WIPO IPC: Definitions

H01L - Definition

Definition statement

This subclass covers:

in general

discrete and integrated semiconductor devices; and
other electric solid state devices (as far as not provided for in an other subclass); and
details thereof.

This includes the following kind of devices:

integrated circuitdevices, e.g. CMOS integrated devices, DRAM, EPROM, CCD;
semiconductor devices (e.g. field-effect, bipolar) adapted for rectifying, amplifying, oscillating or switching, e.g. diodes, transistors, thyristors;
semiconductor devices sensitive to radiation, e.g. photo diodes, photo transistors, solar cells;
incoherent light emitting diodes, e.g. LED;
solid state devices using organic materials as the active part or using a combination of organic materials with other materials as the active part, e.g. organic LED or polymer LED;
electric solid state devices using thermoelectric, superconductive, piezo-electric, electrostrictive, magnetostrictive, galvano-magnetic or bulk negative resistance effects, e.g. thermo couples, Peltier elements, Josephson elements, piezo elements;
photo-resistors, magnetic field dependent resistors, field effect resistors;
capacitors with potential-jump barrier, resistors with potential-jump barrier or surface barrier;
thin-film or thick-film circuits;
processes and apparatus adapted for the manufacture or treatment of such devices, except where such processes relate to single step processes for which provision exists elsewhere.

Relationship between large subject matter areas

Microstructural devices or systems are classified in subclass B81B, and the processes and apparatus specially adapted for the manufacture or treatment thereof are classified in subclass B81C. So, by way of example, microelectro-mechanical devices (MEMS), containing microelectronic and mechanical components, are classified in group B81B 7/02, and their manufacture, treatment or assembling in the relevant groups of B81C.

Microstructural devices or systems working purely electrically or electronically, or related processes or apparatus for the manufacture or treatment thereof are however not covered by B81B or B81C and are classified in section H, for example in the groups of the current subclass H01L.

Microstructural devices or systems being of other than purely electrical or electronically type, and apparatus or processes for the manufacture or treatment thereof, which are normally classified in the subclasses B81B and B81C, may be also classified in those groups of H01L providing for their structural or functional features, whenever such features are of interest per se.

Nanostructures, which are normally classified in subclass B82B, may be also classified in those groups of H01L providing for their structural or functional features, whenever such features are of interest per se.

References relevant to classification in this subclass

This subclass does not cover:

Other electrical solid state devices which are not provided for in H01L:

Use of semiconductor devices for measuring	G01
Resistors in general	H01C
Resistors,e.g. non-adjustable resistors from semiconductor material	H01C 7/00
Magnets, inductors or transformers	H01F
Capacitors in general	H01G
Electrolytic devices	H01G 9/00
Batteries, accumulators	H01M
Waveguides, resonators or lines of the waveguide type	H01P
Electrically-conductive connections, current collectors	H01R
Lasers, stimulated emission devices,e.g. semiconductor lasers	H01S, H01S 5/00
Electromechanical resonators	H03H
Loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers	H04R
Electric light sources in general	H05B
Printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components	H05K
e.g. printed circuits and its manufacturing process	H05K 1/00, H05K 3/00

Informative references

Attention is drawn to the following places, which may be of interest for search:

Use of semiconductor and other solid state devices:

Containers merely intended for transport or storage of wafers except during manufacture or finishing devices thereon	B65D 85/30, B65D 85/86
Conveying systems for semiconductor wafers except during manufacture or treatment of semiconductor or electric solid state devices or components thereon	B65G 49/07
Details of scanning-probe apparatus, in general	G01Q 10/00-G01Q 90/00
Use of semiconductor devices in circuits having a particular application	see particular subclass for the application

Special rules of classification

In subclass H01L, both the process or apparatus for the manufacture or treatment of a device and the device itself are classified, whenever both of these are described sufficiently to be of interest.

Further special rules may occur on maingroup or group level, see relevant Notes on this level.

Glossary of terms

In this subclass, the following terms or expressions are used with the meaning indicated:

Assembly	The "assembly" of a device is the building up of the device from its component constructional units and includes the provision of fillings in containers.
Complete device	A "complete device" is a device in its fully assembled state which may or may not require further treatment, e.g. electro-forming, before it is ready for use but which does not require the addition of further structural units.
Component	A "component" is one electric circuit element of a plurality of elements formed in or on a common substrate.
Container	A "container" is an enclosure forming part of the complete device and is essentially a solid construction in which the body of the device is placed, or which is formed around the body without forming an intimate layer thereon.
Device	The term "device" refers to an electric circuit element; where an electric circuit element is one of a plurality of elements formed in or on a common substrate it is referred to as a "component".
Electrodes	"Electrodes" are regions in or on the body of the device (other than the solid state body itself), which exert an influence on the solid state body electrically, whether or not an external electrical connection is made thereto. An electrode may include several portions and the term includes metallic regions which exert influence on the solid state body through an insulating region, (e.g. capacitive coupling) and inductive coupling arrangements to the body. The dielectric region in a capacitive arrangement is regarded as part of the electrode. In arrangements including several portions only those portions which exert an influence on the solid state body by virtue of their shape, size or disposition or the material of which they are formed are considered to be part of the electrode. The other portions are considered to be "arrangements for conducting electric current to or from the solid state body" or "interconnections between solid state components formed in or on a common substrate", i.e. leads.
Encapsulation	A "encapsulation" is an enclosure which consists of one or more layers formed on the body and in intimate contact therewith.
Integrated circuit	A "integrated circuit" is a device where all components, e.g. diodes, resistors, are built up on a common substrate and form the device including interconnections between the components.
Parts	The term "parts" includes all structural units which are included in a complete "device".
Solid state body	The expression "solid state body" refers to the body of material within which, or at the surface of which, the physical effects characteristic of the device occur. In thermoelectric devices it includes all materials in the current path.
Wafer	A "wafer" means a slice of semiconductor or crystalline substrate material, which can be modified by impurity diffusion (doping), ion implantation or epitaxy, and whose active surface can be processed into arrays of discrete devices or integrated circuits.

Synonyms and Keywords

In patent documents the following terms "- - -", are often used as synonyms. Also, these terms can be used as keywords.

In patent documents the expression "package" is often used with the meaning of "container, encapsulation".