72/07207 should be considered in order to perform a complete search.	H10W72/00	H10W72/07204		513
H10W72/07207	12	{Temporary substrates, e.g. removable substrates}<br><br><u>WARNING</u><br>Group H10W72/07207 is incomplete pending reclassification of documents from group H10W72/07204. <br>Groups H10W72/07204 and H10W72/07207 should be considered in order to perform a complete search.	H10W72/00	H10W72/07207		1604
H10W72/07211	10	{Treating the bond pad before connecting, e.g. by applying flux or cleaning}	H10W72/00	H10W72/07211		383
H10W72/07221	10	{Aligning}	H10W72/00	H10W72/07221		319
H10W72/07223	11	{Active alignment, e.g. using optical alignment using marks or sensors}	H10W72/00	H10W72/07223		572
H10W72/07227	11	{involving guiding structures, e.g. spacers or supporting members}	H10W72/00	H10W72/07227		1132
H10W72/07231	10	{Techniques}	H10W72/00	H10W72/07231		974
H10W72/07232	11	{Compression bonding, e.g. thermocompression bonding}<br><br><u>WARNING</u><br>Group H10W72/07232 is impacted by reclassification into groups H10W72/00, H10W72/07332, H10W72/07532, H10W72/07632 and H10W95/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/07232		2151
H10W72/07233	12	{Ultrasonic bonding, e.g. thermosonic bonding}<br><br><u>WARNING</u><br>Group H10W72/07233 is impacted by reclassification into groups H10W72/00, H10W72/07333, H10W72/07533, H10W72/07633 and H10W95/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/07233		607
H10W72/07234	11	{Using a reflow oven}	H10W72/00	H10W72/07234		740
H10W72/07235	11	{Applying EM radiation, e.g. induction heating or using a laser}	H10W72/00	H10W72/07235		457
H10W72/07236	11	{Soldering or alloying}<br><br><u>WARNING</u><br>Group H10W72/07236 is impacted by reclassification into groups H10W72/00, H10W72/07336, H10W72/07536, H10W72/07636 and H10W95/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/07236		8753
H10W72/07237	11	{using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}	H10W72/00	H10W72/07237		252
H10W72/07241	10	{Controlling the environment, e.g. atmosphere composition or temperature}	H10W72/00	H10W72/07241		5
H10W72/07251	10	{characterised by changes in properties of the bump connectors during connecting}	H10W72/00	H10W72/07251		10869
H10W72/07252	11	{changes in structures or sizes}	H10W72/00	H10W72/07252		1460
H10W72/07253	11	{changes in shapes}	H10W72/00	H10W72/07253		1097
H10W72/07254	11	{changes in dispositions}	H10W72/00	H10W72/07254		3119
H10W72/07255	11	{changes in materials}	H10W72/00	H10W72/07255		503
H10W72/07261	10	{with the bump connectors facing upwards, i.e. not in flip-chip orientation}	H10W72/00	H10W72/07261		11
H10W72/073	9	{of die-attach connectors}	H10W72/00	H10W72/073		26455
H10W72/07302	10	{using an auxiliary member}	H10W72/00	H10W72/07302		231
H10W72/07304	11	{the auxiliary member being temporary, e.g. a sacrificial coating}	H10W72/00	H10W72/07304		485
H10W72/07307	12	{the auxiliary member being a temporary substrate, e.g. a removable substrate}	H10W72/00	H10W72/07307		1071
H10W72/07311	10	{Treating the bonding area before connecting, e.g. by applying flux or cleaning}	H10W72/00	H10W72/07311		1316
H10W72/07321	10	{Aligning}	H10W72/00	H10W72/07321		192
H10W72/07323	11	{Active alignment, e.g. using optical alignment using marks or sensors}	H10W72/00	H10W72/07323		435
H10W72/07327	11	{involving guiding structures, e.g. spacers or supporting members}	H10W72/00	H10W72/07327		832
H10W72/07331	10	{Connecting techniques}	H10W72/00	H10W72/07331		5194
H10W72/07332	11	{Compression bonding, e.g. thermocompression bonding}<br><br><u>WARNING</u><br>Group H10W72/07332 is incomplete pending reclassification of documents from group H10W72/07232. <br>Groups H10W72/07232 and H10W72/07332 should be considered in order to perform a complete search.	H10W72/00	H10W72/07332		1637
H10W72/07333	12	{Ultrasonic bonding, e.g. thermosonic bonding}<br><br><u>WARNING</u><br>Group H10W72/07333 is incomplete pending reclassification of documents from group H10W72/07233. <br>Groups H10W72/07233 and H10W72/07333 should be considered in order to perform a complete search.	H10W72/00	H10W72/07333		188
H10W72/07334	11	{Using a reflow oven}	H10W72/00	H10W72/07334		221
H10W72/07335	11	{Applying EM radiation, e.g. induction heating or using a laser}	H10W72/00	H10W72/07335		281
H10W72/07336	11	{Soldering or alloying}<br><br><u>WARNING</u><br>Group H10W72/07336 is incomplete pending reclassification of documents from group H10W72/07236. <br>Groups H10W72/07236 and H10W72/07336 should be considered in order to perform a complete search.	H10W72/00	H10W72/07336		4943
H10W72/07337	11	{using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}	H10W72/00	H10W72/07337		3648
H10W72/07338	12	{hardening the adhesive by curing, e.g. thermosetting}	H10W72/00	H10W72/07338		2325
H10W72/07339	12	{hardening the adhesive by cooling, e.g. thermoplastics}	H10W72/00	H10W72/07339		187
H10W72/07341	10	{Controlling the bonding environment, e.g. atmosphere composition or temperature}	H10W72/00	H10W72/07341		642
H10W72/07351	10	{characterised by changes in properties of the die-attach connectors during connecting}	H10W72/00	H10W72/07351		982
H10W72/07352	11	{changes in structures or sizes}	H10W72/00	H10W72/07352		1974
H10W72/07353	11	{changes in shapes}	H10W72/00	H10W72/07353		1434
H10W72/07354	11	{changes in dispositions}	H10W72/00	H10W72/07354		3041
H10W72/07355	11	{changes in materials}	H10W72/00	H10W72/07355		661
H10W72/074	9	{of anisotropic conductive adhesives}<br><br><u>WARNING</u><br>Group H10W72/074 is incomplete pending reclassification of documents from group H10W72/30. <br>Groups H10W72/30 and H10W72/074 should be considered in order to perform a complete search.	H10W72/00	H10W72/074		1523
H10W72/075	9	{of bond wires}	H10W72/00	H10W72/075		22142
H10W72/07502	10	{using an auxiliary member}	H10W72/00	H10W72/07502		1564
H10W72/07504	11	{the auxiliary member being temporary, e.g. a sacrificial coating}	H10W72/00	H10W72/07504		470
H10W72/07507	12	{the auxiliary member being a temporary substrate, e.g. a removable substrate}	H10W72/00	H10W72/07507		223
H10W72/07511	10	{Treating the bonding area before connecting, e.g. by applying flux or cleaning}	H10W72/00	H10W72/07511		2765
H10W72/07521	10	{Aligning}	H10W72/00	H10W72/07521		3550
H10W72/07523	11	{Active alignment, e.g. using optical alignment using marks or sensors}	H10W72/00	H10W72/07523		144
H10W72/07527	11	{involving guiding structures, e.g. spacers or supporting members}	H10W72/00	H10W72/07527		29
H10W72/07531	10	{Techniques}	H10W72/00	H10W72/07531		1203
H10W72/07532	11	{Compression bonding, e.g. thermocompression bonding}<br><br><u>WARNING</u><br>Group H10W72/07532 is incomplete pending reclassification of documents from group H10W72/07232. <br>Groups H10W72/07232 and H10W72/07532 should be considered in order to perform a complete search.	H10W72/00	H10W72/07532		1463
H10W72/07533	12	{Ultrasonic bonding, e.g. thermosonic bonding}<br><br><u>WARNING</u><br>Group H10W72/07533 is incomplete pending reclassification of documents from group H10W72/07233. <br>Groups H10W72/07233 and H10W72/07533 should be considered in order to perform a complete search.	H10W72/00	H10W72/07533		4464
H10W72/07535	11	{Applying EM radiation, e.g. induction heating or using a laser}	H10W72/00	H10W72/07535		205
H10W72/07536	11	{Soldering or alloying}<br><br><u>WARNING</u><br>Group H10W72/07536 is incomplete pending reclassification of documents from group H10W72/07236. <br>Groups H10W72/07236 and H10W72/07536 should be considered in order to perform a complete search.	H10W72/00	H10W72/07536		319
H10W72/07537	11	{using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}	H10W72/00	H10W72/07537		66
H10W72/07541	10	{Controlling the environment, e.g. atmosphere composition or temperature}	H10W72/00	H10W72/07541		552
H10W72/07551	10	{characterised by changes in properties of the bond wires during the connecting}	H10W72/00	H10W72/07551		6880
H10W72/07552	11	{changes in structures or sizes}	H10W72/00	H10W72/07552		1937
H10W72/07553	11	{changes in shapes}	H10W72/00	H10W72/07553		2532
H10W72/07554	11	{changes in dispositions}	H10W72/00	H10W72/07554		8184
H10W72/07555	11	{changes in materials}	H10W72/00	H10W72/07555		470
H10W72/076	9	{of strap connectors}	H10W72/00	H10W72/076		1039
H10W72/07602	10	{using an auxiliary member}	H10W72/00	H10W72/07602		23
H10W72/07604	11	{the auxiliary member being temporary, e.g. a sacrificial coating}	H10W72/00	H10W72/07604		22
H10W72/07607	12	{the auxiliary member being a temporary substrate, e.g. a removable substrate}	H10W72/00	H10W72/07607		16
H10W72/07611	10	{Treating the bonding area before connecting, e.g. by applying flux or cleaning}	H10W72/00	H10W72/07611		26
H10W72/07621	10	{Aligning}	H10W72/00	H10W72/07621		18
H10W72/07623	11	{Active alignment, e.g. using optical alignment using marks or sensors}	H10W72/00	H10W72/07623		5
H10W72/07627	11	{involving guiding structures, e.g. spacers or supporting members}	H10W72/00	H10W72/07627		54
H10W72/07631	10	{Techniques}	H10W72/00	H10W72/07631		284
H10W72/07632	11	{Compression bonding, e.g. thermocompression bonding}<br><br><u>WARNING</u><br>Group H10W72/07632 is incomplete pending reclassification of documents from group H10W72/07232. <br>Groups H10W72/07232 and H10W72/07632 should be considered in order to perform a complete search.	H10W72/00	H10W72/07632		56
H10W72/07633	12	{Ultrasonic bonding, e.g. thermosonic bonding}<br><br><u>WARNING</u><br>Group H10W72/07633 is incomplete pending reclassification of documents from group H10W72/07233. <br>Groups H10W72/07233 and H10W72/07633 should be considered in order to perform a complete search.	H10W72/00	H10W72/07633		186
H10W72/07635	11	{Applying EM radiation, e.g. induction heating or using a laser}	H10W72/00	H10W72/07635		100
H10W72/07636	11	{Soldering or alloying}<br><br><u>WARNING</u><br>Group H10W72/07636 is incomplete pending reclassification of documents from group H10W72/07236. <br>Groups H10W72/07236 and H10W72/07636 should be considered in order to perform a complete search.	H10W72/00	H10W72/07636		1762
H10W72/07637	11	{using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}	H10W72/00	H10W72/07637		547
H10W72/07641	10	{Controlling the environment, e.g. atmosphere composition or temperature}	H10W72/00	H10W72/07641		13
H10W72/07651	10	{characterised by changes in properties of the strap connectors during connecting}	H10W72/00	H10W72/07651		1018
H10W72/07652	11	{changes in structures or sizes}	H10W72/00	H10W72/07652		268
H10W72/07653	11	{changes in shapes}	H10W72/00	H10W72/07653		1236
H10W72/07654	11	{changes in dispositions}	H10W72/00	H10W72/07654		70
H10W72/07655	11	{changes in materials}	H10W72/00	H10W72/07655		22
H10W72/077	9	{Connecting of TAB connectors}	H10W72/00	H10W72/077		974
H10W72/20	8	Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps<br><br><u>WARNING</u><br>Group H10W72/20 is incomplete pending reclassification of documents from group H10W72/00. Group H10W72/20 is also impacted by reclassification into groups H10W72/221, H10W72/222, H10W72/223, H10W72/224, H10W72/225, H10W72/227, H10W72/228, H10W72/231, H10W72/232, H10W72/234, H10W72/235, H10W72/237, H10W72/241, H10W72/242, H10W72/244, H10W72/245, H10W72/247, H10W72/248, H10W72/251, H10W72/252, H10W72/253, H10W72/255, H10W72/257, H10W72/2524, H10W72/2528, H10W72/261, H10W72/263, H10W72/265, H10W72/267, H10W72/281, H10W72/283, H10W72/285, H10W72/287, H10W72/60, H10W72/621, H10W72/622, H10W72/623, H10W72/624, H10W72/625, H10W72/627, H10W72/631, H10W72/634, H10W72/635, H10W72/637, H10W72/641, H10W72/645, H10W72/647, H10W72/642, H10W72/643, H10W72/646, H10W72/6478, H10W72/651, H10W72/652, H10W72/653, H10W72/6528, H10W72/655, H10W72/657, H10W72/681, H10W72/683, H10W72/685 and H10W72/691. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/20	H10W72/20		28215
H10W72/221	9	{Structures or relative sizes}<br><br><u>WARNING</u><br>Groups H10W72/221, H10W72/222, H10W72/223, H10W72/224, H10W72/225, H10W72/227 and H10W72/228 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/20	H10W72/221		2559
H10W72/222	10	{Multilayered bumps, e.g. a coating on top and side surfaces of a bump core}	H10W72/20	H10W72/222		2734
H10W72/223	11	{characterised by the structure of the outermost layers, e.g. multilayered coatings}	H10W72/20	H10W72/223		752
H10W72/224	10	{Bumps having multiple side-by-side cores}	H10W72/20	H10W72/224		390
H10W72/225	10	{Bumps having a filler embedded in a matrix}	H10W72/20	H10W72/225		737
H10W72/227	10	{Multiple bumps having different sizes}	H10W72/20	H10W72/227		2387
H10W72/228	10	{Multiple bumps having different structures}	H10W72/20	H10W72/228		129
H10W72/231	9	{Shapes}<br><br><u>WARNING</u><br>Groups H10W72/231, H10W72/232, H10W72/234, H10W72/235 and H10W72/237 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/20	H10W72/231		380
H10W72/232	10	{Plan-view shape, i.e. in top view}	H10W72/20	H10W72/232		1203
H10W72/234	10	{Cross-sectional shape, i.e. in side view}	H10W72/20	H10W72/234		2226
H10W72/235	10	{of outermost layers of multilayered bumps, e.g. bump coating not being conformal on a bump core}	H10W72/20	H10W72/235		100
H10W72/237	10	{Multiple bump connectors having different shapes}	H10W72/20	H10W72/237		745
H10W72/241	9	{Dispositions, e.g. layouts}<br><br><u>WARNING</u><br>Groups H10W72/241, H10W72/242, H10W72/244, H10W72/245, H10W72/247 and H10W72/248 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/20	H10W72/241		11441
H10W72/242	10	{relative to the surface, e.g. recessed, protruding}	H10W72/20	H10W72/242		3625
H10W72/244	10	{relative to underlying supporting features, e.g. bond pads, RDLs or vias}	H10W72/20	H10W72/244		4452
H10W72/245	10	{of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core}	H10W72/20	H10W72/245		656
H10W72/247	10	{Dispositions of multiple bumps}	H10W72/20	H10W72/247		2708
H10W72/248	11	{Top-view layouts, e.g. mirror arrays}	H10W72/20	H10W72/248		2579
H10W72/251	9	{Materials}<br><br><u>WARNING</u><br>Groups H10W72/251, H10W72/252, H10W72/2524, H10W72/2528, H10W72/253, H10W72/255 and H10W72/257 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/20	H10W72/251		5423
H10W72/252	10	{comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}	H10W72/20	H10W72/252		14065
H10W72/2524	11	{Eutectic alloys}	H10W72/20	H10W72/2524		59
H10W72/2528	11	{Intermetallic compounds}	H10W72/20	H10W72/2528		262
H10W72/253	10	{not comprising solid metals or solid metalloids, e.g. polymers or ceramics}	H10W72/20	H10W72/253		1054
H10W72/255	10	{of outermost layers of multilayered bumps, e.g. material of a coating}	H10W72/20	H10W72/255		1250
H10W72/257	10	{Multiple bump connectors having different materials}	H10W72/20	H10W72/257		267
H10W72/261	9	{Functions other than electrical connecting}<br><br><u>WARNING</u><br>Groups H10W72/261, H10W72/263, H10W72/265 and H10W72/267 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/20	H10W72/261		524
H10W72/263	10	{Providing mechanical bonding or support, e.g. dummy bumps}	H10W72/20	H10W72/263		335
H10W72/265	10	{Providing thermal transfer, e.g. thermal bumps}	H10W72/20	H10W72/265		173
H10W72/267	10	{Multiple bump connectors having different functions}	H10W72/20	H10W72/267		665
H10W72/281	9	{Auxiliary members}<br><br><u>WARNING</u><br>Groups H10W72/281, H10W72/283, H10W72/285 and H10W72/287 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/20. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/20	H10W72/281		102
H10W72/283	10	{Reinforcing structures, e.g. bump collars}	H10W72/20	H10W72/283		762
H10W72/285	10	{Alignment aids, e.g. alignment marks}	H10W72/20	H10W72/285		351
H10W72/287	10	{Flow barriers}	H10W72/20	H10W72/287		414
H10W72/29	9	Bond pads specially adapted therefor	H10W72/29	H10W72/29		11499
H10W72/30	8	Die-attach connectors<br><br><u>WARNING</u><br>Group H10W72/30 is incomplete pending reclassification of documents from group H10W72/00. Group H10W72/30 is also impacted by reclassification into groups H10W72/014, H10W72/074, H10W72/321, H10W72/322, H10W72/323, H10W72/324, H10W72/325, H10W72/327, H10W72/328, H10W72/331, H10W72/332, H10W72/334, H10W72/335, H10W72/337, H10W72/341, H10W72/342, H10W72/344, H10W72/345, H10W72/347, H10W72/348, H10W72/351, H10W72/352, H10W72/353, H10W72/354, H10W72/355, H10W72/357, H10W72/3524, H10W72/3528, H10W72/361, H10W72/365, H10W72/367, H10W72/381, H10W72/383, H10W72/385, H10W72/387, H10W72/40 and H10W72/49. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/30	H10W72/30		14695
H10W72/321	9	{Structures or relative sizes of die-attach connectors}<br><br><u>WARNING</u><br>Groups H10W72/321, H10W72/322, H10W72/323, H10W72/324, H10W72/325, H10W72/327 and H10W72/328 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/30. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/30	H10W72/321		2419
H10W72/322	10	{Multilayered die-attach connectors, e.g. a coating on a top surface of a core}	H10W72/30	H10W72/322		803
H10W72/323	11	{characterised by the structures of the outermost layers, e.g. multilayered coatings}	H10W72/30	H10W72/323		41
H10W72/324	10	{Die-attach connectors having multiple side-by-side cores}	H10W72/30	H10W72/324		169
H10W72/325	10	{Die-attach connectors having a filler embedded in a matrix}	H10W72/30	H10W72/325		5497
H10W72/327	10	{Multiple die-attach connectors having different sizes}	H10W72/30	H10W72/327		251
H10W72/328	10	{Multiple die-attach connectors having different structures}	H10W72/30	H10W72/328		27
H10W72/331	9	{Shapes of die-attach connectors}<br><br><u>WARNING</u><br>Groups H10W72/331, H10W72/332, H10W72/334, H10W72/335 and H10W72/337 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/30. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/30	H10W72/331		639
H10W72/332	10	{Plan-view shape, i.e. in top view}	H10W72/30	H10W72/332		526
H10W72/334	10	{Cross-sectional shape, i.e. in side view}	H10W72/30	H10W72/334		1497
H10W72/335	10	{of outermost layers of multilayered die-attach connectors, e.g. coating not being conformal on a core}	H10W72/30	H10W72/335		9
H10W72/337	10	{Multiple die-attach connectors having different shapes}	H10W72/30	H10W72/337		117
H10W72/341	9	{Dispositions of die-attach connectors, e.g. layouts}<br><br><u>WARNING</u><br>Groups H10W72/341, H10W72/342, H10W72/344, H10W72/345, H10W72/347 and H10W72/348 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/30. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/30	H10W72/341		150
H10W72/342	10	{relative to the surface, e.g. recessed, protruding}	H10W72/30	H10W72/342		260
H10W72/344	10	{relative to underlying supporting features, e.g. bond pads, RDLs or vias}	H10W72/30	H10W72/344		650
H10W72/345	10	{of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core}	H10W72/30	H10W72/345		47
H10W72/347	10	{Dispositions of multiple die-attach connectors}	H10W72/30	H10W72/347		2751
H10W72/348	11	{Top-view layouts, e.g. mirror arrays}	H10W72/30	H10W72/348		235
H10W72/351	9	{Materials of die-attach connectors}<br><br><u>WARNING</u><br>Groups H10W72/351, H10W72/352, H10W72/3524, H10W72/3528, H10W72/353, H10W72/354, H10W72/355 and H10W72/357 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/30. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/30	H10W72/351		2084
H10W72/352	10	{comprising metals or metalloids, e.g. solders}	H10W72/30	H10W72/352		8515
H10W72/3524	11	{Eutectic alloys}	H10W72/30	H10W72/3524		105
H10W72/3528	11	{Intermetallic compounds}	H10W72/30	H10W72/3528		224
H10W72/353	10	{not comprising solid metals or solid metalloids, e.g. ceramics}	H10W72/30	H10W72/353		2169
H10W72/354	11	{comprising polymers}	H10W72/30	H10W72/354		8904
H10W72/355	10	{of outermost layers of multilayered die-attach connectors, e.g. material of a coating}	H10W72/30	H10W72/355		189
H10W72/357	10	{Multiple die-attach connectors having different materials}	H10W72/30	H10W72/357		214
H10W72/361	9	{Functions of die-attach connectors, other than mechanically connecting}<br><br><u>WARNING</u><br>Groups H10W72/361, H10W72/365 and H10W72/367 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/30. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/30	H10W72/361		
H10W72/365	10	{Providing thermal transfer}	H10W72/30	H10W72/365		40
H10W72/367	10	{Multiple die-attach connectors having different functions}	H10W72/30	H10W72/367		73
H10W72/381	9	{Auxiliary members}<br><br><u>WARNING</u><br>Groups H10W72/381, H10W72/383, H10W72/385 and H10W72/387 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/30. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/30	H10W72/381		1588
H10W72/383	10	{Reinforcing structures, e.g. collars}	H10W72/30	H10W72/383		64
H10W72/385	10	{Alignment aids, e.g. alignment marks}	H10W72/30	H10W72/385		77
H10W72/387	10	{Flow barriers}	H10W72/30	H10W72/387		1365
H10W72/40	8	Anisotropic conductive adhesives<br><br><u>WARNING</u><br>Groups H10W72/40 and H10W72/49 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/30. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/40	H10W72/40		
H10W72/49	9	Bond pads specially adapted therefor	H10W72/49	H10W72/49		
H10W72/50	8	Bond wires<br><br><u>WARNING</u><br>Group H10W72/50 is incomplete pending reclassification of documents from group H10W72/00. Group H10W72/50 is also impacted by reclassification into groups H10W72/521, H10W72/522, H10W72/523, H10W72/524, H10W72/525, H10W72/527, H10W72/528, H10W72/531, H10W72/533, H10W72/534, H10W72/535, H10W72/537, H10W72/536, H10W72/5363, H10W72/5366, H10W72/5368, H10W72/541, H10W72/543, H10W72/547, H10W72/5434, H10W72/5438, H10W72/5473, H10W72/5475, H10W72/5445, H10W72/5449, H10W72/5453, H10W72/551, H10W72/552, H10W72/5522, H10W72/5524, H10W72/5525, H10W72/553, H10W72/555, H10W72/557, H10W72/5528, H10W72/581, H10W72/583 and H10W72/585. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/50	H10W72/50		18918
H10W72/521	9	{Structures or relative sizes of bond wires}<br><br><u>WARNING</u><br>Groups H10W72/521, H10W72/522, H10W72/523, H10W72/524, H10W72/525, H10W72/527 and H10W72/528 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/50. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/50	H10W72/521		335
H10W72/522	10	{Multilayered bond wires, e.g. having a coating concentric around a core}	H10W72/50	H10W72/522		1562
H10W72/523	11	{characterised by the structures of the outermost layers, e.g. multilayered coatings}	H10W72/50	H10W72/523		315
H10W72/524	10	{Bond wires having multiple distinct cores}	H10W72/50	H10W72/524		33
H10W72/525	10	{Bond wires having a filler embedded in a matrix}	H10W72/50	H10W72/525		80
H10W72/527	10	{Multiple bond wires having different sizes}	H10W72/50	H10W72/527		1665
H10W72/528	10	{Multiple bond wires having different structures}	H10W72/50	H10W72/528		16
H10W72/531	9	{Shapes of wire connectors}<br><br><u>WARNING</u><br>Groups H10W72/531, H10W72/533, H10W72/534, H10W72/535, H10W72/536, H10W72/5363, H10W72/5366, H10W72/5368 and H10W72/537 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/50. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/50	H10W72/531		1622
H10W72/533	10	{Cross-sectional shape}	H10W72/50	H10W72/533		121
H10W72/534	11	{being rectangular}	H10W72/50	H10W72/534		1432
H10W72/535	10	{Shapes of outermost layers of multilayered bond wires, e.g. coating not being conformal on a core}	H10W72/50	H10W72/535		12
H10W72/536	10	{the connected ends being ball-shaped}	H10W72/50	H10W72/536		20211
H10W72/5363	10	{the connected ends being wedge-shaped}	H10W72/50	H10W72/5363		21774
H10W72/5366	10	{the bond wires having kinks}	H10W72/50	H10W72/5366		2039
H10W72/5368	10	{the bond wires having helical loops}	H10W72/50	H10W72/5368		110
H10W72/537	10	{Multiple bond wires having different shapes}	H10W72/50	H10W72/537		966
H10W72/541	9	{Dispositions of bond wires}<br><br><u>WARNING</u><br>Groups H10W72/541, H10W72/543, H10W72/5434, H10W72/5438, H10W72/5445, H10W72/5449, H10W72/5453, H10W72/547, H10W72/5473 and H10W72/5475 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/50. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/50	H10W72/541		84
H10W72/543	10	{of outermost layers of multilayered bond wires, e.g. coating being only on a part of a core}	H10W72/50	H10W72/543		140
H10W72/5434	10	{the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires}	H10W72/50	H10W72/5434		1504
H10W72/5438	10	{the bond wires having multiple connections on the same bond pad}	H10W72/50	H10W72/5438		640
H10W72/5445	10	{being orthogonal to a side surface of the chip, e.g. parallel arrangements}	H10W72/50	H10W72/5445		8513
H10W72/5449	10	{not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}	H10W72/50	H10W72/5449		12264
H10W72/5453	10	{connecting between multiple bond pads on a chip, e.g. daisy chain}	H10W72/50	H10W72/5453		913
H10W72/547	10	{Dispositions of multiple bond wires}	H10W72/50	H10W72/547		6682
H10W72/5473	11	{multiple bond wires connected to a common bond pad}	H10W72/50	H10W72/5473		4398
H10W72/5475	11	{multiple bond wires connected to common bond pads at both ends of the wires}	H10W72/50	H10W72/5475		4149
H10W72/551	9	{Materials of bond wires}<br><br><u>WARNING</u><br>Groups H10W72/551, H10W72/552, H10W72/5522, H10W72/5524, H10W72/5525, H10W72/5528, H10W72/553, H10W72/555 and H10W72/557 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/50. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/50	H10W72/551		2057
H10W72/552	10	{comprising metals or metalloids, e.g. silver}	H10W72/50	H10W72/552		5054
H10W72/5522	11	{comprising gold [Au]}	H10W72/50	H10W72/5522		21502
H10W72/5524	11	{comprising aluminium [Al]}	H10W72/50	H10W72/5524		8685
H10W72/5525	11	{comprising copper [Cu]}	H10W72/50	H10W72/5525		6173
H10W72/5527	11	{Eutectic alloys}	H10W72/50	H10W72/5527		8
H10W72/5528	11	{Intermetallic compounds}	H10W72/50	H10W72/5528		138
H10W72/553	10	{not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}	H10W72/50	H10W72/553		458
H10W72/555	10	{of outermost layers of multilayered bond wires, e.g. material of a coating}	H10W72/50	H10W72/555		1445
H10W72/557	10	{Multiple bond wires having different materials}	H10W72/50	H10W72/557		85
H10W72/581	9	{Auxiliary members, e.g. flow barriers}<br><br><u>WARNING</u><br>Groups H10W72/581, H10W72/583 and H10W72/585 are incomplete pending reclassification of documents from groups H10W72/00 and H10W72/50. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/50	H10W72/581		469
H10W72/583	10	{Reinforcing structures}	H10W72/50	H10W72/583		164
H10W72/585	10	{Alignment aids, e.g. alignment marks}	H10W72/50	H10W72/585		76
H10W72/59	9	Bond pads specially adapted therefor	H10W72/59	H10W72/59		12384
H10W72/60	8	Strap connectors, e.g. thick copper clips for grounding of power devices<br><br><u>WARNING</u><br>Group H10W72/60 is incomplete pending reclassification of documents from groups H10W72/00 and H10W72/20. Group H10W72/60 is also impacted by reclassification into groups H10W72/621, H10W72/622, H10W72/623, H10W72/624, H10W72/625, H10W72/627, H10W72/631, H10W72/634, H10W72/635, H10W72/637, H10W72/641, H10W72/645, H10W72/647, H10W72/646, H10W72/642, H10W72/643, H10W72/6478, H10W72/651, H10W72/652, H10W72/653, H10W72/6528, H10W72/655, H10W72/657, H10W72/681, H10W72/683, H10W72/685 and H10W72/701. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/60	H10W72/60		3195
H10W72/621	9	{Structures or relative sizes of strap connectors}<br><br><u>WARNING</u><br>Groups H10W72/621, H10W72/622, H10W72/623, H10W72/624, H10W72/625 and H10W72/627 are incomplete pending reclassification of documents from groups H10W72/00, H10W72/20 and H10W72/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/60	H10W72/621		72
H10W72/622	10	{Multilayered strap connectors, e.g. having a coating on a lowermost surface of a core}	H10W72/60	H10W72/622		161
H10W72/623	11	{characterised by the structures of the outermost layers, e.g. multilayered coatings}	H10W72/60	H10W72/623		67
H10W72/624	10	{Strap connectors having multiple distinct cores}	H10W72/60	H10W72/624		21
H10W72/625	10	{Strap connectors having a filler embedded in a matrix}	H10W72/60	H10W72/625		14
H10W72/627	10	{Multiple strap connectors having different structures or shapes}	H10W72/60	H10W72/627		249
H10W72/631	9	{Shapes of strap connectors}<br><br><u>WARNING</u><br>Groups H10W72/631, H10W72/634, H10W72/635 and H10W72/637 are incomplete pending reclassification of documents from groups H10W72/00, H10W72/20 and H10W72/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/60	H10W72/631		736
H10W72/634	10	{Cross-sectional shape}	H10W72/60	H10W72/634		319
H10W72/635	10	{of outermost layers of multilayered strap connectors, e.g. coating not being conformal on a core}	H10W72/60	H10W72/635		3
H10W72/637	10	{Multiple strap connectors having different shapes}	H10W72/60	H10W72/637		51
H10W72/641	9	{Dispositions of strap connectors}<br><br><u>WARNING</u><br>Groups H10W72/641, H10W72/642, H10W72/643, H10W72/645, H10W72/646, H10W72/647 and H10W72/6478 are incomplete pending reclassification of documents from groups H10W72/00, H10W72/20 and H10W72/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/60	H10W72/641		24
H10W72/642	10	{being orthogonal to a side surface of the chip, e.g. in parallel arrangements}	H10W72/60	H10W72/642		85
H10W72/643	10	{not being orthogonal to a side surface of the chip, e.g. in fan-out arrangements}	H10W72/60	H10W72/643		14
H10W72/644	10	{connecting directly between multiple pads on a chip}	H10W72/60	H10W72/644		23
H10W72/645	10	{of outermost layers of multilayered strap connectors, e.g. coating being only on a part of a core}	H10W72/60	H10W72/645		24
H10W72/646	10	{the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector}	H10W72/60	H10W72/646		409
H10W72/647	10	{Dispositions of multiple strap connectors}	H10W72/60	H10W72/647		212
H10W72/6478	11	{multiple strap connectors connecting to a common bond pad}	H10W72/60	H10W72/6478		35
H10W72/651	9	{Materials of strap connectors}<br><br><u>WARNING</u><br>Groups H10W72/651, H10W72/652, H10W72/6528, H10W72/653, H10W72/655 and H10W72/657 are incomplete pending reclassification of documents from groups H10W72/00, H10W72/20 and H10W72/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/60	H10W72/651		53
H10W72/652	10	{comprising metals or metalloids, e.g. silver}	H10W72/60	H10W72/652		1917
H10W72/6524	11	{Eutectic alloys}	H10W72/60	H10W72/6524		
H10W72/6528	11	{Intermetallic compounds}	H10W72/60	H10W72/6528		12
H10W72/653	10	{not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}	H10W72/60	H10W72/653		39
H10W72/655	10	{of outermost layers of multilayered strap connectors, e.g. material of a coating}	H10W72/60	H10W72/655		481
H10W72/657	10	{Multiple strap connectors having different materials}	H10W72/60	H10W72/657		1
H10W72/681	9	{Auxiliary members, e.g. flow barriers}<br><br><u>WARNING</u><br>Groups H10W72/681, H10W72/683 and H10W72/685 are incomplete pending reclassification of documents from groups H10W72/00, H10W72/20 and H10W72/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/60	H10W72/681		33
H10W72/683	10	{Reinforcing structures, e.g. bump collars}	H10W72/60	H10W72/683		7
H10W72/685	10	{Alignment aids, e.g. alignment marks}	H10W72/60	H10W72/685		14
H10W72/691	9	{Bond pads specially adapted therefor}<br><br><u>WARNING</u><br>Group H10W72/691 is incomplete pending reclassification of documents from groups H10W72/00 and H10W72/20. <br>Groups H10W72/00, H10W72/20 and H10W72/691 should be considered in order to perform a complete search.	H10W72/60	H10W72/691		256
H10W72/701	8	{Tape-automated bond [TAB] connectors}<br><br><u>WARNING</u><br>Group H10W72/701 is incomplete pending reclassification of documents from group H10W72/60. <br>Groups H10W72/60 and H10W72/701 should be considered in order to perform a complete search.	H10W72/00	H10W72/701		4151
H10W72/709	9	{Bond pads specially adapted therefor}	H10W72/00	H10W72/709		16
H10W72/801	8	{Interconnections on sidewalls of containers}<br><br><u>WARNING</u><br>Group H10W72/801 is impacted by reclassification into group H10W72/812. <br>Groups H10W72/801 and H10W72/812 should be considered in order to perform a complete search.	H10W72/00	H10W72/801		291
H10W72/812	8	{Interconnections on sidewalls of encapsulations, e.g. conductive traces on molded resins}<br><br><u>WARNING</u><br>Group H10W72/812 is incomplete pending reclassification of documents from group H10W72/801. <br>Groups H10W72/801 and H10W72/812 should be considered in order to perform a complete search.	H10W72/00	H10W72/812		
H10W72/823	8	{Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip}<br><br><u>WARNING</u><br>Group H10W72/823 is impacted by reclassification into groups H10W20/20, H10W20/211, H10W20/215, H10W20/222, H10W76/132, H10W76/134, H10W76/153, H10W76/157 and H10W76/165. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/00	H10W72/823		1643
H10W72/834	8	{Interconnections on sidewalls of chips}	H10W72/00	H10W72/834		714
H10W72/851	8	{Dispositions of multiple connectors or interconnections}	H10W72/00	H10W72/851		2141
H10W72/853	9	{On the same surface}	H10W72/00	H10W72/853		873
H10W72/856	10	{Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)}	H10W72/00	H10W72/856		2944
H10W72/859	10	{Bump connectors and bond wires}	H10W72/00	H10W72/859		885
H10W72/862	10	{Bump connectors and strap connectors}	H10W72/00	H10W72/862		19
H10W72/865	10	{Die-attach connectors and bond wires}	H10W72/00	H10W72/865		4201
H10W72/868	10	{Die-attach connectors and strap connectors}	H10W72/00	H10W72/868		60
H10W72/871	10	{Bond wires and strap connectors}	H10W72/00	H10W72/871		1578
H10W72/874	9	{On different surfaces}	H10W72/00	H10W72/874		5959
H10W72/877	10	{Bump connectors and die-attach connectors}	H10W72/00	H10W72/877		8486
H10W72/879	10	{Bump connectors and bond wires}	H10W72/00	H10W72/879		1122
H10W72/881	10	{Bump connectors and strap connectors}	H10W72/00	H10W72/881		85
H10W72/884	10	{Die-attach connectors and bond wires}	H10W72/00	H10W72/884		46770
H10W72/886	10	{Die-attach connectors and strap connectors}	H10W72/00	H10W72/886		818
H10W72/889	10	{Bond wires and strap connectors}	H10W72/00	H10W72/889		38
H10W72/90	8	Bond pads, in general<br><br><u>WARNING</u><br>Group H10W72/90 is impacted by reclassification into groups H10W72/921, H10W72/922, H10W72/9223, H10W72/9226, H10W72/923, H10W72/9232, H10W72/924, H10W72/925, H10W72/926, H10W72/927, H10W72/931, H10W72/932, H10W72/934, H10W72/936, H10W72/941, H10W72/9413, H10W72/9415, H10W72/942, H10W72/944, H10W72/9445, H10W72/951, H10W72/952, H10W72/953, H10W72/957, H10W72/9524, H10W72/9528, H10W72/961, H10W72/963, H10W72/965, H10W72/967, H10W72/981, H10W72/983, H10W72/985 and H10W72/987. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/90	H10W72/90		19788
H10W72/921	9	{Structures or relative sizes of bond pads}<br><br><u>WARNING</u><br>Groups H10W72/921, H10W72/922, H10W72/9223, H10W72/9226, H10W72/923, H10W72/9232, H10W72/924, H10W72/925, H10W72/926 and H10W72/927 are incomplete pending reclassification of documents from group H10W72/90. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/90	H10W72/921		815
H10W72/922	10	{Bond pads being integral with underlying chip-level interconnections}	H10W72/90	H10W72/922		2184
H10W72/9223	11	{with redistribution layers [RDL]}	H10W72/90	H10W72/9223		1181
H10W72/9226	11	{with via interconnections}	H10W72/90	H10W72/9226		907
H10W72/923	10	{Bond pads having multiple stacked layers}	H10W72/90	H10W72/923		11130
H10W72/9232	11	{with additional elements interposed between layers}	H10W72/90	H10W72/9232		1001
H10W72/924	10	{Bond pads having multiple side-by-side cores}	H10W72/90	H10W72/924		47
H10W72/925	10	{Bond pads having a filler embedded in a matrix}	H10W72/90	H10W72/925		223
H10W72/926	10	{Multiple bond pads having different sizes}	H10W72/90	H10W72/926		6583
H10W72/927	10	{Multiple bond pads having different structures}	H10W72/90	H10W72/927		47
H10W72/931	9	{Shapes of bond pads}<br><br><u>WARNING</u><br>Groups H10W72/931, H10W72/932, H10W72/934 and H10W72/936 are incomplete pending reclassification of documents from group H10W72/90. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/90	H10W72/931		3886
H10W72/932	10	{Plan-view shape, i.e. in top view}	H10W72/90	H10W72/932		13580
H10W72/934	10	{Cross-sectional shape, i.e. in side view}	H10W72/90	H10W72/934		4546
H10W72/936	10	{Multiple bond pads having different shapes}	H10W72/90	H10W72/936		681
H10W72/941	9	{Dispositions of bond pads}<br><br><u>WARNING</u><br>Groups H10W72/941, H10W72/9413, H10W72/9415, H10W72/942, H10W72/944 and H10W72/9445 are incomplete pending reclassification of documents from group H10W72/90. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/90	H10W72/941		944
H10W72/9413	10	{on encapsulations}	H10W72/90	H10W72/9413		7297
H10W72/9415	10	{relative to the surface, e.g. recessed, protruding}	H10W72/90	H10W72/9415		9470
H10W72/942	10	{relative to underlying supporting features, e.g. bond pads, RDLs or vias}	H10W72/90	H10W72/942		4509
H10W72/944	10	{Dispositions of multiple bond pads}	H10W72/90	H10W72/944		3845
H10W72/9445	11	{Top-view layouts, e.g. mirror arrays}	H10W72/90	H10W72/9445		3830
H10W72/951	9	{Materials of bond pads}<br><br><u>WARNING</u><br>Groups H10W72/951, H10W72/952, H10W72/9524, H10W72/9528, H10W72/953 and H10W72/957 are incomplete pending reclassification of documents from group H10W72/90. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/90	H10W72/951		4148
H10W72/952	10	{comprising metals or metalloids, e.g. PbSn, Ag or Cu}	H10W72/90	H10W72/952		15887
H10W72/9524	11	{Eutectic alloys}	H10W72/90	H10W72/9524		20
H10W72/9528	11	{Intermetallic compounds}	H10W72/90	H10W72/9528		31
H10W72/953	10	{not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}	H10W72/90	H10W72/953		1071
H10W72/957	10	{Multiple bond pads having different materials}	H10W72/90	H10W72/957		150
H10W72/961	9	{Functions of bonds pads}<br><br><u>WARNING</u><br>Groups H10W72/961, H10W72/963, H10W72/965 and H10W72/967 are incomplete pending reclassification of documents from group H10W72/90. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/90	H10W72/961		
H10W72/963	10	{Providing mechanical bonding or support, e.g. dummy bond pads}	H10W72/90	H10W72/963		267
H10W72/965	10	{Providing thermal transfer}	H10W72/90	H10W72/965		88
H10W72/967	10	{Multiple bond pads having different functions}	H10W72/90	H10W72/967		599
H10W72/981	9	{Auxiliary members, e.g. spacers}<br><br><u>WARNING</u><br>Groups H10W72/981, H10W72/983, H10W72/985 and H10W72/987 are incomplete pending reclassification of documents from group H10W72/90. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W72/90	H10W72/981		604
H10W72/983	10	{Reinforcing structures, e.g. collars}	H10W72/90	H10W72/983		3746
H10W72/985	10	{Alignment aids, e.g. alignment marks}	H10W72/90	H10W72/985		80
H10W72/987	10	{Flow barriers}	H10W72/90	H10W72/987		70
H10W74/00	7	Encapsulations, e.g. protective coatings	H10W74/00	H10W74/00		49799
H10W74/01	8	Manufacture or treatment<br><br><u>WARNING</u><br>Group H10W74/01 is incomplete pending reclassification of documents from group H10W99/00. <br>Groups H10W99/00 and H10W74/01 should be considered in order to perform a complete search.	H10W74/01	H10W74/01		13706
H10W74/012	9	{of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}	H10W74/01	H10W74/01		5874
H10W74/014	9	{using batch processing}	H10W74/01	H10W74/01		7355
H10W74/016	9	{using moulds}	H10W74/01	H10W74/01		7133
H10W74/017	10	{Auxiliary layers for moulds, e.g. release layers or layers preventing residue}	H10W74/01	H10W74/01		543
H10W74/019	9	{using temporary auxiliary substrates (H10W74/017 takes precedence)}	H10W74/01	H10W74/01		7272
H10W74/10	8	characterised by their shape or disposition<br><br><u>WARNING</u><br>Group H10W74/10 is impacted by reclassification into group H10W74/15. <br>Groups H10W74/10 and H10W74/15 should be considered in order to perform a complete search.	H10W74/10	H10W74/10		9004
H10W74/111	9	{the semiconductor body being completely enclosed}	H10W74/10	H10W74/111		10742
H10W74/114	10	{by a substrate and the encapsulations}	H10W74/10	H10W74/114		8746
H10W74/117	11	{the substrate having spherical bumps for external connection}	H10W74/10	H10W74/117		11400
H10W74/121	10	{by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}	H10W74/10	H10W74/121		4275
H10W74/124	10	{the encapsulations having cavities other than that occupied by chips}	H10W74/10	H10W74/124		953
H10W74/127	10	{characterised by arrangements for sealing or adhesion}	H10W74/10	H10W74/127		2458
H10W74/129	10	{forming a chip-scale package [CSP]}	H10W74/10	H10W74/129		5492
H10W74/131	9	{the semiconductor body being only partially enclosed}	H10W74/10	H10W74/131		2624
H10W74/134	10	{the encapsulations being in grooves in the semiconductor body}	H10W74/10	H10W74/134		556
H10W74/137	10	{the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence)}	H10W74/10	H10W74/137		3756
H10W74/141	10	{the encapsulations being on at least the sidewalls of the semiconductor body}	H10W74/10	H10W74/141		1661
H10W74/142	10	{the encapsulations exposing the passive side of the semiconductor body}	H10W74/10	H10W74/142		5343
H10W74/144	10	{the encapsulations comprising foils}	H10W74/10	H10W74/144		156
H10W74/147	10	{the encapsulations being multilayered}	H10W74/10	H10W74/147		2157
H10W74/15	9	on active surfaces of flip-chip devices, e.g. underfills<br><br><u>WARNING</u><br>Group H10W74/15 is incomplete pending reclassification of documents from group H10W74/10. <br>Groups H10W74/10 and H10W74/15 should be considered in order to perform a complete search.	H10W74/15	H10W74/15		23690
H10W74/40	8	characterised by their materials	H10W74/40	H10W74/40		3556
H10W74/43	9	comprising oxides, nitrides or carbides, e.g. ceramics or glasses	H10W74/43	H10W74/43		2615
H10W74/47	9	comprising organic materials, e.g. plastics or resins	H10W74/47	H10W74/47		4727
H10W74/473	10	{containing a filler}	H10W74/47	H10W74/47		2793
H10W74/476	10	{Organic materials comprising silicon}	H10W74/47	H10W74/47		1119
H10W74/481	9	{comprising semiconductor materials}	H10W74/40	H10W74/481		200
H10W76/00	7	Containers; Fillings or auxiliary members therefor; Seals	H10W76/00	H10W76/00		
H10W76/01	8	Manufacture or treatment<br><br><u>WARNING</u><br>Group H10W76/01 is incomplete pending reclassification of documents from group H10W99/00. <br>Groups H10W99/00 and H10W76/01 should be considered in order to perform a complete search.	H10W76/01	H10W76/01		398
H10W76/05	9	Providing fillings in containers, e.g. gas filling	H10W76/05	H10W76/05		402
H10W76/10	8	Containers or parts thereof	H10W76/10	H10W76/10		1789
H10W76/12	9	characterised by their shape	H10W76/12	H10W76/12		3076
H10W76/13	10	Containers comprising a conductive base serving as an interconnection	H10W76/13	H10W76/13		442
H10W76/132	11	having other interconnections through an insulated passage in the conductive base<br><br><u>WARNING</u><br>Groups H10W76/132 - H10W76/165 are incomplete pending reclassification of documents from group H10W72/823. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W76/132	H10W76/132		418
H10W76/134	11	having other interconnections parallel to the conductive base	H10W76/134	H10W76/134		558
H10W76/136	11	having other interconnections perpendicular to the conductive base	H10W76/136	H10W76/136		425
H10W76/138	11	having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type	H10W76/138	H10W76/138		1373
H10W76/15	10	Containers comprising an insulating or insulated base	H10W76/15	H10W76/15		1502
H10W76/153	11	having interconnections in passages through the insulating or insulated base	H10W76/153	H10W76/153		901
H10W76/157	11	having interconnections parallel to the insulating or insulated base	H10W76/157	H10W76/157		1397
H10W76/161	10	{Containers comprising no base}	H10W76/12	H10W76/161		619
H10W76/165	10	{characterised by interconnections through the top surface of the containers, e.g. in a metal cap}	H10W76/12	H10W76/165		1
H10W76/167	10	{the container walls comprising an aperture, e.g. for pressure control}	H10W76/12	H10W76/167		30
H10W76/17	9	characterised by their materials	H10W76/17	H10W76/17		1011
H10W76/18	10	Insulating materials, e.g. resins, glasses or ceramics	H10W76/18	H10W76/18		711
H10W76/40	8	Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)	H10W76/40	H10W76/40		2346
H10W76/42	9	Fillings<br><br><u>NOTE</u><br><br>In this group, the phase of the fillings is determined at the operating temperature of the device.	H10W76/42	H10W76/42		291
H10W76/43	10	Gaseous fillings	H10W76/43	H10W76/43		135
H10W76/45	10	Liquid fillings	H10W76/45	H10W76/45		77
H10W76/47	10	Solid or gel fillings	H10W76/47	H10W76/47		2223
H10W76/48	10	Fillings including materials for absorbing or reacting with moisture or other undesired substances	H10W76/48	H10W76/48		593
H10W76/60	8	Seals<br><br><u>WARNING</u><br>Group H10W76/60 is impacted by reclassification into groups H10W76/63 and H10W76/67. <br>Groups H10W76/60, H10W76/63 and H10W76/67 should be considered in order to perform a complete search.	H10W76/60	H10W76/60		4531
H10W76/63	9	characterised by their shape or disposition, e.g. between cap and walls of a container<br><br><u>WARNING</u><br>Groups H10W76/63 - H10W76/67 are incomplete pending reclassification of documents from group H10W76/60. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W76/63	H10W76/63		371
H10W76/67	9	characterised by their materials	H10W76/67	H10W76/67		149
H10W78/00	7	Detachable holders for supporting packaged chips in operation	H10W78/00	H10W78/00		1283
H10W80/00	7	Direct bonding of chips, wafers or substrates<br><br><u>NOTE</u><br><br>This group covers direct bonding of:<br>chips, e.g. chip-to-chip;<br>wafers having devices and interconnections therein or thereon, e.g. wafer-to-wafer;<br>substrates having devices and interconnections therein or thereon;<br>combinations thereof, e.g. chip-to-wafer.	H10W80/00	H10W80/00		1566
H10W80/011	8	{Manufacture or treatment of pads or other interconnections to be direct bonded}	H10W80/00	H10W80/011		155
H10W80/016	9	{Cleaning}	H10W80/00	H10W80/016		379
H10W80/023	9	{Applying a coating on the bonding area}	H10W80/00	H10W80/023		37
H10W80/031	9	{Changing or setting shapes of the pads}	H10W80/00	H10W80/031		60
H10W80/033	10	{by chemical means, e.g. etching}	H10W80/00	H10W80/033		61
H10W80/035	10	{by heating, e.g. melting or causing diffusion}	H10W80/00	H10W80/035		37
H10W80/037	10	{by mechanical treatment, e.g. by cutting, pressing or stamping}	H10W80/00	H10W80/037		56
H10W80/041	9	{Thermally treating}	H10W80/00	H10W80/041		60
H10W80/102	8	{Controlling the environment during the bonding, e.g. the temperature or pressure}	H10W80/00	H10W80/102		400
H10W80/161	8	{Aligning}	H10W80/00	H10W80/161		62
H10W80/163	9	{using active alignment, e.g. detecting marks and correcting position}	H10W80/00	H10W80/163		251
H10W80/165	9	{using passive alignment, e.g. using self-alignment}	H10W80/00	H10W80/165		71
H10W80/168	9	{using guiding structures}	H10W80/00	H10W80/168		92
H10W80/211	8	{using auxiliary members, e.g. aids for protecting the bonding area}	H10W80/00	H10W80/211		614
H10W80/301	8	{Bonding techniques, e.g. hybrid bonding}	H10W80/00	H10W80/301		636
H10W80/312	9	{characterised by the direct bonding of electrically conductive pads}	H10W80/00	H10W80/312		2675
H10W80/314	9	{characterized by direct bonding of pads or other interconnections}	H10W80/00	H10W80/314		205
H10W80/327	9	{characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers}	H10W80/00	H10W80/327		2641
H10W80/331	9	{characterised by the application of energy for connecting}	H10W80/00	H10W80/331		35
H10W80/333	10	{Compression bonding}	H10W80/00	H10W80/333		160
H10W80/334	11	{Thermocompression bonding}	H10W80/00	H10W80/334		320
H10W80/335	11	{Ultrasonic bonding}	H10W80/00	H10W80/335		59
H10W80/337	10	{causing reflow}	H10W80/00	H10W80/337		11
H10W80/338	10	{using EM radiation or electron beams, e.g. using lasers}	H10W80/00	H10W80/338		46
H10W80/339	10	{using integrated means for heating, e.g. embedded heater}	H10W80/00	H10W80/339		3
H10W80/341	9	{Anodic bonding}	H10W80/00	H10W80/341		24
H10W80/701	8	{characterised by the pads after the direct bonding}	H10W80/00	H10W80/701		375
H10W80/721	9	{having structure or size changed during the connecting}	H10W80/00	H10W80/721		225
H10W80/732	9	{having shape changed during the connecting}	H10W80/00	H10W80/732		493
H10W80/743	9	{having disposition changed during the connecting}	H10W80/00	H10W80/743		786
H10W80/754	9	{having material changed during the connecting}	H10W80/00	H10W80/754		178
H10W90/00	7	Package configurations<br><br><u>NOTE</u><br><br>This group covers:<br>the relative positions of multiple chips within a single package, e.g. adjacent chips in a single encapsulation;<br>the relative positions of multiple chips within multiple packages, e.g. one encapsulated chip on another encapsulated chip in a "package-on-package" configuration.<br><br><u>WARNING</u><br>Group H10W90/00 is impacted by reclassification into groups H10B80/00, H10D80/00, H10D80/20, H10D80/211, H10D80/213, H10D80/215, H10D80/231, H10D80/251, H10D80/30, H10F39/90, H10F39/95, H10H29/20, H10H29/24, H10H29/30, H10H29/32, H10H29/34, H10H29/345, H10H29/352, H10H29/362, H10H29/37, H10H29/39, H10H29/41, H10H29/45, H10H29/49, H10K19/901, H10K39/601, H10K39/621, H10K59/90, H10K59/95, H10K65/00, H10N19/00, H10N19/101, H10N39/00, H10N59/00, H10N69/00, H10N79/00, H10N89/00, H10N89/02, H10W90/10, H10W90/15, H10W90/155, H10W90/20, H10W90/22, H10W90/231, H10W90/24, H10W90/26, H10W90/271, H10W90/275, H10W90/28, H10W90/284, H10W90/288, H10W90/291, H10W90/293, H10W90/295, H10W90/701, H10W90/721, H10W90/722, H10W90/723, H10W90/724, H10W90/725, H10W90/726, H10W90/727, H10W90/728, H10W90/729, H10W90/731, H10W90/732, H10W90/733, H10W90/734, H10W90/735, H10W90/736, H10W90/737, H10W90/738, H10W90/739, H10W90/751, H10W90/752, H10W90/753, H10W90/754, H10W90/755, H10W90/756, H10W90/757, H10W90/758, H10W90/759, H10W90/761, H10W90/762, H10W90/763, H10W90/764, H10W90/765, H10W90/766, H10W90/767, H10W90/768, H10W90/769, H10W90/791, H10W90/792, H10W90/794, H10W90/796, H10W90/798 and H10W90/811. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/00		77178
H10W90/10	8	Configurations of laterally-adjacent chips<br><br><u>WARNING</u><br>Groups H10W90/10, H10W90/15 and H10W90/155 are incomplete pending reclassification of documents from group H10W90/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/10	H10W90/10		2029
H10W90/15	9	the laterally-adjacent chips having different thicknesses than each other	H10W90/15	H10W90/15		5
H10W90/155	9	{the laterally-adjacent chips comprising dummy chips}	H10W90/15	H10W90/15		3
H10W90/20	8	Configurations of stacked chips<br><br><u>WARNING</u><br>Groups H10W90/20, H10W90/22, H10W90/231, H10W90/24, H10W90/26, H10W90/271, H10W90/275, H10W90/28, H10W90/284, H10W90/288, H10W90/291, H10W90/293 and H10W90/295 are incomplete pending reclassification of documents from group H10W90/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/20	H10W90/20		3615
H10W90/22	9	the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL	H10W90/22	H10W90/22		2771
H10W90/231	9	{the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure}	H10W90/20	H10W90/231		793
H10W90/24	9	at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape	H10W90/24	H10W90/24		3053
H10W90/26	9	the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape	H10W90/26	H10W90/26		1928
H10W90/271	9	{the chips having passive surfaces facing each other, i.e. in a back-to-back arrangement}	H10W90/20	H10W90/271		626
H10W90/275	9	{the stacked chips comprising dummy chips}	H10W90/20	H10W90/275		
H10W90/28	9	the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape	H10W90/28	H10W90/28		2043
H10W90/284	9	{characterised by structural arrangements for measuring or testing}	H10W90/20	H10W90/28		607
H10W90/288	9	{characterised by arrangements for thermal management of the stacked chips}	H10W90/20	H10W90/28		3147
H10W90/291	9	{characterised by containers, encapsulations, or other housings for the stacked chips}	H10W90/20	H10W90/291		3092
H10W90/293	9	{characterised by non-galvanic coupling between the chips, e.g. capacitive coupling}	H10W90/20	H10W90/293		872
H10W90/295	10	{optical coupling}	H10W90/20	H10W90/295		116
H10W90/297	9	{characterised by the through-semiconductor vias [TSVs] in the stacked chips}	H10W90/20	H10W90/297		7457
H10W90/401	8	{characterised by multiple insulating or insulated package substrates, interposers or RDLs}	H10W90/00	H10W90/401		7204
H10W90/701	8	{characterised by the relative positions of pads or connectors relative to package parts}<br><br><u>WARNING</u><br>Group H10W90/701 is incomplete pending reclassification of documents from group H10W90/00. Group H10W90/701 is also impacted by reclassification into groups H10W90/724, H10W90/725, H10W90/7295, H10W90/754, H10W90/755, H10W90/764 and H10W90/765. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/701		20798
H10W90/721	9	{of bump connectors}<br><br><u>WARNING</u><br>Groups H10W90/721, H10W90/722, H10W90/723, H10W90/727, H10W90/728 and H10W90/729 are incomplete pending reclassification of documents from group H10W90/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/721		833
H10W90/722	10	{between stacked chips}	H10W90/00	H10W90/722		16007
H10W90/723	10	{between laterally-adjacent chips}	H10W90/00	H10W90/723		62
H10W90/724	10	{between a chip and a stacked insulating package substrate, interposer or RDL}<br><br><u>WARNING</u><br>Group H10W90/724 is incomplete pending reclassification of documents from groups H10W90/00 and H10W90/701. Group H10W90/724 is also impacted by reclassification into group H10W90/726. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/724		46685
H10W90/725	10	{between a chip and a laterally-adjacent insulating package substrate, interposer or RDL}<br><br><u>WARNING</u><br>Group H10W90/725 is incomplete pending reclassification of documents from groups H10W90/00 and H10W90/701. <br>Groups H10W90/00, H10W90/701 and H10W90/725 should be considered in order to perform a complete search.	H10W90/00	H10W90/725		204
H10W90/726	10	{between a chip and a stacked lead frame, conducting package substrate or heat sink}<br><br><u>WARNING</u><br>Group H10W90/726 is incomplete pending reclassification of documents from groups H10W90/00 and H10W90/724. <br>Groups H10W90/00, H10W90/724 and H10W90/726 should be considered in order to perform a complete search.	H10W90/00	H10W90/726		3302
H10W90/727	10	{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}	H10W90/00	H10W90/727		21
H10W90/728	10	{between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors}	H10W90/00	H10W90/728		460
H10W90/729	10	{between a chip and a laterally-adjacent discrete passive device}	H10W90/00	H10W90/729		17
H10W90/7295	10	{on the rear surface of insulating package substrates, interposers or RDLs, for connection outside of the package, e.g. ball grid array [BGA] bumps}<br><br><u>WARNING</u><br>Group H10W90/7295 is incomplete pending reclassification of documents from group H10W90/701. <br>Groups H10W90/701 and H10W90/7295 should be considered in order to perform a complete search.	H10W90/00	H10W90/7295		3
H10W90/731	9	{of die-attach connectors}<br><br><u>WARNING</u><br>Groups H10W90/731, H10W90/732, H10W90/733, H10W90/734, H10W90/735, H10W90/736, H10W90/737, H10W90/738 and H10W90/739 are incomplete pending reclassification of documents from group H10W90/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/731		233
H10W90/732	10	{between stacked chips}	H10W90/00	H10W90/732		11518
H10W90/733	10	{between laterally-adjacent chips}	H10W90/00	H10W90/733		76
H10W90/734	10	{between a chip and a stacked insulating package substrate, interposer or RDL}	H10W90/00	H10W90/734		35485
H10W90/735	10	{between a chip and a laterally-adjacent insulating package substrate, interposer or RDL}	H10W90/00	H10W90/735		86
H10W90/736	10	{between a chip and a stacked lead frame, conducting package substrate or heat sink}	H10W90/00	H10W90/736		20377
H10W90/737	10	{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}	H10W90/00	H10W90/737		442
H10W90/738	10	{between a chip and a stacked discrete passive device}	H10W90/00	H10W90/738		129
H10W90/739	10	{between a chip and a laterally-adjacent discrete passive devices}	H10W90/00	H10W90/739		7
H10W90/751	9	{of bond wires}<br><br><u>WARNING</u><br>Groups H10W90/751, H10W90/752, H10W90/753, H10W90/757, H10W90/758 and H10W90/759 are incomplete pending reclassification of documents from group H10W90/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/751		193
H10W90/752	10	{between stacked chips}	H10W90/00	H10W90/752		3919
H10W90/753	10	{between laterally-adjacent chips}	H10W90/00	H10W90/753		10874
H10W90/754	10	{between a chip and a stacked insulating package substrate, interposer or RDL}<br><br><u>WARNING</u><br>Group H10W90/754 is incomplete pending reclassification of documents from groups H10W90/00 and H10W90/701. Group H10W90/754 is also impacted by reclassification into group H10W90/756. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/754		42163
H10W90/755	10	{between a chip and a laterally-adjacent insulating package substrate, interpose or RDL}<br><br><u>WARNING</u><br>Group H10W90/755 is incomplete pending reclassification of documents from groups H10W90/00 and H10W90/701. <br>Groups H10W90/00, H10W90/701 and H10W90/755 should be considered in order to perform a complete search.	H10W90/00	H10W90/755		913
H10W90/756	10	{between a chip and a stacked lead frame, conducting package substrate or heat sink}<br><br><u>WARNING</u><br>Group H10W90/756 is incomplete pending reclassification of documents from groups H10W90/00 and H10W90/754. <br>Groups H10W90/00, H10W90/754 and H10W90/756 should be considered in order to perform a complete search.	H10W90/00	H10W90/756		47295
H10W90/757	10	{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}	H10W90/00	H10W90/757		1
H10W90/758	10	{between a chip and a stacked discrete passive device}	H10W90/00	H10W90/758		83
H10W90/759	10	{between a chip and a laterally-adjacent discrete passive device}	H10W90/00	H10W90/759		470
H10W90/761	9	{of strap connectors}<br><br><u>WARNING</u><br>Groups H10W90/761, H10W90/762, H10W90/763, H10W90/766, H10W90/767, H10W90/768 and H10W90/769 are incomplete pending reclassification of documents from group H10W90/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/761		37
H10W90/762	10	{between stacked chips}	H10W90/00	H10W90/762		44
H10W90/763	10	{between laterally-adjacent chips}	H10W90/00	H10W90/763		1198
H10W90/764	10	{between a chip and a stacked insulating package substrate, interposer or RDL}<br><br><u>WARNING</u><br>Group H10W90/764 is incomplete pending reclassification of documents from groups H10W90/00 and H10W90/701. <br>Groups H10W90/00, H10W90/701 and H10W90/764 should be considered in order to perform a complete search.	H10W90/00	H10W90/764		1158
H10W90/765	10	{between a chip and a laterally-adjacent insulating package substrate, interposer or RDL}<br><br><u>WARNING</u><br>Group H10W90/765 is incomplete pending reclassification of documents from groups H10W90/00 and H10W90/701. <br>Groups H10W90/00, H10W90/701 and H10W90/765 should be considered in order to perform a complete search.	H10W90/00	H10W90/765		37
H10W90/766	10	{between a chip and a stacked lead frame, conducting package substrate or heat sink}	H10W90/00	H10W90/766		2406
H10W90/767	10	{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}	H10W90/00	H10W90/767		98
H10W90/768	10	{between a chip and a stacked discrete passive device}	H10W90/00	H10W90/768		4
H10W90/769	10	{between a chip and a laterally-adjacent discrete passive device}	H10W90/00	H10W90/769		18
H10W90/791	9	{of direct-bonded pads}<br><br><u>WARNING</u><br>Groups H10W90/791, H10W90/792, H10W90/794, H10W90/796 and H10W90/798 are incomplete pending reclassification of documents from group H10W90/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W90/00	H10W90/791		79
H10W90/792	10	{between multiple chips}	H10W90/00	H10W90/792		4305
H10W90/794	10	{between a chip and a stacked insulating package substrate, interposer or RDL}	H10W90/00	H10W90/794		1510
H10W90/796	10	{between a chip and a stacked lead frame, conducting package substrate or heat sink}	H10W90/00	H10W90/796		157
H10W90/798	10	{between a chip and a stacked discrete passive device}	H10W90/00	H10W90/798		95
H10W90/811	8	{Multiple chips on leadframes}<br><br><u>WARNING</u><br>Group H10W90/811 is incomplete pending reclassification of documents from group H10W90/00. <br>Groups H10W90/00 and H10W90/811 should be considered in order to perform a complete search.	H10W90/00	H10W90/811		5519
H10W95/00	7	Packaging processes not covered by the other groups of this subclass<br><br><u>WARNING</u><br>Group H10W95/00 is incomplete pending reclassification of documents from groups H10W72/07232, H10W72/07233, H10W72/07236 and H10W99/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W95/00	H10W95/00		7670
H10W99/00	7	Subject matter not provided for in other groups of this subclass<br><br><u>WARNING</u><br>Group H10W99/00 is incomplete pending reclassification of documents from group H10W42/00. Group H10W99/00 is also impacted by reclassification into groups H10W40/00, H10W40/01, H10W42/00, H10W70/00, H10W70/01, H10W70/02, H10W70/04, H10W70/05, H10W70/06, H10W70/08, H10W70/09, H10W74/01, H10W76/01 and H10W95/00. <br>All groups listed in this Warning should be considered in order to perform a complete search.	H10W99/00	H10W99/00		11277
