C23C   2/00  \	0	0	4K027	C23C   2/00	4067	˱ƶڤܤȤΤʤͻ֤ˤʤŬѤˤͻåޤͻˡΤ֡Σ	Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor [4]
C23C   2/02  \	1	1	4K027	C23C   2/02	2500	ʤ㡥򤵤줿ɽʬʤ뤿ΤΡʣããͥˡΣ	Pretreatment of the material to be coated, e.g. for coating on selected surface areas (C23C 2/30 takes precedence) [4]
C23C   2/04  \	1	1	4K027	C23C   2/04	232	ʤħΡΣ	characterised by the coating material [4]
C23C   2/06  \	2	2	4K027	C23C   2/06	6961	⤷ϥɥߥޤϤȤΣ	Zinc or cadmium or alloys based thereon [4]
C23C   2/08  \	2	2	4K027	C23C   2/08	670	ޤϤΣ	Tin or alloys based thereon [4]
C23C   2/10  \	2	2	4K027	C23C   2/10	313	ޤϱΣ	Lead or alloys based thereon [4]
C23C   2/12  \	2	2	4K027	C23C   2/12	1882	ߥ˥ޤϥߥ˥Σ	Aluminium or alloys based thereon [4]
C23C   2/14  \	1	1	4K027	C23C   2/14	331	ͻʤؤβ̽ޤĴΣ	Removing excess of molten coatings; Controlling or regulating the coating thickness [4]
C23C   2/16  \	2	2	4K027	C23C   2/16	198	ðήΤѤΡ㡥ʥաΣ	using fluids under pressure, e.g. air knives [4]
C23C   2/18  \	3	3	4K027	C23C   2/18	76	Ĺܺͻʤؤβ̽Σ	Removing excess of molten coatings from elongated material [4]
C23C   2/20  \	4	4	4K027	C23C   2/20	1122	ȥåסġΣ	Strips; Plates [4]
C23C   2/22  \	2	2	4K027	C23C   2/22	26	ӥ󥰡ʣˤˤΡ㡥ʥդѤΡΣ	by rubbing, e.g. using knives [4]
C23C   2/24  \	2	2	4K027	C23C   2/24	130	ޤžѤΡΣ	using magnetic or electric fields [4]
C23C   2/26  \	1	1	4K027	C23C   2/26	1841	ʣããͥˡΣ	After-treatment (C23C 2/14 takes precedence) [4]
C23C   2/28  \	2	2	4K027	C23C   2/28	3096	Ǯˤ㡥Σ	Thermal after-treatment, e.g. treatment in oil bath [4]
C23C   2/30  \	1	1	4K027	C23C   2/30	219	ͻΥեåޤʤʣããͥˡΣ	Fluxes or coverings on molten baths (C23C 2/22 takes precedence) [4]
C23C   2/32  \	1	1	4K027	C23C   2/32	169	ưͥ륮ޤϴĤ˺ѤΡʣããͥˡΣ	using vibratory energy applied to the bath or substrate (C23C 2/14 takes precedence) [4]
C23C   2/34  \	1	1	4K027	C23C   2/34	233	ηħΡʣããͥˡΣ	characterised by the shape of the material to be treated (C23C 2/14 takes precedence) [4]
C23C   2/36  \	2	2	4K027	C23C   2/36	89	ĹܺΣ	Elongated material [4]
C23C   2/38  \	3	3	4K027	C23C   2/38	1206	ࡨɡΣ	Wires; Tubes [4]
C23C   2/40  \	3	3	4K027	C23C   2/40	3106	ġȥåסΣ	Plates; Strips [4]
C23C   4/00  \	0	0	4K031	C23C   4/00	772	ϲʤΥץ졼ˤʤ㡥бꡤץ饺ޤޤŤˤΡܣ£ˡ㡥£ˣ£ˣˡΣ	Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge (built-up welding B23K, e.g. B23K 5/18, B23K 9/04; spraying guns B05B; making alloys containing fibres or filaments by thermal spraying of metal C22C 47/16; plasma guns H05H) [4]
C23C   4/01  \	1	1	4K031	C23C   4/01	32	ʤ̵ǹԤŪʤ㡥ѥʤΣ	Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated [2016.01]
C23C   4/02  \	1	1	4K031	C23C   4/02	797	ʤ㡥򤵤줿ɽʬʤ뤿ΤΡΣ	Pretreatment of the material to be coated, e.g. for coating on selected surface areas [4]
C23C   4/04  \	1	1	4K031	C23C   4/04	1017	ʤħΤΡΣ	characterised by the coating material [4]
C23C   4/06  \	2	2	4K031	C23C   4/06	2109	°Σ	Metallic material [4]
C23C   4/067  \	3	3	4K031	C23C   4/067	60	°ǤͷΥγҤޤΡ°Ǥ㡥úǡǡۥǡޤϥǡΣ	containing free particles of non-metal elements, e.g. carbon, silicon, boron, phosphorus or arsenic [2016.01]
C23C   4/073  \	3	3	4K031	C23C   4/073	232	°Ǥδ̵ͭͭ˴ؤ餺ͣãɤޤϣͣãɣٹޤΡͤϥ˥å롤ХȤޤŴΣ	containing MCrAl or MCrAlY alloys, where M is nickel, cobalt or iron, with or without non-metal elements [2016.01]
C23C   4/08  \	3	3	4K031	C23C   4/08	1847	°ǤΤߤޤΡʣããͥˡΣ	containing only metal elements [4]
C23C   4/10  \	2	2	4K031	C23C   4/10	2602	ʪۤʪúʪⲽʪޤϤʪκʪΣ	Oxides, borides, carbides, nitrides, silicides or mixtures thereof [4]
C23C   4/11  \	3	3	4K031	C23C   4/11	1987	ʪΣ	Oxides [2016.01]
C23C   4/12  \	1	1	4K031	C23C   4/12	2151	ץ졼ˡħΤΡΣ	characterised by the method of spraying [4]
C23C   4/123  \	2	2	4K031	C23C   4/123	1300	°ϼ͡Σ	Spraying molten metal [2016.01]
C23C   4/126  \	2	2	4K031	C23C   4/126	156	ȯϼ͡Σ	Detonation spraying [2016.01]
C23C   4/129  \	2	2	4K031	C23C   4/129	710	ե졼ϼ͡Σ	Flame spraying [2016.01]
C23C   4/131  \	2	2	4K031	C23C   4/131	447	磻䥢ϼ͡Σ	Wire arc spraying [2016.01]
C23C   4/134  \	2	2	4K031	C23C   4/134	1228	ץ饺ϼ͡Σ	Plasma spraying [2016.01]
C23C   4/137  \	2	2	4K031	C23C   4/137	235	ԳʷϵǹԤϼ͡Σ	Spraying in vacuum or in an inert atmosphere [2016.01]
C23C   4/14  \	2	2	4K031	C23C   4/14	73	Ĺܺʤ뤿ΤΡΣ	for covering elongated material [4]
C23C   4/16  \	3	3	4K031	C23C   4/16	210	ࡨɡΣ	Wires; Tubes [4]
C23C   4/18  \	1	1	4K031	C23C   4/18	1522	Σ	After-treatment [4]
C23C   6/00  \	0	0	4K031	C23C   6/00	84	ľͻळȤˤʤΣ	Coating by casting molten material on the substrate [4]
C23C   8/00  \	0	0	4K028	C23C   8/00	63	°ɽ̤ؤ°ǤΤߤθȻʤǤγȻããˡɽ̤ȿȤȿˤ°βŪɽ̽Ǥäɽ̺ȿʪʤ˻ĤΡ㡥ʤΣϡ°ƯֲʣããͥˡΣ	Solid state diffusion of only non-metal elements into metallic material surfaces (diffusion of silicon C23C 10/00); Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals (C23C 14/00 takes precedence) [4]
C23C   8/02  \	1	1	4K028	C23C   8/02	479	ʤʣããͥˡΣ	Pretreatment of the material to be coated (C23C 8/04 takes precedence) [4]
C23C   8/04  \	1	1	4K028	C23C   8/04	281	򤵤줿ɽʬ㡥ޥѤΡΣ	Treatment of selected surface areas, e.g. using masks [4]
C23C   8/06  \	1	1	4K028	C23C   8/06	204	ѤΡʣããͥˡΣ	using gases [4]
C23C   8/08  \	2	2	4K028	C23C   8/08	233	ǤΤߤѤΡΣ	only one element being applied [4]
C23C   8/10  \	3	3	4K028	C23C   8/10	671	Σ	Oxidising [4]
C23C   8/12  \	4	4	4K028	C23C   8/12	545	ǾǤޤϥѤΡΣ	using elemental oxygen or ozone [4]
C23C   8/14  \	5	5	4K028	C23C   8/14	528	Ŵɽ̤λΣ	Oxidising of ferrous surfaces [4]
C23C   8/16  \	4	4	4K028	C23C   8/16	359	ǴͭʪѤΡ㡥ȢϡãϢΣ	using oxygen-containing compounds, e.g. H<sub>2</sub>O, CO<sub>2</sub> [4]
C23C   8/18  \	5	5	4K028	C23C   8/18	499	Ŵɽ̤λΣ	Oxidising of ferrous surfaces [4]
C23C   8/20  \	3	3	4K028	C23C   8/20	625	úΣ	Carburising [4]
C23C   8/22  \	4	4	4K028	C23C   8/22	1929	Ŵɽ̤οúΣ	of ferrous surfaces [4]
C23C   8/24  \	3	3	4K028	C23C   8/24	720	ⲽΣ	Nitriding [4]
C23C   8/26  \	4	4	4K028	C23C   8/26	1727	Ŵɽ̤ⲽΣ	of ferrous surfaces [4]
C23C   8/28  \	2	2	4K028	C23C   8/28	185	ʾθǤʳѤΡΣ	more than one element being applied in one step [4]
C23C   8/30  \	3	3	4K028	C23C   8/30	138	úⲽΣ	Carbo-nitriding [4]
C23C   8/32  \	4	4	4K028	C23C   8/32	1047	Ŵɽ̤οúⲽΣ	of ferrous surfaces [4]
C23C   8/34  \	2	2	4K028	C23C   8/34	326	ʾθǤʳʾѤΡΣ	more than one element being applied in more than one step [4]
C23C   8/36  \	2	2	4K028	C23C   8/36	880	󲽤줿ѤΡ㡥ⲽΣ	using ionised gases, e.g. ionitriding [4]
C23C   8/38  \	3	3	4K028	C23C   8/38	546	Ŵɽ̤νΣ	Treatment of ferrous surfaces [4]
C23C   8/40  \	1	1	4K028	C23C   8/40	94	ΤѤΡ㡥ᡤվʪΣ	using liquids, e.g. salt baths, liquid suspensions [4]
C23C   8/42  \	2	2	4K028	C23C   8/42	283	ǤΤߤѤΡΣ	only one element being applied [4]
C23C   8/44  \	3	3	4K028	C23C   8/44	71	úΣ	Carburising [4]
C23C   8/46  \	4	4	4K028	C23C   8/46	64	Ŵɽ̤οúΣ	of ferrous surfaces [4]
C23C   8/48  \	3	3	4K028	C23C   8/48	102	ⲽΣ	Nitriding [4]
C23C   8/50  \	4	4	4K028	C23C   8/50	254	Ŵɽ̤ⲽΣ	of ferrous surfaces [4]
C23C   8/52  \	2	2	4K028	C23C   8/52	53	ʾθǤʳѤΡΣ	more than one element being applied in one step [4]
C23C   8/54  \	3	3	4K028	C23C   8/54	59	úⲽΣ	Carbo-nitriding [4]
C23C   8/56  \	4	4	4K028	C23C   8/56	117	Ŵɽ̤οúⲽΣ	of ferrous surfaces [4]
C23C   8/58  \	2	2	4K028	C23C   8/58	28	ʾθǤʳʾѤΡΣ	more than one element being applied in more than one step [4]
C23C   8/60  \	1	1	4K028	C23C   8/60	20	ΤѤΡ㡥ʴڡȡʸΤαդѤΣããˡΣ	using solids, e.g. powders, pastes (using liquid suspensions of solids C23C 8/40) [4]
C23C   8/62  \	2	2	4K028	C23C   8/62	74	ǤΤߤѤΡΣ	only one element being applied [4]
C23C   8/64  \	3	3	4K028	C23C   8/64	116	úΣ	Carburising [4]
C23C   8/66  \	4	4	4K028	C23C   8/66	174	Ŵɽ̤οúΣ	of ferrous surfaces [4]
C23C   8/68  \	3	3	4K028	C23C   8/68	105	ܥʥ󥰡Σ	Boronising [4]
C23C   8/70  \	4	4	4K028	C23C   8/70	81	Ŵɽ̤Υܥʥ󥰡Σ	of ferrous surfaces [4]
C23C   8/72  \	2	2	4K028	C23C   8/72	19	ʾθǤʳѤΡΣ	more than one element being applied in one step [4]
C23C   8/74  \	3	3	4K028	C23C   8/74	15	úⲽΣ	Carbo-nitriding [4]
C23C   8/76  \	4	4	4K028	C23C   8/76	14	Ŵɽ̤οúⲽΣ	of ferrous surfaces [4]
C23C   8/78  \	2	2	4K028	C23C   8/78	13	ʾθǤʳʾѤΡΣ	more than one element being applied in more than one step [4]
C23C   8/80  \	1	1	4K028	C23C   8/80	430	Σ	After-treatment [4]
C23C  10/00  \	0	0	4K028	C23C  10/00	76	°ɽ̤ؤζ°ǤΤߤޤϤǤθȻΣ	Solid state diffusion of only metal elements or silicon into metallic material surfaces [4]
C23C  10/02  \	1	1	4K028	C23C  10/02	65	ʤʣããͥˡΣ	Pretreatment of the material to be coated (C23C 10/04 takes precedence) [4]
C23C  10/04  \	1	1	4K028	C23C  10/04	44	򤵤줿ɽʬؤγȻ㡥ޥѤΡΣ	Diffusion into selected surface areas, e.g. using masks [4]
C23C  10/06  \	1	1	4K028	C23C  10/06	40	ѤΡΣ	using gases [4]
C23C  10/08  \	2	2	4K028	C23C  10/08	208	ǤΤߤȻΡΣ	only one element being diffused [4]
C23C  10/10  \	3	3	4K028	C23C  10/10	77	ޥ󥰡Σ	Chromising [4]
C23C  10/12  \	4	4	4K028	C23C  10/12	12	Ŵɽ̤Υޥ󥰡Σ	of ferrous surfaces [4]
C23C  10/14  \	2	2	4K028	C23C  10/14	21	ʾθǤʳǳȻΡΣ	more than one element being diffused in one step [4]
C23C  10/16  \	2	2	4K028	C23C  10/16	5	ʾθǤʳʾǳȻΡΣ	more than one element being diffused in more than one step [4]
C23C  10/18  \	1	1	4K028	C23C  10/18	27	ΤѤΡ㡥ᡤξաΣ	using liquids, e.g. salt baths, liquid suspensions [4]
C23C  10/20  \	2	2	4K028	C23C  10/20	51	ǤΤߤȻΡΣ	only one element being diffused [4]
C23C  10/22  \	3	3	4K028	C23C  10/22	31	Ȼ븵Ǥޤͻ°Σ	Metal melt containing the element to be diffused [4]
C23C  10/24  \	3	3	4K028	C23C  10/24	142	Ȼ븵ǤޤΣ	Salt bath containing the element to be diffused [4]
C23C  10/26  \	2	2	4K028	C23C  10/26	62	ʾθǤȻΡΣ	more than one element being diffused [4]
C23C  10/28  \	1	1	4K028	C23C  10/28	1319	ΤѤΡ㡥ʴڡȡΣ	using solids, e.g. powders, pastes [4]
C23C  10/30  \	2	2	4K028	C23C  10/30	352	ɽ̾ʴޤϥڡȤؤѤΡʸΤαդѤΣããˡΣ	using a layer of powder or paste on the surface (using liquid suspensions of solids C23C 10/18) [4]
C23C  10/32  \	3	3	4K028	C23C  10/32	68	ޥ󥰡Σ	Chromising [4]
C23C  10/34  \	2	2	4K028	C23C  10/34	33	ʴʪΡ㡥ѥåơΣ	Embedding in a powder mixture, i.e. pack cementation [4]
C23C  10/36  \	3	3	4K028	C23C  10/36	123	ǤΤߤȻΡΣ	only one element being diffused [4]
C23C  10/38  \	4	4	4K028	C23C  10/38	63	ޥ󥰡Σ	Chromising [4]
C23C  10/40  \	5	5	4K028	C23C  10/40	52	Ŵɽ̤Υޥ󥰡Σ	of ferrous surfaces [4]
C23C  10/42  \	6	6	4K028	C23C  10/42	61	ȯźúޤ¸ߤΡ㡥ϥʪΣ	in the presence of volatile transport additives, e.g. halogenated substances [4]
C23C  10/44  \	4	4	4K028	C23C  10/44	53	ꥳʥ󥰡Σ	Siliconising [4]
C23C  10/46  \	5	5	4K028	C23C  10/46	33	Ŵɽ̤Υꥳʥ󥰡Σ	of ferrous surfaces [4]
C23C  10/48  \	4	4	4K028	C23C  10/48	214	ߥʥ󥰡Σ	Aluminising [4]
C23C  10/50  \	5	5	4K028	C23C  10/50	110	Ŵɽ̤Υߥʥ󥰡Σ	of ferrous surfaces [4]
C23C  10/52  \	3	3	4K028	C23C  10/52	140	ʾθǤʳǳȻΡΣ	more than one element being diffused in one step [4]
C23C  10/54  \	4	4	4K028	C23C  10/54	55	ʤȤ⥯बȻΡΣ	Diffusion of at least chromium [4]
C23C  10/56  \	5	5	4K028	C23C  10/56	65	Ȥ⥯पӥߥ˥बȻΡΣ	and at least aluminium [4]
C23C  10/58  \	3	3	4K028	C23C  10/58	80	ʾθǤʳʾǳȻΡΣ	more than one element being diffused in more than one step [4]
C23C  10/60  \	1	1	4K028	C23C  10/60	105	Σ	After-treatment [4]
C23C  12/00  \	0	0	4K028	C23C  12/00	246	°ɽ̤ؤΤǰʳξȤ⣱Ĥ°ǤӾȤ⣱Ĥζ°ǤޤϤǤθȻΣ	Solid state diffusion of at least one non-metal element other than silicon and at least one metal element or silicon into metallic material surfaces [4]
C23C  12/02  \	1	1	4K028	C23C  12/02	232	ʳˤȻΣ	Diffusion in one step [4]
C23C  14/00  \	0	0	4K029	C23C  14/00	748	ʤο塤ѥå󥰤ޤϥˡˤʤΣ	Coating by vacuum evaporation, by sputtering or by ion implantation [4]
C23C  14/00  A	0	0	4K029	C23C  14/00	317	ʴ¤	Making foils, powders
C23C  14/00  B	0	0	4K029	C23C  14/00	1454	֤ɻߡɻˡޤ	Cleaning of devices, prevention of contamination (including cleaning, contamination preventing methods)
C23C  14/00  C	0	0	4K029	C23C  14/00	241		Vacuum treatment
C23C  14/00  D	0	0	4K029	C23C  14/00	107		Magnetic materials
C23C  14/00  Z	0	0	4K029	C23C  14/00	132	¾ΣУ֣	Other PVD
C23C  14/02  \	1	1	4K029	C23C  14/02	810	ʤʣããͥˡΣ	Pretreatment of the material to be coated (C23C 14/04 takes precedence) [4]
C23C  14/02  A	1	0	4K029	C23C  14/02	570	ͭĤ	Pre-treatment of organic substrates
C23C  14/02  B	1	0	4K029	C23C  14/02	180	ȾƳΤ	Pre-treatment of magnetic materials, semiconductors
C23C  14/02  Z	1	0	4K029	C23C  14/02	1077	¾	Other pre-treatment
C23C  14/04  \	1	1	4K029	C23C  14/04	1262	򤵤줿ɽʬʤ㡥ޥѤΡΣ	Coating on selected surface areas, e.g. using masks [4]
C23C  14/04  A	1	0	4K029	C23C  14/04	3028	ޥ	Masks
C23C  14/04  B	1	0	4K029	C23C  14/04	230	쥸	Resist
C23C  14/04  C	1	0	4K029	C23C  14/04	123	ž	Transfer
C23C  14/04  Z	1	0	4K029	C23C  14/04	703	¾ʤ	Other selective covering
C23C  14/06  \	1	1	4K029	C23C  14/06	3858	ʤħΤΡʣããͥˡΣ	characterised by the coating material (C23C 14/04 takes precedence) [4]
C23C  14/06  A	1	0	4K029	C23C  14/06	3273	ⲽʪ̣£Ρúⲽʪ	Nitrides (excluding BN, carbontrides etc.)
C23C  14/06  B	1	0	4K029	C23C  14/06	600	úʪ̣ä	Carbides (excluding C)
C23C  14/06  C	1	0	4K029	C23C  14/06	190	ﲽʪ̣£Τ	Boron compounds (excluding BN)
C23C  14/06  D	1	0	4K029	C23C  14/06	198	βʪ	Sulfides
C23C  14/06  E	1	0	4K029	C23C  14/06	529	ʪ	Silicides
C23C  14/06  F	1	0	4K029	C23C  14/06	1407	ú̥եȥɡ	Carbide coating (graphite diamond)
C23C  14/06  G	1	0	4K029	C23C  14/06	554	¾βʪ̣Ʋʪʪ	Other compound coverings (fluorine compounds, arsenic compounds.)
C23C  14/06  H	1	0	4K029	C23C  14/06	847	úⲽʪúʪⲽʪȤޤ	Carbonitrides (including juxtaposition with carbides, nitrides)
C23C  14/06  J	1	0	4K029	C23C  14/06	226	£	BN
C23C  14/06  K	1	0	4K029	C23C  14/06	533	ʣ粽ʪʤúⲽʪ¿°ʪ	Composite compound coating (excluding carbonitrides, multi-metal compounds)
C23C  14/06  L	1	0	4K029	C23C  14/06	1093	ʪ¿°ʪޤ	Compound coating (including multi-metal compounds)
C23C  14/06  M	1	0	4K029	C23C  14/06	237	ʤ̡̳Ȼؤؤ˿ʤؤϿ	Laminate coating in general (diffused layers are not counted in layers, reformed layers are counted)
C23C  14/06  N	1	1	4K029	C23C  14/06	2654	°ؤޤʤ	Laminate coating including metal layer
C23C  14/06  P	1	1	4K029	C23C  14/06	2327	°ؤޤޤʤʤ	Laminate coating not including metal layer
C23C  14/06  Q	1	1	4K029	C23C  14/06	506	ͭؤޤʤ̣ΡФͥ	Laminate coating including organic layer (precedence over N, P)
C23C  14/06  R	1	0	4K029	C23C  14/06	248	ȿ	Reflective coating
C23C  14/06  S	1	0	4K029	C23C  14/06	186	ĶƳ	Superconducting coating
C23C  14/06  T	1	0	4K029	C23C  14/06	392		Magnetic coating
C23C  14/06  Z	1	0	4K029	C23C  14/06	313	¾ʤ	Other coating materials
C23C  14/08  \	2	2	4K029	C23C  14/08	2018	ʪʣããͥˡΣ	Oxides (C23C 14/10 takes precedence) [4]
C23C  14/08  A	2	0	4K029	C23C  14/08	1041	߻ʪ	Aluminium oxides
C23C  14/08  B	2	0	4K029	C23C  14/08	76	Ŵʪ	Iron oxides
C23C  14/08  C	2	0	4K029	C23C  14/08	746	ʪ	Zinc oxides
C23C  14/08  D	2	0	4K029	C23C  14/08	1659	ʪޤϥ󥸥ʪʣɣԣޤ	Stannic oxides or indium oxides (including ITO coating)
C23C  14/08  E	2	0	4K029	C23C  14/08	504	ʪ	Titanic oxides
C23C  14/08  F	2	0	4K029	C23C  14/08	190	ڣ򡢣ȣλʪ	Oxides of Zr, Hf
C23C  14/08  G	2	0	4K029	C23C  14/08	227	Ѳ°ʣԣ顢ڣ򡢣ȣ֡Σˤλʪ	Oxides of refractory metals (excluding Ti, Zr, Hf, e.g. V, Nb)
C23C  14/08  H	2	0	4K029	C23C  14/08	48	°λʪ	Oxides of precious metals
C23C  14/08  J	2	0	4K029	C23C  14/08	602	¾ñ°ʪ	Other single metal oxides
C23C  14/08  K	2	0	4K029	C23C  14/08	2321	ʣʪʣɣԣ¿°ʪ	Composite oxides (polygenetic metallic oxides excluding ITO coating)
C23C  14/08  L	2	0	4K029	C23C  14/08	909	ʪĶƳ	Superconductor oxides
C23C  14/08  M	2	0	4K029	C23C  14/08	128	ʪ	Magnetic coating oxides
C23C  14/08  N	2	0	4K029	C23C  14/08	1143	ʪޤ	Laminate
C23C  14/08  Z	2	0	4K029	C23C  14/08	323	¾	Others
C23C  14/10  \	2	2	4K029	C23C  14/10	771	饹ޤϥꥫΣ	Glass or silica [4]
C23C  14/12  \	2	2	4K029	C23C  14/12	1738	ͭΣ	Organic material [4]
C23C  14/14  \	2	2	4K029	C23C  14/14	1999	°ۤǤޤϤǡΣ	Metallic material, boron or silicon [4]
C23C  14/14  A	2	0	4K029	C23C  14/14	303		Silicides
C23C  14/14  B	2	0	4K029	C23C  14/14	640	̣죵ʾιޤ	Al (containing alloy of Al 50% or more)
C23C  14/14  C	2	0	4K029	C23C  14/14	124	ڣ̣ڣޤࡤڣݣͣ	Zn (containing Zn alloy, e.g. Zn-Mg alloy)
C23C  14/14  D	2	0	4K029	C23C  14/14	2082	°̤¾°ꤷΡ¤ޤ	Metallic materials (with specified other metals, containing B)
C23C  14/14  E	2	0	4K029	C23C  14/14	90	󾽼°	Amorphous metallic materials
C23C  14/14  F	2	0	4K029	C23C  14/14	761	°̼Ͽ	Magnetic metal film (magnetic recording media etc.)
C23C  14/14  G	2	0	4K029	C23C  14/14	890	°ؤΤߤʤ	Laminate coating consisting of metal layer only
C23C  14/14  Z	2	0	4K029	C23C  14/14	492	¾ζ°	Other metallic material film
C23C  14/16  \	3	3	4K029	C23C  14/16	538	°ľޤϤۤǤ⤷ϤǤδľʤΡΣ	on metallic substrates or on substrates of boron or silicon [4]
C23C  14/16  A	3	0	4K029	C23C  14/16	320		Steel plate
C23C  14/16  B	3	0	4K029	C23C  14/16	228	ĶŹ	Super-hard alloys
C23C  14/16  C	3	0	4K029	C23C  14/16	79		Decorations
C23C  14/16  D	3	0	4K029	C23C  14/16	29		Magnets
C23C  14/16  Z	3	0	4K029	C23C  14/16	463	¾°ǡǤޤʹĤħ	Characterized by other metallic material substrates (including boron, silicon)
C23C  14/18  \	3	3	4K029	C23C  14/18	295	¾̵ľʤΡΣ	on other inorganic substrates [4]
C23C  14/20  \	3	3	4K029	C23C  14/20	1040	ͭľʤΡΣ	on organic substrates [4]
C23C  14/20  A	3	0	4K029	C23C  14/20	1479	ľؤʤ	Coating on resin substrates
C23C  14/20  B	3	0	4K029	C23C  14/20	195	ؤʤ	Coating on paint layer
C23C  14/20  C	3	0	4K029	C23C  14/20	7	ؤʤ	Coating on double paint layer
C23C  14/20  D	3	0	4K029	C23C  14/20	55	°ؤ塤ž	Adhesion, transfer on metal layer
C23C  14/20  Z	3	0	4K029	C23C  14/20	167	¾̻ͭ桢ݡʹĤħ	Characterized by other organic material substrates (paper, fibre etc.)
C23C  14/22  \	1	1	4K029	C23C  14/22	881	ʤˡħΤΡΣ	characterised by the process of coating [4]
C23C  14/22  A	1	0	4K029	C23C  14/22	157	ȥʻѡ̥ӡݥƱȼͣ	Combined use of vacuum evaporation and ion implantation (excluding simultaneous irradiation of beam 14/48)
C23C  14/22  B	1	0	4K029	C23C  14/22	72	ѥĥ󥰤ȥʻѡ̥ӡݥƱȼͣ	Combined use of sputtering and ion implantation (excluding simultaneous irradiation of beam 14/48)
C23C  14/22  C	1	0	4K029	C23C  14/22	162	ȥѥĥ󥰤ʻ	Combined use of vacuum evaporation and sputtering (excluding simultaneous irradiation of beam 14/48)
C23C  14/22  D	1	0	4K029	C23C  14/22	66	ޥȤѤʤˡ	General coating methods using microwave
C23C  14/22  E	1	0	4K029	C23C  14/22	59	ʤˡ	General coating methods of magnetic coating
C23C  14/22  F	1	0	4K029	C23C  14/22	201	Ūʥͥ륮ݾȼ̸͡ȼͤޤ	Auxiliary energy irradiation (including light irradiation)
C23C  14/22  Z	1	0	4K029	C23C  14/22	296	¾ʤˡħ	Characterised by other coating methods
C23C  14/24  \	2	2	4K029	C23C  14/24	3331	Σ	Vacuum evaporation [4]
C23C  14/24  A	2	0	4K029	C23C  14/24	1824	ȯƴΡ̺¤ʤ	Evaporation source container unit (material quality, structure, inner coating)
C23C  14/24  B	2	0	4K029	C23C  14/24	506	ȯƴβǮ	Heating, cooling of evaporation source container
C23C  14/24  C	2	0	4K029	C23C  14/24	685	ȯƴοְư	Number of evaporation source containers, movement of position
C23C  14/24  D	2	0	4K029	C23C  14/24	622	ȯζ롢	Supply, replenishment of evaporation source materials
C23C  14/24  E	2	0	4K029	C23C  14/24	998	ȯ	Evaporation source materials per se
C23C  14/24  F	2	0	4K029	C23C  14/24	902	ŸŤˤȯݥž	Evaporation by electric arc discharge, arc discharge evaporation
C23C  14/24  G	2	0	4K029	C23C  14/24	1367	̥ĥݡޥ	Vacuum evaporation (shutter, mask)
C23C  14/24  H	2	0	4K029	C23C  14/24	134	Ѵ	Substrate units for formation of vacuum evaporation coat
C23C  14/24  J	2	0	4K029	C23C  14/24	573	ѴĤݻư	Retention and movement of substrates for formation of vacuum evaporation coat
C23C  14/24  K	2	0	4K029	C23C  14/24	286	ѴĤβǮ	Heating and cooling of substrates for formation of vacuum evaporation coat
C23C  14/24  L	2	0	4K029	C23C  14/24	214	ˤǮѡ̴ĤβǮѤ	Heating and cooling in vacuum evaporation (excluding heating, cooling of substrates)
C23C  14/24  M	2	0	4K029	C23C  14/24	522	ˤӵ	Air supply and discharge in vacuum evaporation, gas composition
C23C  14/24  N	2	0	4K029	C23C  14/24	391	ꤷΡ	Vacuum evaporation (with designated film
C23C  14/24  P	2	0	4K029	C23C  14/24	242	̼С	Vacuum evaporation (magnetism, magnet)
C23C  14/24  Q	2	0	4K029	C23C  14/24	77	ĶƳ	Vacuum evaporation (superconducting film)
C23C  14/24  R	2	0	4K029	C23C  14/24	305	ˡ̿͸ΤΡ	Vacuum evaporation method (with limited values)
C23C  14/24  S	2	0	4K029	C23C  14/24	612	ˡ̿͸ΤʤΡ	Vacuum evaporation method (with no limited values)
C23C  14/24  T	2	0	4K029	C23C  14/24	953	嵭ʬवʤ	Vacuum evaporation devices not classified above
C23C  14/24  U	2	0	4K029	C23C  14/24	708	桢	Control, detection of vacuum evaporation
C23C  14/24  V	2	0	4K029	C23C  14/24	159	Ϣ³	Continuous treatment of vacuum evaporation
C23C  14/24  Z	2	0	4K029	C23C  14/24	85	¾	Others
C23C  14/26  \	3	3	4K029	C23C  14/26	597	񹳲ǮޤͶƳǮˤΡΣ	by resistance or inductive heating of the source [4]
C23C  14/26  A	3	0	4K029	C23C  14/26	401	񹳲Ǯ	Resistance heating
C23C  14/26  B	3	0	4K029	C23C  14/26	75	ͶƳǮ	Induced heating
C23C  14/26  Z	3	0	4K029	C23C  14/26	66	¾	Others
C23C  14/28  \	3	3	4K029	C23C  14/28	1065	ưͥ륮ޤγͤˤΡʣããããͥˡΣ	by wave energy or particle radiation (C23C 14/32-C23C 14/48 take precedence) [4]
C23C  14/30  \	4	4	4K029	C23C  14/30	842	ŻҾ׷ˤΡΣ	by electron bombardment [4]
C23C  14/30  A	4	0	4K029	C23C  14/30	536	ȯ̹¤ưѡ롢Ρ	Evaporation source (structure, transport, cooling, replenishment, detection, control)
C23C  14/30  B	4	0	4K029	C23C  14/30	437	ŻŻҽƤι¤Żҥӡݥи	Electronic source (structure of electronic guns, deflection of electronic beams)
C23C  14/30  Z	4	0	4K029	C23C  14/30	400	¾	Others
C23C  14/32  \	3	3	4K029	C23C  14/32	1961	ȯˤΡȯӤθξΥ󲽤ˤΡʣããããͥˡΣ	by explosion; by evaporation and subsequent ionisation of the vapours (C23C 14/34-C23C 14/48 take precedence) [4]
C23C  14/32  A	3	0	4K029	C23C  14/32	463	ȯ	Evaporation source
C23C  14/32  B	3	0	4K029	C23C  14/32	604		Ionisation area
C23C  14/32  C	3	0	4K029	C23C  14/32	99	®	Acceleration area
C23C  14/32  D	3	0	4K029	C23C  14/32	274		Substrate area
C23C  14/32  E	3	0	4K029	C23C  14/32	142	ӵ	Gas supply exhaust area
C23C  14/32  F	3	0	4K029	C23C  14/32	391	ӡݥ	Ion beam evaporation
C23C  14/32  G	3	1	4K029	C23C  14/32	419	饹ݥӡݥ	Cluster ion beam evaporation
C23C  14/32  H	3	0	4K029	C23C  14/32	236	ȣã	HCD
C23C  14/32  Z	3	0	4K029	C23C  14/32	1050	¾	Others
C23C  14/34  \	2	2	4K029	C23C  14/34	4683	ѥå󥰡Σ	Sputtering [4]
C23C  14/34  A	2	0	4K029	C23C  14/34	7597	ݥĥȤκʣ祿ݥĥȤޤ	Material quality of target (including combined targets)
C23C  14/34  B	2	0	4K029	C23C  14/34	966	ݥĥȤη	Shape of target
C23C  14/34  C	2	0	4K029	C23C  14/34	2390	ݥĥȤ̼֡֡ʣݥĥȤޤ	Installation of target (including peripherals, multiple targets)
C23C  14/34  D	2	0	4K029	C23C  14/34	342	иݥĥȼѥĥ	Facing target type sputtering
C23C  14/34  E	2	0	4K029	C23C  14/34	125	Ʊѥĥ	Coaxial sputtering
C23C  14/34  F	2	0	4K029	C23C  14/34	86	ѥĥ	Sputter guns
C23C  14/34  G	2	0	4K029	C23C  14/34	350	ĥ	Shutters
C23C  14/34  H	2	0	4K029	C23C  14/34	174	ѥĥѴ	Substrate units for formation of sputtering coat
C23C  14/34  J	2	0	4K029	C23C  14/34	783	ѥĥѴĤݻư	Retention and movement of substrates for formation of sputtering coat
C23C  14/34  K	2	0	4K029	C23C  14/34	427	ѥĥѴĤβǮ	Heating and cooling of substrates for formation of sputtering coat
C23C  14/34  L	2	0	4K029	C23C  14/34	268	ѥĥ󥰤ˤǮѡ̴ĤβǮѤ	Heating and cooling in sputtering  (excluding heating, cooling of substrates)
C23C  14/34  M	2	0	4K029	C23C  14/34	1407	ѥĥ󥰤ˤӵ	Air supply and discharge in sputtering, gas composition
C23C  14/34  N	2	0	4K029	C23C  14/34	1291	ѥĥ󥰡ꤷΡ	Sputtering  (with designated film)
C23C  14/34  P	2	0	4K029	C23C  14/34	494	ѥĥ󥰡̼С	Sputtering  (magnetism, magnet)
C23C  14/34  Q	2	0	4K029	C23C  14/34	186	ѥĥ󥰡ĶƳ	Sputtering  (superconducting film)
C23C  14/34  R	2	0	4K029	C23C  14/34	799	ѥĥˡ̿͸ΤΡ	Sputtering method (with limited values)
C23C  14/34  S	2	0	4K029	C23C  14/34	1062	ѥĥˡ̿͸ΤʤΡ	Sputtering method (with no limited values)
C23C  14/34  T	2	0	4K029	C23C  14/34	1746	嵭ʬवʤѥĥ	Sputtering devices not classified above
C23C  14/34  U	2	0	4K029	C23C  14/34	1078	ѥĥ󥰤桢	Control, detection of  sputtering
C23C  14/34  V	2	0	4K029	C23C  14/34	323	ѥĥ󥰤Ϣ³	Continuous treatment of  sputtering
C23C  14/34  Z	2	0	4K029	C23C  14/34	235	¾	Others
C23C  14/35  \	3	3	4K029	C23C  14/35	719	ŬѤˤΡ㡥ޥͥȥ󥹥ѥå󥰡Σ	by application of a magnetic field, e.g. magnetron sputtering [5]
C23C  14/35  A	3	0	4K029	C23C  14/35	265	ݥΰγ	Expansion of erosion area
C23C  14/35  B	3	1	4K029	C23C  14/35	802	Фΰư	Movement of magnets
C23C  14/35  C	3	1	4K029	C23C  14/35	655		Control of magnetic field
C23C  14/35  D	3	2	4K029	C23C  14/35	180	ΥݥĥȤФϳ̼η	Formation of leaking magnetic field against magnetic body target
C23C  14/35  E	3	0	4K029	C23C  14/35	136	ʿԼη	Formation of parallel magnetic field
C23C  14/35  F	3	0	4K029	C23C  14/35	206	ޥȤ	Use of microwave
C23C  14/35  Z	3	0	4K029	C23C  14/35	1139	¾	Others
C23C  14/36  \	3	3	4K029	C23C  14/36	724	ɥѥå󥰡ʣããͥˡΣ	Diode sputtering (C23C 14/35 takes precedence) [4,5]
C23C  14/38  \	4	4	4K029	C23C  14/38	199	ľήŤˤΡΣ	by direct current glow discharge [4]
C23C  14/40  \	4	4	4K029	C23C  14/40	508	ήŤȼΡ㡥šΣ	with alternating current discharge, e.g. high-frequency discharge [4]
C23C  14/42  \	3	3	4K029	C23C  14/42	73	ȥꥪɥѥå󥰡ʣããͥˡΣ	Triode sputtering (C23C 14/35 takes precedence) [4,5]
C23C  14/44  \	4	4	4K029	C23C  14/44	114	ȤɲŪľήŰŬѤˤΡΣ	by application of high frequencies and additional direct voltages [4]
C23C  14/46  \	3	3	4K029	C23C  14/46	347	Υ󸻤ˤ줿ӡˤΡʣããͥˡΣ	by ion beam produced by an external ion source (C23C 14/40 takes precedence) [4]
C23C  14/46  A	3	0	4K029	C23C  14/46	58	ȿ	Reactivity
C23C  14/46  B	3	0	4K029	C23C  14/46	221	ӡݥ฻ڤӥӡݥν	Treatment of beam source and beam
C23C  14/46  C	3	0	4K029	C23C  14/46	128	ݥĥ	Target area
C23C  14/46  Z	3	0	4K029	C23C  14/46	210	¾	Others
C23C  14/48  \	2	2	4K029	C23C  14/48	1078	ˡΣ	Ion implantation [4]
C23C  14/48  A	2	0	4K029	C23C  14/48	439	θ̡®Űͳ	Limitation of implantation conditions (implantation volume. Acceleration voltage, angle of incidence)
C23C  14/48  B	2	0	4K029	C23C  14/48	334	θФޤ	Detection or control of implantation conditions
C23C  14/48  C	2	0	4K029	C23C  14/48	132	Ų٤ν	Removal of accumulated charge
C23C  14/48  D	2	0	4K029	C23C  14/48	489	ӡݥߥ󥰡̥ӡݥॢȤޤ	Ion beam mixing (including beam assist)
C23C  14/48  Z	2	0	4K029	C23C  14/48	1221	¾	Others
C23C  14/50  \	2	2	4K029	C23C  14/50	1443	ݻΣ	Substrate holders [4]
C23C  14/50  A	2	0	4K029	C23C  14/50	478	ʡ̵	Fixing means (adsorption)
C23C  14/50  B	2	0	4K029	C23C  14/50	137	ʡ	Fixing means (elasticity)
C23C  14/50  C	2	0	4K029	C23C  14/50	40	ʡء	Fixing means (intermediate layer)
C23C  14/50  D	2	0	4K029	C23C  14/50	359	ʰ	Fixing means in general
C23C  14/50  E	2	0	4K029	C23C  14/50	833	ĤβǮ	Heating, cooling of substrates
C23C  14/50  F	2	0	4K029	C23C  14/50	460	Ĥݻ̥ޥĥݡ	Retention of substrates (mass/shutter)
C23C  14/50  G	2	0	4K029	C23C  14/50	283	ž	Revolution
C23C  14/50  H	2	1	4K029	C23C  14/50	435	ž	Rotation and revolution
C23C  14/50  J	2	0	4K029	C23C  14/50	198	žΤ	Rotation only
C23C  14/50  K	2	0	4K029	C23C  14/50	624	ʪΰưæ塦½ưľư	Moving of evaporated items (desorption, carry-in/carry-out, vibration, linear movement)
C23C  14/50  Z	2	0	4K029	C23C  14/50	344	¾	Others
C23C  14/52  \	2	2	4K029	C23C  14/52	426	ʤδѻΤμʡΣ	Means for observation of the coating process [4]
C23C  14/54  \	2	2	4K029	C23C  14/54	1468	ʤޤĴΣ	Controlling or regulating the coating process [4]
C23C  14/54  A	2	0	4K029	C23C  14/54	407		Control of coating material supply area
C23C  14/54  B	2	0	4K029	C23C  14/54	704	ʷϵ̵ӵץ饺ͤ	Control of atmosphere inside vacuum tank (air supply and discharge/plasma etc.)
C23C  14/54  C	2	0	4K029	C23C  14/54	465		Control of coat forming area
C23C  14/54  D	2	1	4K029	C23C  14/54	255	ĵڤβ	Temperature control of substrate and coating
C23C  14/54  E	2	0	4K029	C23C  14/54	398	θŪ	Optical detection of coating
C23C  14/54  F	2	0	4K029	C23C  14/54	308	եݥɥХĥ	Feedback control
C23C  14/54  G	2	0	4K029	C23C  14/54	218	ޥĥݤ	Control of masks, shutters
C23C  14/54  Z	2	0	4K029	C23C  14/54	464	¾	Other controls
C23C  14/56  \	2	2	4K029	C23C  14/56	2145	Ϣ³ʤΤäŬ礷֡ݻ뤿֡㡥åΣ	Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks [4]
C23C  14/56  A	2	0	4K029	C23C  14/56	1191	ĹʪΤϢ³	Continuous treatment of elongated substrates
C23C  14/56  B	2	1	4K029	C23C  14/56	425	ư˴ؤ	Related to moving
C23C  14/56  C	2	1	4K029	C23C  14/56	339	ݥ˴ؤ	Related to seal
C23C  14/56  D	2	1	4K029	C23C  14/56	289	Ǯ	Heating and cooling
C23C  14/56  E	2	1	4K029	C23C  14/56	225	ѥĥ󥰤˴ؤ	Related to sputtering
C23C  14/56  F	2	0	4K029	C23C  14/56	296	ĹʪΤϢ³	Continuous treatment of those other than elongated substrates
C23C  14/56  G	2	1	4K029	C23C  14/56	1271	ưڤ½˴ؤ	Related to moving and carry-in/carry-out
C23C  14/56  H	2	1	4K029	C23C  14/56	275	ѥĥ󥰤˴ؤ	Related to sputtering
C23C  14/56  J	2	0	4K029	C23C  14/56	238	ޥĥ	Masks, shutters
C23C  14/56  K	2	0	4K029	C23C  14/56	141		Magnetic coating
C23C  14/56  L	2	0	4K029	C23C  14/56	43	ǥ󥵡Ŷ	Electrode foils for condensers
C23C  14/56  Z	2	0	4K029	C23C  14/56	103	¾	Others
C23C  14/58  \	1	1	4K029	C23C  14/58	738	Σ	After-treatment [4]
C23C  14/58  A	1	0	4K029	C23C  14/58	1067	Ǯ̣ͥ	Heat treatment (C takes precedence)
C23C  14/58  B	1	0	4K029	C23C  14/58	165	У֣˿ȼ	Accompanied by formation of new coating on PVD coating
C23C  14/58  C	1	0	4K029	C23C  14/58	352	ͥ륮ݥӡݥȼ	Energy beam irradiation
C23C  14/58  D	1	0	4K029	C23C  14/58	112	θ	After-treatment of magnetic coating
C23C  14/58  Z	1	0	4K029	C23C  14/58	690	¾θ	Other after-treatment
C23C  16/00  \	0	0	4K030	C23C  16/00	329	ʪʬˤ벽ŪʤǤäơɽ̺ȿʪʤ˻ĤʤΡʤؾΣã֣ġˡȿѥå󥰤ޤϿããˡΣ	Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes (reactive sputtering or vacuum evaporation C23C 14/00) [2006.01]
C23C  16/01  \	1	1	4K030	C23C  16/01	413	Ūʴľ˹ԤΡ㡥å󥰤ˤäƷŪ˽褦ʴĤξΣ	on temporary substrates, e.g. on substrates subsequently removed by etching [7]
C23C  16/02  \	1	1	4K030	C23C  16/02	1620	ʤʣããͥˡΣ	Pretreatment of the material to be coated (C23C 16/04 takes precedence) [4]
C23C  16/04  \	1	1	4K030	C23C  16/04	1050	򤵤줿ɽʬؤʤ㡥ޥѤΡΣ	Coating on selected surface areas, e.g. using masks [4]
C23C  16/06  \	1	1	4K030	C23C  16/06	614	°ϽФħΤΡΣ	characterised by the deposition of metallic material [4]
C23C  16/08  \	2	2	4K030	C23C  16/08	400	°ϥʪΤΡΣ	from metal halides [4]
C23C  16/10  \	3	3	4K030	C23C  16/10	15	ΤߤϽСΣ	Deposition of chromium only [4]
C23C  16/12  \	3	3	4K030	C23C  16/12	64	ߥ˥Τߤ޽СΣ	Deposition of aluminium only [4]
C23C  16/14  \	3	3	4K030	C23C  16/14	598	¾Σ°ǤΤߤϽСΣ	Deposition of only one other metal element [4]
C23C  16/16  \	2	2	4K030	C23C  16/16	263	°ܥ˥벽ʪΤΡΣ	from metal carbonyl compounds [4]
C23C  16/18  \	2	2	4K030	C23C  16/18	1732	°ͭʪΤΡΣ	from metallo-organic compounds [4]
C23C  16/20  \	3	3	4K030	C23C  16/20	150	ߥ˥ΤߤϽСΣ	Deposition of aluminium only [4]
C23C  16/22  \	1	1	4K030	C23C  16/22	236	°ʳ̵ϽФħΤΡΣ	characterised by the deposition of inorganic material, other than metallic material [4]
C23C  16/24  \	2	2	4K030	C23C  16/24	2396	ǤΤߤϽСΣ	Deposition of silicon only [4]
C23C  16/26  \	2	2	4K030	C23C  16/26	2981	úǤΤߤϽСΣ	Deposition of carbon only [4]
C23C  16/27  \	3	3	4K030	C23C  16/27	3372	ɤΤߤϽСΣ	Diamond only [7]
C23C  16/28  \	2	2	4K030	C23C  16/28	104	¾Σ°ǤΤߤϽСΣ	Deposition of only one other non-metal element [4]
C23C  16/30  \	2	2	4K030	C23C  16/30	4117	ʪʪޤϸΤϽС㡥ۤʪúʪⲽʪΣ	Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides [4]
C23C  16/32  \	3	3	4K030	C23C  16/32	1136	úʪΣ	Carbides [4]
C23C  16/34  \	3	3	4K030	C23C  16/34	4474	ⲽʪΣ	Nitrides [4]
C23C  16/36  \	3	3	4K030	C23C  16/36	986	úⲽʪΣ	Carbo-nitrides [4]
C23C  16/38  \	3	3	4K030	C23C  16/38	293	ۤʪΣ	Borides [4]
C23C  16/40  \	3	3	4K030	C23C  16/40	5260	ʪΣ	Oxides [4]
C23C  16/42  \	3	3	4K030	C23C  16/42	4464	ʪΣ	Silicides [4]
C23C  16/44  \	1	1	4K030	C23C  16/44	983	ʤˡħΤΡʣããͥˡΣ	characterised by the method of coating (C23C 16/04 takes precedence) [4]
C23C  16/44  A	1	0	4K030	C23C  16/44	1096	ˡ	Methods
C23C  16/44  B	1	0	4K030	C23C  16/44	2308	֤ȴϢ	Related to devices
C23C  16/44  E	1	1	4K030	C23C  16/44	738	ѥν	Treatment of waste gas
C23C  16/44  F	1	1	4K030	C23C  16/44	1322	Τ	Transportation of bases
C23C  16/44  G	1	1	4K030	C23C  16/44	397	ζư	Driving of bases
C23C  16/44  J	1	1	4K030	C23C  16/44	3758	ȿʪνɻ	Removal, prevention of attachment of reactants
C23C  16/44  Z	1	0	4K030	C23C  16/44	404	¾	Others
C23C  16/442  \	2	2	4K030	C23C  16/442	99	ήξˡѤΡΣ	using fluidised bed processes [7]
C23C  16/448  \	2	2	4K030	C23C  16/448	2027	ȿήȯ뤿ѤˡħΡ㡥ԤξȯޤϾڤˤΡΣ	characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials [7]
C23C  16/452  \	3	3	4K030	C23C  16/452	310	ȿƳȿή뤳ȤˤΡ㡥ȿΥ󲽤ޤźäˤΡΣ	by activating reactive gas streams before introduction into the reaction chamber, e.g. by ionization or by addition of reactive species [7]
C23C  16/453  \	2	2	4K030	C23C  16/453	71	ȿСʡޤϥȡ̤Ρ㡥ã֣ġʣããͥ表ϲʤΡбޤϥץ饺ޤˤ륹ץ졼ѤΤΣããˡΣ	passing the reaction gases through burners or torches, e.g. atmospheric pressure CVD (C23C 16/513 takes precedence; for flame or plasma spraying of coating material in the molten state C23C 4/00) [7]
C23C  16/455  \	2	2	4K030	C23C  16/455	8319	ȿƳ뤿ᡤޤȿΥήѤ뤿˻ȤˡħΡΣ	characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber [7]
C23C  16/458  \	2	2	4K030	C23C  16/458	2828	ȿδĤ٤Τ˻ȤˡħΡΣ	characterised by the method used for supporting substrates in the reaction chamber [7]
C23C  16/46  \	2	2	4K030	C23C  16/46	2564	ĤǮΤ˻ȤˡħΡʣããããͥˡΣ	characterised by the method used for heating the substrate (C23C 16/48, C23C 16/50 take precedence) [4]
C23C  16/48  \	2	2	4K030	C23C  16/48	1495	ͤˤΡ㡥ʬʬγ͡Σ	by irradiation, e.g. photolysis, radiolysis, particle radiation [4]
C23C  16/50  \	2	2	4K030	C23C  16/50	7940	ŤѤΡΣ	using electric discharges [4]
C23C  16/503  \	3	3	4K030	C23C  16/503	322	ήޤľήŤѤΡΣ	using dc or ac discharges [7]
C23C  16/505  \	3	3	4K030	C23C  16/505	1955	ŤˤΡΣ	using radio frequency discharges [7]
C23C  16/507  \	4	4	4K030	C23C  16/507	516	Ŷˡ㡥ȥͥ뷿Υꥢȥ롤ѤΡΣ	using external electrodes, e.g. in tunnel type reactors [7]
C23C  16/509  \	4	4	4K030	C23C  16/509	1869	ŶˤѤΡΣ	using internal electrodes [7]
C23C  16/511  \	3	3	4K030	C23C  16/511	3541	ޥŤѤΡΣ	using microwave discharges [7]
C23C  16/513  \	3	3	4K030	C23C  16/513	251	ץ饺ޥåȤѤΡΣ	using plasma jets [7]
C23C  16/515  \	3	3	4K030	C23C  16/515	470	ѥ륹ŤѤΡΣ	using pulsed discharges [7]
C23C  16/517  \	3	3	4K030	C23C  16/517	93	ããããΥ롼פΤİʾʬवŤȤ߹碌ѤΡΣ	using a combination of discharges covered by two or more of groups C23C 16/503-C23C 16/515 [7]
C23C  16/52  \	2	2	4K030	C23C  16/52	2848	ʤޤĴΣ	Controlling or regulating the coating process [4]
C23C  16/54  \	2	2	4K030	C23C  16/54	1512	Ϣ³ʤäŬ礷֡Σ	Apparatus specially adapted for continuous coating [4]
C23C  16/56  \	1	1	4K030	C23C  16/56	1379	Σ	After-treatment [4]
C23C  18/00  \	0	0	4K022	C23C  18/00	196	վʪޤϱդΤ줫ʤʤʪʬˤ벽ŪʤǤäɽ̺ȿʪʤ˻ĤʤΡܿåΣ	Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating [4]
C23C  18/02  \	1	1	4K022	C23C  18/02	187	ǮʬˤΡΣ	by thermal decomposition [4]
C23C  18/04  \	2	2	4K022	C23C  18/04	52	ʤʣããͥˡΣ	Pretreatment of the material to be coated (C23C 18/06 takes precedence) [4]
C23C  18/06  \	2	2	4K022	C23C  18/06	51	򤵤줿ɽʬʤ㡥ޥѤΡΣ	Coating on selected surface areas, e.g. using masks [4]
C23C  18/08  \	2	2	4K022	C23C  18/08	396	°ϽФħΤΡΣ	characterised by the deposition of metallic material [4]
C23C  18/10  \	3	3	4K022	C23C  18/10	58	ߥ˥ΤߤϽСΣ	Deposition of aluminium only [4]
C23C  18/12  \	2	2	4K022	C23C  18/12	1328	°ʳ̵ϽФħΤΡΣ	characterised by the deposition of inorganic material other than metallic material [4]
C23C  18/14  \	1	1	4K022	C23C  18/14	266	ͤˤʬ㡥ʬγ͡Σ	Decomposition by irradiation, e.g. photolysis, particle radiation [4]
C23C  18/16  \	1	1	4K022	C23C  18/16	2007	ԸޤִˤΡ㡥̵ŲåʣããͥˡΣ	by reduction or substitution, i.e. electroless plating (C23C 18/54 takes precedence) [4]
C23C  18/16  A	1	0	4K022	C23C  18/16	1682	ɽ̤ؤΥå	Characterized by plastic substrates
C23C  18/16  B	1	0	4K022	C23C  18/16	523	ȾƳɽ̤ؤΥĥ	Plating on semiconductor surfaces
C23C  18/16  Z	1	0	4K022	C23C  18/16	830	¾ʴޡѱս	Others
C23C  18/18  \	2	2	4K022	C23C  18/18	2366	ʤΣ	Pretreatment of the material to be coated [4]
C23C  18/20  \	3	3	4K022	C23C  18/20	338	ͭɽ̤㡥Σ	of organic surfaces, e.g. resins [4]
C23C  18/20  A	3	0	4K022	C23C  18/20	509	żȾȼ	Irradiation of electromagnetic waves
C23C  18/20  Z	3	0	4K022	C23C  18/20	1326	¾	Others
C23C  18/22  \	4	4	4K022	C23C  18/22	497	̲㡥å󥰤ˤΡΣ	Roughening, e.g. by etching [4]
C23C  18/24  \	5	5	4K022	C23C  18/24	301	ϱդѤΡΣ	using acid aqueous solutions [4]
C23C  18/26  \	5	5	4K022	C23C  18/26	138	ͭΤѤΡΣ	using organic liquids [4]
C23C  18/28  \	4	4	4K022	C23C  18/28	646	ޤϳΣ	Sensitising or activating [4]
C23C  18/30  \	5	5	4K022	C23C  18/30	1064	Σ	Activating [4]
C23C  18/31  \	2	2	4K022	C23C  18/31	113	°ˤʤΣ	Coating with metals [5]
C23C  18/31  A	2	0	4K022	C23C  18/31	2681	ʪʡ̽ץġͤؤʤ	Coating on specific articles (excluding printed boards)
C23C  18/31  E	2	0	4K022	C23C  18/31	1899		Devices
C23C  18/31  Z	2	0	4K022	C23C  18/31	1437	¾	Others
C23C  18/32  \	3	3	4K022	C23C  18/32	928	ŴХȤޤϥ˥åΤ줫ˤʤ°ΣĤȤޤϤۤǤκʪʤΡΣ	Coating with one of iron, cobalt or nickel; Coating with mixtures of phosphorus or boron with one of these metals [4,5]
C23C  18/34  \	4	4	4K022	C23C  18/34	1236	ԸޤѤΡΣ	using reducing agents [4,5]
C23C  18/36  \	5	5	4K022	C23C  18/36	808	ѤΡΣ	using hypophosphites [4,5]
C23C  18/38  \	3	3	4K022	C23C  18/38	549	ƼˤʤΣ	Coating with copper [4,5]
C23C  18/40  \	4	4	4K022	C23C  18/40	1703	ԸޤѤΡΣ	using reducing agents [4,5]
C23C  18/42  \	3	3	4K022	C23C  18/42	727	°ˤʤΣ	Coating with noble metals [4,5]
C23C  18/44  \	4	4	4K022	C23C  18/44	1107	ԸޤѤΡΣ	using reducing agents [4,5]
C23C  18/48  \	2	2	4K022	C23C  18/48	339	ˤʤΣ	Coating with alloys [4,5]
C23C  18/50  \	3	3	4K022	C23C  18/50	480	ŴХȤޤϥ˥åȤˤΡʣããͥˡΣ	with alloys based on iron, cobalt or nickel (C23C 18/32 takes precedence) [4,5]
C23C  18/52  \	2	2	4K022	C23C  18/52	107	롼ףããããñ쥰롼פʬवʤ°ˤʤΤ˴ԸޤѤΡΣ	using reducing agents for coating with metallic material not provided for in a single one of groups C23C 18/32-C23C 18/50 [4]
C23C  18/52  A	2	0	4K022	C23C  18/52	540	γʬʣĥդѤ	Using grain diffusion composite plating liquid
C23C  18/52  B	2	0	4K022	C23C  18/52	883	¿إĥ	Laminated plating
C23C  18/52  Z	2	0	4K022	C23C  18/52	117	¾	Others
C23C  18/54  \	1	1	4K022	C23C  18/54	110	ܿåʤ̵ŲŵإåΣ	Contact plating, i.e. electroless electrochemical plating [4]
C23C  20/00  \	0	0	4K022	C23C  20/00	115	βʪޤϷʪΤ줫ʤʤʪʬˤ벽ŪʤǤäơɽ̺ȿʪʤ˻ĤʤΡΣ	Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating [4]
C23C  20/02  \	1	1	4K022	C23C  20/02	64	°ˤʤΣ	Coating with metallic material [4]
C23C  20/04  \	2	2	4K022	C23C  20/04	135	°ˤΡΣ	with metals [4]
C23C  20/06  \	1	1	4K022	C23C  20/06	136	°ʳ̵ˤʤΣ	Coating with inorganic material, other than metallic material [4]
C23C  20/08  \	2	2	4K022	C23C  20/08	248	ʪʪޤϸΤˤΡ㡥ۤʪúʪⲽʪΣ	with compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides [4]
C23C  22/00  \	0	0	4K026	C23C  22/00	76	ɽ̤ȿΤȤȿˤ°βŪɽ̽Ǥäơɽ̺ȿʪʤ˻ĤΡ㡥ʤʣ˶°ưֲΣ	Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals [4]
C23C  22/00  A	0	0	4K026	C23C  22/00	1050	żġ̥ե륹ƥ饤줬	Electromagnetic steel plate (mainly forsterite coating)
C23C  22/00  B	0	1	4K026	C23C  22/00	791	Ѥ	Using phosphoric acid, chromic acid
C23C  22/00  Z	0	0	4K026	C23C  22/00	2059	¾	Others
C23C  22/02  \	1	1	4K026	C23C  22/02	175	ϱդѤΡΣ	using non-aqueous solutions [4]
C23C  22/03  \	2	2	4K026	C23C  22/03	95	󲽹ʪޤΡΣ	containing phosphorus compounds [4]
C23C  22/04  \	2	2	4K026	C23C  22/04	31	ಽʪޤΡΣ	containing hexavalent chromium compounds [4]
C23C  22/05  \	1	1	4K026	C23C  22/05	270	ϱդѤΡΣ	using aqueous solutions [5]
C23C  22/06  \	2	2	4K026	C23C  22/06	251	ȡ㣶λϱդѤΡΣ	using aqueous acidic solutions with pH &lt; 6 [4,5]
C23C  22/07  \	3	3	4K026	C23C  22/07	1154	ޤΡΣ	containing phosphates [4,5]
C23C  22/08  \	4	4	4K026	C23C  22/08	416	ȤޤΡΣ	Orthophosphates [4,5]
C23C  22/10  \	5	5	4K026	C23C  22/10	94	ޤޤΡΣ	containing oxidants [4,5]
C23C  22/12  \	5	5	4K026	C23C  22/12	528	ΥޤΡΣ	containing zinc cations [4,5]
C23C  22/13  \	6	6	4K026	C23C  22/13	198	˻ޤϰ˻Υ˥򤵤˴ޤΡΣ	containing also nitrate or nitrite anions [4,5]
C23C  22/14  \	6	6	4K026	C23C  22/14	42	ǻ˥򤵤˴ޤΡΣ	containing also chlorate anions [4,5]
C23C  22/16  \	6	6	4K026	C23C  22/16	39	ʪ򤵤˴ޤΡΣ	containing also peroxy-compounds [4,5]
C23C  22/17  \	6	6	4K026	C23C  22/17	165	ͭ򤵤˴ޤΡΣ	containing also organic acids [4,5]
C23C  22/18  \	5	5	4K026	C23C  22/18	337	ޥ󥬥󥫥ޤΡΣ	containing manganese cations [4,5]
C23C  22/20  \	5	5	4K026	C23C  22/20	194	ߥ˥५ޤΡΣ	containing aluminium cations [4,5]
C23C  22/22  \	5	5	4K026	C23C  22/22	251	륫°ΥޤΡΣ	containing alkaline earth metal cations [4,5]
C23C  22/23  \	4	4	4K026	C23C  22/23	111	̹ޤΡΣ	Condensed phosphates [4,5]
C23C  22/24  \	3	3	4K026	C23C  22/24	1127	ಽʪޤΡΣ	containing hexavalent chromium compounds [4,5]
C23C  22/26  \	4	4	4K026	C23C  22/26	118	ͭʪ򤵤˴ޤΡΣ	containing also organic compounds [4,5]
C23C  22/27  \	5	5	4K026	C23C  22/27	73	ޤΡΣ	Acids [4,5]
C23C  22/28  \	5	5	4K026	C23C  22/28	261	ʬҲʪޤΡΣ	Macromolecular compounds [4,5]
C23C  22/30  \	4	4	4K026	C23C  22/30	622	򤵤˴ޤΡΣ	containing also trivalent chromium [4,5]
C23C  22/32  \	4	4	4K026	C23C  22/32	43	ʴ°򤵤˴ޤΡΣ	containing also pulverulent metals [4,5]
C23C  22/33  \	4	4	4K026	C23C  22/33	325	򤵤˴ޤΡΣ	containing also phosphates [4,5]
C23C  22/34  \	3	3	4K026	C23C  22/34	907	դòʪޤϺդòʪޤΡΣ	containing fluorides or complex fluorides [4,5]
C23C  22/36  \	4	4	4K026	C23C  22/36	488	򤵤˴ޤΡΣ	containing also phosphates [4,5]
C23C  22/37  \	4	4	4K026	C23C  22/37	114	ಽʪ򤵤˴ޤΡΣ	containing also hexavalent chromium compounds [4,5]
C23C  22/38  \	5	5	4K026	C23C  22/38	105	򤵤˴ޤΡΣ	containing also phosphates [4,5]
C23C  22/40  \	3	3	4K026	C23C  22/40	340	֥ǥ󥰥ƥޤϥХʥޤΡΣ	containing molybdates, tungstates or vanadates [4,5]
C23C  22/42  \	4	4	4K026	C23C  22/42	279	򤵤˴ޤΡΣ	containing also phosphates [4,5]
C23C  22/43  \	4	4	4K026	C23C  22/43	25	ಽʪ򤵤˴ޤΡΣ	containing also hexavalent chromium compounds [4,5]
C23C  22/44  \	4	4	4K026	C23C  22/44	195	դòʪޤϺդòʪ򤵤˴ޤΡΣ	containing also fluorides or complex fluorides [4,5]
C23C  22/46  \	3	3	4K026	C23C  22/46	118	夦ޤΡΣ	containing oxalates [4,5]
C23C  22/47  \	4	4	4K026	C23C  22/47	23	򤵤˴ޤΡΣ	containing also phosphates [4,5]
C23C  22/48  \	3	3	4K026	C23C  22/48	240	ಽʪդòʪ⤷Ϻդòʪ֥ǥ󥰥ƥХʥޤϤ夦ޤޤʤΡΣ	not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates [4,5]
C23C  22/50  \	4	4	4K026	C23C  22/50	446	ŴޤŴȤνΣ	Treatment of iron or alloys based thereon [4,5]
C23C  22/52  \	4	4	4K026	C23C  22/52	268	ƼޤƼȤνΣ	Treatment of copper or alloys based thereon [4,5]
C23C  22/53  \	4	4	4K026	C23C  22/53	482	ޤϰȤνΣ	Treatment of zinc or alloys based thereon [4,5]
C23C  22/54  \	4	4	4K026	C23C  22/54	41	Ѳж°ޤѲж°ȤνΣ	Treatment of refractory metals or alloys based thereon [4,5]
C23C  22/56  \	4	4	4K026	C23C  22/56	429	ߥ˥ޤϥߥ˥ȤνΣ	Treatment of aluminium or alloys based thereon [4,5]
C23C  22/57  \	4	4	4K026	C23C  22/57	99	ޥͥޤϥޥͥȤνΣ	Treatment of magnesium or alloys based thereon [4,5]
C23C  22/58  \	4	4	4K026	C23C  22/58	104	¾°νΣ	Treatment of other metallic material [4,5]
C23C  22/60  \	2	2	4K026	C23C  22/60	330	ȡ䣸Υ륫ϱդѤΡΣ	using alkaline aqueous solutions with pH &gt; 8 [4,5]
C23C  22/62  \	3	3	4K026	C23C  22/62	248	ŴޤŴȤνΣ	Treatment of iron or alloys based thereon [4,5]
C23C  22/63  \	3	3	4K026	C23C  22/63	202	ƼޤƼȤνΣ	Treatment of copper or alloys based thereon [4,5]
C23C  22/64  \	3	3	4K026	C23C  22/64	19	Ѳж°ޤѲж°ȤνΣ	Treatment of refractory metals or alloys based thereon [4,5]
C23C  22/66  \	3	3	4K026	C23C  22/66	437	ߥ˥ޤϥߥ˥ȤνΣ	Treatment of aluminium or alloys based thereon [4,5]
C23C  22/67  \	4	4	4K026	C23C  22/67	22	ޤϱդˤΡΣ	with solutions containing hexavalent chromium [4,5]
C23C  22/68  \	2	2	4K026	C23C  22/68	660	ȣοϱդѤΡΣ	using aqueous solutions with pH between 6 and 8 [4,5]
C23C  22/70  \	1	1	4K026	C23C  22/70	24	ͻʪѤΡΣ	using melts [4]
C23C  22/72  \	2	2	4K026	C23C  22/72	36	ŴޤŴȤνΣ	Treatment of iron or alloys based thereon [4]
C23C  22/73  \	1	1	4K026	C23C  22/73	68	ˡħΤΡΣ	characterised by the process [4]
C23C  22/73  A	1	0	4K026	C23C  22/73	733	֤ħΤΡ̥ץݽ	Characterized by devices (excluding sprays)
C23C  22/73  Z	1	0	4K026	C23C  22/73	389	¾	Others
C23C  22/74  \	2	2	4K026	C23C  22/74	282	դʤؤ뤿ΤΡΣ	for obtaining burned-in conversion coatings [4]
C23C  22/76  \	2	2	4K026	C23C  22/76	161	ץ졼ˤΤŬѤΡΣ	Applying the liquid by spraying [4]
C23C  22/77  \	2	2	4K026	C23C  22/77	225	ʤޤĴΣ	Controlling or regulating of the coating process [4]
C23C  22/78  \	1	1	4K026	C23C  22/78	1260	ʤΣ	Pretreatment of the material to be coated [4]
C23C  22/80  \	2	2	4K026	C23C  22/80	124	˥ޤϥ륳˥ಽʪޤϱդˤΡΣ	with solutions containing titanium or zirconium compounds [4]
C23C  22/82  \	1	1	4K026	C23C  22/82	574	Σ	After-treatment [4]
C23C  22/83  \	2	2	4K026	C23C  22/83	549	ŪΣ	Chemical after-treatment [4]
C23C  22/84  \	2	2	4K026	C23C  22/84	47	Σ	Dyeing [4]
C23C  22/86  \	1	1	4K026	C23C  22/86	207	ʤκΣ	Regeneration of coating baths [4]
C23C  24/00  \	0	0	4K044	C23C  24/00	226	̵ʴȯʤͻ֤ˤʤΥץ졼ããȻããããˡΣ	Coating starting from inorganic powder (spraying of the coating material in molten state C23C4/00; solid state diffusion C23C8/00-C23C12/00) [4]
C23C  24/02  \	1	1	4K044	C23C  24/02	92	ϤΤߤä뤳ȤˤΡΣ	by application of pressure only [4]
C23C  24/04  \	2	2	4K044	C23C  24/04	1580	γҤξ׷ϽФޤưϳŪϽСΣ	Impact or kinetic deposition of particles [4]
C23C  24/06  \	2	2	4K044	C23C  24/06	105	ʴʤʪðΡ㡥ˤΡΣ	Compressing powdered coating material, e.g. by milling [4]
C23C  24/08  \	1	1	4K044	C23C  24/08	64	ǮޤϰϤǮŬѤˤΡʣããͥˡΣ	by application of heat or pressure and heat (C23C 24/04 takes precedence) [4]
C23C  24/08  A	1	0	4K044	C23C  24/08	305	°ˤʤ	Coating by metallic material
C23C  24/08  B	1	1	4K044	C23C  24/08	485	°	Metallic material
C23C  24/08  C	1	0	4K044	C23C  24/08	684	̵°ˤʤ	Coating by inorganic non-metallic material
C23C  24/08  Z	1	0	4K044	C23C  24/08	83	¾Τ	Others
C23C  24/10  \	2	2	4K044	C23C  24/10	42	ǱַˤΡΣ	with intermediate formation of a liquid phase in the layer [4]
C23C  24/10  A	2	0	4K044	C23C  24/10	117	°ˤʤ	Coating by metallic material
C23C  24/10  B	2	1	4K044	C23C  24/10	158	°	Metallic material
C23C  24/10  D	2	2	4K044	C23C  24/10	39	Τߤͻ	With only low melting point materials melting
C23C  24/10  C	2	0	4K044	C23C  24/10	86	̵°ˤʤ	Coating by inorganic non-metallic material
C23C  24/10  Z	2	0	4K044	C23C  24/10	28	¾Τ	Others
C23C  26/00  \	0	0	4K044	C23C  26/00	84	롼ףããããʬवʤʤΣ	Coating not provided for in groups C23C 2/00-C23C 24/00 [4]
C23C  26/00  A	0	0	4K044	C23C  26/00	2143	ʤ̣ġͤͥ	Coating material (D to M take precedence)
C23C  26/00  B	0	1	4K044	C23C  26/00	562	°	Metallic material
C23C  26/00  N	0	2	4K044	C23C  26/00	47	Ǳַˤ	With intermediate formation of a liquid phase in the layer
C23C  26/00  C	0	1	4K044	C23C  26/00	2176	̵°	Inorganic non-metallic material
C23C  26/00  D	0	0	4K044	C23C  26/00	467	ʤ	Discharge coating
C23C  26/00  G	0	1	4K044	C23C  26/00	174	ܿΥˤ	By contact opening
C23C  26/00  E	0	0	4K044	C23C  26/00	856	⥨ͥ륮ŬѤΡ̴ޤǤȤޤ	Applying high energy fixing (including cases where subtracted are melted)
C23C  26/00  H	0	1	4K044	C23C  26/00	61	źʬΤǤ	With gaseous additional ingredients being
C23C  26/00  J	0	1	4K044	C23C  26/00	65	źʬѤʤ	Without using additional ingredients
C23C  26/00  F	0	0	4K044	C23C  26/00	193	忧	Colouring
C23C  26/00  K	0	0	4K044	C23C  26/00	180	޿Ŷ	Impregnation, filling
C23C  26/00  L	0	0	4K044	C23C  26/00	103	ʤˡħΤʤɽ̽	Surface treatment process not characterized by coating method
C23C  26/00  M	0	1	4K044	C23C  26/00	192	ؤν㡥š໤ϡ̴Ȥʤ	Treatment of coating, e.g. discharge, friction (when substrate is no melted
C23C  26/00  Z	0	0	4K044	C23C  26/00	633	¾Τ	Others
C23C  26/02  \	1	1	4K044	C23C  26/02	171	ĤͻŬѤΡΣ	applying molten material to the substrate [4]
C23C  28/00  \	0	0	4K044	C23C  28/00	80	ᥤ󥰥롼ףããããñΥᥤ󥰥롼פʬवʤˡˤ뤫ޤϥ֥饹ãäӣãĤʬवˡȹ碌ˤ뾯ʤȤ⣲ʾνŤ͹碌ʤؤ뤿ʤΣ	Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C 2/00-C23C 26/00, or by combinations of methods provided for in subclasses C23C and C25D [4]
C23C  28/00  A	0	0	4K044	C23C  28/00	1974	°ʤͭ	Having coating of metallic material
C23C  28/00  B	0	1	4K044	C23C  28/00	2564	°̵°ʤͭ	Having coating of metallic material and inorganic non-metallic material
C23C  28/00  C	0	2	4K044	C23C  28/00	3200	̵°ʤˤΡ̴۶˻Ų򥯥ݥȡ	With reduction-treated inorganic non-metallic material coating (including anode oxidation, electrolytic chromate)
C23C  28/00  D	0	0	4K044	C23C  28/00	229	°ؤʤ	Coating on non-metal substrates
C23C  28/00  E	0	0	4K044	C23C  28/00	290	ѥݥηʬʤ	Formation of patterns; partial coating
C23C  28/00  Z	0	0	4K044	C23C  28/00	995	¾Τ	Others
C23C  28/02  \	1	1	4K044	C23C  28/02	2051	°ΤߤʤΣ	only coatings of metallic material [4]
C23C  28/04  \	1	1	4K044	C23C  28/04	1455	̵°ΤߤʤΣ	only coatings of inorganic non-metallic material [4]
C23C  30/00  \	0	0	4K044	C23C  30/00	98	°ˤΤħΤ°ˤʤʤʤˡħΤʤΡʣããããͥˡΣ	Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C 26/00, C23C 28/00 take precedence) [4]
C23C  30/00  A	0	0	4K044	C23C  30/00	715	°ˤʤ	Coating by metallic material
C23C  30/00  B	0	1	4K044	C23C  30/00	1170	°ˤʤ	Coating by metallic material
C23C  30/00  D	0	0	4K044	C23C  30/00	100	°ؤʤ	Coating on non-metal substrates
C23C  30/00  E	0	0	4K044	C23C  30/00	70	ѥݥηʬʤ	Formation of patterns; partial coating
C23C  30/00  Z	0	0	4K044	C23C  30/00	194	¾Τ	Others
