Home> Systems/Procedures> Laws and Policies> Laws and Guidelines> Examination Guidelines> Designs> Case examples of registered designs> Case examples of related designs which were registered as whole design and partial design of an article etc.
Main content starts here.
June 8, 2023
Japan Patent office
Design Examination Standards Office
Among the principal / related designs, where similarity was found between designs for which the design registration is sought for an entire article, etc. and a design for which the design registration is sought for a part of an article, etc., we provide some case examples to help better understand the similarity between designs. We list them in the order of Japanese Design Classification and they are linked to the respective design bulletin. We hope this information will be helpful for your(business) activities such as Intellectual Property (IP) management, etc.
The samples below are of the designs which were registered as principal / related designs, where similarity was found between designs for which the design registration is sought for an entire article, etc. and a design for which the design registration is sought for a part of an article, etc.
(Fig.) sample
* Each drawing shown above is only a selected part of a case and the rest of the drawings and the other related designs are omitted.
The case examples are of the related designs filed on or after May 1, 2019, among which were registered as principal / related designs, where similarity was found between designs for which the design registration is sought for an entire article, etc. and a design for which the design registration is sought for a part of an article, etc.
* Selected and compiled based on the information of registered designs as of June 30, 2021.
For the detailed information, please check Japan Platform for Patent information (J-platpat) (External link) by following the link on each design registration number below in the table.
N/A
N/A
[Last updated 8 June 2023]
Contact Us |
Design Examination Standards Office Japan Patent office E-mail:PA1D00@jpo.go.jp |