H01C1/00	7	Details	H01C1/00	H01C1/00		118
H01C1/01	8	Mounting; Supporting	H01C1/01	H01C1/01		890
H01C1/012	9	the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00)	H01C1/012	H01C1/012		244
H01C1/014	9	the resistor being suspended between and being supported by two supporting sections (H01C1/016 takes precedence)	H01C1/014	H01C1/014		360
H01C1/016	9	with compensation for resistor expansion or contraction	H01C1/016	H01C1/016		43
H01C1/02	8	Housing; Enclosing; Embedding; Filling the housing or enclosure	H01C1/02	H01C1/02		951
H01C1/022	9	the housing or enclosure being openable or separable from the resistive element	H01C1/022	H01C1/022		267
H01C1/024	9	the housing or enclosure being hermetically sealed (H01C1/028, H01C1/032, H01C1/034 take precedence)	H01C1/024	H01C1/024		387
H01C1/026	10	with gaseous or vacuum spacing between the resistive element and the housing or casing	H01C1/026	H01C1/026		84
H01C1/028	9	the resistive element being embedded in insulation with outer enclosing sheath	H01C1/028	H01C1/028		436
H01C1/03	10	with powdered insulation	H01C1/03	H01C1/03		41
H01C1/032	9	plural layers surrounding the resistive element (H01C1/028 takes precedence)	H01C1/032	H01C1/032		174
H01C1/034	9	the housing or enclosure being formed as coating or mould without outer sheath (H01C1/032 takes precedence)	H01C1/034	H01C1/034		368
H01C1/036	10	on wound resistive element	H01C1/036	H01C1/036		67
H01C1/04	8	Arrangements of distinguishing marks, e.g. colour coding	H01C1/04	H01C1/04		81
H01C1/06	8	Electrostatic or electromagnetic shielding arrangements	H01C1/06	H01C1/06		83
H01C1/08	8	Cooling, heating or ventilating arrangements	H01C1/08	H01C1/08		464
H01C1/082	9	using forced fluid flow	H01C1/082	H01C1/082		393
H01C1/084	9	using self-cooling, e.g. fins, heat sinks	H01C1/084	H01C1/084		717
H01C1/12	8	Arrangements of current collectors	H01C1/12	H01C1/12		250
H01C1/125	9	of fluid contacts	H01C1/125	H01C1/125		31
H01C1/14	8	Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors	H01C1/14	H01C1/14		2020
H01C1/1406	9	{Terminals or electrodes formed on resistive elements having positive temperature coefficient}	H01C1/14	H01C1/14		761
H01C1/1413	9	{Terminals or electrodes formed on resistive elements having negative temperature coefficient}	H01C1/14	H01C1/14		178
H01C1/142	9	the terminals or tapping points being coated on the resistive element	H01C1/142	H01C1/142		610
H01C1/144	9	the terminals or tapping points being welded or soldered	H01C1/144	H01C1/144		571
H01C1/146	9	the resistive element surrounding the terminal	H01C1/146	H01C1/146		220
H01C1/148	9	the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence)	H01C1/148	H01C1/148		890
H01C1/16	8	Resistor networks not otherwise provided for	H01C1/16	H01C1/16		570
H01C3/00	7	Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids	H01C3/00	H01C3/00		383
H01C3/005	8	{Metallic glasses therefor}	H01C3/00	H01C3/00		12
H01C3/02	8	arranged or constructed for reducing self-induction, capacitance or variation with frequency	H01C3/02	H01C3/02		143
H01C3/04	8	Iron-filament ballast resistors; Other resistors having variable temperature coefficient	H01C3/04	H01C3/04		54
H01C3/06	8	Flexible or folding resistors, whereby such a resistor can be looped or collapsed upon itself	H01C3/06	H01C3/06		74
H01C3/08	8	Dimension or characteristic of resistive element changing gradually or in discrete steps from one terminal to another	H01C3/08	H01C3/08		22
H01C3/10	8	the resistive element having zig-zag or sinusoidal configuration	H01C3/10	H01C3/10		406
H01C3/12	9	lying in one plane	H01C3/12	H01C3/12		247
H01C3/14	8	the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding (H01C3/02&#160;-&#160;H01C3/12 take precedence)	H01C3/14	H01C3/14		175
H01C3/16	9	including two or more distinct wound elements or two or more winding patterns	H01C3/16	H01C3/16		50
H01C3/18	9	wound on a flat or ribbon base (H01C3/16 takes precedence)	H01C3/18	H01C3/18		55
H01C3/20	9	wound on cylindrical or prismatic base (H01C3/16 takes precedence)	H01C3/20	H01C3/20		276
H01C7/00	7	Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C8/00; resistors having potential barriers, e.g. field-effect resistors, H10D1/40 - H10D1/43, H10K10/10; semiconductor devices sensitive to electromagnetic or corpuscular radiation, e.g. photoresistors, H10F30/00; magnetic field controlled resistors H10N50/10; bulk negative resistance effect devices H10N80/00)	H01C7/00	H01C7/00		991
H01C7/001	8	{Mass resistors}	H01C7/00	H01C7/00		321
H01C7/003	8	{Thick film resistors}	H01C7/00	H01C7/00		675
H01C7/005	9	{Polymer thick films}	H01C7/00	H01C7/00		95
H01C7/006	8	{Thin film resistors}	H01C7/00	H01C7/00		742
H01C7/008	8	{Thermistors (H01C7/02&#160;-&#160;H01C7/06 take precedence)}	H01C7/00	H01C7/00		813
H01C7/02	8	having positive temperature coefficient	H01C7/02	H01C7/02		1171
H01C7/021	9	{formed with two or more layers}	H01C7/02	H01C7/02		401
H01C7/022	9	{mainly consisting of non-metallic substances (H01C7/021 takes precedence)}	H01C7/02	H01C7/02		297
H01C7/023	10	{containing oxides or oxidic compounds, e.g. ferrites}	H01C7/02	H01C7/02		123
H01C7/025	11	{Perovskites, e.g. titanates}	H01C7/02	H01C7/02		327
H01C7/026	11	{Vanadium oxides or oxidic compounds, e.g. VOx}	H01C7/02	H01C7/02		15
H01C7/027	9	{consisting of conducting or semi-conducting material dispersed in a non-conductive organic material}	H01C7/02	H01C7/02		782
H01C7/028	9	{consisting of organic substances}	H01C7/02	H01C7/02		152
H01C7/04	8	having negative temperature coefficient<br><br><u>NOTE</u><br><br>In groups H01C7/043 - H01C7/049, the last place priority rule is applied, i.e. at each hierarchical level, in the absence of an indication to the contrary, classification is made in the last appropriate place.	H01C7/04	H01C7/04		1176
H01C7/041	9	{formed with two or more layers}	H01C7/04	H01C7/04		245
H01C7/042	9	{mainly consisting of inorganic non-metallic substances (H01C7/041 takes precedence)}	H01C7/04	H01C7/04		77
H01C7/043	10	{Oxides or oxidic compounds}	H01C7/04	H01C7/04		481
H01C7/044	11	{Zinc or cadmium oxide}	H01C7/04	H01C7/04		27
H01C7/045	11	{Perovskites, e.g. titanates}	H01C7/04	H01C7/04		119
H01C7/046	11	{Iron oxides or ferrites}	H01C7/04	H01C7/04		88
H01C7/047	11	{Vanadium oxides or oxidic compounds, e.g. VOx}	H01C7/04	H01C7/04		63
H01C7/048	10	{Carbon or carbides}	H01C7/04	H01C7/04		40
H01C7/049	9	{mainly consisting of organic or organo-metal substances}	H01C7/04	H01C7/04		83
H01C7/06	8	including means to minimise changes in resistance with changes in temperature	H01C7/06	H01C7/06		416
H01C7/10	8	voltage responsive, i.e. varistors	H01C7/10	H01C7/10		869
H01C7/1006	9	{Thick film varistors}	H01C7/10	H01C7/10		200
H01C7/1013	9	{Thin film varistors}	H01C7/10	H01C7/10		101
H01C7/102	9	Varistor boundary, e.g. surface layers (H01C7/12 takes precedence)	H01C7/102	H01C7/102		446
H01C7/105	9	Varistor cores (H01C7/12 takes precedence)	H01C7/105	H01C7/105		182
H01C7/108	10	Metal oxide	H01C7/108	H01C7/108		222
H01C7/112	11	ZnO type	H01C7/112	H01C7/112		941
H01C7/115	11	Titanium dioxide- or titanate type	H01C7/115	H01C7/115		96
H01C7/118	10	Carbide, e.g. SiC type	H01C7/118	H01C7/118		122
H01C7/12	9	Overvoltage protection resistors; Arresters	H01C7/12	H01C7/12		2392
H01C7/123	10	{Arrangements for improving potential distribution}	H01C7/12	H01C7/12		170
H01C7/126	10	{Means for protecting against excessive pressure or for disconnecting in case of failure}	H01C7/12	H01C7/12		664
H01C7/13	8	current-responsive<br><br><u>NOTE</u><br><br>Groups H01C7/02&#160;-&#160;H01C7/13 take precedence over groups H01C7/18&#160;-&#160;H01C7/22.	H01C7/13	H01C7/13		309
H01C7/18	8	comprising a plurality of layers stacked between terminals	H01C7/18	H01C7/18		628
H01C7/20	8	the resistive layer or coating being tapered	H01C7/20	H01C7/20		30
H01C7/22	8	Elongated resistive element being bent or curved, e.g. sinusoidal, helical	H01C7/22	H01C7/22		222
H01C8/00	7	Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material	H01C8/00	H01C8/00		35
H01C8/02	8	Coherers or like imperfect resistors for detecting electromagnetic waves	H01C8/02	H01C8/02		86
H01C8/04	8	Overvoltage protection resistors; Arresters	H01C8/04	H01C8/04		58
H01C10/00	7	Adjustable resistors	H01C10/00	H01C10/00		701
H01C10/005	8	{Surface mountable, e.g. chip trimmer potentiometer}	H01C10/00	H01C10/00		54
H01C10/02	8	Liquid resistors	H01C10/02	H01C10/02		443
H01C10/025	9	{Electrochemical variable resistors (trimming resistors by electrolytic treatment H01C17/2412, H01C17/262)}	H01C10/02	H01C10/02		37
H01C10/04	8	with specified mathematical relationship between movement of resistor actuating means and value of resistance, other than direct proportional relationship	H01C10/04	H01C10/04		153
H01C10/06	8	adjustable by short-circuiting different amounts of the resistive element	H01C10/06	H01C10/06		134
H01C10/08	9	with intervening conducting structure between the resistive element and the short-circuiting means, e.g. taps	H01C10/08	H01C10/08		95
H01C10/10	8	adjustable by mechanical pressure or force	H01C10/10	H01C10/10		399
H01C10/103	9	{by using means responding to magnetic or electric fields, e.g. by addition of magnetisable or piezoelectric particles to the resistive material, or by an electromagnetic actuator}	H01C10/10	H01C10/10		110
H01C10/106	9	{on resistive material dispersed in an elastic material (H01C10/103 and H01C10/12 take precedence; for electric switches H01H1/029)}	H01C10/10	H01C10/10		198
H01C10/12	9	by changing surface pressure between resistive masses or resistive and conductive masses, e.g. pile type	H01C10/12	H01C10/12		310
H01C10/14	8	adjustable by auxiliary driving means	H01C10/14	H01C10/14		666
H01C10/16	8	including plural resistive elements	H01C10/16	H01C10/16		317
H01C10/18	9	including coarse and fine resistive elements	H01C10/18	H01C10/18		60
H01C10/20	9	Contact structure or movable resistive elements being ganged	H01C10/20	H01C10/20		315
H01C10/22	8	resistive element dimensions changing gradually in one direction, e.g. tapered resistive element (H01C10/04 takes precedence)	H01C10/22	H01C10/22		18
H01C10/23	8	resistive element dimensions changing in a series of discrete, progressive steps	H01C10/23	H01C10/23		28
H01C10/24	8	the contact moving along turns of a helical resistive element, or vica versa	H01C10/24	H01C10/24		303
H01C10/26	8	resistive element moving (H01C10/16, H01C10/24 take precedence)<br><br><u>NOTE</u><br><br>Groups H01C10/02&#160;-&#160;H01C10/26 take precedence over groups H01C10/28&#160;-&#160;H01C10/50.	H01C10/26	H01C10/26		97
H01C10/28	8	the contact rocking or rolling along resistive element or taps	H01C10/28	H01C10/28		203
H01C10/30	8	the contact sliding along resistive element	H01C10/30	H01C10/30		449
H01C10/301	9	{consisting of a wire wound resistor}	H01C10/30	H01C10/30		70
H01C10/303	10	{the resistor being coated, e.g. lubricated, conductive plastic coated, i.e. hybrid potentiometer}	H01C10/30	H01C10/30		25
H01C10/305	9	{consisting of a thick film}	H01C10/30	H01C10/30		45
H01C10/306	10	{Polymer thick film, i.e. PTF}	H01C10/30	H01C10/30		36
H01C10/308	9	{consisting of a thin film}	H01C10/30	H01C10/30		19
H01C10/32	9	the contact moving in an arcuate path	H01C10/32	H01C10/32		1617
H01C10/34	10	the contact or the associated conducting structure riding on collector formed as a ring or portion thereof	H01C10/34	H01C10/34		321
H01C10/345	11	{the collector and resistive track being situated in 2 parallel planes}	H01C10/34	H01C10/34		49
H01C10/36	10	structurally combined with switching arrangements	H01C10/36	H01C10/36		478
H01C10/363	11	{by axial movement of the spindle, e.g. pull-push switch (H01C10/366 takes precedence)}	H01C10/36	H01C10/36		76
H01C10/366	11	{using an electromagnetic actuator}	H01C10/36	H01C10/36		5
H01C10/38	9	the contact moving along a straight path	H01C10/38	H01C10/38		533
H01C10/40	10	screw operated	H01C10/40	H01C10/40		248
H01C10/42	11	the contact bridging and sliding along resistive element and parallel conducting bar or collector	H01C10/42	H01C10/42		155
H01C10/44	10	the contact bridging and sliding along resistive element and parallel conducting bar or collector (H01C10/42 takes precedence)	H01C10/44	H01C10/44		119
H01C10/46	8	Arrangements of fixed resistors with intervening connectors, e.g. taps (H01C10/28, H01C10/30 take precedence)	H01C10/46	H01C10/46		170
H01C10/48	9	including contact movable in an arcuate path	H01C10/48	H01C10/48		251
H01C10/50	8	structurally combined with switching arrangements (H01C10/36 takes precedence)	H01C10/50	H01C10/50		292
H01C11/00	7	Non-adjustable liquid resistors	H01C11/00	H01C11/00		63
H01C13/00	7	Resistors not provided for elsewhere	H01C13/00	H01C13/00		255
H01C13/02	8	Structural combinations of resistors	H01C13/02	H01C13/02		599
H01C17/00	7	Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04)	H01C17/00	H01C17/00		1114
H01C17/003	8	{using lithography, e.g. photolithography (lithographic compositions and processing in general G03F)}	H01C17/00	H01C17/00		131
H01C17/006	8	{adapted for manufacturing resistor chips}	H01C17/00	H01C17/00		777
H01C17/02	8	adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52)	H01C17/02	H01C17/02		922
H01C17/04	8	adapted for winding the resistive element	H01C17/04	H01C17/04		341
H01C17/06	8	adapted for coating resistive material on a base	H01C17/06	H01C17/06		448
H01C17/065	9	by thick film techniques, e.g. serigraphy	H01C17/065	H01C17/065		504
H01C17/06506	10	{Precursor compositions therefor, e.g. pastes, inks, glass frits or green body}	H01C17/065	H01C17/065		80
H01C17/06513	11	{characterised by the resistive component}	H01C17/065	H01C17/065		122
H01C17/0652	12	{containing carbon or carbides}	H01C17/065	H01C17/065		224
H01C17/06526	12	{composed of metals}	H01C17/065	H01C17/065		233
H01C17/06533	12	{composed of oxides}	H01C17/065	H01C17/065		337
H01C17/0654	13	{Oxides of the platinum group}	H01C17/065	H01C17/065		125
H01C17/06546	13	{Oxides of zinc or cadmium}	H01C17/065	H01C17/065		131
H01C17/06553	12	{composed of a combination of metals and oxides}	H01C17/065	H01C17/065		156
H01C17/0656	12	{composed of silicides (H01C17/0652 takes precedence)}	H01C17/065	H01C17/065		48
H01C17/06566	12	{composed of borides (H01C17/0652 takes precedence)}	H01C17/065	H01C17/065		33
H01C17/06573	11	{characterised by the permanent binder}	H01C17/065	H01C17/065		19
H01C17/0658	12	{composed of inorganic material}	H01C17/065	H01C17/065		88
H01C17/06586	12	{composed of organic material}	H01C17/065	H01C17/065		280
H01C17/06593	11	{characterised by the temporary binder}	H01C17/065	H01C17/065		34
H01C17/07	9	by resistor foil bonding, e.g. cladding	H01C17/07	H01C17/07		118
H01C17/075	9	by thin-film techniques	H01C17/075	H01C17/075		267
H01C17/08	10	by vapour deposition	H01C17/08	H01C17/08		202
H01C17/10	10	by flame spraying	H01C17/10	H01C17/10		27
H01C17/12	10	by sputtering	H01C17/12	H01C17/12		362
H01C17/14	10	by chemical deposition	H01C17/14	H01C17/14		72
H01C17/16	11	using electric current	H01C17/16	H01C17/16		46
H01C17/18	11	without using electric current	H01C17/18	H01C17/18		43
H01C17/20	9	by pyrolytic processes	H01C17/20	H01C17/20		132
H01C17/22	8	adapted for trimming	H01C17/22	H01C17/22		289
H01C17/23	9	by opening or closing resistor geometric tracks of predetermined resistive values, {e.g. snapistors}	H01C17/23	H01C17/23		134
H01C17/232	9	Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient of resistance	H01C17/232	H01C17/232		105
H01C17/235	9	Initial adjustment of potentiometer parts for calibration	H01C17/235	H01C17/235		39
H01C17/24	9	by removing or adding resistive material (H01C17/23, H01C17/232, H01C17/235 take precedence)	H01C17/24	H01C17/24		291
H01C17/2404	10	{by charged particle impact, e.g. by electron or ion beam milling, sputtering, plasma etching}	H01C17/24	H01C17/24		29
H01C17/2408	10	{by pulsed voltage erosion, e.g. spark erosion}	H01C17/24	H01C17/24		16
H01C17/2412	10	{by electrolytic treatment, e.g. electroplating (for anodic oxydation H01C17/262)}	H01C17/24	H01C17/24		10
H01C17/2416	10	{by chemical etching}	H01C17/24	H01C17/24		42
H01C17/242	10	by laser	H01C17/242	H01C17/242		405
H01C17/245	10	by mechanical means, e.g. sand-blasting, cutting or ultrasonic treatment	H01C17/245	H01C17/245		190
H01C17/26	9	by converting resistive material	H01C17/26	H01C17/26		53
H01C17/262	10	{by electrolytic treatment, e.g. anodic oxydation}	H01C17/26	H01C17/26		47
H01C17/265	10	{by chemical or thermal treatment, e.g. oxydation, reduction, annealing (etching H01C17/2416)}	H01C17/26	H01C17/26		89
H01C17/267	11	{by passage of voltage pulses or electric current}	H01C17/26	H01C17/26		55
H01C17/28	8	adapted for applying terminals	H01C17/28	H01C17/28		855
H01C17/281	9	{by thick film techniques}	H01C17/28	H01C17/28		328
H01C17/283	10	{Precursor compositions therefor, e.g. pastes, inks, glass frits}	H01C17/28	H01C17/28		165
H01C17/285	11	{applied to zinc or cadmium oxide resistors}	H01C17/28	H01C17/28		68
H01C17/286	11	{applied to TiO2 or titanate resistors}	H01C17/28	H01C17/28		18
H01C17/288	9	{by thin film techniques}	H01C17/28	H01C17/28		172
H01C17/30	8	adapted for baking	H01C17/30	H01C17/30		497
